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WO/2021/246457A1 |
Provided are: a curable resin composition containing at least one type of resin, which is selected from the group consisting of a polyimide precursor, a polybenzoxazole precursor, a polyimide, and a polybenzoxazole, and a compound B, whi...
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WO/2021/246746A1 |
The present invention relates to an oil-based paint composition for an automobile intermediate coating, comprising: 10 to 40 parts by weight of a polyester polyol resin; 5 to 30 parts by weight of a polyester-modified acrylic microgel re...
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WO/2021/246432A1 |
The present invention is a water-dispersible resin composition that contains: a resin α, which has in the main chain a structure M in which two aromatic rings are joined by a sulfide group, sulfonyl group, imide group, or keto group; an...
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WO/2021/246459A1 |
Provided are: a curable resin composition containing a compound having an oxazoline group, a compound containing an acid group and an alkoxysilyl group, and at least one resin selected from the group consisting of polyimide precursors, p...
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WO/2021/246478A1 |
A resin composition comprising at least one polymerizable-group-containing resin selected from the group consisting of polyimide precursors and polybenzoxazole precursors, an antioxidant, and an organic solvent, the content of the antiox...
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WO/2021/241571A1 |
Provided is a layered product that uses a high temperature-resistant transparent film having sufficient heat resistance, and that is capable of being mechanically released from an inorganic substrate after various processes are performed...
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WO/2021/241763A1 |
Provided is a resin composition that includes a polyimide precursor and/or a polyimide resin and that satisfies (A) or (B) below: (A) A polyimide structural unit includes a divalent organic group P5 and a tetravalent organic group P6, P5...
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WO/2021/241574A1 |
The present invention provides a laminate that exhibits little warpage with an inorganic substrate and involves the use of a transparent film with high heat resistance having adequate heat resistance and suitably weak adhesive strength w...
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WO/2021/241548A1 |
One purpose of the present invention is to provide a curable resin composition having excellent applicability by spin coating and giving cured objects which are excellent in terms of adhesiveness and long-term heat resistance. Another pu...
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WO/2021/242174A1 |
Disclosed herein are compounds in the form of polymers, oligomers and defined molecules having repeating units that all incorporate repeating units formed from an imidazolium group and a biodegradable chain connected to an adjacent repea...
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WO/2021/241570A1 |
The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant transparent film which has sufficient heat resistance and is able to be mechanically separated from the inorganic substrate after bein...
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WO/2021/230241A1 |
[Problem] To provide a novel polymer material which has excellent self-healing properties, excellent fastness and excellent moisture resistance. [Solution] A copolymer which comprises at least one repeating unit represented by formula (I...
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WO/2021/227020A1 |
A photosensitive polyimide resin composition, comprising: (a) a photosensitive polyimide resin represented by formula (I), wherein in formula (I), Ar1-Ar4, m, n, and o are as defined in the description; (b) a photo-radical initiator; (c)...
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WO/2021/228081A1 |
A phthalonitrile-based composite material, a preparation method therefor and use thereof. Said composite material comprises a thermally conductive filler. The thermally conductive filler is distributed in the phthalonitrile matrix resin,...
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WO/2021/221118A1 |
The present invention provides: a resin composition which has excellent mechanical characteristics, namely an elastic modulus of 7 GPa or more, a stress at break of 200 MPa or more and an elongation at break of 8% or more in the form of ...
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WO/2021/212326A1 |
Provided is a thermosetting resin composition, which comprises an epoxy resin, a cyanate ester resin, a phenolphthalein benzoxazine resin, a styrene maleic anhydride resin and a phosphorus-containing flame retardant. The equivalent ratio...
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WO/2021/214400A1 |
The invention relates to a composition for additive manufacturing, characterized in that same comprises: - a polymer mixture comprising a polyetheretherketone and a polyetherimide; and - carbon fibers.
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WO/2021/212314A1 |
Disclosed is a thermosetting resin composition, comprising an epoxy resin, a styrene maleic anhydride copolymer, a cyanate resin, a maleimide resin, tetrabromobisphenol A and a filler. The epoxy resin comprises a bromine-containing epoxy...
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WO/2021/208245A1 |
Disclosed are a polyimide composite material, a preparation method therefor, and a display substrate. The compatibility of inorganic nanoparticles with polyimide structural units is increased by linking the inorganic nanoparticles with t...
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WO/2021/208688A1 |
The present invention provides a method for preparing an anti-intestinal adhesion double-layer biological gel, comprising the following steps: S1: preparing a chitosan solution in advance; S2: preparing pure methacrylated chitosan; S3: p...
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WO/2021/196431A1 |
A polyimide base material and a manufacturing method therefor, and a display panel. The manufacturing method for the polyimide base material comprises: providing diamine containing a dioxazole structure; performing a polymerization react...
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WO/2021/199898A1 |
[Solution] The present invention provides an amic acid oligomer or the like which, by virtue of having a specific composition, is capable of providing a cured product having good physical properties, particularly glass transition tempera...
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WO/2021/192632A1 |
Provided is a hydrogen sensor element containing a pair of electrodes and a hydrogen-sensitive film disposed so as to be in contact with the pair of electrodes, wherein the hydrogen-sensitive film contains a conjugated polymer and an org...
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WO/2021/192379A1 |
The present invention addresses the problem of providing a fixing belt with excellent thermal conductivity and capable of suppressing a rise in torque in long-term use. The fixing belt according to the present invention has a base materi...
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WO/2021/193950A1 |
The present invention provides: a carbodiimide composition comprising a water-soluble modified polycarbodiimide (A) and a water-insoluble polycarbodiimide (B); a hardener composition comprising the carbodiimide composition; a coating com...
