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Matches 1 - 50 out of 43,820

Document Document Title
WO/2020/189879A1
The present invention relates to an epoxy resin composition comprising: an epoxy resin; a curing agent; an adhesion enhancer; a coupling agent; a curing accelerator; and a filler, wherein the adhesion enhancer comprises a triazine-based ...  
WO/2020/189445A1
A thermally conductive composition of the present invention comprises: metal particles; a binder resin; and a monomer; wherein the metal particle is sintered by thermal treatment to form a particle connection structure, and satisfies the...  
WO/2020/186571A1
Provided in the present disclosure are a resin composition, a prepreg containing same, and a laminate and a printed circuit board. The resin composition comprises: 100 parts by weight of halogen-free epoxy resin; 11-37 parts by weight of...  
WO/2020/186572A1
The present disclosure provides a resin composition and prepreg containing same, and a laminate board and a printed circuit board. The resin composition contains: 48-54 parts by weight of halogen-free epoxy resin; 16-31 parts by weight o...  
WO/2020/188853A1
A resin composition which comprises an epoxy resin having a mesogenic skeleton and an organic compound having a first functional group, which is capable of forming a crosslinked structure together with the epoxy resin or other organic co...  
WO/2020/186881A1
Disclosed is an ultra-pure sphere-like β silicon nitride powder with a low radioactivity, wherein the degree of sphericity is between 0.5-0.99, the uranium impurity content is < 5 ppb, the thorium impurity content is < 5 ppb, and the pa...  
WO/2020/189778A1
A resin composition containing: a magnetic filler which has a ferrite-containing magnetic powder and a coating layer which contains a silicon oxide and coats the magnetic powder; and a (B) resin component.  
WO/2020/189309A1
A resin composition for sealing which contains an epoxy resin, a curing agent, and an inorganic filler material, wherein the inorganic filler material comprises an inorganic filler material which has been surface treated.  
WO/2020/183449A1
A composite member and a method for manufacturing polymeric material article are presented. The method comprising providing polymeric resin, providing selected amount of filler material, mixing filler material into the polymeric matrix t...  
WO/2020/184222A1
The present invention provides a resin composition having infrared ray-blocking capability and excellent moist heat resistance while maintaining high transparency. This resin composition is characterized by containing, with respect to (A...  
WO/2020/184324A1
Provided is a resin composition for a fiber-reinforced plastic, the resin composition having an excellent balance between stability and curability, and producing a fiber-reinforced plastic having improved strength. This resin composition...  
WO/2020/184549A1
This module is provided with a substrate, components disposed on the substrate, and a sealing material that covers the substrate and the components. There are no gaps between the substrate and the sealing material and between the compone...  
WO/2020/184577A1
The present invention provides an impeller formed from a resin composition having high tensile strength and specific strength in a high-temperature environment, and having high dimensional accuracy and excellent fire resistance. The impe...  
WO/2020/183834A1
This resin composition contains, with respect to 100 parts by mass of an aromatic polycarbonate resin (A): 0.1-3 parts by mass of a polyoxytetramethylene glycol-based multidimensional polymer (B); and 0.005-0.4 parts by mass of a phospho...  
WO/2020/177167A1
Provided in the present disclosure are a halogen-free flame-retardant thermosetting resin composition, a prepreg for printed circuits, and a metal-clad laminate. The halogen-free flame-retardant thermosetting resin composition comprises:...  
WO/2020/181038A1
Chemically resistant sealant compositions include high equivalent weight sulfur-containing prepolymers. Upon exposure to chemicals the properties of sealants prepared using the prepolymers exhibit excellent fuel and phosphate ester resis...  
WO/2020/179668A1
The present invention is a polyester resin composition containing 18-35 parts by mass of a polybutylene terephthalate resin (A), 10-25 parts by mass of a polyethylene terephthalate resin (B), 10-20 parts by mass of a thermoplastic polyes...  
WO/2020/179642A1
The purpose of the present invention is to provide: a porous body in which an imbibition under acidic conditions is suppressed; and a method for producing the porous body. In order to achieve the purpose, a first porous body according ...  
WO/2020/177110A1
A formaldehyde free adhesive composition and a plywood obtained by the adhesive composition is provided, and the plywood retains desired performances, such as water resistance and workability.  
WO/2020/173547A1
The invention relates to cross-linkable polymer-powder compositions that are re-dispersible in water, containing one or more vinyl ester polymers, one or more compounds bearing epoxide groups, and optionally one or more curing agents tha...  
WO/2020/175669A1
A sealing composition that contains: a first epoxy resin which comprises, in each molecule, at least two benzene rings and at least one ether bond that connects the two benzene rings directly or via a linking group, and which is configur...  
WO/2020/175055A1
The present invention addresses the problem of providing a conductive composition and a conductive adhesive agent that have high fluidity and conductivity. The present invention provides a conductive composition containing (A) conductive...  
WO/2020/173216A1
The present invention relates to a thermosetting resin composition, the raw material components of which comprise a biphenyl-type maleimide resin, a carbodiimide, a rubber toughening agent with a core-shell structure, and a thermosetting...  
WO/2020/176456A1
A curable epoxy composition, comprising: an epoxy resin composition comprising one or more epoxy resins, each independently having at least two epoxy groups per molecule; an epoxy resin curing agent; optionally a curing catalyst; and a f...  
