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WO/2005/059925A1 |
A process for preparing conductive polyaniline (PAn) coatings such as films with conductivity in the range of 500 to 5000 S/cm on various substrates such as silicon wafers and glass slides is described. The thickness of the film is in th...
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WO/2005/052070A1 |
Method for production of a coating on a solid substrate comprising the steps of applying a liquid coating composition comprising a polyfunctional resin, a fatty acid or derivative thereof acting as a reactive diluent and optionally a cur...
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WO/2005/038825A1 |
A varnish for insulating films, characterized by comprising (A) a polymer obtained by reacting a bisaminophenol compound having a bulky structure with a dicarboxylic acid compound and constituted mainly of a polybenzoxazole resin precurs...
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WO/2005/030890A1 |
A thermosetting and photocurable coating composition obtained by incorporating either a copolymer of a monomer having a maleimide group with other monomer(s) or a specific maleimide compound into a composition comprising a hydroxylated r...
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WO/2004/108842A1 |
The present invention comprises a process for coating a substrate with a coating comprising a fluoropolymer. The process comprises the sequential steps of: a. Preparing a solid mixture comprising one or more fluoropolymers and one or mor...
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WO/2004/101693A1 |
Chromate-free treatments and compositions, for applying a conversion or passivation coating to zinc coated metal surfaces. The compositions comprise a polyamidoamine/epihalohydrin polymer or cationic polyamine/epihalohydrin polymer compo...
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WO/2004/099325A1 |
It is an object of the present invention to provide an insulating coating composition capable of attaining an insulating film having a high dielectric breakdown voltage, and an insulated wire coated therewith, which has a high insulating...
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WO/2004/094545A1 |
A thermosetting liquid coating composition for aluminum wheels which comprises: (A) a hydroxylated and carboxylated acrylic resin having a hydroxy value of 90 to 150 mg-KOH/g and an acid value of 1 to 30 mg-KOH/g obtained by copolymerizi...
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WO/2004/087792A2 |
This invention relates to a modified polymeric material in the form of polyimide, which polyimide is surface oxyfluorinated and has improved wettability. The invention further relates to surface oxyfluorinated substrates such as optical ...
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WO/2004/067596A1 |
Disclosed is a method for producing polyamide imide resins, according to which the centers of said polyamide imide resins, which are reactive towards humidity, are reacted with one or several compounds of general formula H-X-R1, wherein ...
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WO/2004/061001A1 |
A polyimide precursor liquid composition which contains at least one tetracarboxylic dianhydride or derivative thereof, at least one diamine or derivative thereof, and a polar polymerization solvent and further contains a cyclic compound...
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WO2004026974B1 |
The invention relates to a method of producing a modified diisocyanate to which is fixed an aliphatic pendant chain comprising at least (15) carbon atoms, said modified diisocyanate being obtained by reacting an isocyanate functional gro...
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WO/2004/055592A2 |
Stable non-photosensitive polyimide precursor compositions with an adhesion promoter in a non-NMP solvent for use in forming high temperature resistant relief images and a process for making said images. The non-photosensitive polyimide ...
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WO/2004/048489A1 |
A coating composition which is free from hexavalent chromium serving as binder and exhibits close adhesion equivalent to that of chromium phosphate primer even when baked at high temperature for a long time; and an amido resin compositio...
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WO/2004/033568A1 |
The invention relates to an antimicrobial coating, comprising polymers of cyclic amines of formula (I) with at least one unsaturated group which may be polymerised, where R1, R2 = substituted or unsubstituted, branched or unbranched, ali...
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WO/2004/022628A1 |
The invention relates to novel polyester polyols with a cyclic imide structure and to their use in coating agents.
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WO/2004/022622A1 |
The invention relates to novel polyester polyols with a cyclic imide and isocyanurate structure and to their use in coating agents.
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WO/2004/005394A1 |
Non-stick coatings for use on a substrate are provided. The coatings include at least one coat that contains a binder component and a fluoropolymer component. The at least one coat may be the sole coating for use on the substrate or it m...
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WO/2004/001099A2 |
The invention relates to a composition for treating the surfaces of metals and for depositing metals or metal alloys on plastic surfaces. Said composition contains: a) at least one polymer, as constituent A, containing at least one struc...
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WO/2003/102034A1 |
Methods and compositions are described for protecting a metal surface against corrosion. The method involves applying to the metal surface a coating formulation that comprises a radiation curable resin and a corrosion-responsive agent th...
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WO/2003/097755A1 |
The present invention relates to a radiation curable coating composition comprising (A) a compound according to P-(D-(meth)acrylate)n having a number average molecular weight (Mn) of at least 500 kg/kmol, wherein n=2-40, P=oligomeric or ...
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WO/2003/095574A1 |
This invention relates to a polymeric particle, and in particular to a polymeric particle prepared by forming a polyimide in the presence of a particle of base polymer.
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WO/2003/095525A1 |
Disclosed are copolymers based on aspartic acid or its precursor molecules and methods of their production. The copolymers are water-soluble over a wide range of composition and molecular weight. Their preparation involves conversion of ...
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WO/2003/087823A1 |
The invention relates to a method for immobilizing molecules on surfaces, whereby a largely planar surface is coated with a polymer after which the molecules are immobilized on the surface by said polymer.
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WO/2003/087468A1 |
A method for coating a substrate comprises the steps of : (I) applying a layer on the substrate of a curable composition comprising : (A) a water continuous emulsion comprising a curable elastomeric polymer having a viscosity of 0.5 - 1,...