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WO/2021/192635A1 |
Provided is a hydrogen sensor element that includes a pair of electrodes and a hydrogen-sensitive film disposed so as to be in contact with the pair of electrodes, wherein the hydrogen-sensitive film contains a conjugated polymer and a d...
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WO/2021/192479A1 |
This insulation film (10) comprises a resin (11) and an inorganic filler (12) dispersed in the resin (11), wherein the resin (11) has a viscosity of 50 MPa·s or lower at 200°C, the inorganic filler (12) has a mean particle diameter fal...
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WO/2021/193530A1 |
The present invention addresses the problem of providing a resin film which is capable of suppressing the occurrence of wrinkles or separation of a film superposed thereon in a high temperature process in the production of a device, and ...
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WO/2021/192680A1 |
Provided is a resin composition, containing a cyanate ester compound (A), a filler (B), a molybdenum compound (C), and zinc oxide (D), wherein the molybdenum compound (C) contains molybdenum compound particles, and the zinc oxide (D) con...
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WO/2021/193978A1 |
Provided is a polyimide precursor composition that has excellent stability and that enables production of a polyimide film/substrate laminate having less warpage. The polyimide precursor composition contains: a polyimide precursor; a phe...
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WO/2021/189723A1 |
The present invention provides a polyimide colorless transparent thin film, preparation method therefor, and an optical PI film. The polyimide colorless transparent thin film not only has excellent light transmittance (≥ 85% @ 500 nm),...
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WO/2021/192480A1 |
This insulating film (10) includes a resin (11) and an inorganic filler (12) dispersed in the resin (11), wherein: the resin (11) is a polyimide resin, a polyamide-imide resin, or a mixture thereof; the inorganic filler (12) has an avera...
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WO/2021/193531A1 |
The purpose of the present invention is to provide: a device substrate which is a resin film that is not susceptible to thermal decomposition during high temperature processes, and which has improved light transmittance; a method for pro...
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WO/2021/192633A1 |
Provided is a hydrogen sensor element containing a pair of electrodes and a hydrogen-sensitive film disposed so as to be in contact with the pair of electrodes, wherein the hydrogen-sensitive film contains a conjugated polymer and an org...
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WO/2021/187256A1 |
A coloring composition comprising a coloring agent, a first resin including a repeating unit represented by formula (b-10), and a second resin different from the first resin, wherein the second resin is at least one selected from polyimi...
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WO/2021/185898A1 |
The invention relates to the use of a composition as rheology control agent comprising (A) silicate and (B) a polyethylenimine comprising the structure (I), wherein R1 is formula (I'), or part of the polyethylenimine, and wherein R2 is H...
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WO/2021/182207A1 |
Provided is a resin material that can effectively remove smears using de-smear treatment, reduce the dielectric loss tangent of a cured product, and increase the thermal dimensional stability of a cured product. The resin material acco...
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WO/2021/182565A1 |
The present invention addresses the problem of providing a colored optical film which is capable of exhibiting excellent designability and visibility that does not deteriorate image display performance or the like, while additionally hav...
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WO/2021/176560A1 |
Provided is a polyamide precursor for an insulated wire, said precursor being obtained by reacting a diamine compound with a tetracarboxylic dianhydride compound, wherein: the dianhydride compound includes at least one type of compound s...
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WO/2021/176779A1 |
Provided is a polyamide precursor obtained by reacting a diamine compound with a tetracarboxylic dianhydride compound, wherein: the dianhydride compound includes at least one type of compound selected from the group consisting of aromati...
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WO/2021/177054A1 |
Provided are a thermosetting resin composition which is relatively inexpensive, has outstanding heat resistance, etc., and has an epoxy compound as a curing component and a prescribed polyimide compound as at least a cross-linking agent,...
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WO/2021/172348A1 |
The present invention is a polyester elastomer resin composition that has excellent extrusion moldability and surface smoothness even in a thin shape while maintaining mechanical properties and has excellent flame retardancy and heat agi...
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WO/2021/172420A1 |
This curable resin composition contains an organometallic complex and at least one type of resin selected from the group consisting of a polyimide precursor containing a cyclic imide structure and/or a cyclic isoimide structure, a polybe...
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WO/2021/172316A1 |
Provided are a resin composition that exhibits low water absorbency, a cured product, a prepreg, a metal foil-clad laminate board, a resin sheet, and a printed circuit board. The resin composition includes a compound (A) represented by f...
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WO/2021/172421A1 |
A curable resin composition that includes: at least one type of resin selected from the group that consists of polyimide precursors, polybenzoxazole precursors, and polyamide-imide precursors; an organic metal complex; and, relative to t...
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WO/2021/172827A1 |
The present invention relates to a thermoplastic resin composition and a molded article produced therefrom, the thermoplastic resin composition comprising (A1) 20-40 wt% of a butadiene-based rubber-modified aromatic vinyl-vinyl cyanide g...
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WO/2021/171939A1 |
Provided is a polyimide varnish which can be inhibited from suffering blushing due to moisture absorption, changes little in viscosity, has excellent storage stability, is less apt to cause foreign matter, clogging, etc. when used in obt...
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WO/2021/171765A1 |
A dispersion composition that contains a dispersed substance, a dispersion medium, and a polymer [P]. The polymer [P] is a partially imidized polyamic acid and has at least one type of specific structure selected from the group that cons...
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WO/2021/166930A1 |
[Problem] To provide a method for manufacturing a multilayer film having excellent adhesion and drilling workability and having no wrinkles or extremely few wrinkles, to provide said multilayer film, and also to provide a method for manu...
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WO/2021/160866A1 |
A bulk moulding compound comprising one or more cyanate ester, a catalyst, a filler and reinforcement fibres is provided, whereby the one or more cyanate ester is independently selected from a difunctional cyanate ester compound and/or a...
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