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WO/2011/063238A1 |
The present disclosure is directed to a wire wrap composition having a polyimide layer and a bonding layer. The polyimide layer is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianh...
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WO/2011/063209A1 |
The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide ...
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WO/2011/063204A1 |
The present disclosure is directed to a polyimide film. The film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid...
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WO/2011/051412A1 |
The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. I...
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WO/2011/035920A1 |
The invention relates to a method of preparing a polyetherimide coating on a carbon steel substrate, which comprises the steps of: i. providing an organic solvent; ii. providing a dianhydride; iii. providing a first diamine that is a mon...
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WO/2011/024830A1 |
Disclosed are: a conductive coating composition comprising an aqueous dispersion of an intrinsically conductive polymer, a thickening agent (e.g., a heteropolysaccharide), inorganic microparticles (e.g., silica), a binder (e.g., a polyvi...
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WO/2011/024829A1 |
Disclosed are: a conductive coating composition comprising an aqueous dispersion of an intrinsically conductive polymer, inorganic microparticles, a binder and a polyol; and a member having a conductive coating film formed from the condu...
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WO/2011/017025A2 |
The disclosure provides methods and materials suitable for preparing coating layers on substrates. The coatings comprise quaternary amine groups and therefore impart anti-bacterial properties to the substrate. In one embodiment, for exam...
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WO/2011/001493A1 |
Disclosed is a heat-resistant polyimide produced by polymerizing (1) pyromellitic dianhydride (PMDA), (2) a carboxylic dianhydride component comprising biphenyltetracarboxylic dianhydride (BPDA) or benzophenonetetracarboxylic dianhydride...
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WO/2010/137636A1 |
An epoxy resin-based coating composition which comprises, at least, an epoxy resin, a thiol-type curing agent, and a curing assistant, characterized by consisting of two liquids to be mixed just before using, namely, a liquid (A) contain...
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WO/2010/135229A2 |
Disclosed is a release on demand type corrosion inhibitor composition for a metal substrate formed from only non-electrically conductive film forming copolymer(s): a nitrogen containing functional group X, where the group X comprises a p...
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WO/2010/128661A1 |
A polymer containing a triazine ring-containing repeating unit structure represented by, for example, formula (23) or (24), which alone can achieve high heat resistance, high transparency, high refraction index, high solubility and low v...
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WO/2010/125965A1 |
Disclosed is a circuit connecting material which is provided between circuit electrodes facing each other, applies pressure to the facing circuit electrodes and electrically connects the electrodes in the pressurizing direction. The circ...
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WO/2010/071532A1 |
Disclosed is an acetylenic phenol-aldehyde resin having at least one carbon-carbon triple bond. The resin is obtained by subjecting at least one phenolic compound (1), at least one acetylenic phenolic compound (2), having at least one ca...
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WO/2010/060195A1 |
Poly(anilineboronic acid)/phosphate nanoparticle dispersions are produced in high yields using the reactivity of the boronic acid moiety with phosphate in the presence of fluoride. The poly(anilineboronic acid)/phosphate dispersions have...
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WO/2010/047264A1 |
A positive photosensitive resin composition for spray coating, which contains an alkali-soluble resin, a compound that generates an acid when exposed to light and a solvent, and has a viscosity of 0.5-200 cP. By using the positive photo...
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WO/2010/013660A1 |
Disclosed is a conductive coating composition containing an organic solvent dispersion of an intrinsically conductive polymer such as a doped polyaniline or a doped polythiophene, and a binder. The conductive coating composition is char...
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WO/2009/147938A1 |
Disclosed is a thermosetting resin composition which can be cured at a low temperature (200˚C or less), while having high flexibility, excellent electrical insulation reliability, excellent soldering heat resistance and excellent organi...
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WO/2009/143034A1 |
The assemblies of the present invention comprise an electrode, an absorber layer and a polyimide film. The polyimide film contains from about 40 to about 95 weight percent of a polyimide derived from: i. at least one aromatic dianhydhde,...
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WO/2009/142938A1 |
The films of the present disclosure have a thickness from about 8 to about 150 microns and contain from about 40 to about 95 weight percent of a polyimide derived from: i. at least one aromatic dianhydride, at least about 85 mole percent...
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WO/2009/142940A1 |
The assemblies of the present invention comprise an electrode, an absorber layer and a film having a film thickness from about 8 to about 150 microns. The film contains from about 40 to about 95 weight percent of a polyimide derived from...
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WO/2009/119493A1 |
Disclosed is a powder coating material which does not contain hexavalent chromium that serves as a binder component but exhibits adhesion comparable to that of a chromium phosphate primer even after being subjected to firing at high temp...
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WO/2009/099918A1 |
The present invention is related to a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precurs...
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WO/2009/079540A1 |
A coating process for electrical steel using a core sheet varnish composition, comprising the steps of a) applying at least one coating layer of a core sheet varnish composition onto the surface of the electrical steel the core sheet var...
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WO/2009/079542A1 |
A process for fixing wound items having wire windings of electrical equipment with an impregnating composition comprising the steps of a) impregnating said wound items by applying the composition comprising (A) 5 to 95 wt%, preferably 5 ...
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WO/2009/069688A1 |
Disclosed is a polyamide acid solution containing a polyamide acid (PAA1), a solvent (C) in which the polyamide acid (PAA1) is dissolved, and a substance (M) capable of discharging metal ions of at least one metal selected from group 1 a...
