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WO/2022/168714A1 |
Provided is an adhesive agent that is to be used in optical applications. The adhesive agent contains a modified cyclodextrin having a degree of modification of more than 2.5 but not more than 3.0. The gel fraction of the adhesive agent ...
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WO/2022/168723A1 |
The present invention addresses the problem of providing an organic resin composition sheet for covering an electronic component that improves yield from a processing step and has superior reliability. The organic resin composition she...
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WO/2022/169051A1 |
The present invention relates to an antibacterial and antiviral film and, more specifically, to an antibacterial and antiviral adhesive film and a method for preparing same, wherein the film contains no heavy metals and thus is safe whil...
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WO/2022/169231A1 |
The present invention can provide: a composition comprising a resin component and a filler component, in which, in a state in which a high content of a filler is filled and the realization of physical properties through filling with the ...
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WO/2022/163394A1 |
Provided is a hydrocarbon resin including aliphatic-monomer units or including aliphatic-monomer units and aromatic-monomer units, characterized by having a number-average molecular weight (Mn) in the range of 400-3000, a weight-average ...
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WO/2022/163232A1 |
As an adhesive sheet having excellent rounded surface bondability for bonding to a rounded member having a curved portion without forming air bubbles and also having excellent durability after the bonding to a rounded member, an adhesive...
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WO/2022/163593A1 |
The present invention relates to an adhesive composition for electrical peeling, the adhesive composition containing a base polymer, an ionic liquid, a water-soluble polymer and a corrosion inhibitor.
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WO/2022/163395A1 |
Provided is a hydrocarbon resin which contains an aliphatic monomer unit or an aliphatic monomer unit and an aromatic monomer unit and which is characterized in that the number average molecular weight (Mn) falls within the range 400-300...
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WO/2022/164171A1 |
The present invention relates to a thermosetting adhesive film and a coverlay film comprising same, and more specifically, to a thermosetting adhesive film which has excellent ion migration resistance while having a low dielectric permit...
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WO/2022/163693A1 |
The present invention provides a hot melt type adhesive composition which has a low viscosity when heated and melted and can advantageously form an adhesive layer. Provided is a hot melt type adhesive composition that contains a base pol...
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WO/2022/163523A1 |
A purpose of the present invention is to provide an adhesive composition capable of giving cured objects having excellent mechanical properties. The adhesive composition according to one aspect of the present invention comprises a polyox...
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WO/2022/164947A1 |
Disclosed is a moisture reactive, polyurethane hot melt adhesive composition that is the reaction product of a first mixture comprising heat stabilizer and only one of polyester polyol or filler, wherein the first mixture can optionally ...
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WO/2022/163465A1 |
A thermosetting resin composition which is used for the production of a chip embedded semiconductor device, and which contains a curing agent that has a hydroxyl equivalent of 150 g/eq or less, while having a melt viscosity of 1,000 to 1...
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WO/2022/163027A1 |
Provided is a thermally conductive adhesive agent composition containing an adhesive resin and graphene having a two-dimensional structure. The content of the graphene having a two-dimensional structure is preferably 15 to 200 parts by m...
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WO/2022/158177A1 |
This primer composition comprises: (A) an acrylic acid ester, a methacrylic acid ester, or a (co)polymer of these esters; (B) an organosilicon compound represented by formula (1), an organosilicon compound represented by formula (2), or ...
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WO/2022/158594A1 |
Provided is a film-like adhesive 1 for connecting a circuit, the film-like adhesive 1 containing: solder particles 2 having a Bi content of 20-60 mass% and an Sn content of 40-80 mass%; a radically polymerizable compound; and a thermal r...
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WO/2022/158044A1 |
Provided are: an adhesive sheet capable of enabling a display device to have a low reflectance, a high brightness, and a thin shape; a display device using said adhesive sheet; and an adhesive layer-forming composition for use in product...
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WO/2022/153745A1 |
This workpiece handling sheet 1 is provided with a substrate 12 and an interface ablation layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces 2 and perform interface ablation by irradiation ...
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WO/2022/152668A1 |
The invention is directed to stabilizer compositions comprising at least one oxalanilide UV absorber and/or at least one (2-hydroxyphenyl)-s-triazine UV absorber, and at least one oligomeric hindered amine light stabilizer (HALS), option...
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WO/2022/153761A1 |
The purpose of the present invention is to provide a two-pack urethane-based adhesive that includes a second-pack liquid in which liquid ingredients are inhibited from bleeding out and which can be inhibited from decreasing in thixotropi...
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WO/2022/153877A1 |
[Problem] To provide a workpiece handling sheet with which it is possible to favorably handle even a very small workpiece item. [Solution] A workpiece handling sheet 1 is provided with a base material 11 and an interface ablation layer 1...
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WO/2022/151624A1 |
Provided is a hot melt adhesive for a hollow glass spacer bar, prepared from raw materials comprising the following components: 1-10 parts by weight of butyl rubber; 25-50 parts by weight of a polyisobutylene mixture; 5-15 parts by weigh...
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WO/2022/153878A1 |
A workpiece handling sheet 1 comprises: a substrate 13; an interface abrasion layer 12 laminated on one side of the substrate 13, and capable of interface abrasion through irradiation with laser light; and an adhesive layer 11 laminated ...
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WO/2022/149581A1 |
The present disclosure provides an adhesive agent composition. The adhesive agent composition contains an epoxy resin, a first curing agent having a softening point of 90°C or higher, a second curing agent having a softening point of le...
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WO/2022/149277A1 |
The present disclosure provides an adhesive composition. The adhesive composition contains an epoxy resin, a first curing agent that has a softening point of at least 90°C, a second curing agent that has a softening point of less than 9...
