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Patent Searching and Data


Matches 1 - 50 out of 40,589

Document Document Title
WO/2018/011904A1
The thermally curable resin composition of the present invention is characterized by comprising an epoxy resin (1) including a hardener and inorganic particles (2) having a rutile-form crystal structure and having an average particle dia...  
WO/2018/012534A1
Provided is an infrared LED having an insulating film formed on an element, and a microlens formed on the insulating film, wherein the infrared LED is characterized in that the insulating film and the microlens are formed using a radiati...  
WO/2018/008257A1
To provide a sealing material for affixing to an electronic element provided to an electronic substrate or the like or a portion where metal is exposed and protecting the electronic element or other adherend from moisture and the like, a...  
WO/2018/009086A1
A thermosetting powder paint containing solid resin, hardener, texturing agent, additives, fillers and optionally pigments, is characterised in that the texturing agent (in an amount ranging from 1 to 20% by weight, with a melting point ...  
WO/2018/007576A1
The invention relates to cold and hot curing of unsaturated polyester resins, such as polyester resins and methylmethacrylate resins using mercaptans as reaction accelerators.  
WO/2018/004273A1
The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using th...  
WO/2018/003691A1
Provided is an epoxy resin composition with which an epoxy resin cured product with a high heat resistance and elastic modulus as well as a low colorability can be obtained, said epoxy resin composition not producing white deposits on a ...  
WO/2018/003590A1
The heat-curable resin composition according to the present invention is for use in forming an insulating layer of a printed wiring board, and comprises a heat-curable resin, a hardener, and an inorganic filler. The heat-curable resin co...  
WO/2018/000125A1
Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compoun...  
WO/2018/005045A1
The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a fiber material of a heat resistant fiber, such as a continuous fiber material or a discontinuous chopped fiber mat, in...  
WO/2018/003690A1
Provided is an epoxy resin composition with which an epoxy resin cured product with a high heat resistance and elastic modulus as well as a low colorability can be obtained, said epoxy resin composition not producing white deposits on a ...  
WO/2017/222151A1
The present invention relates to: a resin composition for sealing a solid state semiconductor device, comprising an epoxy resin containing a compound represented by chemical formula 1, a curing agent, and an inorganic filler; an encapsul...  
WO/2017/220386A1
Solution comprising a sulfone polymer, a water-soluble polymer and a N-acyl-morpholine of formula I wherein R1 is a hydrogen atom or a C1- to C3 alkyl group.  
WO/2017/221542A1
The present invention provides: a two-pack type epoxy resin composition which, upon mixing thereof, gives an epoxy resin composition that has excellent viscosity stability at a low temperature (40ÂșC) and retains a low viscosity during i...  
WO/2017/220507A1
The invention relates to the use of at least one mixed mineral organoclay rheology additive, which comprises or consists of a quaternary alkyl-ammonium salt treated mineral clay mixture prepared by forming an aqueous hormite clay slurry ...  
WO/2017/222339A1
The present invention relates to an epoxy resin composition suitable for mass production of a fiber-reinforced composite, and a prepreg using the same. The epoxy resin composition comprises: component (A), which is a mixture of a difunct...  
WO/2017/220347A1
The present invention provides a curable liquid epoxy resin composition useful as underfill material for semiconductor devices, which comprises (a) an epoxy resin component, (b) an aromatic hydrocarbon formaldehyde resin, (c) a curing ag...  
WO/2017/219944A1
A method for manufacturing a graphene-epoxy resin composite material, comprising the following steps: first, mixing a graphene nanoplatelet with organic solvent, to obtain a dispersion liquid; further mixing the dispersion liquid obtaine...  
WO/2017/220583A1
The present invention relates to thermosetting epoxy resin compositions which on the one hand at room temperature in the incompletely cured state exhibit extremely slight alteration in shape and on the other hand develop a high surface t...  
WO/2017/214674A1
An aliphatic epoxy resin precursor composition containing an epoxy component and, optionally, a reactive component, the composition containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor c...  
WO/2017/217276A1
A thermosetting epoxy resin composition containing: epoxy resin; a latent curing agent being porous particles comprising polyuria resin and holding aluminium chelate; and boric acid.  
WO/2017/217638A1
The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy res...  
WO/2017/209093A1
The purpose of the present invention is to provide a resin composition for printed wiring boards, which has high flexibility in a B-stage state, and a cured product of which has high dimensional stability with respect to heat. A resin co...  
WO/2017/209047A1
A first sealing composition according to the present invention contains an epoxy resin, a curing agent, an inorganic filler and an uncalcined hydrotalcite compound having a molar ratio of Mg ions to Al ions (Mg/Al) of 2.4 or more. A seco...  
WO/2017/204206A1
To provide a resin composition having excellent heat resistance and dry etching resistance that can be used suitably as a resin material for a resist, a cured product thereof, a resin material for a resist made using the resin compositio...  
WO/2017/205175A1
The teachings herein are directed at solid polymeric adhesive compositions for adhering metal components, methods for compounding the polymeric adhesive compositions, articles including a component having the polymeric adhesive compositi...  
WO/2017/202596A1
