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WO/2023/182041A1 |
Provided is a photosensitive resin composition having excellent patterning property and providing excellent pressure resistance (elastic modulus) of a cured product. This photosensitive resin composition contains (A) a polyimide, (B) a c...
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WO/2023/182071A1 |
A resin composition containing (A) a soluble resin, (B) an organic salt, and (C) a solvent, wherein the (B) organic salt is formed from a carboxy-group-containing organic compound and an amino-group-containing organic compound, and the (...
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WO/2023/180144A1 |
A mold for the molding of large articles is provided, said mold comprising at least one molding surface for receiving the material to be molded and which comprises at least one polyarylsulfone polymer, selected from poly(ethersulfone) an...
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WO/2023/177103A1 |
The present invention relates to a polymer resin composition, a method for manufacturing a polymer resin film, a polymer resin film and a substrate for a display device using same, and an optical device, wherein the polymer resin composi...
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WO/2023/171691A1 |
The present invention provides a conductive composition which has outstanding dispersion stability of metal particles and allows easy recording of conductive images having outstanding conductive properties just by carrying out simple pos...
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WO/2023/172135A1 |
The present invention is directed to nanoparticles comprising an azanaphthalene-functionalized polymer and a biologically active component, wherein said polymer comprises a polyamine segment that is based on a bis(α,β-unsaturated carbo...
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WO/2023/166971A1 |
A polyimide resin composition that contains polyimide resin (A) having a specific structure and compound (B) represented by formula (5). (R51 is an alkyl group having 1-10 carbon atoms or an alkoxy group having 1-10 carbon atoms. R52 to ...
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WO/2023/167152A1 |
The present invention provides a block copolymer which comprises a polymer block (B) that is mainly composed of a conjugated diene monomer unit, and a polymer block (A) that is mainly composed of a vinyl aromatic monomer unit and/or a po...
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WO/2023/165011A1 |
Disclosed in the present application are a cross-linking agent as well as a preparation method and the use thereof. The structure of the cross-linking agent contains triazolyl, and contains a double bond, amide acid or imide structure at...
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WO/2023/162687A1 |
Provided are: a resin composition having excellent storage stability and excellent chemical resistance of the resulting cured article; a cured article obtained by curing the resin composition; a laminate including the cured article; a me...
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WO/2023/162644A1 |
The present invention addresses the problem of providing a polyimide film capable of providing a high-density graphite sheet with good productivity. This problem is solved by a polyimide film for a graphite sheet, said polyimide film hav...
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WO/2023/163001A1 |
The present invention relates to a composition that comprises: a polymer compound having a repeat unit given by formula (1), having possibly substituted fluorene in the main chain and/or in side chain position, and having a crosslinking ...
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WO/2023/162643A1 |
The present invention addresses the problem of providing a polyimide film capable of providing a high-density graphite sheet with good productivity. This problem is solved by a polyimide film for a graphite sheet, said polyimide film hav...
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WO/2023/160563A1 |
The present invention relates to a high-temperature-resistant colorless transparent polyimide film for lead-free welding reflow in the electronic industry, and a preparation method therefor. The present invention aims to solve the proble...
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WO/2023/162904A1 |
This solid electrolytic capacitor element comprises: a positive electrode foil having a porous portion on a surface layer thereof, and also including a first portion including a first end and a second portion including a second end oppos...
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WO/2023/157914A1 |
Provided is a sealing resin composition and a seal which can be used, in particular, with a high-temperature and high-pressure gas, especially hydrogen gas. The sealing resin composition is used in a piston ring 1 that is for sealing a g...
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WO/2023/157911A1 |
The present invention provides a resin composition which contains a resin and a metallocene compound, wherein: the metallocene compound comprises a metal atom, an optionally substituted cyclopentadienyl ligand, and an aromatic ring that ...
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WO/2023/155030A1 |
The present invention relates to a polyimide membrane, a preparation method therefor and use thereof. Both sides of the polyimide membrane are formed with different hydrophilic properties by means of different degrees of polymerization. ...
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WO/2023/152661A1 |
A polyetherimide composition includes a polyetherimide having a percent transmission of 75% to 85% at 500 nanometers as determined according to ASTM D1003 at a thickness of 1.6 mm. The composition further includes a colorant. A molded sa...
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WO/2023/149435A1 |
A resin composition comprising a polyimide and an acrylic resin, wherein the polyimide comprises an alicyclic tetracarboxylic dianhydride as at least some of a tetracarboxylic dianhydride component and a fluoroalkyl-substituted benzidine...
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WO/2023/149394A1 |
One embodiment of the present invention relates to a polymer, a composition, a cured product, a laminated body, or an electronic component, said composition including a polymer containing a repeating unit that is represented by formula (...
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WO/2023/148996A1 |
Provided are a resin composition that enables fine pattern processing even on a rough-surfaced substrate made of a ceramic or the like, a resin composition film, and a semiconductor device in which these are used. A resin composition con...
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WO/2023/149429A1 |
A fluororesin composition according to the present invention comprises a fluororesin, a liquid crystal polymer resin, a polyimide resin, and an inorganic filler, wherein the water absorption rate of the polyimide resin is not more than 1...
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WO/2023/145472A1 |
This resin composition comprises: a curable resin (A); an acrylic monomer copolymer (B) having structures represented by formulas (1) to (3) and having a weight-average molecular weight of at least 10,000 and not more than 900,000; an in...
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WO/2023/145473A1 |
A resin composition according to the present invention contains: a core-shell rubber (A) having a core that contains a silicone polymer and/or an acrylic polymer and a shell that contains a poly(methyl methacrylate), said rubber having a...