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WO/2009/047269A2 |
The invention relates to the use of highly functional, highly branched polyetheramine polyols for coating substrates such as metal surfaces or plastic components, allowing an improved adhesion of additional coats.
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WO/2009/037834A1 |
Disclosed is a primer resin for a semiconductor device having a lead frame comprising copper or 42 alloy, which comprises a polyamide resin represented by the formula (1) [wherein R1 represents a tetravalent aromatic residue of a tetraca...
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WO/2009/034940A1 |
Disclosed is a method for forming a conductive layer, which comprises the following steps: a coating film formation step (S1) of applying a coating solution containing a polyimide precursor resin on the surface of an insulating substrate...
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WO/2009/014009A1 |
Disclosed is a coating composition which exhibits good mechanical stability and storage stability and enables to obtain a coating film having excellent adhesion to an article to be coated, even when the amount of a fluorine-containing su...
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WO/2009/007809A1 |
To provide primer compositions with which it is possible to form primer paint films with which the adhesion on metals such as iron, copper and the like, plated steel sheets where these have been plated, and especially zinc plated steel s...
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WO/2009/001182A1 |
To provide a primer composition with which primer coatings can be formed which have excellent adhesion to metals such as iron or copper, or steel sheet plated with these, in particular zinc-plated steel sheet, and excellent adhesion to t...
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WO/2008/155611A1 |
The Problem: to provide primer compositions which can form coated primer films with: excellent adhesion to metals such as iron and copper, these metals with plating thereon plated steel sheet, particularly zinc- plated steel sheet; excel...
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WO/2008/152461A1 |
To provide primer compositions with which it is possible to form primer paint films with which the adhesion on metals such as iron, copper and the like, plated steel ' sheets on which these have been plated, and especially zinc plated st...
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WO/2008/143128A1 |
Disclosed is a resin composition comprising: a component (A) which is a resin having an acid anhydride group and/or a carboxyl group; a component (B) which is an epoxy resin; and a component (C) which is a filler comprising hydrotalcite....
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WO/2008/139990A1 |
Disclosed is a suspension of an electrodeposition coating composition which contains, as a resin component, a block copolymerized polyimide which has a siloxane bond in the molecular skeleton, while containing an anionic group in a molec...
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WO/2008/136467A1 |
A coating material with which a fixing belt or the like which satisfies required properties, e.g., heat resistance at fixing temperatures and toner releasability, can be produced at low cost and which can give a fluororesin coating film ...
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WO/2008/129947A1 |
Any of the oligoaniline compounds with a triphenylamine structure represented by the formula (1) exhibits satisfactory light emitting efficiency and brightness performance when used in either an OLED device or a PLED device, and is furth...
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WO/2008/121964A1 |
A high barrier composition to a gas or organic liquid usable as a coating or layer on an article. The composition includes a blend of polyetheramine resin and at least one additive being a highly hydrolyzed organic compound, preferably o...
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WO/2008/108680A1 |
The inventive method for producing coatings which exhibit disinfecting properties used for sanitising areas and facilities and for conserving and decontaminating water, including potable water, consists in producing polyhexamethylene gua...
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WO/2008/096441A1 |
The invention aims at lowering the curing temperature of a resin composition containing a compound having a phenylethynyl group and thereby providing cured articles excellent in mechanical characteristics such as heat resistance, modulus...
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WO/2008/091082A1 |
The present invention relates to a method for preparing a cationic microgel for electrodepositable coating and an electrodepositable coating composition comprising cationic microgel prepared by the same method. More specifically, the pre...
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WO/2008/081770A1 |
Disclosed is a polybenzoimidazole coating composition which is easy to apply and capable of forming a thick coating film. This polybenzoimidazole coating composition contains polybenzoimidazole particles dispersed in a mixed solvent, and...
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WO/2008/078620A1 |
Disclosed is a polyimide precursor composition which can be cured at low temperatures (250˚C or less), while having low viscosity even at high concentration. Also disclosed is a method for producing such a polyimide precursor compositio...
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WO/2008/079237A1 |
A selfbonding enamel containing resins with nucleophilic groups as well as possibly amide group-containing resins which are capable of crosslinking with one another, comprising (A) 5 to 95 wt% of at least one resin with nucleophilic grou...
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WO/2008/075910A1 |
There are provided an apparatus for surface treatment on an insulation panel, which is capable of continuously performing the surface treatment, such as plasma pretreatment and the like, on the work surface of the insulation panel instal...
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WO/2008/076597A1 |
The present invention is directed to a transparent coating composition with good cure response and appearance. In particular, the transparent coating composition may comprise (a) at least one functional polymer containing amine groups an...
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WO/2008/076200A1 |
Methods of making hydrophilic coatings having anti-fog properties, and hydrophilic articles are provided. In certain example instances, a substrate supports a surfactant and polyethylenimine. The method includes forming a polyethylenimin...
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WO/2008/076033A1 |
A packaging laminate for a retortable packaging container for a food in which the packed food may be stored and, after storage, be heated by means of microwaves without the packaging container first needing to be opened. The packaging la...
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WO/2008/073273A2 |
The invention relates to water-based coating compositions, comprising: A) at least one aqueous (meth)acrylate latex, B) at least one aqueous polymer latex, selected from the group consisting of polydiene latex, polydiene copolymer latex,...
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