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Matches 1 - 50 out of 41,366

Document Document Title
WO/2018/164042A1
Provided is a curable resin composition which has high fluidability upon use and has excellent handling properties. A curable resin composition containing an epoxy resin and a phenolic resin curing agent, wherein a crystalline hydrocarbo...  
WO/2018/161612A1
The invention discloses a graphene oxide polypropylene fiber heat-resistant high-strength composite material, and a preparation method thereof. The composite material is a graphene oxide polypropylene fiber-based reinforced plain weave c...  
WO/2018/159267A1
[Problem] In recent years, epoxy resin compositions are used with electronic components such as camera modules. These electronic components often use Ni-plated members from the standpoint of conductivity, but conventional epoxy resin com...  
WO/2018/159675A1
In order to be capable of forming a cured product having superior adhesion to a substrate, flux resistance, solder resistance, and solvent resistance, and in order to enable temporal curing, this thermosetting resin composition contains ...  
WO/2018/159674A1
In order to provide good adhesion to a substrate, flux resistance, solder resistance, and solvent resistance, this thermosetting resin composition contains a polyester amide acid (A), an epoxy compound (B) having a weight-average molecul...  
WO/2018/160520A1
The present application generally relates to epoxy/tannin reaction product compositions, and methods of making and using the epoxy tannin reaction product compositions. The epoxy/tannin reaction product compositions are hardened thermose...  
WO/2018/159564A1
Provided is a resin composition having low viscosity, high fluidity, excellent shelf life and low-temperature curability. The cured product of the resin composition has very high moisture permeation resistance. The composition comprises ...  
WO/2018/154832A1
The purpose of the present invention is to provide: a new curable resin composition which can form a cured product having excellent flexibility without using silicone rubber or a plasticizer and which can be suitably used as a material f...  
WO/2018/155165A1
Provided are: a liquid epoxy resin sealing material which does not undergo fillet cracking that can occur when an underfill cured product is allowed to leave under high-temperature aerobic conditions; and a semiconductor device using the...  
WO/2018/155672A1
The present invention is a resin composition for a fiber-reinforced plastic, which contains (A) a cyanate ester, (B) an epoxy resin and (C) an aromatic amine-based curing agent that has a liquid form at 25ºC, wherein the average number ...  
WO/2018/150779A1
Provided are: a resin sheet which exhibits good handling properties and formability even if the resin sheet has a reduced thickness, and which is capable of maintaining flexibility for a long period of time, thereby being suitable for se...  
WO/2018/151080A1
Provided is a composition which contains an alicyclic epoxide, a bisphenol A epoxy resin, a long-chain fatty acid ethylene glycol ester, a filler, an ammonium salt-containing thermal acid generator and a photoacid generator, and wherein:...  
WO/2018/147053A1
The resin composition according to the present invention comprises a cyanic acid ester compound (A). Furthermore, the resin composition according to the present invention comprises a maleimide compound (B) and/or an epoxy resin (C), and ...  
WO/2018/143322A1
A polycarbonate resin composition that has exceptional long-term optical characteristics stability, that maintains excellent color tone with little yellowing even when caused to reside in a molding machine at high temperatures exceeding ...  
WO/2018/143078A1
Provided is a polyester resin composition containing: a polyester resin A containing 70-100 mass% of a polybutylene terephthalate resin and 0-30 mass% of a polyethylene terephthalate resin; a predetermined amount of a metal organic acid ...  
WO/2018/144518A1
Low density aerospace compositions and sealants are disclosed. The low density compositions and sealants are characterized by a high volume percent loading of low density microcapsules.  
WO/2018/141619A1
The invention relates to a wrapping-tape insulating system for electrical machines and in particular one that has a tape accelerator that is more vacuum-stable than the prior art. According to the invention, imidazoles bonded to acrylate...  
WO/2018/143077A1
Provided is a polyester resin composition containing: a polyester resin A containing 50-100 mass% of a polybutylene terephthalate resin and 0-50 mass% of a polyethylene terephthalate resin; a predetermined amount of a metal organic acid ...  
WO/2018/142710A1
The present invention improves the insulating properties of a resin composition constituting part of an insulating member, and corresponds to an increase in output of an ignition coil for an internal combustion engine. A resin compositio...  
WO/2018/144849A1
In one or more embodiments, the present invention is directed to poly(propylene fumarate) polymers and polymer structures made therefrom (and related methods) that have been end and/or monomer functionalized to add functional groups for ...  
WO/2018/143320A1
A polycarbonate resin composition that maintains excellent color tone with little yellowing even when retained within a high-temperature molding machine exceeding 340°C, has little change in color tone over time even when a molded artic...  
WO/2018/139112A1
A purpose of the present invention is to provide an epoxy resin giving cured objects which are excellent in terms of heat resistance and toughness. Specifically, the epoxy resin is a product of the reaction of 1,6-dihydroxynaphthalene wi...  
WO/2018/140576A1
A multiple component anhydride-free, thermosetting epoxy resin composition comprising, (A) at least one epoxy resin, and (B) at least one curing agent selected from the group of (b1) a polyetheramine of the formula (1) (Formula (1)), whe...  
WO/2018/139206A1
The present invention is a polycarbonate resin composition for optical parts and an optical part, which have a good hue and very little gas generation and mold contamination during molding. The polycarbonate resin composition for optical...  
WO/2018/139463A1
The purpose of the present invention is to provide an electrically conductive composition having exceptional screen printability, low resistance, and adhesion to a substrate. The present invention pertains to an electrically conductive c...  
