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WO/2022/054747A1 |
The purposes of the present invention are to provide an epoxy resin composition in which an additive contained therein can exhibit its effect efficiently even at high temperatures and to provide a molding material having reduced unevenne...
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WO/2022/054897A1 |
The present invention provides: a curing agent composition for epoxy resins, said curing agent composition containing a component (A) that is a compound represented by general formula (1), and a component (B) that is at least one compoun...
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WO/2022/054702A1 |
Provided are a resin composition having high colorability and a resin sheet made from this resin composition. The resin composition contains particles (A) and a curable component (B). The average particle size of the particles (A) calcul...
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WO/2022/050170A1 |
A compound material according to one aspect of the present invention comprises a metal powder and a resin composition that contains an epoxy resin, a curing agent and a coupling agent; the coupling agent contains a first silane compound ...
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WO/2022/050175A1 |
The present invention provides a resin composition which is capable of achieving a good balance between strength and elongation at higher levels in comparison to conventional epoxy resins. In order to achieve the above, the present inv...
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WO/2022/049809A1 |
A method for producing a regenerated thermoplastic resin composition according to the present disclosure comprises a mixing step for mixing, with respect to 100 parts by weight of a used thermoplastic resin composition, at least one amon...
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WO/2022/050415A1 |
This insulating resin composition comprises: an epoxy resin; an amine-based curing agent containing a first amine compound represented by formula (A-1) and a second amine compound represented by formula (A-2); and an inorganic filler hav...
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WO/2022/046836A1 |
Two-part curable compositions capable of demonstrating substantially no phase separation at room temperature over time and improved adhesion strength retention at elevated temperature conditions.
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WO/2022/045487A1 |
The present invention relates to an anti-icing/de-icing honeycomb core composite material and a method for manufacturing same. The anti-icing/de-icing honeycomb core composite material may be manufactured by a method comprising: a formin...
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WO/2022/045663A1 |
A resin composition for a semiconductor package according to an embodiment is a composite of a resin and a filler disposed in the resin, wherein the filler comprises at least one depression in the surface thereof, the filler has a conten...
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WO/2022/043844A1 |
Thermally curable compositions with excellent storage stability are provided that include a thermal curing system comprising a compound of Formula (I). In Formula (I), L+n is a cation of an alkali metal or alkaline earth metal and n is e...
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WO/2022/044829A1 |
[Problem] To provide a polyvinyl chloride resin sheet having high thermal stability and good adhesiveness, and a laminated sheet using the same. [Solution] A polyvinyl chloride resin sheet containing a polyvinyl chloride resin and, relat...
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WO/2022/044947A1 |
[Problem] The present invention addresses the problem of providing a resin composition having superior flame retardance, and a molded article of the resin composition. [Solution] A flame-retardant resin composition comprising a polyalkyl...
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WO/2022/045484A1 |
A micro core-shell capsule for self-healing is provided. The micro core-shell capsule comprises: a core which is healing material of a heterogeneous matrix composition comprising vinyl ester and epoxy; a shell which is silicon dioxide; a...
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WO/2022/044878A1 |
The present invention provides an amorphous silica powder that is suitable for obtaining a liquid sealant that exhibits superior filling properties and preservation properties, and a resin composition obtained by using the amorphous sili...
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WO/2022/044877A1 |
The present invention provides an amorphous silica powder that is suitable for obtaining a solid sealant that exhibits superior fluidity and filling properties, and a resin composition obtained by using the amorphous silica powder as a f...
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WO/2022/040125A1 |
The present disclosure provides a curable resin composition including a thermoset resin, a toughener component containing a multistage polymer and a thermoplastic toughener and a phenylindane diamine hardener. The curable resin compositi...
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WO/2022/037060A1 |
Disclosed is a reduced graphene oxide nitrile rubber comprising the following components in parts by weight: 100-140 parts of nitrile rubber, 30-90 parts of a reduced graphene oxide-nitrile rubber masterbatch, 1.8-2.52 parts of a vulcani...
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WO/2022/037061A1 |
A functionalized graphene oxide nitrile rubber and an indentation-free tooth block having are provided. The functionalized graphene oxide nitrile rubber comprises the following components in parts by weight: 100-140 parts of a nitrile ru...
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WO/2022/039121A2 |
Provided are: a thermosetting resin composition which has excellent workability at approximately 50°C by the viscosity thereof being lowered, and of which the obtained cured product has excellent heat resistance in high temperature regi...
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WO/2022/039050A1 |
The present invention addresses the problem of providing an epoxy resin composition having an excellent balance among modulus, deformability, fracture toughness, and heat resistance, a prepreg obtained using the epoxy resin composition, ...
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WO/2022/034829A1 |
A silicone emulsion composition with which the treated fiber surface exhibits flexibility and high water absorption and the treated fibers can maintain water absorption even after washing treatment that contains: (A) an amino-modified si...
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WO/2022/035817A1 |
Reprocessable materials are provided that include a product of cross-linking a glycidyl methacrylate grafted high-density polyethylene (HDPE-g-GMA) with a polymacrolactone of formula (II) to form a cross-linked polymer exhibiting vitrime...
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WO/2022/033114A1 |
The present application provides a material for three-dimensional molding, and a three-dimensional object and a sliced layer thereof. The material comprises: a powder material, comprising a polyamide powder and/or a modified polyamide po...
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WO/2022/034696A1 |
Provided is an electroconductive composition capable of forming a cured product having good solder wettability. The electroconductive composition contains a thermosetting compound-containing binder component, metal particles, and a flu...
