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Matches 301 - 350 out of 33,870

Document Document Title
WO/2023/068239A1
One purpose of the present invention is to provide a resin composition for sealing use, which has a low viscosity, can be cured into a cured article having a high refractive index, and has low outgassing properties and transparency. Anot...  
WO/2023/068610A1
The present invention relates to a granular resin composition for the encapsulation of semiconductor devices and a semiconductor device encapsulated using same.  
WO/2023/068083A1
The purpose of the present invention is to provide a multicomponent curable composition that can provide a cured product that exhibits an improved residual tack after one day. This problem is solved by the provision of a multicomponent c...  
WO/2023/068044A1
The present invention addresses the problem of providing a thermally conductive sheet that has a high thermal conductivity, a low elastic modulus in a low temperature range of -30°C or lower, and excellent adhesive strength. The main ob...  
WO/2023/068024A1
This thermosetting resin composition contains an epoxy resin, a curing agent, an acrylic copolymer having a functional group in a side chain thereof, boron nitride, and a filler. The average particle diameter (D50) of the boron nitride i...  
WO/2023/067662A1
This thermosetting resin composition contains: an epoxy resin that is solid at 25°C; an epoxy resin that is non-solid at 25°C; a finely particulate rubber that is dispersed in the non-solid epoxy resin; a setting agent; an inorganic fi...  
WO/2023/068109A1
The purpose of the present invention is to provide a curable resin composition which makes it possible to obtain a cured product having excellent conductivity and curing properties. The present invention is a curable resin composition ...  
WO/2023/063264A1
A rotor-fixing resin composition according to the present invention is used for forming a fixing member in a rotor comprising a rotor core that is fixed to a rotary shaft and is provided with a plurality of holes arranged along the perip...  
WO/2023/063052A1
The purpose of the present invention is to provide a sheet for application to component-mounting surfaces of electronic substrates and for thereby protecting the electronic substrates; and an electronic substrate protected by the sheet. ...  
WO/2023/062877A1
The present invention provides a liquid sealing agent which has good curability and is capable of suppressing molding failure. The present invention provides a liquid sealing agent which contains an epoxy resin, a curing agent, a curin...  
WO/2023/063266A1
A resin composition comprising a biphenyl aralkyl-type phenol resin (A), an epoxy resin (B), an active ester compound (C), and an inorganic filler (D), wherein the amount of the active ester compound (C) is not less than 10 mass% with re...  
WO/2023/058546A1
The purpose of the present invention is to provide: a prepreg which has excellent bonding strength to another member, has a properly controlled resin flow during welding, and has excellent dimensional stability during welding; and a fibe...  
WO/2023/054559A1
One purpose of the present invention is to provide a curable resin composition giving cured objects excellent in terms of hardness and transparency. Another is to provide a coating layer and a film which are formed using the curable resi...  
WO/2023/054203A1
Provided are an acoustic matching layered material, acoustic matching sheet, composition for acoustic matching layered material, acoustic wave probe, acoustic wave measurement device, and method for manufacturing acoustic wave probe, the...  
WO/2023/054479A1
The present invention addresses the problem of providing a curable resin composition that can provide a cured product having exceptional adhesive strength, rigidity at high temperatures, and vibration damping properties. This problem is ...  
WO/2023/054563A1
The purpose of the present invention is to provide a curable resin composition which has excellent adhesiveness and is capable of forming a cured product having excellent hardness. In addition, the purpose of the present invention is to ...  
WO/2023/054617A1
[Problem] The present invention addresses the problem of providing a thermosetting resin composition, the provisionally cured state and the fully cured state of which are able to be distinguished from each other by visual observation. [S...  
WO/2023/054561A1
One purpose of the present invention is to provide a curable resin composition having excellent coloration and giving cured objects having excellent hardness. Another is to provide a coating layer and a film which are formed using the cu...  
WO/2023/056035A1
An epoxy-based resin composition for clear fiber composites includes epoxy resins and an anhydride curing agent. The epoxy resins include at least one epoxy resin having a refractive index higher than a refractive index of glass fibers, ...  
WO/2023/054560A1
One purpose of the present invention is to provide a curable resin composition excellent in terms of coloration, cured-object hardness, and inner-portion curability. Another is to provide a coating layer and a film which are formed using...  
WO/2023/054204A1
Provided are an acoustic matching layered material, an acoustic matching sheet, a composition for the acoustic matching layered material, an acoustic wave probe, an acoustic wave measurement device, and a method for manufacturing the aco...  
WO/2023/053869A1
The present invention addresses the problem of providing a resin composition having exceptional light resistance, and a prepreg that has exceptional light resistance and handleability at room temperature and that has less resin flow duri...  
WO/2023/053749A1
Provided is a resin composition that has excellent resistance to soldering heat, has a low dielectric characteristic at an initial state, and can suppress changes in dielectric characteristics when left for an extended period at a high t...  
WO/2023/054884A1
The present invention relates to an epoxy resin composition for molding, a semiconductor device encapsulated by using same, or a vehicle part molded by using same.  
WO/2023/048258A1
The present invention provides: a carbon fiber reinforced composite material which has excellent tack properties, excellent compatibility with epoxy resins, and excellent interfacial adhesion, while being capable of achieving high mechan...  
