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Matches 1 - 50 out of 27,204

Document Document Title
WO/2017/159650A1
The purpose of the present invention is to provide a polyester-based resin composition whereby the water contact angle of a coating film surface thereof is 30° or less and the peel strength thereof with respect to a metal or a resin fil...  
WO/2017/158917A1
Provided is an adhesive composition which is suitable for laminating a polyimide film to copper foils to produce a double-sided copper-clad laminate for use in producing flexible printed wiring boards. The adhesive composition comprises ...  
WO/2017/158994A1
A film-like adhesive composition containing each of an epoxy resin, an epoxy resin curing agent, a phenoxy resin and an aluminum nitride filler, wherein the content of the aluminum nitride filler is 30-60% with respect to the total amoun...  
WO/2017/159788A1
The purpose of the present invention is to provide an adhesive sheet which is formed from a dual curing adhesive composition, and which has a sufficiently low relative dielectric constant and excellent durability. The present invention r...  
WO/2017/159707A1
The objective of the present invention is to provide a thermoplastic adhesive film capable of, in a thermobonding step of a laminated body of different materials used particularly in automobile members, electronic members, construction m...  
WO/2017/159719A1
An adhesive tape having a prescribed wavelength conversion function and having excellent durability is provided. An adhesive tape according to the present invention comprises a substrate and an adhesive layer having a wavelength conversi...  
WO/2017/155117A1
This adhesive for semiconductor sensor chip mounting can reduce noise sensing and can improve heat resistance and thermal cycle resistance characteristics. This adhesive for semiconductor sensor chip mounting is used in semiconductor sen...  
WO/2017/154415A1
A curable resin composition characterized by comprising a compound represented by the following general formula (1) (wherein X is a functional group including a reactive group, and R1 and R2 each independently represent a hydrogen atom o...  
WO/2017/155116A1
An adhesive for semiconductor mounting is provided which can achieve high-precision gap control and can improve heat resistance when mounting a semiconductor. This adhesive for semiconductor mounting is used in semiconductor mounting, an...  
WO/2017/155368A2
The present invention relates to a protective film and a polarizing plate comprising the same. Provided is a protective film which can minimize the amount of static electricity which may be generated when separating the protective film.  
WO/2017/154226A1
Provided is an adhesive film having few fish eyes, exceptional mechanical strength and heat resistance, little dust adhesion, and excellent adhesive characteristics, the adhesive film being used in various types of surface protection fil...  
WO/2017/148199A1
The present invention provides a graphene-modified polyurethane composite, a polyurethane adhesive prepared from same, a method for preparing the polyurethane adhesive, and an aerostat having the polyurethane adhesive. The composite comp...  
WO/2017/151898A1
A curable adhesive composition includes a curable epoxy resin, an amine curing agent, a toughening agent, and aluminum flakes. The aluminum flakes include a fatty acid milling aid on at least a portion of their surfaces. The aluminum fla...  
WO/2017/150203A1
The livestock papillary foramen protective patch according to the present invention is characterized by being applied to a part, of livestock, including a papillary foramen, and by comprising a layered body 1 formed of an elastic sheet 2...  
WO/2017/149982A1
The purpose of the present invention is to provide: an adhesive composition that, without requiring curing for forming an adhesive layer, has a satisfactorily high adhesive strength before ultraviolent irradiation, a satisfactorily large...  
WO/2017/150142A1
The purpose of the present invention is to provide a hot-melt adhesive which has a reduced temperature dependence, exhibits flowability immediately upon heating to above the melting point, and has an excellent rupture tensile strength. T...  
WO/2017/150290A1
Provided is a surface protective film that has ultraeasy separability, while having a low possibility of contaminating the surface of an object to which the surface protective film is bonded. A surface protective film according to the pr...  
WO/2017/149981A1
The purpose of the present invention is to provide: an adhesive composition that, regardless of being heated, has a high adhesive strength before ultraviolent irradiation, a satisfactorily large range of decline in the adhesive strength ...  
WO/2017/152188A1
The present description provides esterified fatty acid and/or tall oil compositions and their use as alternative plasticizers in adhesives formulations. These esters demonstrate similar or improved performance over adhesives industry sta...  
WO/2017/145589A1
The present invention provides an optically clear adhesive sheet having excellent transparency using a heat-curable polyurethane composition that has excellent flexibility and can be made into a thick film. The optically clear adhesive s...  
WO/2017/144929A1
The present invention generally relates to thermoplastic adhesives, and more particularly to adhesives used for bonding or joining PVC (polyvinyl chloride), CPVC (chlorinated polyvinyl chloride) or ABS (acrylonitrile butadiene styrene) p...  
WO/2017/146103A1
Disclosed are a silane compound represented by general formula (1), and a rubber composition, a sealing agent composition, an adhesive agent composition, and a tire which contain the silane compound. The silane compound represented by ge...  
WO/2017/145624A1
An adhesive film which comprises an acrylic resin (a), an epoxy resin (b), a hardener (c), and an α-alumina filler (d), wherein the α-alumina filler (d) comprises a polyhedral α-alumina filler having a purity of 99.90 mass% or higher ...  
