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Matches 1 - 50 out of 41,840

Document Document Title
WO/2019/033972A1
Disclosed in the present invention are a magnet assembly and a preparation method therefor. The magnet assembly is formed by overlapping and adhesively bonding a plurality of magnetic sheets which are made of a rare earth permanent magne...  
WO/2019/036636A1
Aspects of the present invention relate to polymers, and particularly to farnesene polymers functionalized with one or more oxirane groups and, optionally, one or more hydroxyl groups. According to one aspect of the invention, provided i...  
WO/2019/035431A1
This sealing resin composition satisfies at least any of conditions (1)-(3) below: condition (1) an epoxy resin and an inorganic filler material are included, and the specific surface area of the inorganic filler material is not more tha...  
WO/2019/035430A1
This sealing resin composition includes an epoxy resin and an inorganic filler material. The dielectric relaxation value of the sealing resin composition in a cured state is 20 or lower when measured at a frequency of 0.001 Hz.  
WO/2019/026784A1
Provided is an aromatic polycarbonate resin composition containing 0.01-0.1 part by mass of an alicyclic epoxy compound (B), 0.2-0.6 part by mass of a polyether compound (C) having a polyoxyalkylene structure, and 0.005-1 part by mass of...  
WO/2019/025465A1
The present invention relates to foamable heat-curable one-component epoxy resin compositions which contain aerogel particles, can be used in injection-molding processes, have a high stability during the foaming process and at the same t...  
WO/2019/024184A1
An epoxy resin curing agent, comprising: a fluorocarbon material and an amine curing agent, wherein the mass fraction of the fluorocarbon material is 0-20wt%, not including 0. The provided epoxy resin curing agent can effectively improve...  
WO/2019/021879A1
The purpose of the present invention is to provide an epoxy resin composition and a cured product, each of which has achieved excellent toughness, high bending modulus of elasticity and high bending strength without deteriorating heat re...  
WO/2019/021613A1
The present invention provides: a prepreg that yields a carbon-fiber-reinforced composite material having exceptional mode I interlayer toughness, mode II interlayer toughness, and tensile strength; and a carbon-fiber-reinforced composit...  
WO/2019/021944A1
Provided are a polymer compound, a composition including the same, a resin composition including these, and a molded body thereof that can sustainably impart a superior antistatic effect to a synthetic resin. This polymer compound is obt...  
WO/2019/017365A1
The present invention addresses the problem of providing: an epoxy resin composition which is excellent in terms of both quick curability and storage stability; a prepreg using the epoxy resin composition; and a fiber-reinforced composit...  
WO/2019/015654A1
Disclosed is an epoxy resin and functional graphene integrated filtering IC, comprising a filtering coil and a filtering medium. The filtering medium comprises the following raw materials in parts by weight: 5% to 20% of a functional gra...  
WO/2019/017053A1
Provided is a resin composition for a sealing sheet, the resin composition containing: (A) a crystalline epoxy resin and/or a liquid epoxy resin; (B) a phenolic resin curing agent; (C) a curing accelerator; (D) an inorganic filler; and (...  
WO/2019/013299A1
The present invention provides a thermally conductive material that has excellent thermal conductivity. The present invention also provides: a device that is provided with a thermally conductive layer that includes the thermally conducti...  
WO/2019/011984A1
A curable polymeric resin composition comprising i. a resin system comprising at least one resin component, ii. a curative system, and iii. a particle system comprising a multistage polymeric particle comprising a polymer composition (PC...  
WO/2019/012892A1
Provided is an NCF suitable for pressure-mounting. A pre-applied semiconductor sealing film for curing in a pressurized environment is characterized by containing (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room tem...  
WO/2019/011849A1
The invention relates to single-component thermosetting epoxy resin adhesives, comprising: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2...  
WO/2019/011982A1
The present invention relates to a curable polymeric resin composition comprising a resin component, a curative system comprising at least one component in the form of an amine based curative, and a multistage polymeric particle. The pol...  
WO/2019/012077A1
The present invention relates to a composition suitable as epoxy adhesive composition comprising a multistage polymer in form of polymeric particles and a (meth) acrylic polymer its process of preparation and its use. In particular the p...  
WO/2019/013223A1
Provided is a resin composition for printed wiring board containing: (A) a silicon-containing polymer which contains bonds (a), (b), (c) and (d); (B) a cyanic acid ester compound; (D) an epoxy resin; and a filler (E) (In bonds (a) to (d)...  
WO/2019/012905A1
[Problem] To provide a composition that contains a crosslinkable butyl rubber and can form an adhesive having an excellent gas barrier performance and an excellent heat-resistant holding power. [Solution] A composition that contains a ca...  
WO/2019/009201A1
An aspect of the present invention relates to a thermally curable resin composition characterized by comprising an epoxy resin, an isocyanate resin, a polyrotaxane resin, and a hardener, the isocyanate resin including, in the structure, ...  
WO/2019/006942A1
The present invention belongs to the field of textiles. Disclosed are is a textile material added with perlite powder and a preparation method therefor. The textile material added with the perlite powder is prepared from tetraethoxysilan...  
WO/2019/003673A1
The purpose of the present invention is to provide: an unsaturated polyester resin composition that has high thermal shock resistance and high productivity; and an electrical appliance using the same. This unsaturated polyester resin com...  
WO/2019/003095A1
A process for the production of a multiple-walled carbon nanotube (MWCNTs) suspension in a polymeric matrix is described, the suspension being obtained by the process, and different uses of the suspension, including use for impregnation ...  
