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WO/2024/080146A1 |
This adhesive composition, which constitutes an adhesive sheet (2), contains an acrylic base polymer, a crosslinking agent, an acrylic oligomer that has a weight average molecular weight of 1,000 to 30,000 and a glass transition temperat...
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WO/2024/079274A1 |
The invention relates to an adhesive tape for covering elongate articles, such as in particular leads or cable sets, comprising a tape-like carrier which is provided on at least one side with a curable adhesive compound, in which the tap...
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WO/2024/080145A1 |
A reinforcing film (10) comprises an adhesive layer (2) that is layered and fixed on one main surface of a film base material (1). The adhesive layer is composed of a photocurable composition containing an acrylic base polymer having a c...
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WO/2024/080218A1 |
The present invention relates to a curable perfluoropolyether pressure-sensitive adhesive composition comprising: 100 parts by mass of (A) a linear perfluoropolyether compound having at least two alkenyl groups in the molecule and having...
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WO/2024/071265A1 |
This bonding sheet (1) contains a resin component and solder particles (5). The average primary particle diameter of the solder particles (5) and the average secondary particle diameter of the solder particles (5) are both 7 µm or less.
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WO/2024/065703A1 |
Provided in the present application is an expandable microsphere with a core-shell structure, wherein the shell of thereof is a melamine resin, and a core substance is mainly a foamable azo compound. Further provided in the present appli...
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WO/2024/066601A1 |
A preparation method for an aircraft cargo hold floor, and an aircraft cargo hold floor. The preparation method comprises the following preparation steps: separately preparing phenolic resin upper panel layers (4), phenolic resin lower p...
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WO/2024/066254A1 |
Disclosed are a low-modulus die attach film adhesive for a vertically stacked package, a preparation method therefor and an application thereof. The die attach film adhesive comprises the following raw materials: 2-5 parts by mass of sil...
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WO/2024/069992A1 |
Provided are: an adhesive composition that is highly bio-based and has suitable adhesion and high thermal resistance; and a production method for the same. This adhesive composition comprises: a block copolymer (X) that includes a polyme...
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WO/2024/070317A1 |
A connection structure 1 in which an electrode 11 of an electronic component 10 and an electrode 21 of a substrate 20 are connected by a connecting material 2' derived from a conductive particle-containing layer in which conductive parti...
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WO/2024/071132A1 |
Disclosed is a method for providing a structure This method for producing a structure includes: a first step for preparing a first structure which comprises a first adherend, a second adherend, and an adhesive part that bonds the first a...
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WO/2024/070715A1 |
The present invention pertains to an adhesive sheet that has a laminate structure in which a first adhesive layer, a second adhesive layer, and a base material are laminated in this order, wherein: the visible light transmittance T1 of t...
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WO/2024/062930A1 |
Provided are: an adhesive agent having excellent adhesiveness and heat resistance; a cured product of the adhesive agent; and a member including the cured product. Specifically, the adhesive agent comprises: 0.05-9.5 mass% of a polyfunct...
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WO/2024/064046A1 |
Provided herein is a method for producing a die attach adhesive film sheet, comprising: Providing a first release substrate layer, a die attach adhesive layer, and a dicing tape layer, and joining the first release substrate layer, the d...
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WO/2024/062865A1 |
The present invention addresses the problem of providing a 2-cyanoacrylate adhesive composition that has improved moist heat resistance and includes alkoxyalkyl 2-cyanoacrylate as a main component. By using an adhesive composition compri...
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WO/2024/063029A1 |
The present disclosure provides a foam adhesive sheet having an adhesive layer, the adhesive layer containing a thermosetting adhesive and a foaming agent, wherein when a displacement was measured through the thermochemical analysis by a...
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WO/2024/063092A1 |
The purpose of the present invention is to provide an adhesive tape having an adhesive layer having excellent retention performance and adhesion even while using a low-molecular-weight (meth)acrylic copolymer. The present invention is an...