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WO/2003/085033A1 |
The invention relates to a UV absorber comprising a finely dispersed polymer having an average volume particle size ranging from 5 to 1000 nm. The invention also relates to a method for producing this UV absorber and to the use thereof f...
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WO/2003/080709A1 |
A process for the preparation of a reactive friable polyimide powder comprises dissolving an aromatic dianhydride and an organic diamine in a high-boiling, aprotic organic solvent to form a reaction solution; heating the reaction solutio...
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WO/2003/074587A1 |
A polyimide precursor solution exhibiting desirable coating operability, and a transfer/fixing member, such as a polyimide seamless belt, obtained from the polyimide precursor solution. The polyimide precursor solution is produced by dis...
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WO/2003/072639A1 |
A halogen-free polyamide-imide resin which is capable of dissolving in an amide solvent in a concentration of 10% to give a varnish undergoing a solution viscosity change through 1-month storage at 5°C, [(solution viscosity after 1 mont...
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WO/2003/070845A1 |
The invention relates to wire enamels based on polyester-, polyester-imide-, polyester-amide-imide- and/or polyurethane resins that contain one or more of the aforementioned resins as a binder and organic solvents and optionally diluents...
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WO/2003/071559A1 |
An organic conductive material comprising a salt formed by an oligoaniline derivative of the formula (1), after reduction of a quinoimine being an oxide produced in synthesis thereof with a reducing agent, and an electron accepting dopan...
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WO/2003/068703A1 |
The invention relates to aqueous dispersions consisting of polycarbodiimides which essentially carry no carboxyl groups. Said polycarbodiimides are characterised in that (I) they are obtained from polyisocyanates of general formula (I) w...
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WO/2003/059964A2 |
The invention relates to a supramolecular polymer containing units which are linked by hydrogen bonds, said units being monomers or prepolymers comprising at least one function selected from functions (1) and (3) and a second function se...
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WO/2003/056061A2 |
The invention relates to a composition for treating metal surfaces and for separating metals or metal alloys from plastic surfaces, containing a) at least one polymer as component A made of structural element (1) and at least three struc...
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WO/2003/033790A1 |
Polyamideimide coating compositions for magnet wire which exhibit solvent or varnish-induced craze resistance. The polyamideimide compositions include a compound selected from the group consisting of diacid compounds, trimellitic anhydri...
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WO/2003/033606A1 |
A coating composition comprising pigment, medium and a binder characterised in that (i) the binder comprises a cationic polymer comprising a repeat unit of formula (I): wherein: X and Y are the same or different and represent divalent or...
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WO/2003/033212A1 |
Provided is a treated substrate (12) comprising a backing material coated with a resin derived from a curable precursor resin, which comprises an energy-curable component comprising a cyanate ester resin and a curing agent. Also provided...
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WO/2003/029374A1 |
A method of forming a polybenzimidazole coating film on a substrate surface&semi and a method of forming a polybenzimidazole film. The former method comprises applying a solution containing a prepolymer for polybenzimidazole to a substra...
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WO2002074840B1 |
The invention relates to a process for coating the surface of plastics comprising the steps of: i) absorbing one or more internal reagent(s) in the plastic to be coated; ii) contacting one or more external reagent(s) with the surface of ...
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WO/2002/100962A1 |
The present invention relates to the catalysis of the curing rate of epoxy hybrid powder coatings by organic amines or ammonia under mild conditions.
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WO/2002/090452A2 |
Components for electronic displays containing a polyimide substrate and an electrical conductor are disclosed. The components are suitable for use in touch panel displays. The invention is also directed to electronic displays incorporati...
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WO/2002/088845A1 |
A resin composition which comprises a polyimide precursor and a photosensitizer, wherein the polyimide precursor has structural units represented by the following formula (1), wherein A?1¿ is a tetravalent organic group and A?2¿ is a d...
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WO/2002/086624A1 |
A composition for forming an antireflection film for use in a lithographic process for semiconductor device production, which contains as a component a resin containing structural units derived from cyanuric acid, a derivative thereof, o...
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WO/2002/083415A1 |
Anti-reflective compositions and methods of using those compositions to form circuits are provided. The compositions comprise a polymer dissolved or dispersed in a solvent system. In one embodiment, the compositions comprise less than ab...
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WO/2002/073772A1 |
Rotor, stator, or field coil in an electrical motor or generator, a toroid or a toroidal tape core coated with a powder coating obtained by curing a thermosetting powder coating composition comprising an epoxy-terminated polyoxazolidone ...
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WO/2002/066546A1 |
A polyimide film is produced by subjecting a solution of a polyamic acid prepared from a specific acid dianhydride component and a specific diamine component to thermal imidation under a reduced pressure to thereby obtain a soluble polyi...
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WO/2002/062909A1 |
The present invention is directed to fast dry ambient temperature curable coating compositions especially suited for use in automotive refinish applications. A binder component of the two pack coating composition includes an epoxy resin ...
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WO/2002/062871A2 |
Described are monomer compositions containing aspartic acid and other comonomers, such as monosodium aspartate, and methods for their production. The monomer compositions can be polymerized, particularly by thermal polymerization, to obt...
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WO/2002/061765A1 |
A composition for forming a dielectric substance, characterized in that it comprises (A) composite particles for a dielectric substance comprising inorganic particles having a permittivity of 30 or more and an electroconductive metal or ...
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WO/2002/059209A1 |
Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiati...
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