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WO/2020/263872A1 |
A floor care composition includes pre-made polymer particles in a liquid vehicle as well as a non-ionic crosslinking agent. The polymer particles include a relatively narrow ratio of hydro¬ philic to hydrophobic regions or components, a...
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WO/2020/255616A1 |
The present invention provides a polishing liquid that has good polishing speed and is capable of suppressing the occurrence of corrosion and scratches on the polishing surface, when applied to CMP of a body to be polished that has a cob...
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WO/2020/256932A1 |
Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substra...
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WO/2020/255862A1 |
Provided are: a chemical-mechanical polishing composition containing an aqueous carrier and at least one compound selected from the group consisting of an abrasive, a basic component, a quaternary polyammonium salt, a quaternary ammonium...
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WO/2020/245904A1 |
This polishing solution for CMP contains a liquid medium and abrasive grains containing silica, wherein the contained amount of the abrasive grains with respect to the total amount of the polishing solution is 1.0 mass% or more, and, in ...
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WO/2020/245224A1 |
The invention relates to a use of a compound of general formula I, wherein A is selected from the group consisting of a hydroxy group, a thiol group and an amino group; Y is selected from the group consisting of -O-, a hydroxy group, an ...
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WO/2020/246471A1 |
This polishing solution for CMP contains a liquid medium and abrasive grains containing silica, wherein the contained amount of the abrasive grains with respect to the total amount of the polishing solution is 1.0 mass% or more, and, in ...
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WO/2020/246964A1 |
An abrasive composition comprising a substrate selected from the group consisting of a fibrous substrate, a sponge substrate, and combinations thereof and a plurality of calcium carbonate particles dispersed therein; wherein at least a p...
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WO/2020/223029A1 |
Chemical Mechanical Planarization (CMP) polishing compositions, methods and systems are used to polish low-k or ultra-low-k films with reasonable high removal rates while to polish oxide and nitride films with relative low removal rates....
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WO/2020/214662A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising silica particles and alumina particles, wherein the alumina particles are surface coated with an anionic polymer, and (b) water. The...
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WO/2020/212074A1 |
The present invention relates to aqueous coating composition (A) for at least partially coating an electrically conductive substrate with an electrocoat comprising (A1) at least one cathodically depositable resin as a binder, (A2) at lea...
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WO/2020/203568A1 |
Provided are: a method for production of a polishing composition that is capable of improving post-polishing surface quality; and a polishing method. The polishing composition production method according to the present invention is used ...
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WO/2020/196542A1 |
[Problem] The purpose of the present invention is to provide a polishing composition which enables the speed-of-removal of a metal material to be the same as, or similar to, the speed-of-removal of a resin material in a chemical mechanic...
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WO/2020/198102A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) about 0.05 wt.% to about 10 wt.% of an abrasive; (b) a dispersant, wherein the dispersant is a linear or branched C2-C10 alkylenediol; and (c) water, where...
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WO/2020/180061A1 |
The invention of the present application relates to a slurry composition for CMP, and a polishing method using same and, more specifically, provides a slurry composition for CMP, and a polishing method using same, which are capable of mi...
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WO/2020/172273A1 |
Coatings, coating systems and coating methods for skis and snowboards are provided. The coatings may be lubricious coatings including one or more hydrophobic compounds, adhesion agents, shape memory polymers, free-radical initiators, and...
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WO/2020/166438A1 |
Provided is a polishing composition capable of suppressing swelling in a peripheral part of a laser mark without lowering the polishing rate thereof. The polishing composition contains water, abrasive grains, a basic compound, a benzyltr...
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WO/2020/160762A1 |
The invention relates to a glide agent for increasing the gliding characteristics of a sports device, in particular a winter sports device, comprising an aqueous solution containing - an aqueous silicone emulsion, - an emulsion of a poly...
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WO/2020/156959A1 |
The present invention relates to the use of apple wax as an additive in a composition for treating a surface, wherein the surface is selected from a group consisting of a wooden surface, a ceramic surface, a plastic surface, a leather su...
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WO/2020/160286A1 |
A multi-modal diamond abrasive package or slurry is disclosed for polishing hard substrates. The multi-modal diamond abrasive package or slurry generally includes a plurality of diamond abrasives. Each one of the diamond abrasives of the...
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WO/2020/145121A1 |
The present invention addresses the problem of providing: a method for regenerating a polishing agent, which can be employed for the polishing of a chemically strengthened glass, and whereby it becomes possible to remove a K2O-containing...
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WO/2020/146161A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising colloidal silica, (b) a compound of formula (I), (c) a compound of formula (II), (d) hydrogen peroxide, and (e) water, wherein the p...
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WO/2020/142354A1 |
A chemical mechanical polishing composition includes a water based liquid carrier, cationic abrasive particles dispersed in the liquid carrier, a first amino acid compound having an isoelectric point of less than 7 and a second amino aci...
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WO/2020/141804A1 |
The present invention provides a chemical-mechanical polishing particle having high polishing quality with a high polishing rate and few defects or scratches by modifying the surface of a polishing particle, and a polishing slurry compos...
