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Matches 1 - 50 out of 41,632

Document Document Title
WO/2018/221682A1
A liquid resin composition for resin molding, including: an aliphatic epoxy compound (A); an epoxy compound (B) having an aromatic ring in the molecules thereof; a nitrogen-containing heterocyclic compound (C); and an inorganic filler (D).  
WO/2018/220133A1
The present invention relates to a composition containing cement, filler, polymer and a compound comprising epoxy groups and an amine, wherein the composition contains more than 10 wt% cement and is a storage-stable, pourable powder and/...  
WO/2018/218597A1
A high temperature resistant and aging resistant LED packaging material, comprising the following raw materials in parts by weight: 40-80 parts by weight of an epoxy resin, 20-60 parts by weight of a silicone resin, 20-60 parts by weight...  
WO/2018/221373A1
Provided is a polysiloxane-polyalkylene glycol block copolymer which can be obtained by reacting a polysiloxane (A) having a functional group selected from among a carboxylic acid anhydride group, a hydroxyl group, an epoxy group, a carb...  
WO/2018/221681A1
A liquid resin composition for sealing that includes: an aliphatic epoxy compound (A); an epoxy compound (B) having an aromatic ring in the molecules thereof; a nitrogen-containing heterocyclic compound (C); and an inorganic filler (D). ...  
WO/2018/220934A1
Provided are: an epoxy resin composition that has exceptional releaseability during continuous molding and exceptional soldering heat resistance (product adhesion), and that undergoes little discoloration when left at high temperatures; ...  
WO/2018/216739A1
The purpose of the present invention is to provide an electroconductive film composition which is excellent in terms of solderability, screen printability, low resistance, adhesion to substrates, and storage stability. The electroconduct...  
WO/2018/216524A1
Provided are: a molding material that enables the achievement of a fiber-reinforced composite material which has excellent releasability from a mold and excellent surface appearance, and which does not soil a mold surface much after mold...  
WO/2018/214680A1
A basalt fiber composite material and a preparation method therefor. The method comprises: mixing an epoxy resin and a cyanate resin by stirring according to a ratio, adding a toughening agent, then adding a solidification catalyst, and ...  
WO/2018/216647A1
This resin composition contains: an aromatic compound (A) obtained by directly bonding, to an aromatic ring, a monovalent substituent represented by formula (1a) and a monovalent substituent represented by formula (1b); and a maleimide c...  
WO/2018/216229A1
A thermosetting resin composition which contains a thermosetting resin, an activator and a thixotropy-imparting agent. The thermosetting resin contains a base material and a curing agent. The base material contains a bi- or higher functi...  
WO/2018/217996A1
A curable composition, includes a diluent, an epoxy functionalized resin derived from a nutshell oil, an epoxy-rubber copolymer adduct, and a curing agent. There is disclosed a method for making the curable composition, a method of imbui...  
WO/2018/214681A1
An epoxy resin wave-absorbing composite material and a preparation method therefor. The method comprises: heating an epoxy resin to 50-70°C and adding carbon black to obtain an epoxy resin/carbon black mixture; heating the epoxy resin/c...  
WO/2018/216752A1
The present invention addresses the problem of providing: an epoxy resin that has excellent flexibility; an epoxy resin-containing composition; and a cured product. The present invention relates to an epoxy resin which is a reaction prod...  
WO/2018/216814A1
Provided are: a conductive paste composition which has low electrical resistance and does not cause excessive shrinkage during the formation process of an electrode, while being capable of suppressing internal stress upon the completion ...  
WO/2018/211799A1
This liquid thermosetting resin composition contains a thermosetting resin (1), nanocarbon (2), an organic additive (5) having, at an end of the molecule, a functional group which reacts with the thermosetting resin and the nanocarbon, a...  
WO/2018/207509A1
Provided is a fiber-reinforced composite material having high heat resistance and excellent quality of appearance. This epoxy resin composition for a fiber-reinforced composite material comprises the following constituent elements (A), (...  
WO/2018/207510A1
Provided is a method for producing a fiber-reinforced composite material having high heat resistance and excellent quality of appearance. Disclosed is a method for producing a fiber-reinforced composite material, the method comprising: a...  
WO/2018/207820A1
Provided is an insulating sheet which can effectively enhance thermal conductivity and adhesiveness, and which can effectively suppress variation in the adhesiveness. This insulating sheet includes a thermosetting component and boron n...  
WO/2018/207532A1
Provided are: an active ester compound that exhibits excellent dielectric characteristics and copper foil adhesiveness in a cured product; a curable composition comprising the same and a cured product thereof; and a semiconductor sealing...  
WO/2018/205336A1
Disclosed in the present invention is a light-emitting diode (LED) packaging material, which is formed by compositing graphene and silane or epoxy resin so as to alleviate deficiencies which exist when preparing an LED packaging material...  
WO/2018/205020A1
The present relates to a process for the depolymerization of a feedstock comprising lignin producing depolymerized lignins comprising the loading of the feedstock, a catalyst, a polyalcohol, and water into a reactor; heating the reactor ...  
WO/2018/207821A1
Provided is an insulating sheet which can effectively enhance thermal conductivity and adhesiveness, and which can effectively suppress the occurrence of voids. This insulating sheet includes a thermosetting component and boron nitride...  
WO/2018/201428A1
A thermally curable sealant composition, comprising: a) a thermally curable resin selected from maleimide resins, maleimide-modified epoxy resins and any combination thereof;b) a latent curing agent;c) a polysiloxane containing a mer...  
