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Matches 1 - 50 out of 25,246

Document Document Title
WO/2017/047600A1
The present invention is a film for plastic restoration with which a plastic that has deteriorated in transparency can be easily made to recover the transparency. The film for plastic restoration according to the present invention compri...  
WO/2017/047548A1
This pressure-sensitive adhesive composition comprises a (meth)acrylic copolymer (A) and a tackifier resin (B), wherein the tackifier resin (B) is contained in an amount of 5-100 parts by mass per 100 parts by mass of the (meth)acrylic c...  
WO/2017/047805A1
The present invention provides a curable resin composition which can maintain excellent fluidability thereof over a long period when melted by heating for the application onto an adherend and therefore has excellent coatability, and whic...  
WO/2017/047269A1
A pressure-sensitive adhesive sheet for fixing members for portable devices is provided, the sheet including a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition which comprises an acrylic polymer as ...  
WO/2017/047578A1
Provided is a polarizing film with an adhesive layer that comprises a polarizing film and an adhesive layer A disposed on the polarizing film, said polarizing film with an adhesive layer being characterized in that the polarizing film is...  
WO/2017/047077A1
Provided is a urethane adhesive that can be applied as a thick film, and with which it is possible to form an adhesive layer with good resistance to whitening caused by moist heat. The urethane adhesive contains a urethane prepolymer (A)...  
WO/2017/047452A1
Provided is an alumina-based heat conductive oxide which has not only excellent thermal conductivity but also excellent chemical resistance, water resistance and electrical insulation properties, while having good kneadability (miscibili...  
WO/2017/047703A1
The present invention pertains to an adhesive composition containing a rubber-based polymer (A) and a tackifier (B), wherein the rubber-based polymer (A) includes at least one rubber-based polymer selected from the group consisting of a ...  
WO/2017/047889A1
Provided is a photocurable composition for an optical adhesive comprising an acrylic photocurable compound and a plasticizer, wherein the acrylic photocurable compound comprises a monofunctional acrylic photocurable monomer and a (meth)a...  
WO/2017/047886A1
The present invention relates to a catechol derivative-based adhesive composition and a production method therefor, and more specifically, to a catechol derivative-based adhesive composition comprising a hydroxyl protecting group and var...  
WO/2017/043683A1
The present invention relates to an adhesive composition and a method for producing an adhesive tape using the same and, more particularly, to a halogen-free environmentally friendly adhesive tape for use in production of an adhesive tap...  
WO/2017/041584A1
Provided are an α-silane coupling agent and application thereof,the α-silane coupling agent having the structure formula of formula I. Wherein, R1, R2, R3 are alkyl containing 1-6 carbon atoms, respectively; R4 or R5 is one selected ...  
WO/2017/043256A1
Provided is a composition which includes: powdered silver in which grain distribution of primary particles has a first peak in a particle size range of 20 to 70 nm and a second peak in a particle size range of 200 to 500 nm, in which 50%...  
WO/2017/043405A1
The present invention provides a resin composition which can be thermally cured at a temperature of approximately 80°C and exhibits excellent PCT resistance, and is therefore suitable as a one-component adhesive used when producing an i...  
WO/2017/043532A1
Provided is a hydrogenated block copolymer including in the molecule a polymer block (C) composed mainly of a conjugated diene compound, a polymer block (B) composed mainly of a conjugated diene compound, and a polymer block (S) composed...  
WO/2017/043173A1
The pressure-sensitive adhesive composition according to the present invention comprises (A) a polymer including a structural unit having a hydroxy group in a side chain, (B) a compound having two or more isocyanate groups, (C) a bismuth...  
WO/2017/043455A1
[Problem] In the case of fabricating a flexible wiring device, for example, when the final curing and bonding time during final curing and bonding of an electroconductive reinforcing board and a flexible wiring board is reduced, peeling ...  
WO/2017/038180A1
The present invention addresses the problem of providing an adhesive sheet for coating, which has a relatively low tensile strength, has a relatively high tensile elongation, suppresses misalignment and degradation caused by high tempera...  