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WO/2022/030089A1 |
The present invention provides a conductive composition which enables the achievement of excellent die shear strength by sintering silver particles together regardless of the presence or absence of pressurization even by means of a low-t...
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WO/2022/030368A1 |
A composition that includes a compound (A) including a structure represented by general formula (I) as a first component, that includes at least one of an antioxidant (B1) different from a phosphorus-based antioxidant and a light stabili...
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WO/2022/030236A1 |
Provided is a semiconductor-sealing epoxy resin composition that satisfies required characteristics as a semiconductor sealing material, that does not produce odors, or NOx gas or SOx gas upon combustion, emits fluorescence even at long ...
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WO/2022/030370A1 |
The present invention is a heat-curable resin composition characterized in containing (A) a heat-curable resin, (B) a laser direct structuring additive, (C) an inorganic filler, and (D) a coupling agent, the (D) coupling agent: containin...
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WO/2022/031517A1 |
Provided herein is a hardener composition comprising (a) a first adduct comprising a reaction product of a liquid epoxy resin and isophorone diamine; (b) a second adduct comprising a reaction product of a liquid epoxy resin and m-xylylen...
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WO/2022/027922A1 |
A novel intumescent fireproof flame-retardant system, a coating, a flame retardant, and a sizing agent. A carbon source in the flame-retardant system is a phenolic resin, an acid aldehyde epoxy resin, PPO polyphenyl ether and/or polyphen...
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WO/2022/030507A1 |
A thermoplastic polyester resin composition characterized by comprising 100 parts by mass of a thermoplastic polyester resin (A) having an intrinsic viscosity of 0.60 dl/g or higher but lower than 0.85 dl/g, 5-30 parts by mass of a malei...
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WO/2022/030773A1 |
The present invention relates to a conductive resin composition, a method for preparing same, and a molded product comprising same and, more specifically, to a conductive resin composition, a method for preparing same, and a molded produ...
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WO/2022/030413A1 |
One aspect of the present invention relates to a resin composition comprising an acrylic resin and a curing agent. The acrylic resin comprises a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B)...
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WO/2022/025416A1 |
A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a polyolefin resin; about 7 to about 28 parts by weight of a polyolefin-polyalkylene oxide block copolymer; about 0.03 to about 1.3 parts ...
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WO/2022/022777A1 |
The invention relates to a high-power plug connection system comprising a cable connection housing for connecting at least two electric high-power plug connectors in order to transmit and/or distribute high electric current strengths and...
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WO/2022/023954A1 |
Efficient method for mixing, dispersing and integrating reduced graphene oxide (RGO) or carbon nanomaterials or nanostructured materials into a fusion-bonded epoxy (FBE) matrix. The polymer material comprises a mixture of the solid epoxy...
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WO/2022/024727A1 |
This epoxy resin composition comprises a mesogenic framework-containing epoxy resin (A), a liquid-state epoxy resin (B) having a viscosity of 1,500 mPa·s or lower at 25°C, a hardener (C), and an inorganic filler (D).
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WO/2022/019095A1 |
This thermosetting resin composition contains: an epoxy resin that is solid at 25°C; an epoxy resin that is non-solid at 25°C; fine particulate rubber that is dispersed in the non-solid epoxy resin; a setting agent; an inorganic filler...
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WO/2022/019309A1 |
Provided is a novel epoxy composition (modified epoxy resin). This composition is composed of an acrylic resin and an epoxy resin containing an alicyclic epoxy resin.
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WO/2022/019498A1 |
The present invention relates to an electrodeposition paint composition comprising a resin, a hardener, and an additive having cations dispersed in water, the additive being produced from an additive composition comprising a first epoxy ...
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WO/2022/014627A1 |
Provided is a liquid crosslinking agent which, as a liquid concentrate, has a sufficiently long life (pot life) and which exhibits satisfactory applicability during use. The liquid crosslinking agent contains an epoxy compound and an e...
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WO/2022/016134A1 |
Provided herein are curable resin compositions comprising (a) an epoxy resin component; (b) a phosphorated anhydride component; and (c) an active ester component. For example, the curable resin composition may comprise a phosphorated anh...
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WO/2022/011829A1 |
The present application provides a quantum dot film and preparation method therefor, and a display device. The quantum dot film comprises a quantum dot layer and a protective layer. The quantum dot layer comprises red quantum dots, green...
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WO/2022/014338A1 |
The present invention provides: a stabilizer composition which is capable of imparting a vinyl chloride resin with excellent thermal stability, coloring resistance, thermal coloring resistance and the like; a vinyl chloride resin composi...
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WO/2022/015535A1 |
Thermoset bulk molding compounds (BMC) useful for making electrically conductive components such as bipolar plates for fuel cells are described. The thermoset bulk molding compounds incorporate graphene nanoplatelets to increase the thro...
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WO/2022/014593A1 |
The present invention provides a compound for bonded magnets, said compound enhancing the mechanical strength (for example, crushing strength) of a bonded magnet. This compound for bonded magnets comprises a magnetic powder, an epoxy res...
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WO/2022/009628A1 |
One problem addressed by the present invention is to provide a curing agent for an epoxy resin that yields a resin composition having low viscosity and rapid curing and a cured product having high impact strength. The present invention p...
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WO/2022/007906A1 |
A method for catalyzing degradation of an anhydride-cured epoxy resin, comprising: formulating an anhydride-cured epoxy resin, a reaction solvent, and an organic acid catalyst into a degradation system, and performing a degradation react...
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WO/2022/010403A1 |
The present invention refers to a radiation curable composition, comprising 51-100 wt% of a cationic curable resin, further comprising a cycloaliphatic epoxide, at least one vinyl compound, selected from the group consisting of methyl vi...
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