The invention relates to a molding compound (100) for electronic components, comprising a plastic main matrix (10) into which polypropylene particles (11) having a beta crystallite structure are introduced.  
WO/2017/202771A1
This invention relates to the technical field of composite materials comprising a thermosetting polymer-based matrix in which thermoplastic polymer and/or elastomer particles are dispersed. More specifically, the invention relates to a n...  
WO/2017/201592A1
The present invention relates to a liquid, homogeneous and isotropic composite material in three dimensions, formed by a composition of resin pre-reinforced with glass micro-filaments, and to the method for producing same. The microfilam...  
WO/2017/199905A1
One purpose of the present invention is to provide a sealing agent for liquid crystal display elements, which enables the achievement of a liquid crystal display element that has excellent bonding properties, low possibility of contamina...  
WO/2017/199639A1
This thermosetting resin composition for LDS contains a thermosetting resin, an inorganic filler, a non-conductive metal compound that forms a metal nucleus upon irradiation of an active energy ray, and a coupling agent. The non-conducti...  
WO/2017/201473A1
A wiper blade having a wiper strip having a wide portion and a lip, and an elongate backing element. The backing element having a top portion, and two opposing legs that descend from the top portion, such that each opposing leg has a cla...  
WO/2017/199989A1
Provided is a polybutylene terephthalate-based resin composition characterized by containing, with respect to 100 parts by mass of (A) a polybutylene terephthalate resin, (B) a total of 30-60 parts by mass of at least two different bromi...  
WO/2017/195304A1
A liquid resin composition for encapsulation which comprises (A) an epoxy resin, (B) a hardener having at least one amino group in the molecule, (C) a high-molecular-weight resin, and (D) an inorganic filler, wherein the high-molecular-w...  
WO/2017/193463A1
The present invention discloses a composite phosphorus flame retardant comprising cyclic organophosphate with multiple DOPO moieties, and manufacturing method thereof. The composite structure phosphorus flame retardant has a structural f...  
WO/2017/192419A1
The present invention provides aqueous compositions for making damage tolerant coatings comprising a blend of (i) from 2 to 30 wt.%, based on the total weight of solids in the composition, of an acid or anhydride functionalized polyolefi...  
WO/2017/191801A1
The present invention provides a resin composition characterized by containing a polycyclic aromatic epoxy resin (A1), a non-aromatic epoxy resin (A2) having a C6 or higher aliphatic hydrocarbon structure and not having an aromatic ring ...  
WO/2017/186870A1
A particulate coating composition, preferably a powder coating composition, comprising: (i) at least one hardener such as at least one epoxy containing compound, (ii) at least one polyester polymer, (iii) at least one amino alcohol; and ...  
WO/2017/188286A1
This sealing liquid epoxy resin composition comprises an epoxy resin, a curing agent, and particles having a core shell structure. The particles having the core shell structure comprise a core portion containing crosslinked polysiloxane,...  
WO/2017/188155A1
This thermosetting resin composition contains an epoxy resin, a curing accelerator, a (meth)acryloyl group-containing compound and a compound which has an acidic functional group and has a weight average molecular weight of 1000 or more....  
WO/2017/188384A1
This composition for laminates is characterized by containing: (a) an epichlorohydrin polymer; (b) a compound having a vinyl group; (c) at least one compound selected from the group consisting of 1, 8-diazabicyclo(5. 4. 0)undecene-7 salt...  
WO/2017/190053A2
Methods for preparing dynamic cross-linked polymer compositions derived from an ester oligomer component, a polymeric chain extender component, and transesterification and poly condensation catalysts are described.  
WO/2017/186618A1
It is proposed a conductor arrangement (100) for insulating an electrical conductor (101) with a mica tape (200) and a resin mixture. The conductor arrangement including an electrical conductor (101); and an insulation being provided aro...  
WO/2017/188448A1
Provided are: a composition for a benzoxazine-compound-containing curable resin, which can be used under severer use conditions in the fields of adhesive agents, sealing materials, paints, matrix resins for composite materials and the li...  
WO/2017/188604A1
The present invention relates to: a resin composition comprising a mercaptosilane coupling agent, a hydrolysis resistant additive, a filler, and a polyarylene sulfide having a chlorine content of 300 ppm or less; and a molded product man...  
WO/2017/183226A1
Provided are a thermosetting resin composition capable of forming a cured film having high hardness, high transparency, and adhesion to glass or ITO, and an application for the same. The thermosetting resin composition according to the p...  
WO/2017/184514A1
The present disclosure is directed to a two-component epoxy resin paint, comprising a) an epoxy resin component; and b) an amine component for curing the epoxy resin component, the amine component comprising: i) at least one polyamide cu...  
WO/2017/181323A1
An epoxy modified cement composition having (A) epoxy resin comprising at least one epoxy resin, (B) a curing agent comprising water and at least one amine compound selected from the group consisting of polyamine, polyamide, a polyamidoa...  
WO/2017/183496A1
[Problem] To provide a thermosetting resin composition which forms a protection film for flexible wiring boards, said protection film having excellent bending resistance and being sufficiently suppressed in warping, while maintaining hig...  
WO/2017/179358A1
Provided are: an epoxy resin curing agent containing an amine compound (A) indicated by general formula (1) and a phenol compound (B), said epoxy resin curing agent having a component (B) content of 8-35 parts by mass relative to 100 par...  

Matches 1 - 50 out of 40,589