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WO/2024/057206A1 |
Adhesive compositions, articles, and methods are described. The electronic may comprise: i) a conductive metallic substrate; ii) an insulating resin layer; and iii) and an adhesive layer disposed between the substrate and insulating resi...
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WO/2024/057792A1 |
This film-like adhesive agent is formed of a resin composition having thermosetting properties and containing a filler, and has a single-layer structure including a first surface and a second surface. The film-like adhesive agent has a r...
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WO/2024/058185A1 |
This pressure-sensitive adhesive tape for corrosion prevention comprises a substrate and a pressure-sensitive adhesive layer disposed on at least one surface of the substrate, wherein the substrate has a difference between the tensile lo...
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WO/2024/057560A1 |
Provided is an adhesive sheet capable of highly suppressing fine concavo-convex deformation. Provided is an adhesive sheet having a colored adhesive layer. In this invention, the adhesive layer includes an acrylic polymer. The gel fracti...
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WO/2024/058218A1 |
An adhesive agent composition comprising: a radical-polymerizable compound; a radical polymerization initiator; a compound having a nitrogen-containing aromatic heterocyclic ring; and particles containing at least one metal compound sele...
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WO/2024/059270A1 |
Adhesive formulations comprising bovine serum albumin, b-lactoglobulin, and/or a-lactalbumin can be applied and cured underwater to form a strong adhesive. Curing can be accomplished using heat or via a chemical denaturing component.
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WO/2024/055403A1 |
The present application belongs to the technical field of photovoltaics. Disclosed in the present application is a packaging adhesive film. The packaging adhesive film comprises a cell layer, wherein the cell rate of the cell layer is S1...
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WO/2024/055959A1 |
Provided in embodiments of the present application is a resin composition, the resin composition comprising epoxy resin, a curing agent and an inorganic filler, wherein the cut-off particle size of the inorganic filler is 3 μm, and the ...
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WO/2024/057561A1 |
Provided is an adhesive sheet having excellent light-pressure adhesion. Provided is an adhesive sheet having an adhesive layer. The adhesive layer comprises an acrylic polymer and an acrylic oligomer. The acrylic polymer is a polymer of ...
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WO/2024/057791A1 |
Provided is a film-form adhesive configured from a resin composition that has thermal curing properties and contains a filler, the film-form adhesive being of a single-layer structure that has a first surface and a second surface, wherei...
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WO/2024/053576A1 |
This adhesive composition comprises a crystalline modified olefin polymer, an acid anhydride monomer, and a crosslinking agent. The crystalline modified olefin polymer is obtained by modifying a crystalline C2-20 α-olefin polymer with a...
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WO/2024/053614A1 |
The present disclosure provides an adhesive sheet which is used to attach a first member and a second member together, and in which the tensile elastic modulus of the first member is smaller than the tensile elastic modulus of the second...
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WO/2024/053232A1 |
This laminated film comprises in the order given: an adhesive layer containing a thermoplastic resin, a thermosetting resin, a curing agent, and a flux compound having two carboxyl groups; a pressure-sensitive adhesive layer; and a base ...
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WO/2024/050710A1 |
Disclosed in the present invention are an insulating adhesive film material for preparing a fine circuit and a preparation method therefor. Specifically, the insulating adhesive film material is composed of a polymer compound, which is c...
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WO/2024/053498A1 |
Provided is a double-sided pressure-sensitive adhesive sheet which exhibits repairability when bonded to an adherend and with which adhesive strength after bonding can be intentionally improved by carrying out a heat treatment or a press...
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WO/2024/045376A1 |
The present invention provides a raw adhesive of an ultraviolet curing adhesive, comprising the following raw materials in parts by weight: 40-60 parts of an acrylic acid monomer; 0.1-1 part of an initiator; 0.1-1 part of a catalyst; 0.1...
