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WO/2022/010972A1 |
Disclosed herein are curable compositions comprising an epoxide-functional polymer, a curing agent capable of reacting with the epoxide-functional polymer that is activatable by an external energy source, and a fluoropolymer that is subs...
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WO/2022/004656A1 |
The present invention pertains to: a flexible tube for an endoscope, said tube having a flexible cylindrical base material that is flexible, and a cover layer that covers the outer circumference of the flexible base material, wherein the...
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WO/2022/004553A1 |
Provided are: a liquid crystalline resin composition for a ball bearing anti-sliding wear member, said liquid crystalline resin composition being for use in the production of a ball bearing anti-sliding wear member in which sliding wear ...
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WO/2022/004409A1 |
The present invention provides a semiconductor package with an antenna, which has excellent solder heat resistance and low transmission loss. A semiconductor package 100 with an antenna, wherein an antenna part 5 is integrally formed wit...
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WO/2022/005890A1 |
A functional laminated glass article includes: a backer substrate; a flexible glass substrate comprising a thickness of no greater than 300 μm, and laminated to the backer substrate with an adhesive; a plurality of conductive traces dis...
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WO/2022/004695A1 |
Provided are a coated electric cable sealing composition which has excellent sealing properties even under conditions of cold/hot cycle and high temperature and humidity, for example, and a method for sealing a coated electric cable. Thi...
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WO/2022/000088A1 |
A compound of formula (I): MXy, alone or in combination with a compound of formula (II): MXzL, useful as a catalyst for accelerating the crosslinking of a reactive epoxy monomer, oligomer or polymer to form an epoxy thermoset resin, is p...
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WO/2022/000270A1 |
Thermoplastic compositions, methods of making the compositions, and composites containing the compositions are described. The thermoplastic composition can contain a polycarbonate, a polyphthalyl carbonate (PPC) copolymer, a poly (carbon...
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WO/2022/003769A1 |
The purpose of the present invention is to achieve an insulating material molded body (10) for arc suppression, said insulating material molded body being capable of suppressing decrease in the surface insulation performance when exposed...
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WO/2022/002217A1 |
Provided is a light conversion film capable of promoting plant growth and a preparation method therefor. The light conversion film contains garnet fluorescent powder with a composition of Y (3-x)Ba xAl (5-x)Si xO 12:mCe 3+,nCr 3+, where ...
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WO/2022/004756A1 |
A resin composition according to the present invention comprises: (A) a vinyl resin having a hyperbranched structure; (B) a liquid hardening agent; and (C) an inorganic filler.
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WO/2021/261383A1 |
A thermally curable composition which contains (A) a polyoxyalkylene polymer that has a hydrolyzable silyl group represented by general formula (1) -Si(R1)3-a(X)a (wherein each R1 independently represents a hydrocarbon group having from ...
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WO/2021/260557A1 |
The present invention relates to an epoxy adhesive composition, comprising: a) 10-50 parts by weight of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a combination of a bisphenol A epoxy resin and a bisphenol F epoxy resin, wh...
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WO/2021/261391A1 |
The present invention relates to a resin composition which comprises an epoxy resin and an aromatic polysulfone resin including an aminated aromatic polysulfone having an amino group at at least one of the terminals of a polymer backbone...
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WO/2021/261196A1 |
Provided is a radical curable resin composition comprising, as essential raw materials, a vinylester resin (A), an unsaturated monomer (B) having a flash point of at least 100ºC, a polyisocyanate (C), a polymerization initiator (D), a s...
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WO/2021/261427A1 |
Provided is an optical module in which a space between a light-emitting part (or a light-receiving part) 11a in an optical element 11 and an insulation layer 1 in an electric circuit board E is filled with a cured product of a light-tran...
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WO/2021/261306A1 |
This resin composition contains a maleimide compound (A), a phosphine oxide compound (B), and an epoxy compound (C). The maleimide compound (A) includes a maleimide compound (A1) having an alkyl group having 6 or more carbon atoms and/or...
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WO/2021/253771A1 |
Disclosed are a low-smoke density high-performance halogen-containing flame-retardant reinforced PBT composite and a preparation method therefor. The low-smoke density high-performance halogen-containing flame-retardant reinforced PBT co...
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WO/2021/253580A1 |
Disclosed is a radiation cooling thin film. The thin film is formed by mixing ceramic particles, an organic solution and a curing agent with an organic curing precursor solution and then curing same. A micro-nano photon structure array i...
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WO/2021/251357A1 |
The present invention addresses the problem of providing a composition that makes it possible to form a magnetic-particle-containing film having excellent magnetic isotropic properties and that has excellent stability over time. The pres...
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WO/2021/251454A1 |
A heat-conductive sheet according to the present invention includes a resin layer composed of a resin composition that contains a thermosetting resin, a specific curing agent, and an inorganic filler.
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WO/2021/245650A1 |
A photopolymer composition comprising at least one cycloaliphatic epoxy compound and a photoinitiator comprising a triarylsulfonium salt.
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WO/2021/247419A1 |
Provided herein is a curable liquid stereolithography resin comprising (a) a divinylarene dioxide, such as for example a divinylbenene dioxide (DVBDO); (b) a free radically curable component, such as for example a (meth)acrylate componen...
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WO/2021/241541A1 |
A resin composition, a molded body of which is an electromagnetic wave absorber, the resin composition being such that an imaginary part (ε") of the complex dielectric constant at 25°C and 10 GHz and the volume resistivity (ρv) at 25...
