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Patent Searching and Data


Matches 1 - 50 out of 42,538

Document Document Title
WO/2019/175338A1
The disclosure relates to a curable mixture, in particular for use in impregnation of paper bushings, comprising (a) a resin composition comprising a bisphenol-A-diglycidylether; a polyglycidylether different from BADGE and/or a cycloali...  
WO/2019/176859A1
This epoxy resin composition contains an epoxy resin, a curing agent, alumina particles, and a silane compound that does not have a functional group reactive to an epoxy group, that has a functional group not reactive to an epoxy group, ...  
WO/2019/174972A1
The present invention relates to a PVC plastisol composition comprising at least one vinyl chloride polymer selected from polyvinylchlorides and copolymers of vinyl chloride with one or more monomers; at least one plasticizer; at least o...  
WO/2019/176074A1
This epoxy resin has a mesogenic structure and a siloxane structure. This epoxy resin composition contains: an epoxy resin having a mesogenic structure and a siloxane structure; and a curing agent.  
WO/2019/175342A1
Disclosed are a storage stable resin composition, comprising an epoxy resin, a block-copolymer with silicone and organic blocks, and a silane, a process for obtaining such storage stable resin composition, a curable resin composition obt...  
WO/2019/176554A1
Provided are an underfill material whereby high connection reliability can be obtained, and a method for manufacturing a semiconductor device using the same. The underfill material contains an epoxy compound, an epoxy curing agent, and a...  
WO/2019/177013A1
This hollow-particle dispersion contains: hollow particles each having a shell formed by at least one layer; an acidic compound; and an organic solvent, wherein the at least one layer contains nitrogen and carbon atoms, the contained amo...  
WO/2019/171993A1
Provided are: an epoxy resin composition which enables the achievement of an epoxy resin cured product that has excellent tracking resistance and excellent thermal decomposition stability, while having a good balance between the tracking...  
WO/2019/171998A1
The present invention addresses the problem of providing: a coloring curable resin composition which is capable of forming a color filter that is suppressed in decrease of the brightness even if a metal compound is contained therein; a c...  
WO/2019/171991A1
The purpose of the present invention is to provide a resin composition which has excellent fast curing properties without deteriorating heat resistance and low viscosity. A resin composition for fiber-reinforced composite materials, whic...  
WO/2019/171613A1
Provided is a resin composition comprising; (A) a cellulose acylate; (B) a polyester resin; and (C) a cardanol composition containing a cardanol type compound having an epoxy group.  
WO/2019/172347A1
[Problem] To provide: a curable composition for a polymer electrolyte, the curable composition being capable of providing strong adhesion between a polymer electrolyte and another substrate such as a heat resistant polymer, and exhibitin...  
WO/2019/172342A1
Provided are a prepreg, a layered plate, a multilayer printed wiring board, and a semiconductor package which have high adhesion to conductors, excellent heat resistance, high glass transition temperatures, low thermal expansion coeffici...  
WO/2019/167579A1
A heat-curable resin composition which contains at least [A] an epoxy resin having at least two glycidyl groups, [B] a cyanate ester resin having at least two cyanate groups and [C] an amine compound and meets the requirements (1) and (2...  
WO/2019/166579A1
The present invention relates to a new elasticizing additive, to be introduced into a polymerizable material, particularly an epoxy resin, and formed with it, a structural adhesive obtained by reaction of a first reaction component made ...  
WO/2019/167905A1
The present invention provides a resin composition for sealing, which has excellent moisture barrier properties and is thus capable of suppressing deterioration of an element such as an EL element due to the moisture taken in the resin c...  
WO/2019/165583A1
Disclosed by the present invention are a reversible self-repairing epoxy resin and a preparation and recovery remoulding method therefor. Under the catalysis of potassium iodide, the acetate solution of 2-mercaptoacetic acid is oxidized ...  
WO/2019/165281A1
The invention provides methods and compositions that prevent, mitigate or delay the onset of corrosion of iron or steel (e.g., plain carbon steel) components used as reinforcement or otherwise at least partially embedded in carbonated co...  
WO/2019/165359A1
Disclosed are mixtures of polyphosphonates with carbon nanotubes (CNTs), blends of polycarbonate and polyphosphonate with CNTs, and methods of manufacturing and using the same, as well as articles made therefrom. In some embodiments, art...  
WO/2019/163818A1
The present invention pertains to: an epoxy resin composition which is capable of undergoing curing in a short period of time even under low-temperature conditions to form a cured product having excellent moisture resistance, and which i...  
WO/2019/159368A1
An epoxy resin composition that is a reaction induction-type epoxy resin composition containing an epoxy compound and a curing agent and capable of forming a smectic liquid crystal structure, that contains no filler or has a filler conte...  
WO/2019/160287A1
The present invention relates to a thermosetting resin composition, for a semiconductor package, having excellent flowability and stiffness, and a prepreg using same. More particularly, provided are a thermosetting resin composition for ...  
WO/2019/155950A1
A resin composition for semiconductor sealing use according to the present invention which contains an epoxy resin, a curing agent, an inorganic filler and carbon black microparticles. When the resin composition for semiconductor sealing...  
WO/2019/154933A1
The invention initially relates to a sprayable formulation for producing a multi-layer insulation for an electrical machine, in particular a rotating electrical machine in the high-voltage or medium-voltage range such as a generator, tra...  
WO/2019/153218A1
