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WO/2015/086762A1 |
Gloss enhancing compositions for polymer surfaces and polishing compositions for stainless steel surfaces are microemulsions of a diaminoorganopolysiloxane, a film forming acrylate polymer, and a wax. The compositions exhibit high gloss,...
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WO/2015/060293A1 |
This polishing liquid composition for silicon wafers contains 0.01-0.5% by mass of silica particles, a nitrogen-containing basic compound and a water-soluble polymer. The water-soluble polymer contains a constituent unit represented by g...
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WO/2015/053207A1 |
A semiconductor wetting agent including an aqueous polymer having within a molecule 70-99 mol% of the structural unit represented by formula (1), and 1-30 mol% of the specific structural unit represented by formula (2). [-CH2CH(OH)-] (1)...
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WO/2015/052988A1 |
A polishing agent which contains water, abrasive grains containing a hydroxide of a tetravalent metal element, a polymerization product of α-glucose and a cationic polymer, and wherein the polymerization product of α-glucose has a weig...
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WO/2015/050260A2 |
Provided are: a polishing agent composition that contains silica particles, an alkali substance, a water-soluble synthetic polymer, and water, and that is characterized by the water-soluble synthetic polymer having structural unit (1), t...
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WO/2015/045757A1 |
The present invention provides a polishing composition having excellent storage stability. The present invention is a polishing composition comprising abrasive grains and an oxidizing agent containing a halogen atom, wherein a value (A/B...
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WO/2015/041942A1 |
An aqueous composition having three components. The first component is an aromatic-acrylic polymer. The second component is an epoxy silane. The third component is a nonionic surfactant having a C10-C20 alkyl group and two to four polyme...
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WO/2015/040979A1 |
The present invention is a polishing composition containing: silica having functional groups that satisfy at least one of the following conditions (1) and (2), the functional groups immobilized on the surface of the silica; and a pH adju...
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WO/2015/024610A1 |
The invention relates to the use of a silica-based polishing agent for polishing an optical glass.
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WO/2015/019849A1 |
The problem addressed by the present invention is to provide a slurry for CMP, with which it is possible to suppress polishing scratches and dishing, and to achieve a higher polishing speed and cleaning performance. This slurry for CMP...
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WO/2015/019911A1 |
The problem addressed by the present invention is to provide a slurry for CMP, with which it is possible to suppress polishing scratches and dishing, and to achieve a higher polishing speed and dispersion stability. This slurry for CMP i...
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WO/2015/019706A1 |
[Problem] To provide a method for producing a polished object which is capable of reducing the haze level of the surface of an object to be polished, while effectively reducing defects. [Solution] A method for producing a polished object...
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WO/2015/008193A1 |
Described is a chemical-mechanical polishing (CMP) composition comprising abrasive particles containing ceria.
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WO/2015/005200A1 |
[Problem] To provide a means which is capable of reducing level difference defects such as dishing, while maintaining a high polishing rate, and which is also capable of improving storage stability with respect to a polishing composition...
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WO/2014/208400A1 |
This method for producing an SiC substrate comprises at least a CMP step wherein an Si surface (1a) and a C surface (1b) of an SiC substrate (1) are subjected to double side polishing by a Chemical Mechanical Polishing (CMP) method at a ...
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WO/2014/195932A1 |
A wet napkin sealed in a packaging wherein the said wet napkin is moisturized with cleaning materials or with shining and protective materials aimed for cleaning and protecting plastic materials including car headlights
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WO/2014/195167A1 |
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) elemental germanium or (ii) Si1-xGex with 0.1 ≤ x < 1, wherein the CMP composition (Q) consists essentiall...
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WO/2014/185835A1 |
The present invention regards a method for manufacture of an article (ART) adapted to be mountable on a sub-structure (54) of an aerial vehicle (23), the article comprises an outer surface (3) serving as an aerodynamic surface during use...
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WO/2014/179419A1 |
CMP processes, tools and slurries utilize composite particles that include core particles having organosilica particles disposed about the core particles. Using these processes, tools and slurries can enhance removal rates, reduce defect...
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WO/2014/172604A1 |
The present invention provides an antistatic wax, which comprises: 1 part by weight of a wax; 1.2 to 10 parts by weight of an imidazole-based amphoteric surfactant; and 3-1000 parts by weight of a solvent.
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WO/2014/156381A1 |
Provided is a polishing composition which is able to be stably used for the polishing of a material that contains a metal, especially tungsten, and which is capable of improving the polishing rate. The present invention is a polishing co...
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WO/2014/148399A1 |
Provided is a polishing composition that contains a water-soluble polymer having a molecular structure that contains a plurality types of repeating units having different SP values, in which an etching rate and abrasive grain adsorption ...
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WO/2014/126051A1 |
Provided is a polishing composition which includes abrasive grains, a water-soluble polymer, and water. Measured using dynamic light scattering, the volume average particle size (DA) of particles included in the polishing composition whe...
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WO/2014/122976A1 |
The problem addressed by the present invention is to provide a polishing material slurry that can obtain a high polishing speed and superior durability, and that suppresses the amount of cerium oxide used. The polishing material slurry c...
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WO/2014/122982A1 |
The problem to be solved by the present invention is to provide a polishing slurry that makes it possible to reduce the amount of cerium oxide used, does not cause clumping of polishing particles during long-term storage, has outstanding...
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WO/2014/119301A1 |
The present invention provides a polishing composition having a high ratio of a polishing rate of a silicon nitride (SiN) surface to a polishing rate of a silicon oxide surface and/or a high ratio of a polishing rate of a SiN surface to ...
