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WO/2013/067703 |
A one-component epoxy composition containing a latent catalyst and with surprisingly long storage stability. The catalyst being a reaction product of at least one tertiary amine compound and at least one polymer having at least one carbo...
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WO/2013/070478 |
A bimodal toughening agent comprising a) a first preformed coreshell toughening agent and b) a second preformed coreshell toughening agent wherein the second preformed coreshell toughening agent has a particle size of at least two times ...
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WO/2013/068501 |
The present invention relates to hardeners for epoxy resins, which contain an alkylated polyethylene imine. Said hardeners have high functionality and a high content in secondary amino groups. They harden surprisingly quickly together wi...
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WO/2013/068502 |
The invention relates to hardeners for epoxy resin containing secondary amino groups having dialkyl amino phenyl groups. Said hardeners have a surprisingly low viscosity and harden surprisingly fast together with the epoxy resins, even i...
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WO/2013/069479 |
Provided are: a resin composition which enables the production of a laminated sheet, a printed wiring board and the like each having high heat conductivity and good moldability and rarely undergoing cracking or void formation in a simple...
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WO/2013/071122 |
Curable compositions including an epoxy resin, a hardener, and a block copolymer having a thermoset-philic block and a thermoset-phobic block, where the block copolymer is from 20 weight percent to 80 weight percent of the curable compos...
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WO/2013/068437 |
The present invention relates to the use of aromatic P-N-compounds in flame retardant polymer compositions. These compositions are especially useful for the manufacture of flame retardant compositions based onthermoplastic polymers, espe...
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WO/2013/065448 |
Provided is a conductive composition comprising (A-1) carbon nanotubes, (B-1) a conductive polymer, (C-1) an onium salt compound, and (D-1) a polymerizable compound. Also provided are a conductive film obtained using the composition; a c...
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WO/2013/065159 |
A resin composition comprising: a first filler having an average particle diameter (D50) of 1 nm to 500 nm corresponding to 50% cumulation from the smallest particle diameter side in a weight cumulative particle size distribution, and in...
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WO/2013/065433 |
The present invention addresses the problem of preventing migration in a resin composition after curing and the problem of suppressing a curing reaction during storage of the resin composition, specifically the problem of suppressing thi...
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WO/2013/065758 |
A resin composition comprising: a first filler having a peak in the range of at least 1 nm to less than 500 nm in a particle size distribution measured using a laser diffraction method, and including α-alumina; a second filler having a ...
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WO/2013/063635 |
The invention relates to novel novolacs that are modified to be flame-retardant by means of 9,10-dihydro-9-oxa-10-phosphanphenanthrene (DOP) and/or derivatives thereof and correspond to formula (I), in which R1 are selected from i) hydro...
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WO/2013/065694 |
A resin composition according to the present invention comprises (A) a mixture of at least two cyanic acid ester compounds independently selected from the group consisting of cyanic acid ester compounds (A1) to (A3) each having a specifi...
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WO/2013/063236 |
Novel oligomers and polymers derived from the reaction of benzoxazine compounds with a mixture of epoxy compounds and amine compounds are disclosed. The compositions are useful in coating, sealants, adhesive and many other applications.
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WO/2013/062123 |
The present invention provides: a vinyl polymer powder that comprises a vinyl polymer having a glass transition temperature of at least 120°C and a mass average molecular weight of at least 100,000, has superior dispersibility in a cura...
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WO/2013/062951 |
Graphene has been used in nanocomposites as constituents/doping in plastics or epoxy providing dramatic enhancement of the mechanical properties but have not progressed past the laboratory level novelty. This invention can provide a grap...
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WO/2013/061688 |
A resin composition, containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), and characterized by the inorganic filler being surface treated using a specified organic compound. This resin composition: has a low ar...
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WO/2013/061478 |
[Problem] To provide a resin composition that: has a low arithmetic average roughness and root-mean-square roughness on an insulating layer surface in a wet roughening step; is capable of forming a plated conductive layer having sufficie...
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WO/2013/059238 |
Processes are described for making epoxidized fatty acid esters from epoxidized natural fats and oils, wherein low moisture fats and oils are identified and selected or made and used in a transesterification process. The products undergo...
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WO/2013/056411 |
Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active...
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WO/2013/058324 |
Provided is a sealant for a liquid crystal dropping process, having excellent adhesion and line drawing properties. Also provided are a vertical-conduction material and liquid crystal display element manufactured using the sealant for a ...
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WO/2013/056426 |
A halogen-free low-dielectric resin composition, and a prepreg and a copper foil laminate made by using same. The halogen-free low-dielectric resin composition, based on parts by weight of the organic solid content, comprises: 5 to 90 pa...
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WO/2013/056419 |
Disclosed are an epoxy resin composition and a high frequency electronic-circuit substrate manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least t...
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WO/2013/056021 |
A composite metal surface that looks metallic, but permits effective transmission of an electromagnetic field. The composite metal surface can be integrated into various electronic equipment, such as telephones, remote controls, battery ...
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WO/2013/051227 |
A resin composition characterized by comprising: an epoxy resin represented by formula (I); a phenolic resin represented by formula (II), which acts as a curing agent; and a polytetrafluoroethylene filler. In the formula, n represents an...
