Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 751 - 800 out of 3,640

Document Document Title
JP2009025711A
To provide a high-toughness sequentially biaxially-stretched optical film which exhibits negative birefringence, excels in heat resistance, mechanical characteristics and optical characteristics, and excels in toughness (elongation) part...  
JP2009024086A
To simply manufacture a heat storing material formed by supporting a phase change material on a porous particle in which the phase change material does not leak and is uniformly supported by the porous particle and the manufacture is sim...  
JP2009024064A
To provide a polyphenylene resin composition that has a low dielectric loss tangent and thus is suitably useful, for example, for a printed wiring board corresponding to the densification of wiring, a higher frequency signal etc.The poly...  
JP4212191B2  
JP4210991B2  
JP2009001783A
To provide a resin composition for a laminate, having high heat resistance, low hygroscopicity, low dielectric characteristics and excellent flame retardancy.Using a resin composition which contains polymaleimide resin represented by for...  
JP2008308660A
To provide a new acrylic alkyl copolymer dispersant.This dispersant is obtained by jointly reacting: (i) an acylated acrylic alkyl copolymer of a number average molecular weight from about 5,000 to about 500,000; (ii) a hydrocarbyl acyla...  
JP4201906B2  
JP4199546B2  
JP4199654B2  
JP2008291181A
To provide a material-recyclable thermoplastic resin foam which is a thick-wall thermoplastic resin foam having excellent heat and chemical resistances and excellent environmental compatibility and adapted to flame retardance required fo...  
JP2008544059A  
JP4188843B2  
JP4190873B2  
JP2008284797A
To provide a mold releasing agent composition excellent in a mold releasing property on a polyurethane slash molding, which is more excellent in persistence capacity than conventional mold releasing agents and further less staining a mol...  
JP4183622B2  
JP2008539281A  
JP4176878B2  
JP4170457B2  
JP2008247983A
To provide a thermoplastic resin composition capable of obtaining a formed article having no-dispersion in property.The thermoplastic resin composition contains 95-10 mass% of a thermoplastic resin containing a polyamide resin, and 5-90 ...  
JP4166402B2  
JP4166417B2  
JP2008239708A
To provide an alcohol-resistant molding material that hardly causes a defective phenomenon such as whitening, cracks, deformation or the like even when brought into contact with an alcohol, is excellent in permeation resistance in the pr...  
JP2008239773A
To provide a hydrogel composition useful for composing a cold insulator excellent in flexibility and shape-maintaining properties even under a low temperature condition and also excellent in the feeling of use and compatibility (feeling ...  
JP4163308B2  
JP2008231425A
To provide a resin composition for an optical material which is excellent in heat resistance and transparency and is soluble in an aqueous alkaline solution, a resin film for an optical material comprising the same, and an optical wavegu...  
JP2008223028A
To provide a resin composition for an optical material excellent in heat resistance and transparency, and soluble in an alkaline water solution, a resin film for the optical material composed of the resin composition and an optical waveg...  
JP4155245B2  
JP4152245B2  
JP4146230B2  
JP4139832B2  
JP4139548B2  
JP4140666B2  
JP2008532736A  
JP4134338B2  
JP2008530300A  
JP2008163332A
To provide a gel polymer electrolyte precursor and a secondary battery equipped with it.The gel polymer electrolyte precursor comprises an alkali metal electrolyte, an aprotic solvent, a bismaleimide monomer or a bismaleimide oligomer, a...  
JP4120380B2  
JP2008156577A
To provide a rubber-reinforced resin composition which is heat resistant and also transparent and is suitable as a molding material for a substrate for a transparent laminate laminated with a transparent film.The rubber-reinforced resin ...  
JP2008156635A
To provide a curable aqueous composition imparting improved flexibility to a substrate, when cured on the substrate.This curable composition useful as a thermosetting binder comprises a polycarboxy polymer or copolymer, a polyol and, if ...  
JP2008156468A
To provide a heat-resistant extrusion foam board excellent in heat-resistance, water absorption-resistance, chemical-resistance, burn-resistance, appearances and strength, and causing little odor in extrusion-foaming molding.The heat-res...  
JP2008524368A  
JP4113978B2  
JP4114177B2  
JP4111290B2  
JP4111513B2  
JP4111514B2  
JP2008521521A  
JP2008144087A
To provide a resin composition to be used for a flexible printed circuit board having both high flex resistance and folding resistance (flexibility), and to provide an insulating material with a support substrate and a metal-clad laminat...  
JP2008521996A  

Matches 751 - 800 out of 3,640