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Matches 1 - 50 out of 41,157

Document Document Title
WO/2018/126436A1
Disclosed is a composite epoxy resin board, the preparation raw materials thereof include the following components in weight percentages: 5% to 100% of a waste prepreg powder, and 0 to 95% of a waste printed circuit board powder. The was...  
WO/2018/123442A1
Provided is a resin composition that is suitable as a matrix resin for a fiber-reinforced composite material that gives a cured molded product having high toughness and a superior fatigue resistance, the matrix resin exhibiting good impr...  
WO/2018/123795A1
The present invention addresses the problem of providing an aqueous resin composition that can be used as a primer that greatly improves adhesion between a substrate and a cured coating of an active energy ray-curable composition, even i...  
WO/2018/124167A1
The present invention provides: a reliable liquid crystal alignment film that can be obtained even in a low-temperature firing process, has excellent rubbing resistance, and has a desired voltage retention rate; a liquid crystal alignmen...  
WO/2018/124161A1
The resin composition according to the present invention contains :an allylphenol compound (A); a maleimide compound (B); a cyanate ester compound (C); and/or an epoxy compound (D), in order to provide a printed wiring board resin compos...  
WO/2018/120564A1
Provided in the present invention are a phosphorus-containing active ester, a halogen-free resin composition thereof, and a prepreg and a laminate using the same. The halogen-free resin composition comprises: (A) a thermosetting resin; (...  
WO/2018/120590A1
The present invention relates to a flame-retardant polyphenylene ether resin composition, comprising, by weight percent: (A) 10-45% of a phosphorus-containing polyphenylene ether resin with a number-average molecular weight of 1000-6000;...  
WO/2018/120471A1
A method for preparing a benzoxazine-containing resin composition, and a prepreg and a laminate prepared from the resin composition. The method for preparing a benzoxazine-containing resin composition is: adding an acid filler to a benzo...  
WO/2018/120560A1
Disclosed is a polymer-based composite comprising three-dimensional network of filler particles and a preparation method therefor. The polymer-based composite of the present invention comprises a three-dimensional network of filler parti...  
WO/2018/120563A1
The present invention provides a halogen-free epoxy resin composition, and a prepreg and a laminate using same. The halogen-free epoxy resin composition comprises (A) a halogen-free epoxy resin and (B) a phosphorus-containing active este...  
WO/2018/123695A1
Provided are a curable composition with which it is possible to obtain a cured product having exceptional strength, a base resin, a curing agent, a dry film, a cured product, and a printed wiring board. A curable composition containing (...  
WO/2018/120614A1
Provided in the present invention are a phosphorus-containing active ester and a halogen-free resin composition thereof, as well as a prepreg and a laminate using the same. The halogen-free resin composition comprises: (A) a thermosettin...  
WO/2018/123897A1
The composite material according to one aspect of the present invention comprises a matrix phase of a resin, and a ruthenium oxide which is contained in the matrix phase of the resin and which has a Ca2RuO4 structure. The ruthenium oxide...  
WO/2018/125697A1
An abrasive material containing a cured product of a thermosetting resin powder, comprising: a porous body having a plurality of bubbles derived from heat-expandable microspheres; and abrasive grains dispersed in the porous body.  
WO/2018/124169A1
In order to provide: a resin composition having a high glass transition temperature (high Tg) or not having a distinct glass transition temperature (Tg less), and being capable of sufficiently suppressing the warpage (achieving low-warpa...  
WO/2018/120587A1
Provided in the present invention are a halogen-free thermosetting resin composition and a prepreg, a laminate and a printed circuit board containing the same. The halogen-free thermosetting resin composition contains the following three...  
WO/2018/124164A1
In order to provide a resin composition having a high glass transition temperature (high Tg) or not having a definite glass transition temperature (Tg-less), whereby warping can be adequately reduced (low warping can be achieved) in a pr...  
WO/2018/120589A1
The present invention relates to a modified polyphenylene ether resin and an application thereof. The modified polyphenylene ether resin has a long carbon chain structure containing at least one hydrocarbon compound group with more than ...  
WO/2018/120586A1
The present invention relates to a method of preparing a benzoxazine-containing resin composition and a prepreg and a laminate made thereof. The method of preparing the benzoxazine-containing resin composition is to add an acid filler to...  
WO/2018/123745A1
Provided is a resin composition comprising a resin and an inorganic filler, wherein the inorganic filler contains inorganic particles having an average particle diameter of 0.07 to 0.5 µm.  
WO/2018/119833A1
A cationically curable sealant composition for liquid crystal sealing is suitable to be used in one drop filling (ODF) process for manufacturing liquid crystal display device without the concern of moisture resistance and liquid crystal ...  
WO/2018/120472A1
The present invention relates to a halogen-free flame-retardant resin composition, and a prepreg and a copper clad laminate prepared from same. The halogen-free flame-retardant resin composition comprises the following solid components i...  
WO/2018/125692A1
Provided are curable compositions that include an epoxy resin; a 9,9-bis(aminophenyl)fluorene or derivative therefrom; and core shell particles, each comprising an elastomeric core and a polymeric outer shell layer coated on the elastome...  
WO/2018/116757A1
Provided is an epoxy resin composition which has an excellent balance of shrinkage on cure-molding, heat resistance when a cured product, and thermal elastic modulus when a cured product. Specifically, the epoxy resin composition compris...  
WO/2018/117373A1
The present invention relates to: a film-type semiconductor sealing member comprising a phenol resin, an epoxy compound, and an inorganic filler; a semiconductor package manufactured using the film-type semiconductor sealing member; and ...  