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WO/2021/241734A1 |
The present invention addresses the problem of providing an epoxy resin composition which has an extremely low viscosity and excellent impregnation properties, is resistant to an increase in viscosity at an injection temperature, is stab...
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WO/2021/241548A1 |
One purpose of the present invention is to provide a curable resin composition having excellent applicability by spin coating and giving cured objects which are excellent in terms of adhesiveness and long-term heat resistance. Another pu...
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WO/2021/241245A1 |
A phenolic resin composition sheet which is used for a step wherein a layer of a phenolic resin composition is arranged on at least one surface of a sheet-like base material and the phenolic resin composition is melted and liquefied by h...
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WO/2021/237959A1 |
The present invention relates to an insulation processing method of a motor. The method comprises the following steps: electrifying and heating a motor winding to 100-120°C, performing heat preservation and impregnating an impregnation ...
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WO/2021/235480A1 |
Provided is a curable epoxy composition from which it is possible to form a cured product having excellent heat resistance even in a high temperature environment. This first curable epoxy composition contains an alicyclic epoxy compoun...
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WO/2021/236483A1 |
A polymer composite formed from an epoxy based polymer and an amino-graphene. The epoxy based polymer forms a polymer matrix and the amino graphene is dispersed throughout the polymer matrix. Further, a graphene is functionalized with 3,...
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WO/2021/230940A2 |
Resins and formulations of individual monomers bearing both vinyl ester and epoxy functionality were either synthesized or formulated such that vinyl ester components capable of polymerizing by photo-induced, free radical polymerization ...
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WO/2021/230104A1 |
Provided is a thermosetting resin composition which produces a cured product exhibiting excellent low dielectric properties, high heat resistance and high adhesion properties. The thermosetting resin composition contains an aromatic po...
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WO/2021/229909A1 |
A fiber treatment agent according to the present invention contains a copolymer (X), a polyepoxy compound (Y) that does not comprise an ethylenically unsaturated bond and does comprise at least two epoxide groups per molecule, and an aqu...
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WO/2021/230002A1 |
The present invention provides a curable composition capable of giving thermally conductive materials having excellent thermal conductivity. Also provided are a thermally conductive material, a thermally conductive sheet, a device with a...
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WO/2021/229028A1 |
The present invention relates to a fire protection composition, comprising a component A and a component B. The component A comprises an epoxy liquid resin and ammonium polyphosphate. The component B comprises: - an adduct B1 of (i) at l...
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WO/2021/230336A1 |
An objective of the present disclosure is to provide: a novel epoxy resin that makes it possible to obtain a cured product with excellent heat resistance and mechanical characteristics, and that is useful as an electronic material, vario...
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WO/2021/230140A1 |
The present disclosure provides an electromagnetic wave shielding laminated sheet that is lightweight but capable of suppressing transmission and reflection of electromagnetic waves. This electromagnetic wave shielding laminated sheet (1...
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WO/2021/230335A1 |
An objective of the present disclosure is to provide: a novel epoxy resin that makes it possible to obtain a cured product with excellent heat resistance and mechanical characteristics, and that is useful as an electronic material, vario...
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WO/2021/229573A1 |
A method and a system for repairing a pothole is disclosed. The method may include: forming one or more undercut cavities in the pothole wall, below a surrounding road surface; clearing debris and removing loose asphalt pieces from a pot...
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WO/2021/229006A1 |
The present invention relates to a thermosetting material for use in additive manufacturing, the material comprising at least one thermosetting resin and at least two curing compounds different from said thermosetting resin that are able...
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WO/2021/230152A1 |
Provided are: a polyorganosilsesquioxane from which it is possible to form a cured product having excellent mechanical properties and surface hardness; and a curable composition containing said polyorganosilsesquioxane. The polyorganos...
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WO/2021/229012A1 |
The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of b...
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WO/2021/230096A1 |
The present invention provides a method for producing modified boron nitride particles that can be used for the production of a heat conductive material which has excellent heat conductivity and excellent peel strength. The present inven...
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WO/2021/225153A1 |
Provided are a resin composition with which laser welding is possible under wide-laser-irradiation conditions, a molded article, a galvano-type laser welding kit, an onboard camera component, an onboard camera module, a UV ray exposure b...
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WO/2021/225154A1 |
Provided are a resin composition that demonstrates minimal color loss even after a weathering resistance test and has superior heat resistance, as well as a molded product, a kit, a vehicle on-board camera component, a vehicle on-board c...
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WO/2021/223336A1 |
A preparation method for a fluorescent and transparent composite material, comprising: (1) selecting a crab shell or crab shell piece having a complete form, washing, and saving in deionized water for later use; (2) sequentially using a ...
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WO/2021/224786A1 |
The present disclosure relates to a method for styling mammalian hair fibers, including providing body, straightening, relaxing, curling, or applying any other desired modification to the shape of the hair. The method comprises applying ...
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WO/2021/218662A1 |
A thermosetting resin composition which contains spherical silica powder and has no pit on a polished surface after curing, the thermosetting resin composition comprising spherical silica powder fillers not having internal pores and ther...
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WO/2021/222358A1 |
Coating compositions comprising a phenolic resin and a film-forming resin having functional groups that are reactive with the functionality of the phenolic resin are disclosed herein. The phenolic resin comprises a phenol group containin...
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WO/2021/220976A1 |
This manufacturing method for an electronic component is characterized by the following: having a preparation step for preparing an electronic component-use electrode formation body, and an electrode formation step for forming an electro...
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