WO/2017/145866A1
The purpose of the present invention is to provide: a rubber composition for adhesives, which exhibits excellent adhesiveness; a bonding method for rubbers; and a conveyor belt. The present invention provides: a rubber composition for ad...  
WO/2017/142094A1
An adhesive film for multilayer printed wiring boards, which comprises a resin composition layer that is obtained by forming a layer from a resin composition on a supporting film, said resin composition containing (A) a novolac phenolic ...  
WO/2017/140459A1
The invention relates to a crosslinkable adhesive compound comprising at least a first base polymer component having functional groups suitable for covalent crosslinking and for coordinative crosslinking, and comprising at least one cova...  
WO/2017/141449A1
One aspect of the present invention is a pressure-sensitive adhesive which comprises 100 parts by mass of (A) an acrylic polymer having a glass transition temperature of -50 to -25ºC, 0.01-3 parts by mass of (B) a silane coupling agent ...  
WO/2017/138544A1
Proposed is a new transparent double-sided pressure-sensitive adhesive sheet for image display devices which has an ultraviolet-absorbing function and which can be used in such a manner that the pressure-sensitive adhesive sheet is prima...  
WO/2017/138447A1
The present invention provides a resin composition with which a substrate for electronic-circuit formation or a substrate for semiconductor-circuit formation can be bonded to a supporting substrate and which, in the state of being bondin...  
WO/2017/138254A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138253A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138255A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138567A1
[Problem] To improve long-term storage stability of a polymerizable composition containing an organoborane and a polymerizable monomer. [Solution] Provided is a polymerizable composition which contains an organoborane (A), a polymerizabl...  
WO/2017/138256A1
Provided are: an electroconductive adhesive composition which is suitable for use as an electroconductive bonding material for bonding, for example, a semiconductor chip (in particular, a power device) to the surface of an element-suppor...  
WO/2017/138907A1
The invention relates to laminated, heat-sealing multilayered materials for use as a packaging material with an anti-counterfeit function. The present multilayered material can consist either exclusively of polymer materials (1, 5) or of...  
WO/2017/138310A1
Provided is an adhesive sheet which is able to be suppressed in changes of the characteristics of a bonding film X due to migration of an additive in the bonding film X to an adhesive tape in the adhesive sheet. The present invention pro...  
WO/2017/138510A1
Provided is a saponified crosslinked ethylene/vinyl acetate copolymer that is for use as a hot-melt adhesive which not only has low-temperature adhesiveness to glass but also suffers no practically problematic change in appearance even w...  
WO/2017/138399A1
Provided is an adhesive composition of an organic solvent solution type which shows excellent adhesiveness to polyolefin bases, in particular, polyethylene bases (both LDPE and HDPE), and which is in a stable solution state even at low t...  
WO/2017/138252A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138463A1
Provided is a room-temperature-curable composition containing reactive silicon-containing groups, in particular, a curable composition which gives a cured object satisfactory in terms of initial adhesiveness to wood and water-resistant a...  
WO/2017/138483A1
Provided are insulated coated conductive particles which enable the achievement of a good balance between excellent insulation reliability and conduction reliability even in a connection between micro circuits. Each insulated coated cond...  
WO/2017/135482A1
The purpose of the present invention is to propose a composition for improving the physical properties of a TPU high-frequency adhesive sheet to be attached to shoe uppers and, preferably, to improve a TPU high-frequency adhesive sheet t...  
WO/2017/134282A1
Described is a method for the integral joining of components, comprising: a) mechanically applying core-shell particles to at least one joining surface of at least one component, wherein the particles are applied via a gaseous dispersant...  
WO/2017/135299A1
Provided are features by which it is possible to form a coated layer such as a coated film or printed film on polyethylene with sufficient adhesive strength, to bond polyethylene materials together with sufficient adhesive strength, and ...  
WO/2017/135102A1
The purpose of the present invention is to provide: an adhesive agent which has a satisfactorily high nonvolatile component fraction, a satisfactory pot life, and satisfactory coating properties, and can be used as a one-part curable age...  
WO/2017/136188A1
The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer and/or silicone polyurea block copolymer and a silicate tackifying resin. Some embodiment...  
WO/2017/134931A1
An adhesive for a laminate of a metal foil and a resin film, said adhesive including a polyol (A), a polyisocyanate polymer (B), and a metal compound (C) that is at least one metal compound from group 7 and group 12, wherein the polyisoc...  
WO/2017/133120A1
Disclosed are a frame sealing adhesive, a liquid crystal panel, a liquid crystal display and a preparation method belonging to the technical field of liquid crystal display. The disclosed frame sealing adhesive comprises a frame sealing ...  
WO/2017/130892A1
Provided is a conductive material capable of providing high conduction reliability since the conductive material has high storage stability, and shows, after being arranged on a member to be connected, excellent solder cohesiveness perfo...  
WO/2017/130444A1
Provided is a stress distributing film having excellent stress distributing ability. Also provided are an optical member and an electronic member equipped with same stress distributing film. This stress distributing film comprises a laye...  

Matches 1 - 50 out of 27,204