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WO/2013/051497 |
Provided is an epoxy resin composition in which a plurality of monocrystalline structures are formed by aligning a plurality of colloidal silicon oxide particles in a regular manner in an epoxy resin, and which contains a polycrystalline...
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WO/2013/046434 |
Provided are: a fiber-reinforced composite material, whereby it becomes possible to achieve all of excellent CAI, excellent ILSS and excellent bending fracture toughness simultaneously at high levels and it also becomes possible to keep ...
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WO/2013/046784 |
The purpose/object of the present invention is to provide inorganic nitride particles which exhibit excellent dispersibility without lowering heat conductivity when added into an epoxy resin. Inorganic nitride particles of the present in...
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WO/2013/047378 |
Provided is a resin composition which is usable in adhesives for films or coatings for films to be used in the inner and outer faces of the body and lid of laminated type beverage cans and food cans, has particularly excellent curability...
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WO/2013/047203 |
Provided is a novel surface-treated molybdenum compound powder; also provided are a prepreg, laminate, metal foil laminate, printed circuit board, and the like having a low thermal expansion coefficient in the direction of the surface an...
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WO/2013/047485 |
A porous separator for fuel cells, which is obtained by molding a composition that contains a carbon material powder and a resin component, and which is characterized in that: the resin component contains an epoxy resin and a curing agen...
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WO/2013/047041 |
Provided is a resin composition having excellent electrical properties and damp heat resistance, and also offering excellent flow characteristics during the production of laminate. Also provided are a metal foil-clad laminate and a resin...
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WO/2013/046452 |
The purpose of the present invention is to inhibit a decrease in strength attributable to the interface between a simple-shape portion and a complicated-shape portion. This fiber-reinforced resin composite material comprises: a simple-sh...
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WO/2013/047696 |
This epoxy resin composition contains: (A) an epoxy resin containing a compound indicated by general formula (I); (B) a phenol resin containing a compound indicated by general formula (II); and (C) a dihydroxynaphthalene compound contain...
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WO/2013/041398 |
A process for curing epoxy resins which comprises curing epoxy resin compositions comprising a) epoxy resins and b) a compound of the general formula I in which R1 and R2 independently of one another are hydrogen, C1-C6-alkyl, C1-C4-alko...
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WO/2013/042894 |
The present invention relates to an epoxy resin composition, to an adhesive sheet using same, to a circuit board including same, and to a method for manufacturing same, and more particularly, the epoxy resin composition comprises: a mult...
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WO/2013/042783 |
A polymer-bound asphalt composition comprising (a) asphalt, (b) an ethylene-alkyl (meth)acrylate-glycidyl (meth)acrylate ternary copolymer and (c) a styrene-type elastomer, wherein an epoxy group in the component (b) is reacted with a fu...
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WO/2013/041425 |
A process for curing epoxy resins which comprises curing epoxy resin compositions comprising a) epoxy resins and b) a compound of the general formula (I) in which R1 and R2 independently of one another are hydrogen, C1-C6-alkyl, C1-C4-al...
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WO/2013/040202 |
An epoxy resin composition comprises an epoxy resin, a plurality of particles, and a diluent. The particles can comprise a magnesium oxysulfate compound. The diluent can be selected from the group consisting of monoglycidyl compounds, di...
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WO/2013/036502 |
The present invention is directed to a permanent epoxy photoresist composition useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more epoxy resins acco...
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WO/2013/035681 |
Provided are: an embedding resin composition for an electron microscope, which has satisfactory performance for use as an embedding agent, including embedding performance and a property of being sliced thin, and can exhibit excellent ant...
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WO/2013/035685 |
Provided is a conductive resin composition with which an increase in facility cost can be prevented in that solvent distillation and exposure to light are unnecessary; B staging (semicuring) is possible such that the product is sufficien...
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WO/2013/035542 |
Provided is a resin composition for sealing optical semiconductors that enables the obtainment of a hardened product having excellent transparency, heat resistance, light resistance, and crack resistance, and that exhibits excellent c...
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WO/2013/032238 |
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin com...
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WO/2013/029295 |
A railway-specific baffle base for a elastic bar-type fastener made of a modified, thermosetting, ultra-high molecular epoxy resin and method for forming same, the baffle base consisting of a thermosetting epoxy resin, a fibrous reinforc...
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WO/2013/032238 |
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin com...
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WO/2013/030998 |
This resin composition contains an epoxy resin containing a multifunctional epoxy resin, a curing agent containing a novolac resin having a structural unit represented by general formula (I), and an inorganic filler containing nitride pa...
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WO/2013/033147 |
Compositions for coating food or beverage containers comprising a resinous binder and 5 to 35 percent by weight of an epoxidized olefin-polyamide product.
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WO/2013/031593 |
Provided is a resin composition for sealing electrical and electronic parts with which it is possible to obtain flame-resistant sealed electrical and electronic parts wherein there is no bleed out of the flame resistor but filling with a...
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WO/2013/029831 |
Disclosed is the use of a curable composition for padding-free encapsulation of instrument transformers comprising (a) a cycloaliphatic epoxy resin, (b) a polyoxyalkylene diglycidylether (c) an OH-terminated polysiloxane, (d) a cyclic po...
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