WO/2018/139368A1
This resin composition contains: at least one type selected from the group consisting of (i) a product of a reaction between a cyanate ester compound (A) and a polybutadiene (B), and/or (ii) a product of a reaction between a polymer of t...  
WO/2018/135517A1
Provided are: a material having high thermal conductivity that includes an alumina fiber sheet and a resin, wherein the material having high thermal conductivity includes 20-90% by mass of the alumina fiber sheet; and a method for produc...  
WO/2018/135558A1
[Problem] The purpose of the present invention is to provide a curable resin composition for optical reflection which enables the production of a reflector by compression molding, and which additionally has high light reflectivity and ex...  
WO/2018/135557A1
The purpose of the present invention is to provide a curable epoxy resin composition with which it is possible to form a cured product that has high heat resistance, light stability, thermal shock resistance, and reflow resistance, and t...  
WO/2018/133157A1
The present invention relates to a process for manufacturing a TPU alloy material by in-situ compatibilization. A dual-activity substance is introduced during manufacturing, so that chemical bonding between a TPU material and other mater...  
WO/2018/131567A1
Provided is an epoxy resin composition that has a low dielectric loss tangent while maintaining excellent adhesiveness. Specifically, the present invention provides an epoxy resin composition that contains a specific epoxy resin and a ph...  
WO/2018/131580A1
A purpose of the present invention is to provide an epoxy resin composition which stably forms a fine phase separation structure in accordance with a molding condition width, and which stably provides an epoxy resin cured product that ha...  
WO/2018/131563A1
Provided is an epoxy resin composition having excellent low dielectric properties. Specifically, an epoxy resin composition is provided that contains polyphenylene ether and an epoxy resin having a specific structure.  
WO/2018/129686A1
A radiation curable sealant composition particularly suitable for producing a liquid crystal display is disclosed. The sealant composition contains: one or more curable resins having a group selected from epoxy group, (meth) acryloyl gro...  
WO/2018/131570A1
Provided is an epoxy resin composition capable of achieving excellent low dielectric properties and high adhesion to metal. Specifically, an epoxy resin composition is provided that contains organic particles and an epoxy resin having a ...  
WO/2018/131571A1
Provided is an epoxy resin composition having excellent adhesion and low dielectric properties. Specifically, an epoxy resin composition is provided that contains an acid-modified polyolefin resin and an epoxy resin having a specific str...  
WO/2018/131545A1
The purpose of the present invention is to provide a curable resin composition in which an increase in hardness or a decrease in elongation caused by heat or light is suppressed and which forms a tough cured product. The present inventio...  
WO/2018/126436A1
Disclosed is a composite epoxy resin board, the preparation raw materials thereof include the following components in weight percentages: 5% to 100% of a waste prepreg powder, and 0 to 95% of a waste printed circuit board powder. The was...  
WO/2018/123442A1
Provided is a resin composition that is suitable as a matrix resin for a fiber-reinforced composite material that gives a cured molded product having high toughness and a superior fatigue resistance, the matrix resin exhibiting good impr...  
WO/2018/123795A1
The present invention addresses the problem of providing an aqueous resin composition that can be used as a primer that greatly improves adhesion between a substrate and a cured coating of an active energy ray-curable composition, even i...  
WO/2018/124167A1
The present invention provides: a reliable liquid crystal alignment film that can be obtained even in a low-temperature firing process, has excellent rubbing resistance, and has a desired voltage retention rate; a liquid crystal alignmen...  
WO/2018/124161A1
The resin composition according to the present invention contains :an allylphenol compound (A); a maleimide compound (B); a cyanate ester compound (C); and/or an epoxy compound (D), in order to provide a printed wiring board resin compos...  
WO/2018/120564A1
Provided in the present invention are a phosphorus-containing active ester, a halogen-free resin composition thereof, and a prepreg and a laminate using the same. The halogen-free resin composition comprises: (A) a thermosetting resin; (...  
WO/2018/120590A1
The present invention relates to a flame-retardant polyphenylene ether resin composition, comprising, by weight percent: (A) 10-45% of a phosphorus-containing polyphenylene ether resin with a number-average molecular weight of 1000-6000;...  
WO/2018/120471A1
A method for preparing a benzoxazine-containing resin composition, and a prepreg and a laminate prepared from the resin composition. The method for preparing a benzoxazine-containing resin composition is: adding an acid filler to a benzo...  
WO/2018/120560A1
Disclosed is a polymer-based composite comprising three-dimensional network of filler particles and a preparation method therefor. The polymer-based composite of the present invention comprises a three-dimensional network of filler parti...  
WO/2018/120563A1
The present invention provides a halogen-free epoxy resin composition, and a prepreg and a laminate using same. The halogen-free epoxy resin composition comprises (A) a halogen-free epoxy resin and (B) a phosphorus-containing active este...  
WO/2018/123695A1
Provided are a curable composition with which it is possible to obtain a cured product having exceptional strength, a base resin, a curing agent, a dry film, a cured product, and a printed wiring board. A curable composition containing (...  
WO/2018/120614A1
Provided in the present invention are a phosphorus-containing active ester and a halogen-free resin composition thereof, as well as a prepreg and a laminate using the same. The halogen-free resin composition comprises: (A) a thermosettin...  
WO/2018/123897A1
The composite material according to one aspect of the present invention comprises a matrix phase of a resin, and a ruthenium oxide which is contained in the matrix phase of the resin and which has a Ca2RuO4 structure. The ruthenium oxide...  

Matches 1 - 50 out of 41,366