WO/2019/002907A1
The invention relates to a composite material consisting of a polymer matrix loaded with multi-walled carbon nanotubes (MWCNTs) as well as a process for the production of the composite material and the use of the composite in liquid form...  
WO/2019/004458A1
Provided is a resin composition for encapsulation, the resin composition satisfying at least one among (1)-(4): (1) contains a curable resin component, an elastomer component, and a filler, wherein the cured product of the resin composit...  
WO/2019/004022A1
The present invention relates to a thermoplastic polyester resin composition obtained by compounding a thermoplastic polyester resin (A), an epoxy compound (B) having an epoxy equivalent of 200-3,000 g/eq, and a hydroxylated resin (C) ha...  
WO/2019/004120A1
This foam-moulded body comprises a thermoplastic polyester elastomer resin composition containing 0.1–4.5 parts by mass of a thickener (B) per 100 parts by mass of a thermoplastic polyester elastomer (A), wherein hard segments and soft...  
WO/2019/004709A1
The present invention relates to: a liquid crystal alignment agent composition that can achieve high imidization rates at relatively mild curing conditions, and has excellent stability due to minimizing side reactions; a method for produ...  
WO/2019/003600A1
Provided are: a resin composition that has a good external appearance without the occurrence of voids, that exhibits low moisture permeability as a cured product, that exhibits a low rate of change of capacitance, and that is suitable fo...  
WO/2018/234534A1
The invention relates to a method for connecting two molded bodies S1 and S2, the method comprising the following steps: a) providing a molded body S1; b) arranging a molded body S2 on the molded body S1, a cavity (1) being formed betwee...  
WO/2018/235824A1
This image display device sealing material contains a resin component and a curing agent, wherein the resin component contains a biphenyl backbone-containing epoxy resin having a weight-average molecular weight of 200-100,000, an alicycl...  
WO/2018/236455A1
A two-component curable epoxy resin system having an epoxy component containing a unique combination of two or more epoxy resins with at least one of the epoxy resins being an epoxy novolac type resin. The composite made from such resin ...  
WO/2018/236052A1
Provided are a tablet-type epoxy resin composition for sealing a semiconductor device, and a semiconductor device sealed using the same, and with respect to an entire tablet-type epoxy resin composition for sealing a semiconductor device...  
WO/2018/235918A1
Provided is a resin material that makes it possible to effectively enhance adhesiveness and long-term insulating reliability. This resin material contains first inorganic particles having an average aspect ratio of 2 or less, second inor...  
WO/2018/236975A1
Disclosed are powder coating compositions that include a polymeric aromatic product of an aromatic isocyanate manufacturing process.  
WO/2018/229583A1
Curable epoxy/thiol resin compositions, methods of curing, methods of bonding substrates, and tapes including the cured polymeric material, wherein the curable epoxy/thiol resin composition includes: an epoxy resin component comprising a...  
WO/2018/230109A1
Provided are: a conductive resin composition which has good shielding properties, good adhesion to a package, and which can, by spray coating, form a shield layer that is less likely to discolor even under severe heating conditions; and ...  
WO/2018/230655A1
The purpose of the present invention is to provide a sealant for a liquid crystal display element, the sealant having excellent adhesion, moisture permeation prevention, and low liquid-crystal staining properties and whereby a liquid cry...  
WO/2018/225599A1
[Problem] To provide an epoxy resin composition which allows high flatness of a polished surface obtained by polishing a surface after the epoxy resin composition is cured, and a production method for an electronic component mounting str...  
WO/2018/224566A1
The invention relates to a connection fitting for a flexible pipe (10) for transporting fluid. The flexible pipe (10) comprises at least one tubular sheath (20) and at least one layer (24, 25) of tensile armour arranged on the outside wi...  
WO/2018/223780A1
The present invention provides a preparation method for an epoxy resin composite, comprising: bisphenol AF being completely dissolved in epichlorohydrin, and a catalyst then being added for a reaction so as to obtain a resin etherate; th...  
WO/2018/223524A1
The present invention provides a halogen-free epoxy resin composition, a prepreg and laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reacti...  
WO/2018/226680A1
A thermoplastic composite material includes a thermoplastic polymer matrix component, a microparticle component, a nanoparticle component, and a compatibilizing agent component, at least a portion of the microparticle component and/or na...  
WO/2018/223779A1
Disclosed is a wave-absorbing impregnation glue liquid, comprising: a two-component epoxy resin; a solvent; a polyether-based siloxane; and carbon powder, wherein the ratio by mass of the two-component epoxy resin to the solvent is 1 : 3...  
WO/2018/227151A1
In one aspect, compositions are described herein, and in another aspect methods are described herein. In some embodiments, a polymerizable composition described herein comprises (i) one or more alkoxylated or alkenoxylated, or non-alkoxy...  
WO/2018/225880A1
The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition including the same, and a use, wherein the novel compound exhibits improved low hygro...  
WO/2018/225471A1
Provided is an electrical/electronic sealing resin composition which exhibits long-term durability, in particular, long-term reliability with no physical deterioration under high-temperature and high-humidity conditions or high-temperatu...  
WO/2018/225543A1
Provided is a compound represented by formula (1) and a photocurable composition using the compound. In formula (1): R1 and R2 each independently represent a hydrogen atom, a carboxy group, a sulfo group, a hydroxy group, an acetylamino ...  

Matches 1 - 50 out of 41,840