Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 301 - 350 out of 16,012

Document Document Title
WO/2015/119842A1
Plastomer-modified asphalt binders meeting MSCR specifications, asphalt paving materials with such asphalt binders, and methods for fabricating such asphalt binders are provided. The asphalt binder contains a base asphalt and a plastomer...  
WO/2015/111552A1
A sliding bearing formed from a member containing resin, wherein the effect of thermal expansion of the resin is reduced. A bearing surface (10) that slidably holds the outer peripheral surface of a rotating body is formed on the inner p...  
WO/2015/111574A1
 Provided is an inexpensive slide member capable of realizing excellent sliding characteristics over an extended period of time. A slide member (1) is provided with a backing material (21) and a slide layer (20) formed on the backing m...  
WO/2015/099086A1
A phenol resin foam which comprises a phenol resin, a hydrocarbon having six or fewer carbon atoms, and at least one halogenated hydroolefin selected from the group consisting of hydrofluoroolefins and hydrochlorofluoroolefins and which ...  
WO/2015/093443A1
 The purpose of the present invention is to provide a resin composition which enables the use of an easily and inexpensively obtainable resin and facilitates mass production, and with which it is possible to form a sliding member havin...  
WO/2015/089720A1
Polyamide molding compositions, use thereof, and molded parts obtained therefrom Provided is a polyamide molding composition comprising a) at least one semi- crystalline polyamide; b) at least one thermoplastic polyester; c) at least one...  
WO/2015/093260A1
This thermosetting resin composition (P) is for use in the formation of a resin member (101) in a metal-resin composite (100) that is provided with the resin member (101) and an aluminum-based metal member (102) that is joined to the res...  
WO/2015/095267A1
Conductive thermoplastic compositions are described that exhibit low permeability, high strength and flexibility. Methods for forming the thermoplastic compositions are also described. Formation methods include dynamic vulcanization of a...  
WO/2015/093261A1
This thermosetting resin composition (P) is for use in the formation of a resin member (101) in a metal-composite composite (100) that is provided with the resin member (101) and a stainless steel metal member (102) that is joined to the...  
WO/2015/086035A1
The invention relates to a wood material product or natural-fiber composite material product composed of at least one material containing lignocellulose and/or cellulose, which material has been provided with a formaldehyde-free amino or...  
WO/2015/086074A1
The invention relates to a method for producing a formaldehyde-free resin, wherein a hydroxyl monoaldehyde is reacted with an amine, an amide or an aromatic hydroxyl compound; also a resin produced by said method.  
WO/2015/087722A1
This metal-resin composite body (100) is obtained by bonding a resin member (101) and a metal member (102) with each other. The resin member (101) is obtained by curing a thermosetting resin composition (P) that contains a thermosetting ...  
WO/2015/083819A1
 The present invention relates to: a rubber composition [X] containing a polyamide [I] of 30-100 mol% terephthalic acid structural units having a melting point of 220-290°C, an ethylene-α-olefin-unconjugated polyene copolymer rubber ...  
WO/2015/072489A1
 A laminate of a film and a rubber composition, said film being formed from a thermoplastic elastomer composition in which rubber particles are dispersed in a thermoplastic resin, wherein the Sdr value of said film in contact with said...  
WO/2015/057881A1
The invention relates to a process for improving the stability of a base-modified alkylphenol aldehyde resin (such as an amine-modified alkylphenol aldehyde resin). The process comprises the step of reacting a base-modified alkylphenol-a...  
WO/2015/056757A1
The present invention involves the development of a resin composition which has improved mechanical strength, hardness and low heat-dissipation properties, and which, when used specifically as a rubber composition, minimizes the tanδ (l...  
WO/2015/057879A1
The invention relates to an in-situ process for preparing an alkylphenol-aldehyde resin. The process comprises the step of providing a raw alkylphenol composition. The raw alkylphenol composition comprises one or more alkylphenol compoun...  
WO/2015/052657A1
The present invention relates to a composition based on phenolic resin comprising at least one phenolic resin, a vegetable protein hydrolysate, preferentially a wheat gluten hydrolysate, and an agent for accelerating curing, and also to ...  
WO/2015/049326A1
The aqueous adhesive composition comprises a resin based: - on at least one aromatic aldehyde bearing at least one aldehyde function, comprising at least one aromatic nucleus, and - on at least one compound of formula (I) in which: each ...  
WO/2015/046588A1
A resin composition containing lignin and a phenolic resin, wherein: the lignin is obtained by separating a cellulose component and a hemi-cellulose component from the decomposed product produced by decomposing a plant material; and the ...  
WO/2015/046588A8
A resin composition containing lignin and a phenolic resin, wherein: the lignin is obtained by separating a cellulose component and a hemi-cellulose component from the decomposed product produced by decomposing a plant material; and the ...  
WO/2015/042266A1
Methods for making phenolic resins modified with one or more monosaccharides and methods for making composite products therewith are provided. In at least one specific embodiment, a method for making a composite product can include conta...  
WO/2015/040163A1
A vulcanizable composition comprising a) an elastomeric polymer having a Mooney viscosity (ML 1+4) at 125°C) of least 10 MU, b) a phenol formaldehyde resin cross-linker c) an activator package d) a VOC absorber and e) an elastomeric pol...  
WO/2015/032733A1
The invention relates to a method for producing a formaldehyde-free amino resin or amide resin, comprising (i) the reaction of an amine or amide with a monoaldehyde that has at least 2 C atoms to form an intermediate product that has a r...  
WO/2015/016873A1
Formaldehyde-free binder compositions are described that include an aldehyde or ketone, an organic anhydride, an alkanol amine, and a nitrogen-containing salt of an inorganic acid. The binder compositions may be applied to fibers, such a...  