WO/2018/199705A1
The present application relates to an encapsulating composition, an organic electronic device comprising same, and a method for manufacturing the organic electronic device, and provides an encapsulating composition which can effectively ...  
WO/2018/199309A1
Provided is a method for manufacturing a sealing film containing a heat curable resin, and an inorganic filler, the method comprising: the step for preparing a resin composition containing a resin having a reactive functional group equiv...  
WO/2018/196517A1
Disclosed are a wave absorbing material and a preparation method therefor, and the preparation method comprises: mixing a raw rubber, a filler, a vulcanising agent and an auxiliary agent into a mixture in a mixing step, and then hot pres...  
WO/2018/199306A1
Provided is a sealing film made of a resin composition comprising a thermosetting resin that has a structural unit represented by formula (1), and an inorganic filler: [in formula (1), X1 denotes a reactive functional group and R1 denote...  
WO/2018/198850A1
[Problem] To provide a poly(arylene sulfide) resin composition and an insert-molded article using the resin composition which exhibit excellent impact resistance at high and low temperatures and low warpage. [Solution] This poly(arylene ...  
WO/2018/199038A1
The present invention provides a polyarylate resin which has excellent fluidity and reactivity with epoxy resin, and can form a cured product having sufficiently excellent heat resistance and dielectric characteristics; and a production ...  
WO/2018/194410A1
The present application relates to a composition for sealing an organic electronic element and an organic electronic device comprising the same, wherein the composition: can form a structure in which the permeation of external moisture o...  
WO/2018/194099A1
This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; and (D) a magnetic filler, wherein the modulus of elasticity of a cured product at 23°C is 7-18 GPa, the cured product being obta...  
WO/2018/194100A1
This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; (D) a magnetic filler; and (E) an inorganic filler other than the magnetic filler, wherein, when a content mass of component (D) i...  
WO/2018/189945A1
The purpose of the present invention is to provide a curable composition that makes it possible to form a hardcoat layer that has a favorable appearance, e.g., favorable surface smoothness (uniformity of thickness), that has high surface...  
WO/2018/190346A1
A thermosetting resin composition according to the present invention comprises a polyester amide acid (A), an epoxy compound (B) having a fluorene skeleton, a coloring agent (D), and a thiol compound (E) having a plurality of thiol group...  
WO/2018/190292A1
A resin composition which contains an epoxy resin (A) represented by general formula (1) and a cyanic acid ester compound (B).  
WO/2018/188932A1
The present invention relates to an organic aerogel obtained by reacting an amine compound having at least two amine functionalities and a cyclic ether compound in the presence of a solvent. An organic aerogel according to the present in...  
WO/2018/184151A1
Provided is a light curable composition comprising a) an epoxy resin component; b) epoxy silane oligomer having a general structure (1) or (2) or (3); and c) a cationic photoinitiator. The said composition provides good adhesion properti...  
WO/2018/186339A1
Provided is a thermoplastic polyester resin composition obtained by blending 0.05-10 parts by weight of an epoxy compound (B) and 0.001-1 parts by weight of a hindered amine compound (C) with 100 parts by weight of a thermoplastic polyes...  
WO/2018/186030A1
Provided is a resin composition capable of: giving a prepreg which has satisfactory formability and high adhesiveness to the base and is reduced in dusting; and forming a cured object having a low coefficient of thermal expansion. The re...  
WO/2018/186972A1
An epoxy resin composition is provided which comprises an epoxy resin and a reactive diluent comprising one or more of the monoesters of epoxidized soy oil characterized by a ratio of mols of epoxide groups to mols of ester on the whole ...  
WO/2018/180091A1
Provided is a resin composition that is capable of achieving excellent thermal properties. The resin composition comprises an epoxy compound and a trinaphthylbenzene compound. (Provided that in the trinaphthylbenzene compound, one or mor...  
WO/2018/181737A1
A paste-like resin composition which contains (A) an epoxy resin, (B) a liquid curing agent, (C) a heat conductive filler and (D) a dispersant.  
WO/2018/181286A1
The present invention provides: a method for producing a prepreg which has small variation in the amount of dimensional change; a prepreg which has small variation in the amount of dimensional change; a laminate; a printed wiring board; ...  
WO/2018/181849A1
Provided is an epoxy resin composition for fiber-reinforced composite materials, which has a good balance between storage stability and impregnation ability during the production of a prepreg, and which enables the achievement of a molde...  
WO/2018/177939A1
An aqueous dispersion comprising at least one fatty acid-modified epoxy amine adduct wherein the fatty acid has an iodine number of lower than 30andat least one polymer obtained from the polymerization of one or more ethylenically unsatu...  
WO/2018/181600A1
An epoxy resin composition for sealing, which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler, and which is configured such that the inorganic filler contains 75% by mass to 98% by ma...  
WO/2018/181601A1
Provided is an epoxy resin composition for sealing, the composition containing (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a C17-C50 fatty acid amide compound.  
WO/2018/181947A1
A polycarbonate resin composition which contains (A) an aromatic polycarbonate resin, (B) an alicyclic epoxy compound, (C) a predetermined antioxidant and (D) a predetermined phosphorus compound, and wherein, relative to 100 parts by mas...  
WO/2018/181802A1
The present invention provides: a curable resin composition with which it is possible to obtain a cured product that is capable of retaining a low thermal expansion rate even in a high-temperature range during component mounting and that...  

Matches 1 - 50 out of 41,632