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WO/2020/138717A1 |
The present invention relates to a CMP slurry composition for polishing polycrystalline silicon and a polishing method using same. A CMP slurry composition for polishing polycrystalline silicon according to an embodiment of the present i...
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WO/2020/135168A1 |
Disclosed is a chemico-mechanical polishing solution, comprising silica abrasion particles, a nitrogen-containing heterocyclic compound comprising one or more carboxyl groups, and an ethoxylated butoxylated alkyl alcohol. Also disclosed ...
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WO/2020/138737A1 |
The present invention relates to a one-component polishing slurry composition and a polishing method using same and, more specifically, to a one-component polishing slurry composition and a polishing method using same, the one-component ...
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WO/2020/130332A1 |
The present invention relates to a polishing slurry composition. A polishing slurry composition according to one embodiment of the present invention comprises: a nonionic polymer having at least one amide bond; a selectivity control agen...
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WO/2020/131155A1 |
This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydr...
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WO/2020/130251A1 |
The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present invention comprises a polishing solution containing polishing particles; and an additive solution c...
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WO/2020/131153A1 |
This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydr...
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WO/2020/130256A1 |
The present invention relates to a polishing slurry composition for an STI process and, more specifically, to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including ...
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WO/2020/120522A1 |
The presently claimed invention relates to a chemical-mechanical polishing (CMP) composition and chemical-mechanical polishing (CMP)methods. The presently claimed invention particularly relates to a composition and process for chemical-m...
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WO/2020/120641A1 |
The presently claimed invention relates to a chemical-mechanical polishing (CMP) composition and chemical-mechanical polishing (CMP) methods. The presently claimed invention particularly relates to a composition and process for chemical-...
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WO/2020/123332A1 |
The invention provides a chemical-mechanical polishing composition comprising(a) an abrasive having a Vickers hardness of 16 GPa or more, and (b) a liquid carrier, wherein the polishing composition is substantially free of an oxidizing a...
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WO/2020/122191A1 |
Provided are: a polishing composition which can be used more suitably in a use application in which a synthetic resin or the like is polished; and a polishing method for polishing an object of interest with a polishing composition. A pol...
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WO/2020/120520A1 |
The presently claimed invention relates to a chemical-mechanical polishing (CMP) composition and chemical-mechanical polishing (CMP) methods. The presently claimed invention particularly relates to a composition and process for chemical-...
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WO/2020/117441A1 |
A chemical mechanical polishing composition for polishing a substrate having copper, barrier, and dielectric layers includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole...
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WO/2020/117438A1 |
A chemical mechanical polishing composition for polishing a substrate having a cobalt layer includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole compound, wherein the p...
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WO/2020/117440A1 |
The invention provides a chemical mechanical polishing composition for polishing a silicon nitride containing substrate. The composition includes an aqueous carrier; cationic silica particles dispersed in the aqueous carrier, the cationi...
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WO/2020/117439A1 |
A chemical mechanical polishing composition for polishing a substrate includes a liquid carrier and cationic metal oxide abrasive particles dispersed in the liquid carrier. The cationic metal oxide abrasive particles have a surface modif...
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WO/2020/101134A1 |
The present invention relates to a polishing slurry composition and a method for producing same. The polishing slurry composition according to one embodiment of the present invention comprises: polishing particles dispersed so as to have...
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WO/2020/100985A1 |
In one embodiment, there is provided a polishing liquid composition capable of reducing scratching of a substrate surface after polishing while ensuring polishing speed. The present disclosure, in one embodiment, pertains to a polishin...
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WO/2020/100848A1 |
The objective of the invention is to provide a multi-core ferrule polishing material suitable for polishing a multi-core ferrule. The multi-core ferrule polishing material of the present invention for solving the above problem contains...
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WO/2020/091242A1 |
The present invention relates to a slurry composition for CMP comprising: polishing particles; one or more additives selected from the group consisting of a heterocyclic compound, a nitride, a chelating agent, a copper polishing rate enh...
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WO/2020/087721A1 |
The present application provides a chemical-mechanical polishing solution for silicon carbide having increased pH stability. The polishing solution comprises: an oxidant, a high hardness abrasive and a pH stabilizer, the pH stabilizer be...
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WO/2020/081870A1 |
An article includes a package including a packaging material defining an enclosed volume, wherein a desiccant and a bonded abrasive article are contained within the enclosed volume. In an embodiment, the desiccant comprises calcium ions ...
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WO/2020/075654A1 |
The present invention addresses the problem of providing a silica-based particle dispersion which contains a silica-based particle group and with which a high polishing rate and high surface precision can be achieved with respect to a si...
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WO/2020/066671A1 |
Provided are: a polishing pad useful for removing undulations in a curved resin-coated surface at a high polishing rate; and a polishing method using the polishing pad. A polishing pad (10) according to an aspect of the present invention...
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WO/2020/066998A1 |
This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The ave...
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