Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 40,921

Document Document Title
WO/2018/069081A1
The invention relates to a semi-finished product, in particular for thermal and/or electrical contacting of components, such as battery cells and/or electronic components, for example. In order to simplify methods for producing electrica...  
WO/2018/070301A1
The purpose of the present invention is to provide: an anti-reflective material that has sufficient anti-reflective function, has high thermal shock resistance, and can prevent reductions in the total luminous flux of a light source; and...  
WO/2018/070237A1
This resin composition for sealing contains (A) an epoxy resin, (B) a curing agent that has at least one amino group in each molecule and (C) an inorganic filler. The inorganic filler (C) contains (C1) a first inorganic filler having an ...  
WO/2018/070470A1
The present invention provides a resin composition which exhibits good impregnation ability into reinforcing fibers, while having fast curing properties, and which is suitable for use in fiber-reinforced composite materials that produce ...  
WO/2018/070695A1
Provided are: a composition for a window film, comprising a silicone resin of chemical formula 1 and an initiator; and a flexible window film formed therefrom.  
WO/2018/070658A1
The present invention relates to a raw material for a bio-3D printing support and, more specifically, to a novel type bio-3D printing support material for tissue engineering, a method for manufacturing a three-dimensional support by usin...  
WO/2018/066548A1
The present invention provides an encapsulation resin composition which comprises a thermosetting resin (A), a semi-calcined hydrotalcite (B), and a curing agent (C), wherein a cured product of the resin composition has a refractive inde...  
WO/2018/066600A1
Provided is a novel fiber-reinforced composite material which has excellent mode I interlaminar fracture toughness and mode II interlaminar fracture toughness. A prepreg which contains the constituent elements (A), (B) and (C) described ...  
WO/2018/066851A1
The present invention relates to: a semiconductor bonding resin composition; a semiconductor adhesive film comprising the semiconductor bonding resin composition; a dicing die bonding film comprising an adhesive layer comprising the semi...  
WO/2018/066546A1
The present invention provides a composition which contains an electron-donating polymer (D) having a structure represented by formula (1) and an electron-withdrawing polymer (A) having a structure represented by formula (2). (In the for...  
WO/2018/064322A1
A treated cellulosic material comprising a cellulosic material having a porous structure defining a plurality of pores, the cellulosic material comprising wood including wood or wood composite materials, at least a portion of the pores c...  
WO/2018/062405A1
Provided is a cured body capable of improving adhesion between an insulation layer and a metal layer and reducing surface roughness of the surface of the insulation layer. This cured body is a cured body of a resin composition including ...  
WO/2018/058760A1
Provided in the present invention are a silicone epoxy resin containing phosphine imide, a preparation method therefor and an application thereof. The silicone epoxy resin containing phosphine imide is prepared by means of a reaction bet...  
WO/2018/060902A1
There is provided a carbon fiber sheet molding composition including a vinyl ester resin type system. The carbon fiber distribution is random. The carbon fiber length is from about.5 inches to two inches. The carbon fiber loading is from...  
WO/2018/062179A1
Provided are: a photocurable resin composition capable of forming a cured product that has superior printing properties, i.e., free of oozing, streaks, etc., and superior crack resistance; a dry film having a resin layer obtained using t...  
WO/2018/062404A1
Provided is an interlayer insulating material which is capable of enhancing the adhesion between an insulating layer and a metal layer, while being capable of decreasing the surface roughness of the surface of the insulating layer. The p...  
WO/2018/064326A1
A method for preparing a treated cellulosic material comprising: providing a cellulosic material; a first treatment protocol comprising impregnating the cellulosic material with an aqueous solution comprising a polymer, the polymer compr...  
WO/2018/061516A1
Provided is a fiber-reinforced plastic (FRP) molding material that exhibits good moldability, which is a characteristic of phenoxy resins, while being able to suppress changes in mechanical characteristics in high temperature environment...  
WO/2018/053907A1
The invention relates to an oil and hydrolysis-resistant PBT engineering plastic composition for nanomolding, comprising, in parts by weight, 45-60 parts of a PBT, 20-40 parts of a glass fiber, 4-6 parts of a toughener, 8-15 parts of a m...  
WO/2018/057057A1
A high heat epoxy prepreg, comprising a substrate; a high heat epoxy composition comprising: a hardener; a high heat epoxy mixture comprising: a high heat epoxy compound and an auxiliary epoxy compound different from the high heat epoxy ...  
WO/2018/058116A1
A high heat epoxy composition comprising: a high heat epoxy compound; a thermoplastic polymer; and a hardener; wherein a cured sample of the high heat epoxy composition has a glass transition temperature greater than or equal to 200ºC, ...  
WO/2018/057056A1
A high heat epoxy composition including a high heat epoxy compound; and an auxiliary epoxy compound different from the high heat epoxy compound; wherein the composition has a glass transition temperature between -10°C and 62°C, prefera...  
WO/2018/050413A1
The invention relates to heat-curing and light-fixable compounds, which are liquid at room temperature and are epoxy-based, and which comprise at least one epoxy-containing compound (A) having at least two epoxy groups, at least one hard...  
WO/2018/052079A1
Provided are aromatic polyether microparticles including a plurality of particles that contain an aromatic polyether, the contained amount of particles having a particle diameter of 50 μm or less being 50 vol% or more relative to the to...  
WO/2018/051715A1
Provided are: a flame-retardant resin composition which gives a flame-retardant resin having a satisfactory balance among all of adhesion, flame retardancy, permittivity, and dielectric dissipation factor; the flame-retardant resin; and ...  
