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WO/2000/053677 |
An aqueous-based composition comprising an aqueous solution of the product formed of the combination of a polyamide-amic acid and a triamine, preferably wherein the polyamide-amic acid is prepared from trimellitic acid halide or its equi...
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WO/2000/052757 |
The invention improves the workability of manufacture of flip chips and provides various semiconductor devices with high reliability. A positive photosensitive resin composition containing 100 parts of polyamide by weight and 1-100 parts...
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WO/2000/036036 |
The invention provides a powder slurry composition having a particulate component (a) dispersed in a liquid component (b). Component (a) comprises a solid or particulate compound (i) of the formula R(X)¿y? having C¿n? symmetry wherein ...
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WO/2000/036035 |
The invention provides a carbamate functional compound (a) of the formula R(X)¿y? having C¿n? symmetry wherein $i(n) = 2 or higher and a T¿g? $m(G) 30 °C, wherein X is a carbamate functional group and y $m(G) 2. The invention further...
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WO/2000/032691 |
Resin compositions comprising polyimides composed of repeating units represented by general formula (1), (wherein Ar?0¿ is a C¿6?-C¿15? aromatic hydrocarbon group; and R?1¿ is at least one member selected from the group consisting of...
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WO/2000/027934 |
The present invention relates to compositions used in the application of coatings on buildings and structures essentially made of wood or metal, wherein said coatings exhibit high fire-protection and thermal insulation properties. This i...
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WO/2000/026313 |
The present invention provides a curable coating composition that includes at least three components. The coating composition includes a component (a) having at least one carbamate group or urea group and having a lactone or hydroxy carb...
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WO/2000/011084 |
A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity, and (F) an organic solvent and which...
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WO/2000/009477 |
The invention relates to unsaturated oligophenol cyanates of the general formula (I) [A-]¿n?[B-A-]¿x?B[-A]¿m?, in which A is a group of formula (II) and B is a group of formula (III), where R?1¿, R?2¿ and R?3¿ are each hydrogen or ...
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WO/2000/006628 |
A stable emulsion comprising a polyetherimide resin, neutralization agent, cosolvent, solvent, ring opening agent, and water, for use in a cataphoretic deposition process for forming a polyetherimide coating on a substrate, particularly ...
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WO/2000/006630 |
A cataphoretic electrodeposition process for forming a thermoplastic coated article using a stable emulsion comprising a thermoplastic resin, neutralization agent, cosolvent, solvent, ring opening agent, and water. The substrate and an a...
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WO/2000/006629 |
A cataphoretic electrodeposition process for forming a fiber polyetherimide composite using a stable emulsion comprising a polyetherimide resin, neutralization agent, cosolvent, solvent, ring opening agent, and water. The fibers and an a...
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WO/2000/001750 |
Compositions comprising a blend of an inorganic base, an organic base, a monofunctional organic nucleophile or a multifunctional organic nucleophile and a thermoplastic hydroxy-functionalized polyetheramine can be formed into films and l...
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WO/1999/047615 |
A composition comprising a plurality of multicomponent particles, one component of each of the particles being melt fabricable fluoropolymer and another component of each of the particles being a high temperature resistant non-dispersed ...
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WO/1999/041757 |
An insulated wire which has an insulating layer formed by coating a conductor with a resin composition selected from the group consisting of polyamide-imide resins and polyimide resins each having a molecular structure containing a struc...
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WO/1999/036454 |
A novel modified polyimide resin which has a polybutadiene skeleton obtained by reacting three compounds, i.e., a bifunctional hydroxyl-terminated polybutadiene having a number-average molecular weight of 800 to 5,000, the dianhydride of...
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WO/1999/032076 |
The invention concerns the use of hyperbranched polymers and dendrimers, comprising at least one group of formula (I) in which: Y represents the oxygen atom or a NH group; and A represents a C¿1?-C¿12? alkane di-yl group, linear, branc...
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WO/1999/028787 |
A high optical density, i.e., > 3.0, at 1 micron or less film thickness, black matrix is disclosed having improved stability and shelf life as a consequence of admixing Pigment Black 7 and organic dye or dye mixtures on a polyimide polym...
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WO/1999/024991 |
A fluid conductive polymer mixture for use in the preparation of coatings, films and fibres is based on a polyaniline in base form (preferably emeraldine-base form). This is doped with a sulfonic acid having in addition to at least one s...
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WO/1999/016841 |
A composition comprising a polymer and an inorganic filler, whereby it comprises (a) a polymer selected from polyether sulphone (PES) and polyetherimide (PEI), and (b) inorganic filler coated with one or more layers of metal oxide. The c...
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WO/1999/010565 |
A process for forming polymer films through electrochemical techniques utilizing electrolytes with include conductive polymer. The resulting polymer films are electrically conductive and corrosion and wear resistant. Polyamino-benzene (p...
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WO/1999/008288 |
The invention relates to a coating for enamelled wire, comprising at least one base layer and at least one topcoat enamel layer, at least one topcoat enamel layer containing titanium dioxide, and to enamelled wires which are coated with ...
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WO/1998/040881 |
The present invention includes a coating composition for protecting aluminium and alloys thereof from corrosion. The composition comprises at least one substance selected from the group consisting of emeraldine base polyaniline and oligo...
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WO/1998/036029 |
Matte grade coated ink jet paper comprises a cellulosic substrate coated with a coating composition comprising a calcined kaolin clay particulate pigment comprising porous aggregates with a total pore volume of 0.60 cm?3�/g to 2.00 cm?...
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WO/1998/029471 |
A novel soluble polyimide resin which is highly soluble in a solvent, has high transparency and hence is useful particularly in the fields of electronics and optoelectronics, and has good moldability; a process for preparing the same; an...