WO/2020/170908A1
A multiple package-type curable composition which comprises: an agent A that contains (A) a polyoxyalkylene polymer having a reactive silicon group, (B) a (meth)acrylic acid ester polymer having a reactive silicon group, and (D) an epoxy...  
WO/2020/170778A1
The purpose of the present invention is to provide: a liquid epoxy resin composition which is a low-viscosity liquid at room temperature, exhibits sufficient adhesive strength, and provides a cured product exhibiting a lower dielectric c...  
WO/2020/171186A1
A composition which contains (A) a cationically polymerizable compound, (B) a cationic photopolymerization initiator, and (C) one or more phosphoric acid compounds that are selected from the group consisting of phosphoric acid esters and...  
WO/2020/164896A1
The subject matter of the invention is a kit for floor coating or for wall coating, comprising: - a component A comprising an epoxy resin, - a component B comprising a hardener, which is a compound comprising at least one N-H or S-H func...  
WO/2020/166137A1
The present invention provides an electroconductive composition which gives electroconductive films having a low volume resistivity and excellent moisture resistance. The electroconductive composition of the present invention comprises e...  
WO/2020/164254A1
Provided are an optical diffusion film preparation method and a backlight module, comprising: removing impurities from cellulose crystallite to obtain a first solid compound, adding the first solid compound into a surfactant solution, an...  
WO/2020/166180A1
The purpose of the present invention is to provide an electroconductive composition which gives electroconductive films having a low volume resistivity and a low contact resistivity. The electroconductive composition of the present inven...  
WO/2020/162274A1
Provided are a syringe filled with a resin composition and a storage method therefor. The present invention suppresses air inclusion which causes intermittent discharge of a resin composition from a syringe. This syringe filled with a re...  
WO/2020/162278A1
Provided is a composition for suppressing back exposure of a photosensitive composition that is cured with light having a wavelength of 350-420 nm. This composition contains a compound (A) having: a naphthalene skeleton; and a substituen...  
WO/2020/162414A1
Provided are: a stabilizing agent that can impart excellent heat stability, coloring resistance, anti-thermal discoloration, etc. to a vinyl chloride resin, and can also impart excellent transparency to a vinyl chloride resin, if the vin...  
WO/2020/158259A1
The present invention provides a composition for forming a thermally conductive material, which enables the achievement of a thermally conductive material that has excellent thermal conductivity. The present invention also provides a the...  
WO/2020/158574A1
The present invention provides a composition for heat conductive materials, which enables the achievement of a heat conductive material that exhibits excellent heat conductivity. The present invention also provides: a heat conductive mat...  
WO/2020/155291A1
Provided by the present invention are a thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bism...  
WO/2020/158300A1
To provide a hologram recording composition which ensures further improvement in diffraction characteristics and hologram transparency. The present technique provides a hologram recording composition which at least comprises a chromic ...  
WO/2020/156366A1
The present invention relates to a polyphenol-modified hydrocarbon composition-based prepreg and a copper clad laminate. In the present invention, a hydroxy-terminated, amino-terminated or mercapto-terminated modified polyarylether or po...  
WO/2020/158851A1
A resin composition for sealing, which contains: an epoxy resin; a curing agent that contains an active ester compound; and a thermosetting silicone.  
WO/2020/158903A1
The present invention provides: a novel resin composition for a powder lamination shaping method; pellets; a powder; a shaped article using this resin composition; and a method for producing this shaped article. A resin composition which...  
WO/2020/151527A1
The invention discloses a method for implementing mercapto-epoxy deep photocuring and an application thereof. A point light source with a wavelength in the range of 220-400nm is used for irradiating a photocuring composition to generate ...  
WO/2020/150798A1
A kit for solidifying breast milk and a process for solidifying breast milk using said kit are described, providing for the transformation of breast milk into a solid product by means of a chemical reaction, with the proportions of each ...  
WO/2020/153205A1
Provided is a composition that enables provision of a thermally-conductive material having excellent thermal conductivity. Also provided are a thermally-conductive sheet and a device equipped with a thermally-conductive layer. This compo...  
WO/2020/145083A1
The present invention is a resin composition and the like comprising an epoxy resin, a curing agent, and an inorganic filler, wherein the inorganic filler is dispersed in the epoxy resin. The inorganic filler contains two or more types o...  
WO/2020/144139A1
The present invention relates to a process for preparing polymer/opaque filler composite materials using a three-component copper complex/iodonium salt/amine as photoinitiating system, and uses of a copper complex and/or tri-association ...  
WO/2020/143336A1
Disclosed in the present invention are a high-frequency resin prepolymer, and a high-frequency resin composition, a prepreg, a laminated board, and an interlayer insulating film prepared by using same. The high-frequency resin prepolymer...  
WO/2020/141130A1
The present invention relates to heat-curing epoxy resin compositions containing a dihydracide as a hardener, which is selected from the group consisting of glutaric acid dihydracide, adipic acid dihydracide and pimelic acid dihydracide ...  
WO/2020/133335A1
Provided in the present invention are a thermosetting resin composition, a prepreg using same, a metal foil-cladded laminate, and a printed circuit board. The thermosetting resin composition comprises an epoxy resin, a phosphorous-contai...  
WO/2020/137339A1
A resin composition according to the present invention is used to form a stress relaxation layer (102) of a metal base copper-clad laminate (100) configured by laminating a metal plate (101), a stress relation layer (102), and a copper f...  

Matches 1 - 50 out of 43,820