WO/2018/051940A1
A curable composition containing: an epoxy compound (A) having a melting point of at least 50°C; a polymerizable compound (B); a polymerization initiator (C); and a colorant (D). The polymerizable compound (B) is preferably: an unsatura...  
WO/2018/048807A1
Embodiments are directed to compositions comprising (i) amphiphilic block copolymer; (ii) resin material; and amine modified graphene oxide; where the composition shows a synergic effect in critical strain energy release rate (Glc) value...  
WO/2018/049302A1
Curable formulations, cured formulations, and mixtures and composites thereof are described herein, as well as methods of making and using the formulations, mixtures, and composites.  
WO/2018/047724A1
A resin composition containing an epoxy resin (A) represented by formula (1) and a cyanic acid ester compound (B). (In formula (1), Ar represents a polycyclic aromatic group, R represents a hydrogen atom or methyl group, G represents a g...  
WO/2018/043395A1
This negative photosensitive resin composition comprises an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator (I). The cation polymerization initiator (I) is characterized by containing one or more sele...  
WO/2018/043490A1
Provided is a thermosetting resin composition (C) which contains an epoxy resin, an epoxy resin curing agent and an epoxy resin curing accelerator, and wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 that ...  
WO/2018/043035A1
A resin composition which comprises a thermally curable component, a thermoplastic resin, a filler, and a triazine compound, wherein the triazine compound is represented by general formula (1). In general formula (1), R1 is a hydrogen at...  
WO/2018/041465A1
The invention relates to a two-component mortar compound comprising at least one resin component (A), which contains at least one resin, which can be polymerized by an addition reaction, as a curable constituent, and one hardener compone...  
WO/2018/038221A1
A curable resin composition is provided which contains a photoradical polymerization initiator, a monomer component, a colorant and a photoacid generator, wherein the monomer component includes a monomer having one radical polymerizable ...  
WO/2018/037195A1
The present invention relates to a block copolymer comprising at least one diene elastomer Q-block having chain terminations, and at least one A-block bearing at least one binding group B and at least two identical or different functions...  
WO/2018/037283A1
The embodiments herein relate to an epoxy resin composition comprising a specific type of amine-based epoxy resin containing four epoxy groups per molecule, a prepreg, and a fiber-reinforced composite material. More specifically, the emb...  
WO/2018/037517A1
A curable resin composition is provided which contains a photoradical polymerization initiator, a monomer component, a colorant and a photoacid generator, wherein the monomer component includes a monomer having one radical polymerizable ...  
WO/2018/037565A1
Provided is an epoxy resin composition which is inhibited from shrinking during curing and gives cured films having low warpage and high adhesion. The epoxy resin composition comprises (A) an epoxy resin, (B) a compound represented by fo...  
WO/2018/037497A1
The present invention provides an epoxy resin composition which cures at low temperatures, is inhibited from generating heat during curing, has excellent flowability, and can give cured objects having excellent mechanical strength. The e...  
WO/2018/036506A1
An epoxy resin composition with rapid curing and low linear shrinkage, composed of an epoxy resin, an amine curing agent, and an additive. The ratio of the epoxy equivalent of the epoxy resin to the active hydrogen equivalent of the amin...  
WO/2018/038908A1
Polyester-epoxide polymer (PEEP) compositions are disclosed. The PEEP compositions comprise a reaction product of a polyepoxide compound (eq. wt. 125 to 250 g/eq.) and a polyester polyol composition. The ratio of epoxy equivalents to hyd...  
WO/2018/035397A1
The present disclosure provides an adduct comprising the reaction product of a residual epoxy oligomer product and a reactive compound having at least two reactive hydrogens where the residual epoxy oligomer product was obtained from a p...  
WO/2018/034856A1
Alkoxylated hydrophobes that include a poly(alkylene oxide) chain of at least 5 oxyalkylene units having a terminal secondary hydroxyl group or a terminal C1-8 hydrocarbyl group are effective internal mold release agents for epoxy resin ...  
WO/2018/029311A1
The invention relates to an impact modifier which is an isocyanate-terminated polymer, the isocyanate groups of which are partially or completely blocked by reaction with a blocking agent, obtainable by A) reacting a) two or more polyols...  
WO/2018/029313A1
The invention relates to a method for producing an impact modifier which is an isocyanate-terminated polymer, the isocyanate groups of which are partially or completely blocked by reaction with a blocking agent, comprising the steps of A...  
WO/2018/031103A1
There is provided herein a curable epoxy composition comprising (a) at least one epoxy compound; (b) at least one oligomeric aromatic polyester phosphorus- containing curing agent; and, (c) at least one co-curing agent having a dielectri...  
WO/2018/030184A1
[Problem] The present invention provides: an epoxy resin composition which exhibits excellent storage stability, while having low initial viscosity and good curability at low temperatures; and a conductive adhesive which contains this ep...  
WO/2018/030216A1
This resin composition for in-vehicle module substrates is used for the purpose of forming an in-vehicle module substrate, and contains a bisphenol A epoxy resin having an epoxy equivalent weight of from 100 g/eq to 500 g/eq (inclusive),...  
WO/2018/031511A1
Disclosed are biocidal self-healing protective materials, including coatings, stains, sealants, and adhesives. The biocidal protective materials may include a first microcapsule that includes a hydrophobic film-forming agent and a hydrop...  
WO/2018/026556A3
To provide a heat-dissipating resin composition, and cured product thereof, which can effectively transmit heat generated from a heat-generating part such as a semiconductor element or the like with a high heating value to an object such...  

Matches 1 - 50 out of 40,921