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WO/2023/206652A1 |
Provided are an ultrahigh-voltage-resistant insulating resin and a preparation method therefor. The method comprises the following steps: mixing 40-68 parts of matrix resin and 5-15 parts of toughening agent, and stirring the mixture at ...
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WO/2023/211911A1 |
The present teachings provide for an adhesive formulation comprising a part A with an epoxy resin, and a part B with an acidic phosphorous constituent, wherein the adhesive has a T-Peel of at least about 2.5 N/mm as measured in accordanc...
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WO/2023/206653A1 |
The present invention relates to an ultrahigh-voltage-resistant hybrid fiber reinforced composite material and a preparation method therefor. The method comprises: carrying out ball milling on a dielectric ceramic powder and a solvent to...
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WO/2023/210791A1 |
This silicalite is spherical and has a particle size of 0.4-20 μm. The present invention can provide: a silicalite having a low rate of moisture absorption; and a low-viscosity composition that has a low thermal expansion coefficient af...
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WO/2023/212274A1 |
A two-part thermally conductive curable composition exhibits long-term storage stability and high dispensation flow rates at elevated temperatures up to 50°C. One or more low melting point phase changing compounds are incorporated into ...
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WO/2023/204820A1 |
Embodiments of the present invention provide an acrylate-functionalized polysiloxane - bisphenol A polyether block copolymer for use as a toughener with thermosetting resins.
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WO/2023/203906A1 |
This resin composition comprises an epoxy resin (A) and an inorganic filler (B), wherein the epoxy resin (A) contains a liquid epoxy resin (A-1); the inorganic filler (B) contains a carbon-containing inorganic filler (B-1) having a carbo...
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WO/2023/202111A1 |
A curable epoxy composition comprising an epoxy resin, a core-shell rubber, a capped polyurethane prepolymer, a hardener, an accelerator, a multifunctional epoxy-terminated prepolymer, along with related methods of making and using the s...
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WO/2023/201614A1 |
This invention relates to a curable epoxy composition comprising an epoxy resin, a core-shell rubber, a capped polyurethane prepolymer, a hardener, a multifunctional epoxy-terminated prepolymer, along with related methods of making and u...
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WO/2023/199802A1 |
Provided are: a liquid composition containing a thermosetting resin and silica particles, wherein (1) the silica particle d50 and specific surface area are in specific ranges, and the composition viscosity is in a specific range, (2) the...
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WO/2023/199738A1 |
[Problem] The purpose of the present invention is to provide a composition that achieves an excellent balance between electrical characteristics and adhesive strength. [Solution] Provided is a composition which contains a cyclic ether co...
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WO/2023/198722A1 |
The present invention relates to a composition comprising a multistage polymer, a (meth)acrylic polymer and a monomer or prepolymer, its process of preparation and its use. In particular the present invention relates to a process for pre...
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WO/2023/199924A1 |
The present disclosure relates to an electroconductive paste containing components (A) through (C). Component (A) is an epoxy resin, component (B) is a latent curing agent, and component (C) is a plate-like crystalline metal powder havin...
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WO/2023/199925A1 |
According to the present disclosure, provided is an electrically conductive resin composition which exhibits excellent storage stability and yields a cured product having low connection resistance. The present disclosure relates to an el...
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WO/2023/199865A1 |
The present invention provides: a flame retardant composition which has excellent flame retardancy and water resistance; a flame-retardant resin composition; a molded article; and a molded body of the same. The present invention provid...
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WO/2023/199803A1 |
Provided are: a liquid composition including a thermosetting resin, first silica particles, second silica particles, and a solvent, wherein the first silica particles have a median size d50 of 1.5 to 20.0 μm, with the product of the med...
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WO/2023/195992A1 |
The invention pertains generally to a composition which comprises: at least one two-part epoxy resin; Part A of the epoxy resin comprising at least one polyepoxide; and Part B of the epoxy resin comprising at least one amine hardener; at...
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WO/2023/190135A1 |
The present invention provides a stress reducing agent (i) which has excellent dispersibility in a matrix resin, and (ii) which enables the achievement of a cured product that has a good linear expansion coefficient. The above is achieve...
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WO/2023/188943A1 |
Disclosed are: a thermoplastic resin composition which is for agricultural materials, which contains starch, biodegradable resins, and a viscosity modifier, and in which the contained amount of a plasticizing agent is 0-5 parts by mass w...
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WO/2023/190810A1 |
The present invention relates to a photosensitive resin film containing (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine...
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WO/2023/189030A1 |
The present invention provides a thermosetting resin composition which is capable of suppressing the generation of a void space between a sheet and an adherend that has a roughened surface even if pressing is performed with a low pressur...
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WO/2023/188401A1 |
This resin composition for molding comprises a curable resin and an inorganic filler, wherein the inorganic filler includes calcium titanate particles and at least either of silica particles or alumina particles; the content ratio of the...
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WO/2023/188952A1 |
The present invention provides: a thermally conductive rubber composition that makes it possible to obtain a cured product that has a low coefficient of thermal expansion, excellent heat resistance, and favorable tackiness; a heat-dissip...
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WO/2023/191109A1 |
A two-component curable composition comprising: liquid A that contains a thermal-conductive filler, a reactive diluent, and an epoxy compound that has two epoxy groups and has, between the two epoxy groups, at least one selected from the...