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WO/1998/023667 |
The invention relates to a method for the production of polyester imide resins containing hydroxyl- and carboxyl groups, comprising as monomer components: (A) imide-forming compounds with at least two primary amino groups and/or at least...
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WO/1998/015588 |
There is now provided a method for coating a substrate using a one package composition which is stored stable at room temperature and which can be cured into a thermoset coating upon application of heat. The storage stable mixture is mad...
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WO/1998/013728 |
An organic black matrix having high resistivity ($m(G) 10?11� ohm/square), high optical density ($m(G) 2.0) at ultra thin film thicknesses ($m(F) 1.0 microns) for improved STN and TFT pixel display applications is made possible by comb...
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WO/1998/007770 |
An electrodepositable composition that has: (A) an active hydrogen-containing cationic resin, electrodepositable on a cathode, having: (1) a polyepoxide; (2) an oxygen-substituted diamine compound having formula (I) where n is an integer...
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WO/1998/006512 |
A method of forming a hydrophilic coating on a metal surface which includes contacting the metal surface with a substantially silane-free aqueous solution containing a cationic polymer and an alkaline aqueous silicate.
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WO/1998/006790 |
The invention relates to wire enamels containing polyester imide and/or polyamide imide as binders, in which the binders contain, as a monomer element, amino-terminated polyoxyalkylene diamine. Preferred polyoxyalkylene diamines are sele...
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WO/1998/000467 |
Curable coating compositions are described comprising a) a polymer resin comprising active hydrogen-containing functional groups, b) a curing agent having groups that are reactive with said functional groups on (a), and c) a compound com...
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WO/1997/045497 |
The present invention relates to polyimides which are derived from at least one non-aromatic component, a process for their manufacture and their uses in electronic applications, particularly as dielectric coatings for printed wiring boa...
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WO/1997/039073 |
A primer layer composition for a non-stick coating on a smooth substrate consists essentially of polytetrafluoroethylene and polymer binder in a weight ratio of 0.2 to 1.4 : 1. Other fluoropolymer can be used, and the polymer binder can ...
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WO/1997/037843 |
An electrically conductive laminate comprises an electrically conductive layer having electrically conductive macromolecules and laminated to at least one surface of inorganic or organic substrate. The electrically conductive layer has a...
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WO/1997/033700 |
A process for rendering underwater marine surfaces resistant to fouling includes applying to the surfaces before the submerging thereof a coating or film of a polyimide which contains fluorine in the chemical structure.
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WO/1997/031914 |
At least bis-imido 1,3,5-triazines and processes of preparing the same are disclosed. Also disclosed are prepolymers having at least bis-imido functionality and curable compositions comprising at least bis-imido 1,3,5-triazines or prepol...
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WO/1997/025386 |
The invention concerns solvent-free, low-emission hardenable coating means containing saturated and/or non-saturated polyester as a bonding agent which has dihydrodicyclopentadiene units of formula (I) as the structural unit and/or oligo...
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WO/1997/025724 |
A process is disclosed for coating winding and profiled wires with polyester, polyesterimide or polyurethane resins. The process involves incorporation in the polyester, polyesterimide or polyurethane resins of structural units of genera...
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WO/1997/020894 |
The invention concerns a radiation-hardenable coating compound containing between 50 and 85, preferably between 60 and 75, wt % polyetheracrylate, between 15 and 40, preferably between 20 and 30, wt % fillers, between 0 and 10, preferabl...
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WO/1997/018255 |
Thermosetting polymers with high temperature capability for composite and adhesive applications are disclosed. Inhibitors for improving pot life, gel time and storage stability are disclosed. These polymers are ideally suited for adhesiv...
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WO/1997/014729 |
Methods of forming low molecular weight oligomers of aniline-based compounds are provided as well as methods of forming varied molecular weight oligomers and polymers that are aniline-based which are end-functionalized and capable of bei...
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WO/1997/007170 |
The invention relates to a baking coating agent based on at least one binding agent selected from amino(meth)acrylate resins and/or epoxide amine addition compounds and having cationic groups and/or groups convertible into cationic group...
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WO/1997/006208 |
Compositions of ETFE and mica are resistant to permeation by water and provide useful coatings for such items as chemical equipment. The composition can be used either as films which can be laminated to substrates or as coatings which ca...
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WO/1996/039457 |
A composition of matter comprises an aromatic cyanate ester silane comprising at least one cyanate ester group and at least one hydrolyzable silyl group. In the presence of a cyanate ester resin the aromatic cyanate ester silane acts as ...
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WO/1996/037563 |
The invention pertains to a coating composition comprising a polyacetoacetate and a crosslinker for said polyacetoacetate wherein the crosslinker is present in an amount insufficient to crosslink all acetoacetate groups and the polyaceto...
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WO/1996/037562 |
The invention pertains to a coating composition comprising a polyacetoacetate, a crosslinker for said polyacetoacetate and an organosilane. The organosilane preferably comprises at least one amino group, amino-containing group, epoxy gro...
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WO/1996/027643 |
A wire coating medium contains polyester resins, polyester imide resins or hydroxyl group-containing polyesters together with an isocyanate component whose free isocyanate groups are completely blocked. This wire coating medium is produc...
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WO/1996/021699 |
A conductive coating composition comprising 100 parts by weight of a (meth)acrylate compound having at least two (meth)acryloyl groups in its molecule, 0.1-30 parts by weight of a particulate conductive aniline polymer, 1-100 parts by we...
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WO/1996/020242 |
A method for bonding a copper foil to a substrate comprising a polymeric compound which method comprises coating the substrate with a resin composition comprising a specific cyanate ester compound [A], for instance a phenol novolac polyc...
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