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WO/2023/145471A1 |
A resin composition according to the present invention contains: a molybdenum compound (A); a curable resin (B) that includes a maleimide compound (B1) and a benzoxazine compound (B2) having an allyl group; and an inorganic filler (C). T...
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WO/2023/140322A1 |
A weak-anchoring liquid crystal alignment agent according to the present invention contains the following component A and component B. Component A: A polymer represented by formula (1). Component B: a polymer having a site that, upon h...
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WO/2023/141035A1 |
In an aspect, a thermosettable composition comprises an imide extended compound and a reactive monomer that is free-radically crosslinkable with the reactive end groups of the imide extended compound to produce a crosslinked network. A t...
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WO/2023/139814A1 |
The present invention enables patterning to be performed without generating residues during development and provides a high elastic modulus and a low linear expansion coefficient. This resin composition contains a high molecular weight c...
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WO/2023/133943A1 |
A cross-linked polyamic acid ester. The cross-linked polyamic acid ester has structural units linked by means of a cross-linked structure. Each structural unit has a structure as shown in general formula I, wherein Ar1 is a dianhydride m...
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WO/2023/132310A1 |
This resin composition contains a polyamide-imide and an acrylic resin. The polyamide-imide has diamine-derived structures, tetracarboxylic-acid-dianhydride-derived structures, and dicarboxylic-acid-derived structures. The diamine-derive...
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WO/2023/128075A1 |
The present invention relates to an optical film and a method of preparing same, the optical film comprising a polymer resin comprising imide repeating units and amide repeating units, the amide repeating units being included at a ratio ...
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WO/2023/125802A1 |
Disclosed in the present invention are an allyl-type flame-retardant prepolymer, a resin composition, a composite resin, a prepreg and a laminated board. The allyl-type flame-retardant prepolymer provided by the present invention is prep...
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WO/2023/125817A1 |
The present invention relates to a resin composition, and a preparation method therefor and an application thereof. The resin composition comprises the following raw material components in parts by mass: 10-30 parts of hydrocarbon resin ...
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WO/2023/127523A1 |
The present invention provides a resin composition which has substrate processing adequacy including embeddability into substrate relief patterns, heat cycle resistance and plating solution resistance, and which enables the achievement o...
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WO/2023/125784A1 |
The present invention relates to a resin composition, and a prepreg and the use thereof. The resin composition comprises the following components, in parts by weight: 50 to 150 parts of a modified epoxy resin, 40 to 120 parts of a modifi...
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WO/2023/128267A1 |
A unit cell of a metamaterial absorber may be an electromagnetic wave absorber for a 5.8 GHz band or a 10 GHz band. The unit cell of the metamaterial absorber may include: a first metal layer including a conductor pattern including first...
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WO/2023/115158A1 |
Disclosed herein are compositions that may be formulated as coating compositions. The compositions comprise: (i) at least one essential oil; (ii) at least one metal species and/or (iii) at least one cationic species. The compositions may...
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WO/2023/120304A1 |
This semiconductor resin material comprises a polyimide resin (A) containing repeating structural units derived from an aromatic tetracarboxylic acid component and an aliphatic diamine component.
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WO/2023/119128A1 |
A thermoplastic composition including 40 to 70 weight percent of a polycarbonate; 15 to 50 weight percent of a polycarbonate-polysiloxane copolymer; 4 to 8 weight percent of a polyetherimide-polysiloxane copolymer; 1 to 8 weight percent ...
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WO/2023/120037A1 |
The present invention provides: a joined body production method that makes it possible to obtain a joined body having a high maximum separation resisting force between two substrates when the two substrates are joined; a joined body obta...
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WO/2023/120627A1 |
The purpose of the present invention is to provide: a curable resin composition in which film cracking does not readily occur at high temperatures in a nitrogen atmosphere even with a thick film; a cured film in which the curable resin c...
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WO/2023/120059A1 |
Provided are: a resin composition from which a cured article having excellent elongation at break can be obtained; a cured article obtained by curing the resin composition; a laminate including the cured article; a method for producing a...
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WO/2023/120862A1 |
The present invention relates to a polyimide-based resin film, a substrate that is for a display device and uses the resin film, and an optical device, wherein the polyimide-based resin film has a thermal hysteresis gap of 100 μm to 500...
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WO/2023/119762A1 |
Provided are: a method for producing a polymer dispersion liquid which is for a solid electrolytic capacitor and with which a solid electrolytic capacitor having more electrostatic capacitance and less equivalent series resistance can be...
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WO/2023/120303A1 |
A light-emitting molded body including a polyimide resin (A) that includes repeating structural units represented by formula (1) and repeating structural units represented by formula (2) (R1 is a C6-22 divalent group including at least o...
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WO/2023/112849A1 |
The purpose of the present invention is to provide: a resin material that has a novel structure and can be suitably used in a printed wiring board; and a resin composition that contains the resin material, has excellent coatability onto ...
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WO/2023/112764A1 |
As a release layer-forming composition for forming a release layer which can be released without causing damage to a resin substrate of a flexible electronic device, provided is a release layer-forming composition that contains an organi...
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WO/2023/112443A1 |
A heat-curable composition comprising: a polyimide resin (A) which has a repeating unit of general formula (1), has a phenolic hydroxyl group, and has a storage modulus G' of 1.0×107 Pa at a temperature of 0-90°C, at least some of the ...
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WO/2023/112450A1 |
The purpose of the present invention is to provide: a novel polyacetal resin composition used in applications for performing radiation sterilization; and a method for improving radiation resistance in a polyacetal resin. This polyaceta...
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