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WO/2023/189150A1 |
Provided is a method for producing an automobile structural body, by which it is possible to suppress appearance defects in the automobile structural body. Also provided is a curable composition which is suitably used in the production o...
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WO/2023/189298A1 |
Provided is a resin composition that has exceptional heat resistance and enables bonding of a copper foil and a glass substrate using a lamination method. This resin composition contains: two or more polymers selected from the group cons...
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WO/2023/184202A1 |
The present disclosure provides latent amine compositions which are used as a curing agent for flame resistant epoxy systems, the amine-epoxy resin compositions, and the cured products from amine-epoxy composition.
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WO/2023/190221A1 |
Provided is a thermosetting resin composition capable of reducing the dielectric loss tangent while having high permittivity. A thermosetting resin composition containing (A) an epoxy compound, (B) a compound having a maleimide group, ...
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WO/2023/190571A1 |
Provided is a conductive composition that can form a cured product having excellent conductive properties and adhesion to an adherend even at a lower curing temperature than is conventional. A conductive composition according to the pres...
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WO/2023/189297A1 |
The present invention provides a resin composition which enables the bonding of a copper foil and a glass substrate by a lamination method, while having excellent dimensional stability. This resin composition contains a polyimide resin t...
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WO/2023/189325A1 |
The first problem to be addressed by the present invention is to provide a composition which is capable of forming a magnetic material that has excellent magnetic permeability and excellent moisture resistance. The second problem to be a...
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WO/2023/188297A1 |
A photosensitive resin film containing (A) a compound having an ethylenic unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine-containing resin, wherein the (D) in...
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WO/2023/189609A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
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WO/2023/184762A1 |
Disclosed are a degradable composite material, a fan blade, and a method for preparing same. The degradable composite material of the present invention comprises, in percentages by mass, 30-40% of a degradable epoxy resin composition, 45...
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WO/2023/187507A1 |
The present invention provides a curable composition, a curable adhesive film, and an adhesive tape. Specifically, the curable composition comprises, based on the total weight thereof as 100 wt%: 15-50 wt% of an ethylene-vinyl acetate co...
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WO/2023/190419A1 |
The present invention provides a resin composition for molding, the resin composition containing a curable resin, and an inorganic filler that contains silica particles and/or alumina particles, and calcium titanate particles. The conten...
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WO/2023/190466A1 |
The present invention addresses the problem of providing a novel impact modifier for a polyacetal resin, capable of providing a polyacetal resin composition having low VOC emission. The modifier for a polyacetal resin contains a rubber-c...
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WO/2023/189610A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
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WO/2023/190191A1 |
This epoxy resin composition comprises an epoxy resin, a styrene-based viscosity adjuster, polyisobutylene and a compatibilizer. The compatibilizer has a diblock structure containing a styrene-derived structure and an olefin-derived stru...
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WO/2023/190309A1 |
A surface-modifier resin composition which is for use in a process comprising a step in which the surface-modifier resin composition is adhered to a surface of a structure including a first region, which is made of a cured epoxy resin co...
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WO/2023/189996A1 |
This resin composition for molding is for collectively sealing: a substrate equipped with an electronic component; a stator core which is fixed onto the substrate and which has a plurality of slots formed in the circumferential direction...
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WO/2023/190456A1 |
Provided is a cured product that has a surface onto which a marking ink can be easily applied, exhibits excellent adhesiveness with the marking ink after curing, and can form a marker having excellent visibility of characters and symbols...
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WO/2023/182495A1 |
[Problem] To provide a curable resin composition for black light shielding for an inkjet, the curable resin composition having excellent surface curability in addition to high light-shielding properties, exhibiting stable adhesion under ...
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WO/2023/181831A1 |
The present invention addresses the problem of providing a low-temperature-curable resin composition and an adhesive which are able to be inhibited from suffering bleeding. Provided is a resin composition comprising (A) an epoxy compou...
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WO/2023/182141A1 |
Provided is a glycidyl amine-type fluorine-containing epoxy compound. The present disclosure relates to a fluorine-containing epoxy compound represented by general formula (1). In general formula (1), n each independently represents an i...
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WO/2023/179260A1 |
Disclosed in the present invention are a natural plant fiber/water-borne epoxy resin composite material and a manufacturing method therefor. The main components of the composite material are natural plant fibers, a water-borne epoxy resi...
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WO/2023/183272A1 |
Provided herein is a two-component thermally-conductive epoxy adhesive.
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WO/2023/182485A1 |
This resin composition for encapsulation is used to produce a single-sided-encapsulation-type structure by single-sided encapsulation of a mother board on which at least one electronic device is mounted. This resin composition for encaps...
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WO/2023/182492A1 |
The present invention provides a curable composition which can form cured objects having both a low degree of thermal expansion and a low modulus. The present invention relates to a curable composition comprising (A) an epoxy compound ...
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WO/2023/181953A1 |
A resin film is formed using a resin composition containing a carboxyl group-containing resin, a corrosion inhibitor having a solubility parameter (SP value) ranging from 17.0 (MPa)1/2 to 25.5 (MPa)1/2 inclusive, and a crosslinking agent.
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