An environmentally friendly non-destructive fiber-reinforced composite material recovering method, comprising the following steps: (A) placing a fiber-reinforced resin-based composite material in an electrolyte, wherein the electrolyte c...  
WO/2019/155800A1
The present invention addresses the problem of providing a resist composition which has excellent storage stability and is excellent in terms of screen printability, resolution, low warpage, flexibility, chemical resistance, and flame re...  
WO/2019/156341A1
The present invention relates to a powder coating composition comprising: epoxy resins including a bisphenol A type epoxy resin, an isocyanate modified epoxy resin, and a novolac type epoxy resin; and an amine-based curing agent.  
WO/2019/153108A1
The present invention provides a curable epoxy resin composition and a cured product, prepreg, and fiber-reinforced composite material obtained therefrom. The curable epoxy resin composition according to the present invention has low vis...  
WO/2019/154932A1
The invention initially relates to a sprayable formulation for producing an insulating system for an electrical machine, in particular a rotating electrical machine in the high-voltage or medium-voltage range such as a generator and/or a...  
WO/2019/150433A1
Disclosed is a thermosetting resin composition comprising: an epoxy resin; a hardening agent; a first elastomer having at least one type of functional group selected from a group consisting of a carboxy group and a hydroxy group; and a s...  
WO/2019/151645A1
The present invention relates to an adhesive film for a semiconductor, comprising: an adhesive binder; a first layer comprising a heat dissipating filler; and a second layer formed on at least one surface of the first layer and comprisin...  
WO/2019/150994A1
Provided is a resin composition capable of suppressing a decrease in capacitance or a decrease in dielectric constant while maintaining excellent dielectric properties and circuit adhesiveness when used as a dielectric layer of a capacit...  
WO/2019/151471A1
Provided are: a resist underlayer film having, in particular, a high dry etching speed; the resist underlayer film formation composition; a resist pattern formation method, and a method for manufacturing a semiconductor device. The resis...  
WO/2019/146736A1
The present invention provides a curable resin composition for sealing, which contains (A) a bifunctional alicyclic epoxy resin having a molecular weight of less than 1,000, (B) a polyfunctional epoxy resin having a molecular weight of 1...  
WO/2019/145349A1
The present invention relates to a composition comprising a binder comprising one or more siloxane polymers, silicone resins, silicone based elastomers, and mixtures thereof, wherein said binder optionally comprises one or more cross-lin...  
WO/2019/146617A1
The problem addressed by the present invention is to provide a resin composition for sealing capable of suppressing warpage even when sealing a large-area substrate. To solve this problem, a resin composition for sealing electronic compo...  
WO/2019/146532A1
Provided is an alkali-soluble resin that is used to obtain an alkali-soluble radiation-sensitive resin composition having excellent alkali solubility and resolution, and developability with a close fit. The present invention pertains to ...  
WO/2019/145352A1
The present invention relates to a composition comprising a binder comprising one or more siloxane polymers, silicone resins, silicone based elastomers, and mixtures thereof, wherein said binder optionally comprises one or more cross- li...  
WO/2019/148084A1
A process of forming a composite structure by providing a plurality of layers having one or more of a fiber or a fabric; applying a tackifier to each of the layers, the tackifiers comprising sPEKK in amount selected to on provide tackifi...  
WO/2019/146693A1
Provided is an aromatic polycarbonate resin composition which comprises an aromatic polycarbonate resin (A), a polyether derivative (B), and a specific aromatic compound (C), wherein the polyether derivative (B) is contained in an amount...  
WO/2019/142646A1
According to the present invention, a curable resin composition for case type sealing under no pressure is in a solid state at 25°C and has a gel time of 10 minutes or more at 110°C.  
WO/2019/142752A1
Provided is a heat-curable resin composition which rarely undergoes dripping or bleeding even when used for the hole plugging in a printed wiring board which has holes, such as through-holes, each having a large opening size, and is part...  
WO/2019/138919A1
This liquid sealing resin composition contains an epoxy resin, an amine-based curing agent, and a cyclic carbodiimide.  
WO/2019/138953A1
This composition includes a pigment, a cationic polymer compound, and an acid-generating agent. It is preferred that the pigment includes a tetraaza porphyrin pigment, a triarylmethane pigment or a cyanine pigment. It is preferred that t...  
WO/2019/139354A1
The present invention relates to an epoxy resin composition for semiconductor molding, which has excellent heat resistance and mechanical properties and has a low thermal expansion coefficient and thus exhibits an improved bending proper...  
WO/2019/134821A1
The invention relates to an epoxy resin composition comprising at least one epoxy liquid resin, bis(aminomethyl)cyclohexane and a wax. The claimed composition can be processed in an excellent manner, cures very rapidly and virtually no y...  
WO/2019/127172A1
This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present inventio...  
WO/2019/133354A1
The present invention is directed to multifunctional surfacing films each comprising: (a) a single layer of curable polymer composition having opposing first and second surfaces: (b) a peelable porous sheet disposed at or beneath the sec...  
WO/2019/131095A1
An encapsulating epoxy resin composition for ball grid array (BGA) packages which comprises an epoxy resin, a phenolic hardener having a hydroxyl equivalent of 120 g/eq or less, and an inorganic filler comprising alumina particles and si...  
WO/2019/127391A1
The present invention relates to a maleimide resin composition and a prepreg, a laminate and a printed circuit board using same. The maleimide resin composition of the present invention comprises: a maleimide compound (A) with a structur...  

Matches 1 - 50 out of 42,538