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WO/2014/117066A1 |
A tungsten jewelry resurfacing kit for consumer end use comprises a buffing cloth; a container of tungsten resurfacing compound having less than 50 ml of resurfacing compound, wherein the resurfacing compound comprises a mixture of i) a ...
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WO/2014/112857A1 |
The invention relates to a surface treatment process and to polishing operations comprising the following steps: - The impurities which exist in the crude phosphate are removed using a sieve. - The phosphate is washed with distilled wate...
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WO/2014/102249A1 |
Provided is a method for the formation of particulate compounds of selectable size characteristics, which method includes supporting a slurried particulate precursor on a porous support; heating the support such that aggregates of the pa...
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WO/2014/089906A1 |
An application of a phosphate ester surfactant in self-stopping polishing. The phosphate ester surfactant at least comprises a structural formula (1) and/or a structural formula (2), wherein X=RO, RO-(CH2CH2O)n, or RCOO-(CH2CH2O)n; R is ...
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WO/2014/090890A1 |
This invention relates to a composition for the brightening and/or passivating of stainless steel after pickling. The invention is based on the discovery that the presence of organic compounds containing multiple hydroxyl groups with at ...
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WO/2014/089905A1 |
The present invention provides a chemical mechanical polishing slurry used for copper and an application thereof. The slurry comprises grinding particles, a complex agent, an oxidant, a corrosion inhibitor, and at least one type of a pho...
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WO/2014/089907A1 |
Disclosed is an application of a chemical mechanical polishing agent in polishing of a silicon-based material. The polishing agent at least comprises grinding particles and an oxidant. The polishing agent can be used for polishing a sili...
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WO/2014/079144A1 |
Disclosed is a chemical mechanical polishing solution for shallow trench isolation technology, comprising a silicon dioxide abrasive, one or more anionic surfactants and water. The polishing solution has a relatively high removal speed f...
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WO/2014/071859A1 |
Provided are a cerium oxide based composite polishing powder and preparation method thereof, the cerium oxide based composite polishing powder containing the element magnesium in a total amount of 0.005%-5% by weight of magnesium oxide; ...
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WO/2014/070461A1 |
A method for chemically stabilizing polishing slurries in aqueous suspension to prevent their agglomeration while maintaining their surface activity is disclosed. The method prevents the formation of irreversible particle agglomerates du...
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WO/2014/069043A1 |
Provided is a polishing composition with which a high-gloss surface can be achieved, and with which smoothness of a surface of an alloy material is improved while maintaining a sufficiently high polishing speed with respect to the alloy ...
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WO/2014/065029A1 |
This CMP polishing solution for polishing a substrate including an aluminium-based material includes abrasive grains, an oxidant, and a liquid medium. The circularity of the abrasive grains is not more than 0.90. The pH of the CMP polish...
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WO/2014/061417A1 |
A polishing solution for CMP, which can be used for polishing a base comprising an aluminum-containing material, and which comprises abrasive grains, an oxidizing agent, at least one component selected from the group consisting of diethy...
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WO/2014/059744A1 |
The present invention provides an alkaline polishing solution for polishing a barrier layer, comprising grinding particles, an azole compound, C1-C4 quaternary ammonium alkali, an oxidant, water, and a surface active agent for adjusting ...
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WO/2014/048058A1 |
Disclosed is a chemical mechanical polishing solution. The polishing solution comprises water, ceria ground particulates, oxidizer and water soluble cyclic oligosaccharide. The chemical mechanical polishing solution in the present invent...
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WO/2014/037059A1 |
The present invention relates to a method and blasting means for producing a satinized finish on an aluminium substrate. A method is specified for the production of a satinized finish on an aluminium substrate comprising the steps: -prov...
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WO/2014/008356A1 |
An abrasive article includes a bonded abrasive body having abrasive particles contained within a bond material. The bonded abrasive body may include an abrasive particle-to-bond material interfacial modulus of elasticity (MOE) of at leas...
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WO/2013/191139A1 |
In the present invention, a polishing composition contains abrasive particles, a surface adsorption agent, and water and is used to polish a polishing target comprising crystalline metallic compounds. Compared to the case where the surfa...
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WO/2013/189168A1 |
Disclosed is a chemical mechanical polishing solution for silicon through-holes, comprising at least a grinding particle, an azole compound, an acid, one or more anionic surfactants, and an oxidant. The polishing solution has a high sili...
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WO/2013/177943A1 |
Disclosed are a chemical mechanical planarization slurry and an application thereof. The slurry comprises grinding particles, oxidizer, polishing rate enhancer, a corrosion inhibitor, polishing surface improver, and a carrier. The chemic...
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WO/2013/175396A1 |
A process for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate or layer containing at least one lll-V material in the presence of a chemical-mechanical polishing composition (Q1) compri...
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WO/2013/176095A1 |
The purpose of the present invention is to provide an abrasive material which can have high crush strength even when the abrasive material has a Fe concentration as high as 6.0 to 35.0 mass% in terms of FeO content, and which shows small...
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WO/2013/151745A1 |
Shaped ceramic abrasive particles include a first surface having a perimeter having a perimeter comprising at least first and second edges. A first region of the perimeter includes the second edge and extends inwardly and terminates at t...
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WO/2013/149209A1 |
An engineered coated abrasive product having a backing, a frontfill coat, a make coat, and/or a size coat, wherein at least one of the coats includes fibrillated fibers. The coated abrasive product is capable of improved inter-layer adhe...
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