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Matches 1 - 50 out of 42,237

Document Document Title
WO/2019/111623A1
The present invention addresses the problem of providing an electrically conductive paste for use in the formation of a solar cell electrode, whereby it becomes possible to produce an electrically conductive film capable of being treated...  
WO/2019/111978A1
Achieved are: a nitride ceramic resin composite body that has further improved reliability in terms of heat resistance during the reflow process, while exhibiting heat conductivity, electrical insulation and adhesion to an adherend, whic...  
WO/2019/110970A1
A ceramic inlay in automotive component, such as a trim panel is provided by grinding a ceramic, such as porcelain, into a powder, mixing it with a resin, such as epoxy resin to form a paste and filling recesses in the component with the...  
WO/2019/111707A1
This epoxy resin composition contains an epoxy resin, a curing agent and an inorganic filler, while containing chlorine-containing particles that contain an organic substance.  
WO/2019/111607A1
An epoxy resin curing agent which contains (A) at least one compound selected from the group consisting of N-aminoethyl piperazine and isophorone diamine and (B) a bis(aminomethyl)cyclohexane; an epoxy resin composition which contains th...  
WO/2019/106171A1
Impact-Modified Poly(arylene sulfide) Compositions Methods of making a polymer composition, the method including (i) contacting a poly(arylene sulfide) (PAS) with an aqueous solution including zinc ions, preferably during recovery of the...  
WO/2019/108630A1
A composition comprising a) an epoxy resin; b) a silicone resin; and c) an organosilane coupling agent having at least one protecting functional group, is disclosed. The composition can be used for coating applications.  
WO/2019/107307A1
In the present invention, in order to provide an epoxy resin composition for a fiber-reinforced composite material that exhibits excellent heat resistance, toughness and workability, 8-15 parts by mass of (C) a thermoplastic resin, 2-10 ...  
WO/2019/106953A1
Provided are: a resin sheet which is capable of maintaining flexibility after curing, and which is suitable for sealing of semiconductor elements; and a semiconductor device which is produced using this resin sheet. A resin sheet which i...  
WO/2019/106835A1
Provided is a resin composition containing 40-60 vol% of an inorganic filler, wherein (1) the resin composition has a thixotropic index of 1.2-10 at 25°C, has a viscosity of 3.5-50 Pa・s as measured under the conditions of 25°C and 5 ...  
WO/2019/108866A1
A polyester blend is made in a reaction of a linear polylactide resin and a thermoplastic epoxy group-containing polymer. The polyester blend is blended with a polyester having a glass transition temperature below 0C to form a polyester ...  
WO/2019/101918A1
The invention relates to an adhesive tape comprising at least one layer of an adhesive adhesion compound which comprises a polymer film-forming agent matrix and a curable composition, said curable composition having at least one epoxy re...  
WO/2019/100748A1
Disclosed are a halogen-free, flame-retardant PET composite material for use in a transparent film and a preparation method. The halogen-free, flame-retardant PET composite material comprises the following formula composition in terms of...  
WO/2019/075331A3
Isobutylene copolymer includes repeat units derived from isobutylene and one or more comonomers selected from isoprene, butadiene, cyclopentadiene, dicyclopentadiene, limonene, substituted styrenes, and C4 to CIO dienes other than isopre...  
WO/2019/101916A1
The invention relates to a curable composition comprising at least one epoxy resin and at least one curing reagent for said epoxy resin, characterised in that a fatty-acid modified epoxy resin is used as the epoxy resin, and the curing r...  
WO/2019/101740A1
The invention relates to a two-component composition comprising: A) a first component Α, comprising: an aqueous dispersion of at least one polymer Ρ1; B) a second component B, comprising: at least one hydraulic binder H, at least one f...  
WO/2019/100470A1
A high-performance polycarbonate composite material, which relates to the technical field of plastics. The high-performance polycarbonate composite material uses a polycarbonate as a matrix and contains various additives. By selecting th...  
WO/2019/102719A1
The present invention addresses the problem of providing a filmy semiconductor encapsulant which satisfies properties required of NCFs. The problem is solved with a filmy semiconductor encapsulant which comprises (A) a compound having a ...  
WO/2019/101913A1
The invention relates to a process for producing pressure-sensitive adhesive compositions which comprise at least one elastomer component and at least one reactive adhesive, comprising one or more reactive resins, at least one of the rea...  
WO/2019/100472A1
An ABS-PBT-polyamide three-matrix composite material, which relates to the technical field of plastics. The ABS-PBT-polyamide three-matrix composite material uses ABS, PBT and polyamide as matrixes of the composite material, and contains...  
WO/2019/101914A1
The invention relates to an adhesive tape comprising at least one layer of an adhesive adhesion compound which comprises a polymer film-forming agent matrix (M) and a curable composition, said curable composition comprising at least one ...  
WO/2019/101049A1
A modified nano-copper, and a modified nano-copper-epoxy resin composite material and a manufacturing method therefor, aimed at providing a modified nano-copper having excellent dielectric properties, stability and dispersibility; specif...  
WO/2019/098201A1
This prepreg contains carbon fibers and a resin composition which contains: an epoxy resin which has a biphenyl structure; a curing agent; and a melamine cyanurate.  
WO/2019/097852A1
Provided is a filler-filled highly thermally conductive dispersion composition obtained by: pulverizing 5-70 parts by weight of thermoplastic polymer particles and 30-95 parts by weight of highly thermally conductive filler particles hav...  
