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Matches 1 - 50 out of 31,604

Document Document Title
WO/2019/139112A1
Particles of a hardener comprising a urea compound for epoxy resins are provided. When the particles are contained in an epoxy resin composition, excellent storage stability and heating stability can be imparted to the epoxy resin compos...  
WO/2019/139016A1
This adhesive composition contains a modified polypropylene resin (A) having: an acidic group and/or an acid anhydride group; and a (meth)acryloyl group (a). The (meth)acryloyl group (a) is introduced from a modification reaction of an a...  
WO/2019/139418A1
The present specification provides a temperature-changeable adhesive sheet and a temperature-changeable adhesive sheet manufacturing method using the same.  
WO/2019/136823A1
Disclosed are a polyolefin elastomer adhesive film with a low water vapor permeability and a preparation method therefor. The adhesive film comprises 50-100 parts by mass of a matrix resin, 0-40 parts by mass of a modified resin, 0.001-2...  
WO/2019/138135A1
Disclosed are an additive composition for an adhesive composition as well as an adhesive composition itself that is based on starch, dextrin or polyvinyl alcohol as the adhesive component, the products comprising a cross-linked carbomer ...  
WO/2019/135541A1
Embodiments of the present invention provide a polarizing plate comprising a polarizer and a protective substrate formed on at least one surface of the polarizer, wherein the protective substrate includes a laminate made of a protective ...  
WO/2019/130822A1
Provided are a resin layer capable of strongly adhering to a rough surface and to a plastic, the resin layer having high holding power and exhibiting good adhesion even at low temperature, a resin composition suitable for forming the res...  
WO/2019/132086A1
The present invention relates to a heat resistant rubber-based adhesive composition and a heat resistant adhesive tape including the same, and according to the present invention, provided are: a heat resistant rubber-based adhesive compo...  
WO/2019/132139A1
According to the problem to be solved by the present invention, a method for manufacturing a fine dust proof mesh using a nano-fiber coats a mesh to which a nano-fiber is bonded, with a resin by using a special method so as to prevent de...  
WO/2019/132365A1
An embodiment of the present invention provides: an adhesive coating composition enabling adherence (coupling) of an electrical steel sheet without using conventional coupling methods such as welding, clamping and interlocking; an electr...  
WO/2019/131591A1
Provided are an adhesive excellent in adhesion between a non-polar base such as an olefin resin and a metal base and thermal resistance, and a laminate and a battery packing material excellent in thermal resistance obtained by using the ...  
WO/2019/131923A1
One embodiment of the present invention provides an adhesive film comprising a first adhesive layer, a metal layer, and a second adhesive layer in said order, wherein the first adhesive layer and the second adhesive layer each contain fi...  
WO/2019/132355A1
An electrical steel sheet adhesive coating composition according to an embodiment of the present invention contains, relative to 100 wt% of all solids: 20-40 wt% of a resin having an average particle diameter of 10-300 nm; 10-35 wt% of i...  
WO/2019/132369A1
Disclosed are: an adhesive sheet for effectively blocking light of an ultraviolet area without deteriorating adhesion and the transmittance of light in a visible light area; and an adhesive composition comprising a binder resin, and a li...  
WO/2019/131857A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention is closely adhered to...  
WO/2019/131852A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a linear transmit...  
WO/2019/131854A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a total light tra...  
WO/2019/131524A1
An adhesive patch which is provided with an adhesive layer and a supporting body, and wherein the adhesive layer contains: (A) one or more substances selected from among polyacrylic acids and salts thereof; (B) a cellulose derivative whi...  
WO/2019/131556A1
Provided is a method for manufacturing a stacked body including an adherend, and an adhesive piece which partially covers the adherend, wherein an adhesive force of the adhesive piece with respect to the adherend is at least equal to 5 N...  
WO/2019/131094A1
To provide: a chemical polymerization initiator divided into two or more partial initiator compositions and blended, which is used in chemical polymerization in a system in which an acid component is present, and in which components cons...  
WO/2019/131904A1
One embodiment of the present invention is a method for producing a connection structure, which comprises a step wherein: an adhesive layer is arranged between a first electronic member which has a first substrate and a first electrode t...  
WO/2019/132320A1
The present invention relates to a hot-melt adhesive composition. With the maintenance of a low-viscosity characteristic therein, the hot-melt adhesive composition of the present invention can be melt processed at relatively low temperat...  
WO/2019/131972A1
A hot melt adhesive suitable for positioning of an absorbent article is provided which is used as an adhesive for positioning of an absorbent article, and which, even when an absorbent article is stored within a broad temperature range (...  
WO/2019/131856A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention is closely adhered to...  
WO/2019/131218A1
The present invention provides a polarizing plate with an adhesive layer, which is thin and has extremely excellent moisture resistance. A polarizing plate with an adhesive layer according to the present invention comprises: a polarizer;...  
WO/2019/131850A1
Provided is a semiconductor back surface adhering film which has more excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a semiconductor back surface adhering layer ...  
WO/2019/132322A1
The present invention relates to a hot-melt adhesive composition. With the maintenance of a low-viscosity characteristic therein, the hot-melt adhesive composition of the present invention can be melt processed at relatively low temperat...  