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WO/2024/050272A1 |
Disclosed are tack lessening components and methods of their use. The tack lessening components provide a broad range of radiation curable compositions with a cured surface having lessened tack. The tack lessening agents are used in very...
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WO/2024/047472A1 |
Color absorbing adhesive compositions include an optically clear pressure sensitive adhesive and at least one light absorbing component dispersed within the pressure sensitive adhesive. The light absorbing component is a dye that has a p...
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WO/2024/048088A1 |
Provided are an anisotropic conductive film, a connection structure, and a method for producing a connection structure, that, in the case of high-pressure mounting, suppress increases in the continuity resistance value, avoid the generat...
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WO/2024/049137A1 |
The present invention relates to a pressure-sensitive adhesive composition comprising an acrylic compound, a pressure-sensitive adhesive film comprising same, and a manufacturing method therefor. In a process for preventing bubble genera...
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WO/2024/042892A1 |
An embodiment of the present invention relates to an adhesive composition or an optical laminated body with an adhesive layer. The adhesive composition comprises a meth(acrylic) copolymer that is a copolymer of a monomer mixture containi...
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WO/2024/040687A1 |
The present invention relates to the field of silicone structural sealants, and in particular to a single-component transparent silicone structural sealant for photovoltaics and a preparation method therefor. The single-component transpa...
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WO/2024/044505A1 |
An adhesive material includes a polymeric-based adhesive composition and a bio-based reactive diluent, wherein the bio-based reactive diluent includes a hydrocarbon ring structure having at least one pendant epoxy end group or a hydrocar...
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WO/2024/042720A1 |
An adhesive film for circuit connection comprising a first adhesive layer having thermosettability, conductive particles partially embedded in one side of the first adhesive layer, and a second adhesive layer that has thermosettability a...
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WO/2024/043165A1 |
Provided is a curable composition in which a layered compound is dispersed in a liquid phase which contains a monomer starting material. The provided curable composition contains a liquid phase containing a monomer starting material, and...
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WO/2024/043288A1 |
The present invention relates to an adhesive composition which contains a multifunctional epoxy resin, a monofunctional epoxy compound and a thermoplastic resin, wherein: the content ratio of the monofunctional epoxy compound with respec...
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WO/2024/040727A1 |
A recycled elastomer-based modular tileable floor mat, and a production process therefor. The modular tileable mat comprises a floor mat body (1) and an anti-slip mat (5). The floor mat body (1) is of a horizontally-arranged rectangular ...
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WO/2024/038794A1 |
This low dielectric resin composition contains a polyolefin resin. The polyolefin resin contains a styrene elastomer (A) and a cyclic olefin polymer (B) that has an alicyclic ring in the main chain. The content ratio of the styrene elast...
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WO/2024/038816A1 |
[Problem] The purpose of the present invention is to provide an epoxy-based adhesive which exhibits good toughness and heat resistance, while having excellent adhesion to a base material. [Solution] An adhesive composition which contains...
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WO/2024/038859A1 |
The present invention addresses the problem of providing an adhesive resin composition usable without solvents, said adhesive resin composition having high flexibility, impact resistance and adhesive strength, showing little difference i...
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WO/2024/037170A1 |
An HDI/IPDI curing agent, a preparation method therefor, the use thereof and a thermally curable PU adhesive film. The curing agent is prepared from an ester solvent, TMP, HDI, IPDI and DBTDL. The prepared curing agent has a more compact...
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WO/2024/034731A1 |
The present invention pertains to an anti-slip adhesive for paper packaging and, more specifically, discloses an anti-slip adhesive for paper packaging, which is an aqueous acrylic adhesive comprising a carboxymethyl cellulose-based thic...
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WO/2024/032382A1 |
A heat-resistant UV-curable adhesive and a use thereof in preparation of a fuel cell, relating to the technical field of fuel cells. Raw materials of the heat-resistant UV-curable adhesive disclosed by the present disclosure comprise: a ...
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