WO/2019/098053A1
This resin composition for reinforcement contains an epoxy compound and a curing agent, wherein the composition contains, as the epoxy compound, 25–100 mass% of a bisphenol-E epoxy resin with respect to the entire amount of the epoxy c...  
WO/2019/098026A1
The purpose of the present disclosure is to provide: a semiconductor encapsulation resin composition that enables encapsulation resin blackening and a low dissipation factor for the encapsulation resin; and a semiconductor package. This ...  
WO/2019/098078A1
A resin sheet used to seal an electronic component, wherein the resin sheet is provided with a curable resin composition layer formed from a resin composition containing an epoxy resin, the storage modulus at 150°C of a cured layer form...  
WO/2019/093139A1
The present invention provides: a curable composition characterized by comprising an epoxy compound (A), one or more amine compounds (B), and an acrylic resin (C), the amine compounds (B) comprising an N-(aminoalkyl)piperazine compound (...  
WO/2019/090916A1
Disclosed are a copper cladding plate bent in a static state, and a method for manufacturing same and a bend shaping method. The copper cladding plate comprises copper foil and a thermosetting resin composite dipped substrate adhered on ...  
WO/2019/092359A1
The subject of the present invention is the polyepoxidized biphenyl compounds corresponding to formula (I) below: wherein R, Ru R2 and R3 are as defined in the description, and also the mixtures of at least two of said compounds. These p...  
WO/2019/090917A1
Provided are a thermosetting resin composition and a statically bendable copper-clad plate and printed circuit board prepared therefrom. The thermosetting resin composition of the present invention contains: a thermosetting resin, a curi...  
WO/2019/085134A1
Provided is a 3D printing wax that is crosslinkable, contributes to fast printing speed and high printing precision, and can be used for both casting and model printing. The wax comprises the following parts by weight: 20-90 parts of an ...  
WO/2019/087463A1
The present invention provides: a circuit board obtained using an epoxy resin composition that can have a satisfactory level of low-shrinkage rate after being cured, and can be used to obtain a circuit board having less warpage and excel...  
WO/2019/087877A1
Provided are an epoxy resin composition which not only has high heat resistance and mechanical strength but also has excellent damping properties and a film or forming material comprising or obtained from the epoxy resin composition. The...  
WO/2019/088617A1
According to an embodiment of the present invention, an epoxy resin composition is provided, wherein the epoxy resin composition includes an epoxy resin and cyanamide, and contains 5-20 parts by weight of the cyanamide with respect to 10...  
WO/2019/087259A1
This casting resin composition contains a curable component, a first filler, and a second filler different from the first filler, wherein the ratio of the major axis of the first filler to the thickness of the first filler is 3-25. This ...  
WO/2019/088739A1
The present invention relates to: a liquid crystal aligning agent composition for forming a liquid crystal alignment layer having an excellent alignment property and durability and, simultaneously, having improved electrical properties a...  
WO/2019/087986A1
An epoxy resin composition for encapsulation which comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a fatty acid amide compound having 17-50 carbon atoms, wherein (D) the inorga...  
WO/2019/083921A2
Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aroma...  
WO/2019/083006A1
The purpose of the present invention is to provide a curable resin composition which has superior flame retardancy, adhesiveness, high-temperature long-term heat resistance, and moisture-absorption reflow resistance, and low environmenta...  
WO/2019/082962A1
The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy com...  
WO/2019/083876A1
Provided herein is a polymerizable liquid useful for the production of a three-dimensional object by additive manufacturing, the polymerizable liquid comprising a mixture of: (a) at least one free-radically polymerizable constituent; (b)...  
WO/2019/082828A1
[Problem] To provide a sealing material composition and a sealing material with which it is not necessary to perform heating after coating an electronic element, etc., and which is flexible and has fixed-shape properties. [Solution] A se...  
WO/2019/078044A1
A thermally conductive resin composition comprising the following components (A) to (C): (A) an epoxy resin, (B) an adduct-type latent hardener which is solid at 25°C, and (C) a mixture of the following ingredients (C1) to (C3), in whic...  
WO/2019/077688A1
A method for producing a glassy liquid-crystalline epoxy resin, the method comprising a step in which a liquid-crystalline epoxy resin is cooled to change the state to a glassy state.  
WO/2019/078024A1
This resin composition for sealing contains an epoxy resin (component (A)), an inorganic filler (component (B)) and a black coloring agent (component (C)); and the content of S in a cured product of this resin composition for sealing is ...  
WO/2019/073690A1
The main purpose of the present invention is to provide a boron nitride powder having excellent conductivity and high particle strength. A boron nitride powder which has the characteristic properties (A) to (C) mentioned below and contai...  
WO/2019/074795A1
A curable resin composition contains a curable resin that comprises at least one non- aromatic epoxy compound, at least one non-aromatic oxetane compound, or a mixture thereof, one or more curing agents selected from Lewis acid: Lewis ba...  
WO/2019/073763A1
The present invention provides a cured article that is formed from a cured material obtained by curing a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler and that has a polished surface, wh...  
WO/2019/070819A1
A curable composition includes a polyamide composition comprising a polyamide. The polyamide comprises a tertiary amide in the backbone thereof and is amine terminated. The curable composition also comprises an epoxy composition that inc...  

Matches 1 - 50 out of 42,237