WO/2019/128962A1
The present invention relates to an adhesive encapsulation film for a solar cell, the adhesive encapsulation film comprising a transparent layer in contact with a cell sheet, and a first adhesive film layer in contact with the transparen...  
WO/2019/131167A1
The problem to be solved by the present invention is to provide an article manufacturing method which achieves a high degree of waterproofness by preventing wrinkles or gaps from occurring when attaching an adhesive tape to members of va...  
WO/2019/131471A1
This polyester resin composition is characterized by containing 100 parts by mass of a polyester resin (A) and 0.05 to 10 parts by mass of a nitrogen-containing heterocyclic compound (B), wherein the polyester resin (A) has a glass trans...  
WO/2019/132455A1
The present invention relates to: an adhesive composition comprising an acrylic copolymer to be formed by polymerizing a monomer mixture, which comprises a monomer represented by [chemical formula 1], a (meth)acrylic monomer containing a...  
WO/2019/131768A1
Provided is a modified block copolymer composition containing a modified diblock copolymer that: is modified with a compound having one aromatic vinyl polymer block and one conjugated diene polymer block and also having a silicon atom an...  
WO/2019/131408A1
Provided is an adhesive layered body comprising: a thermally expandable adhesive sheet (I) that includes a substrate (Y1) and an adhesive layer (X1), either of which contains thermally expandable particles; and a resin film forming sheet...  
WO/2019/131507A1
This layered product 10 is obtained by adhering, by using a polyurethane hot-melt adhesive 13 containing a catalyst (II) and a polyurethane pre-polymer (I) obtained using a polyol component (A) and a polyisocyanate component (B) as raw m...  
WO/2019/124013A1
This adhesive composition comprising a vinyl polymer (A) and an acrylic adhesive polymer syrup (B), wherein the vinyl polymer (A) has a glass transition temperature (Tg) of 30-200°C and a number-average molecular weight of 500-10,000, a...  
WO/2019/123892A1
Provided is a solvent-free acrylic resin composition that exhibits a small increase in viscosity due to heating, that has excellent thermal stability, that can be applied thickly when used as an adhesive, and that can be used to obtain a...  
WO/2019/124192A1
The purpose of the present invention is to improve storage stability of a resin composition used for applications such as semiconductor sealing materials. Provided is a resin composition, comprising: (A) an epoxy resin; (B) a curing agen...  
WO/2019/123799A1
This adhesive sheet (1) with a mold release film is provided with: a photocurable adhesive sheet (50) which has a first main surface and a second main surface; and a first mold release film (10) which is provisionally bonded to the first...  
WO/2019/124713A1
The present invention relates to a single-component epoxy-based adhesive composition for adhering a component comprising heterogeneous material, and an article using same. The present invention enables both excellent elongation propertie...  
WO/2019/124332A1
The present invention addresses the problem of providing an adhesive agent composition which can form an adhesive sheet which has conformability to uneven surfaces, durability, and handling properties. The present invention pertains to a...  
WO/2019/119782A1
The present invention relates to a halogen-free flame retardant H-class slot insulating material for nuclear power or a transformer, comprising a first polyimide film layer, a first mixed glue layer, a second mixed glue layer, a first wo...  
WO/2019/124417A1
[Problem] To provide a silicone-based adhesive sheet which has a slightly tacky surface and is hence capable of easily temporarily fixing, for example, semiconductor chips obtained by dicing to a semiconductor base and which comes to exh...  
WO/2019/123885A1
The objective of the present invention is to provide a radical-polymerizable adhesive composition which is for an adhesive laminated steel sheet and from which an adhesive laminate that contributes to the simplification of an adhesive la...  
WO/2019/123214A1
Multi-layer thermally conductive sheets include at least two layers, a core layer and a surface layer. The core layer and the surface layer are simultaneously cured to form a multi-layer sheet where the core layer is tacky, and the surfa...  
WO/2019/124712A1
The present invention relates to a single-component epoxy-based adhesive composition which enables compensation of brittleness of an epoxy-based adhesive by means of using together at least three toughening agents comprising phenoxy resi...  
WO/2019/124624A1
The present invention relates to an electromagnetic wave shielding film, a method for manufacturing a printed circuit board, and a method for manufacturing an electromagnetic wave shielding film. The electromagnetic wave shielding film a...  
WO/2019/126648A1
Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leavi...  
WO/2019/124405A1
The present invention pertains to a double-sided adhesive tape comprising a foam base and an acrylic adhesive layer provided on both surfaces of the base, and having a total thickness of at least 1200 μm, a tensile elongation of 100-600...  
WO/2019/125057A1
The present invention relates to a washer for a secondary battery, a secondary battery comprising the same, and a method for manufacturing the washer, the washer comprising: a film layer; and an adhesive layer disposed on at least one su...  
WO/2019/123968A1
The present invention provides a moisture-curable polyurethane hot-melt resin composition which includes a urethane prepolymer (i) having an isocyanate group, characterized by further containing a curing catalyst (ii) represented by gene...  

Matches 1 - 50 out of 31,604