WO/2018/117214A1
Provided is a curable resin composition comprising components (A), (B), (C), and (D). Component (A) is a bisphenol-type epoxy resin having a softening point of 80°C or higher; component (B) is a bisphenol-type epoxy resin in liquid form...  
WO/2018/117374A1
The present invention relates to: a film-type semiconductor sealing member comprising a phenol resin comprising a unit represented by chemical formula 1, an epoxy compound represented by chemical formula 2, and an inorganic filler; a sem...  
WO/2018/108028A1
A high-strength thermally conductive insulation material, comprising a thermally conductive insulation material base and a high-strength system, the amount of high-strength system added being 3.2-3.4% of the weight of the thermally condu...  
WO/2018/109618A1
A thermally conductive three-dimensional (3-D) graphene-polymer composite material, methods of making, and uses thereof are described. The thermally conductive three- dimensional (3-D) graphene-polymer composite material contains: (a) a ...  
WO/2018/109766A1
A curable epoxy composition suitable for surface application, comprising one or more epoxy resin (s); 2, 4, 6-tribromophenyl end-capped tetrabromobisphenol A epoxy-based flame retardant; and phosphorus-containing compound selected from t...  
WO/2018/109046A1
Self-healing mircrocapsules comprising: a) a polymeric shell; b) a healing-agent compartmentalized inside the polymeric shell; and c) a catalyst deposited on the surface of the polymeric shell. The microcapsules are prepared by suspensio...  
WO/2018/106090A1
The present application relates to a sealant composition and an organic electronic device comprising same, and provides a sealant composition which can secure the life of an organic electronic device by effectively blocking moisture or o...  
WO/2018/103199A1
Provided in the present invention is a thermosetting resin composition, comprising phosphorus-containing active ester and epoxy resin, the phosphorus-containing active ester being copolymerised using bis-aromatic formyl chloride hydrocar...  
WO/2018/105057A1
Disclosed is a resin composition for sealing, comprising: (A) an epoxy resin; (B) a curing agent containing at least one amino group; (C) a resin having a phenoxy structure; and (D) an inorganic filler.  
WO/2018/105282A1
Provided is a gas barrier film which comprises a resin cured layer and a base material film having an inorganic deposition layer, and wherein: the gas barrier film has the resin cured layer on the inorganic deposition layer-side surface ...  
WO/2018/105070A1
Provided are a resin varnish, a prepreg, a laminate, and a printed wiring board using a thermosetting resin composition which has high heat resistance, a low dielectric constant, a high metallic foil adhesive property, a high glass trans...  
WO/2018/105437A1
[Problem] To provide: a poly(arylene sulfide) resin composition having excellent low-temperature impact resistance and exceedingly low warpage; and an insert-molded article comprising the resin composition. [Solution] A poly(arylene sulf...  
WO/2018/103276A1
The present invention provides a thermosetting resin composition comprising an esterified dihydroxylphenyl phosphaphenanthrene. The thermosetting resin composition has the advantages of good thermal stability, heat and humidity resistanc...  
WO/2018/106875A1
The present disclosure provides a curable void filler composition comprising: (a) at least one epoxy resin; (b) at least one epoxy curing agent comprising a carboxylic acid anhydride compound; (c) at least one alkaline oxide and/or at le...  
WO/2018/105743A1
Provided are: a curing resin composition which can simultaneously have fast curing ability and cured product performance such as high heat resistance; a cured product of the curing resin composition; and a curing method for the curing re...  
WO/2018/105071A1
Provided is a thermosetting resin composition comprising: (A) a maleimide compound; (B) an epoxy resin having at least two epoxy groups in a molecule; (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound...  
WO/2018/105056A1
Disclosed is a resin composition for sealing, comprising: (A) an epoxy resin; (B) a curing agent containing at least one amino group; (C) a metal complex and/or a metal compound; and (D) an inorganic filler.  
WO/2018/106089A1
The present application relates to a sealant composition, a method for producing same, and an organic electronic device comprising same, and provides a sealant composition which can secure the life of an organic electronic device by effe...  
WO/2018/102198A1
An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and opt...  
WO/2018/101219A1
A curable composition containing two or more types of cationic dye (A), a cationically polymerizable organic substance (B), and an acid generator (C). The cationic dye (A) is preferably a polymethine compound represented by general formu...  
WO/2018/098908A1
Provided is a thermosetting resin composition comprising a phosphorus-containing active ester, the thermosetting resin composition has the advantages of good thermal stability, moisture and heat resistance, a low dielectric constant and ...  
WO/2018/100514A1
Provided are pre-dynamically cross-linked compositions including a networking impact modifier additive. Compositions include a pre-dynamic cross-linked polymer composition including polyester chains joined by a coupler component and one ...  
WO/2018/099734A1
The invention relates to a composition for producing an insulation tape, the composition being used to fix a non-conductive material to a reinforcing layer. To provide an insulation tape which is used in particular in the production of i...  
WO/2018/096967A1
[Problem] To provide a photopolymerizable composition which gives a cured object exhibiting a large Abbe number and a high refractive index and is suitable for producing molded objects having high transparency. [Solution] A photopolymeri...  
WO/2018/095357A1
Disclosed are a fluorine-containing silicon polyphosphate ester and method for preparation thereof, having a chemical structural formula of: wherein R1 is formula (II), (III) or formula (IV), R2 is formula (V) or formula (VI), and n = 10...  

Matches 1 - 50 out of 41,157