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WO/2022/149582A1 |
The present disclosure provides a film-like adhesive. With respect to this film-like adhesive, the shear viscosity at 120°C is 17000 Pa·s or less, the storage elastic modulus at 150°C is 23 MPa or more after being cured at 170°C for ...
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WO/2022/145369A1 |
[Problem] To provide a polarizing plate in which protective films are affixed to both surfaces of a polarizing film, the polarizing plate exhibiting a small degree of curling or not being prone to curling even when placed in a high-humid...
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WO/2022/145368A1 |
(Problem) To provide: a curable adhesive composition suitable for the bonding of a polarizer to a thermoplastic resin film; and a polarizing plate comprising a polarizer, an adhesive layer and a thermoplastic resin film which are arrange...
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WO/2022/145370A1 |
(Abstract) [Problem] To provide: a curable adhesive composition suitable for the bonding of a polarizer to a thermoplastic resin film; and a polarizing plate comprising a polarizer, an adhesive layer and a thermoplastic resin film which ...
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WO/2022/141462A1 |
The open-closure sealing label (211, 311, 411, 511) comprises a face (101) and an adhesive layer (102) adjoined to the face. The adhesive layer (102) comprises removable pressure sensitive adhesive and the face (101) comprises filmic mat...
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WO/2022/145935A1 |
The present invention relates to an aqueous flame retardant adhesive composition and a method for preparing same, wherein the adhesive composition is eco-friendly and can reduce costs through replacement of an organic flame retardant, am...
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WO/2022/145522A1 |
The present invention relates to an adhesive composition comprising an amino acid, dextrin, gum, and alkandiol, and to a method for preparing same. As the adhesive composition has excellent adhesion and is wash-off and biodegradable, a s...
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WO/2022/145576A1 |
The present invention relates to an ultrathin eco-friendly adhesive coating agent for bridge deck overlays, and a construction method using same, the ultrathin eco-friendly adhesive coating agent comprising: a base comprising a resin, 10...
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WO/2022/145367A1 |
(Problem) To provide: a curable adhesive composition suitable for the bonding of a polarizer to a thermoplastic resin film; and a polarizing plate comprising a polarizer, an adhesive layer and a thermoplastic resin film which are arrange...
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WO/2022/145448A1 |
The present invention relates to a polychloroprene latex composition, a dipped product, an adhesive, a bonding agent, and a bonded product. The polychloroprene latex composition includes a chloroprene (co)polymer (A) and an aromatic comp...
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WO/2022/145643A1 |
The present invention relates to silicone adhesive coating composition, and an adhesive film comprising same. The adhesive film is used in OLED manufacturing, does not experience changes in physical properties during processing, and exhi...
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WO/2022/141816A1 |
Provided are a resin composition, a resin adhesive film, and an application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 par...
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WO/2022/142648A1 |
The present invention relates to an organic silicon prepolymer, an organic silicon modified epoxy resin, an adhesive, and a colloid and a preparation method therefor. The organic silicon modified epoxy resin is mainly prepared from the f...
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WO/2022/137881A1 |
This ultraviolet-curable resin composition includes: a monomer and/or oligomer that has a polymerizable unsaturated double bond; a photopolymerization initiator; a polymerization-inhibiting agent; and an acid that has an acid dissociatio...
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WO/2022/138341A1 |
[Problem] To provide: an integrated dicing die bonding sheet which has excellent storage stability and stress mitigating properties, which does not exhibit problems such as cracking, chipping, or chip fly-off during dicing, and which has...
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WO/2022/138345A1 |
[Problem] To provide: a composition that, even when the contained amount of a solvent is low, has viscosity allowing the composition to be applicable, that has excellent curability, and that provides a Si-based pressure-sensitive adhesiv...
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WO/2022/137880A1 |
This ultraviolet-curable resin composition comprises: a monomer and/or an oligomer having a polymerizable unsaturated double bond; a photopolymerization initiator; and an acid having an acid dissociation constant (pKa1) of at most 4.0 in...
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WO/2022/139351A1 |
The present invention relates to: an electrical steel sheet, and an electrical steel sheet comprising a bonding coating layer positioned on the electrical steel sheet and further comprising: a first interface layer located within the ele...
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WO/2022/138114A1 |
Provided is a surface protection film including a urethane-based pressure-sensitive adhesive layer having an excellent surface modulus. A surface protection film according to an embodiment of the present invention includes a urethane-b...
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WO/2022/138113A1 |
Provided is a surface protective film capable of increasing the film thickness of an adhesive layer, demonstrating easy peelability, and realizing low haze. Also provided is an optical member and an electronic member having such surface ...
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WO/2022/138807A1 |
The present invention addresses the problem of providing a curable resin composition that is superior as a two-component or multi-component epoxy resin composition as compared to the prior art. Provided is a curable resin composition inc...
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WO/2022/138099A1 |
The purpose of the present invention is to provide a hot-melt composition which is excellent in terms of applicability, unsusceptibility to thermal flowing, balance between bonding and debonding properties, nonvolatile property, and high...
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WO/2022/138343A1 |
Provided is an epoxy resin composition including an epoxy resin (A) and a latent curing agent (B) wherein the latent curing agent (B) is solid at 25°C.
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WO/2022/138703A1 |
Provided is a gas-generating agent that generates a gas through the radiation of light. The gas-generating agent comprises: a gas-generating moiety having a specific structure; and a fluorinated aliphatic hydrocarbon group, which may con...
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WO/2022/137908A1 |
The present invention provides: an adhesive composition for organic fibers, said adhesive composition being capable of ensuring a desired adhesiveness without using resorcin, while having excellent environmental friendliness and not dete...
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