WO/2023/045888A1
A carbon dioxide copolymer composition and a preparation method therefor. The following raw materials are comprised: PPCP and a filler; the mass ratio of the PPCP to the filler is 100:(1-500). The carbon dioxide copolymer composition pro...  
WO/2023/048282A1
These zirconium nitride particles (10): have zirconium nitride particles (11), an oxide layer (12) covering at least a part of the surface of the zirconium nitride particles (11), and carbon microparticles (13) scattered on the surface o...  
WO/2023/048260A1
A carbon fiber reinforced composite and a production method of the carbon fiber reinforced composite are provided which can shorten curing time and achieve high mechanical strength while reducing bleeding of the resin. The carbon fiber r...  
WO/2023/048259A1
The present invention provides: a carbon-fiber-reinforced composite material having exceptional tackiness as well as compatibility and interfacial adhesiveness with epoxy resins, the carbon-fiber-reinforced composite material being capab...  
WO/2023/048209A1
This resin composition contains a phenol carbonate resin (A) and an epoxy resin (B), wherein the molar ratio (epoxy groups / terminal hydroxyl groups) of the epoxy groups of the epoxy resin (B) to the terminal hydroxyl groups of the phen...  
WO/2023/047702A1
The present invention provides a liquid compression molding material which is composed of an epoxy resin composition that contains (A) an epoxy resin, (B) a curing accelerator, (C) a filler and (D) an elastomer, wherein the blending rati...  
WO/2023/043930A1
A fire-resistant two-part system comprising a first component and a second component. The first component comprises one or more fire resistance improving additives. The second component comprises one or more acids.  
WO/2023/042727A1
Provided is a rubber composition which can attain an improved balance among the scorch time of the unvulcanized form and the hardness, tensile strength, and freeze resistance of the vulcanizate. The rubber composition comprises a chlorop...  
WO/2023/038775A1
The present invention relates to a composition comprising an aqueous dispersion of a thermosettable compound and polymer particles functionalized with aminoalkyl ester groups. The composition is useful as a two-component waterborne curin...  
WO/2023/037862A1
Provided is a thermally conductive composition comprising: a curable component; a curing agent for curing the curable component; and a metal filler. The metal filler includes thermally conductive particles and low-melting-point metal par...  
WO/2023/039504A1
An adhesive composition including an adhesive compound; and a plurality of particles each comprising an exterior surface comprising a coating deposited thereon wherein the coating comprises a thermoset material and a method or forming an...  
WO/2023/030989A1
The invention relates to a method for producing a vulcanizable composite material, having the steps of: a) producing or providing a textile reinforcement, b) treating the textile reinforcement with an aqueous dispersion in order to activ...  
WO/2023/033404A1
The present disclosure relates to a thermoplastic resin composition, a method for preparing same, and a molded product comprising same and, more specifically, to a thermoplastic resin composition, a method for preparing same, and a molde...  
WO/2023/029257A1
Disclosed in the present application are a recoverable nano-composite material, and a preparation method therefor and the use thereof. The preparation method comprises: providing a reinforcement material which comprises a conductive mate...  
WO/2023/033919A1
Provided herein is a two-component adhesive composition showing excellent adhesive strength after heat and humidity exposure.  
WO/2023/032467A1
Provided are: a resin composition having excellent sensitivity during pattern processing and having excellent adhesion to inorganic materials; a resin composition film; and a semiconductor device employing the same. The resin composition...  
WO/2023/032680A1
[Problem] To provide a silica sol which, as the dispersoid, contains silica particles that include an epoxy group or an epoxy group-containing organic group and an alkoxy group, and that is stably dispersed in an organic solvent; and a c...  
WO/2023/030454A1
The present invention provides a thermosetting resin composition, comprising an epoxy curing agent, an epoxy resin component, a free radical initiator, a reactive diluent, a toughening agent, and a polyurethane compound. The epoxy resin ...  
WO/2023/032943A1
A heat-curable composition including a main agent with a glycidyl ether group, and a solid latent curing agent, wherein the particle size prior to heat curing is 40 μm or less.  
WO/2023/032986A1
The purpose of the present invention is to provide a silica which has a low dielectric loss tangent and excellent uniform dispersibility in a resin, while achieving high safety. The present invention relates to a material for forming a f...  
WO/2023/032971A1
An epoxy resin composition for compression molding which comprises an epoxy resin including a polycyclic structure and/or two or more cyclic structures, a hardener, and an inorganic filler, the content of the inorganic filler being 87.0 ...  
WO/2023/032860A1
In a chart regarding this curable resin composition which is obtained by performing dynamic viscoelasticity measurement of a cured resin product of the curable resin composition and in which tan δ is the vertical axis and the horizontal...  
WO/2023/030988A1
The invention relates to a method for producing a vulcanizable composite material, comprising the steps of: a) producing or providing a textile reinforcement, b) treating the textile reinforcement with an aqueous dispersion in order to a...  
WO/2023/026584A1
A film-like adhesive agent comprising an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), wherein the contained amount of the epoxy resin curing agent (B) in the film-like adhesive agent is 0.30-12.0 mass%, the ...  
WO/2023/025534A1
Polymer compositions are provided, as are processes of preparing them. Compositions comprising the polymer composition and up to 60 wt.% of at least one filler are also provided, as are articles, parts and composite materials comprising ...  

Matches 301 - 350 out of 33,870