WO/2015/012320A1
This resin composition is used in order to form surface layers which coat at least portions of outer surfaces of particles used to fill fractures formed in a subterranean layer, and includes: an acid curing agent provided with acidic gro...  
WO/2015/007642A1
The aqueous adhesive composition according to the invention comprises an unsaturated elastomer latex and a phenol-aldehyde resin with a base of: - an aldehyde of formula (I); wherein X comprises N, S or O and R represents -CHO, - a polyp...  
WO/2015/008565A1
 The present invention provides a tire having excellent molding adhesion, air-blocking properties, and durability, the tire comprising an inner liner composed of a rubber composition for an inner liner in which 5 to 20 parts by mass of...  
WO/2015/007641A1
P10-3108_PCT -25- Companies:-COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN, and -Michelin Recherche et Technique S.A. Title: AQUEOUS ADHESIVE COMPOSITION WITH A BASE OF BIOSOURCED ALDEHYDE AND POLYPHENOL ABSTRACT The aqueous adhesive co...  
WO/2015/001998A8
A phenolic resin molding material characterized by comprising: a novolac-type phenolic resin having an ortho/para binding ratio of 1.2 to 3.0 inclusive; and an oxidized polyethylene having an acid value of 10 to 40 mgKOH/g inclusive. Pre...  
WO/2015/001998A1
A phenolic resin molding material characterized by comprising: a novolac-type phenolic resin having an ortho/para binding ratio of 1.2 to 3.0 inclusive; and an oxidized polyethylene having an acid value of 10 to 40 mgKOH/g inclusive. Pre...  
WO/2015/000761A1
The present invention relates to a transparent composite composition (a) comprising: a. a resin composition, comprising i. at least one (meth)acrylated oligomer (ia) and/or monomer (ib), ii. at least one polythiol (ii), and iii. optional...  
WO/2014/208542A1
[Problem] To provide: a resist underlayer film which is suppressed in generation of a sublimate and exhibits good embeddability when applied to a substrate having a hole pattern, while having high dry etching resistance, wiggling resista...  
WO/2014/203781A1
This resin composition for semiconductor sealing is characterized by comprising a maleimide compound represented by general formula (1), at least one of the benzoxazine compounds represented by general formula (2-1) and general formula (...  
WO/2014/203866A1
This resin composition contains (A) a cyanic acid ester compound that is obtained by cyanating a modified naphthalene formaldehyde resin and (B) an epoxy resin.  
WO/2014/203735A1
[Problem] To provide a novel heat-curable resin composition. [Solution] A heat-curable resin composition which contains a polymer having a repeating structural unit represented by formula (1-a) (wherein R1 and R2 independently represent ...  
WO/2014/201185A3
Methods are provided for producing bio-oil polyols, alkoxylating bio-oil polyols to provide polyols, and for employing the alkoxylated bio-oil polyols for making polymers or copolymers of polyesters or polyurethanes. Compositions and met...  
WO/2014/199656A1
Provided are: a heat-curable resin composition which has a long pot life, enables the reduction in the amount of a surplus of the curable composition to be discarded, and enables the production of a fiber-reinforced composite material, i...  
WO/2014/199800A1
[Problem] To provide a resin composition which enables the formation of an insulating film that can exhibit excellent adhesion to a metal even under an extremely severe environment having a high temperature and a high humidity. [Solution...  
WO/2014/185496A1
Provided is a flaky graphite that contains boron, that has an average thickness of 100 nm or less, and that has an average plate diameter (dc) of 0.01-100 µm. Also provided are: a conductive resin composition that comprises a resin comp...  
WO/2014/184963A1
Provided are a convenient thermosetting resin composition having excellent fracture toughness in addition to dimensional stability and heat resistance, and an electric appliance using the same. The thermosetting resin composition pertain...  
WO/2014/181358A3
The present invention discloses isohexide based compounds and their polymers which are derived from renewable resources and are potentially degradable. Also disclosed herein is the synthesis of isohexide based monomers and their polymers...  
WO/2014/179939A1
Method for recovering carbon fibers from carbon fiber reinforced polymer composites is provided. The recovered carbon fibers can be separable and can be substantially free of thermosetting resins. Compositions comprising said recovered c...  
WO/2014/181358A9
The present invention discloses isohexide based compounds and their polymers which are derived from renewable resources and are potentially degradable. Also disclosed herein is the synthesis of isohexide based monomers and their polymers...  
WO/2014/178307A1
A reactive diluent according to the present invention is represented by formula (1). (In the formula, m represents an integer of 2 or 3; R's independently represent an alkyl group having 1 to 20 carbon atoms, an allyl group or an aryl gr...  
WO/2014/177850A1
The present invention relates to the use of hydroxylamine as a retarder for a curing reaction of pre-polymeric resin formulations containing pre- polymeric resins and partial phosphate ester curing agents.  
WO/2014/167937A1
This pneumatic tire has a jointless band obtained by covering a cord, having a cord tear strength of 200 to 700 N and an elongation rate during 66 N tension of 1.0 to 5.0%, with a rubber composition for a band cord topping containing pre...  
WO/2014/167940A1
Provided are: a sealed electrical or electronic component which exhibits excellent flame retardance and excellent adhesion; a process suitable for producing said sealed electrical or electronic component; and a resin composition for seal...  
WO/2014/167993A1
Provided are: a resin composition that has a thermal conductivity of 0.5 W/m·K or greater, has excellent initial adhesive strength to glass-epoxy plates, and has excellent durability against environmental loads such as thermal cycle loa...  
WO/2014/162606A1
Provided are a plastic film that exhibits sufficiently excellent thermal dimensional stability and thermal deformation resistance while also having good transparency; and a method for producing the plastic film. Specifically provided is ...  

Matches 301 - 350 out of 16,012