WO/2017/038915A1
This adhesive agent composition comprises an acrylic copolymer and an adhesive aid. The acrylic copolymer is a copolymer including 2-ethylhexyl acrylate as a main monomer. The adhesive aid includes, as a main component, a rubber-based ma...  
WO/2017/037951A1
The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) a radical-polymerizable compound, (c) a free-radical polymerization initiator, and (d) an epoxy resin containing no (meth)acryloyloxy...  
WO/2017/037170A1
The present patent application relates to a method for gluing two adjacent substrates together by using a radiation curable adhesive composition and a use of a radiation curable adhesive composition for gluing. In particular, the method ...  
WO/2017/038307A1
Provided is a pressure-sensitive adhesive sheet which has excellent shear performance and improved low-temperature resilience resistance. The present invention provides a pressure-sensitive adhesive sheet which includes a pressure-sensit...  
WO/2017/038572A1
Provided is a conductive paste which is capable of suppressing the occurrence of a large void in a bonded portion even in cases where a relatively large chip is bonded to a substrate. A conductive paste which contains: a metal powder hav...  
WO/2017/038615A1
A lamination adhesive, the requisite components thereof being an olefin resin (A) that has an acid group or an acid anhydride group, a curing agent (B), and a styrene resin (C), wherein the proportion of the styrene resin (C) in the comp...  
WO/2017/035710A1
Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of silver particles and surface coated copper particles, and optional (c) solvent.  
WO/2017/033935A1
Provided is an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and minimize migration and keep the connection resistance low even when the electrode width...  
WO/2017/033933A1
Provided is an electroconductive material in which solder can be selectively disposed in the electroconductive particles on an electrode without an inorganic filler excessively inhibiting the movement of the solder, electroconductivity c...  
WO/2017/034211A1
A protein adhesive of a novel sequence is disclosed. The protein adhesive according to the present application enables adhesion between two non-biological materials or between a non-biological material and a biological material, thereby ...  
WO/2017/032320A1
An aqueous binder for a lithium ion battery, a preparation method therefor and a use thereof. The binder is an inorganic-organic composite emulsion, comprising a dispersing agent, inorganic nanoparticles, (methyl) acrylate monomers, unsa...  
WO/2017/033956A1
The purpose of the present invention is to provide: a resin composition which exhibits good adhesion to a copper surface, a polyimide surface and a gold-plated surface, while having excellent adhesiveness after heat resistance test and a...  
WO/2017/033741A1
A purpose of the present invention is to provide an adhesive layer for optical members, which can be used to attach large and thin optical members or uneven optical members to each other, and which has a light diffusing function. Another...  
WO/2017/029959A1
[Problem] To provide an adhesive layer which is applicable to a configuration wherein at least one of polarizer protective films conventionally formed on both surfaces of a polarizer is omitted, and which has excellent light leakage prev...  
WO/2017/028008A1
The present invention belongs to the technical field of adhesives, relating to LED packaging silicones, and more particularly to a high-refractive-index LED packaging silicone. A high-refractive-index LED packaging silicone provided by t...  
WO/2017/030877A1
A polyester including at least one crosslinkable moiety is described. Each crosslinkable moiety includes at least one crosslinkable pendent group. A ratio of a total number of the at least one crosslinkable pendent groups to a total numb...  
WO/2017/031074A1
A barrier adhesive composition comprising a resin system and organically modified nanoclay. The resin system comprises (a) a first polyisobutylene resin having a viscosity average molecular weight of about 300,000 to about 500,000 g/mol,...  
WO/2017/027482A1
The present invention provides compositions, including die attach adhesives, coatings and underfill materials, which are useful in electronics packaging and the composite fields. Specifically, the invention provides liquid and very low m...  
WO/2017/022191A1
A composition including (a) 20 to 85 wt% of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxa...  
WO/2017/020399A1
The present invention provides a structural adhesive tape, comprising: a first adhesive layer, used for being adhered to an adhered object; a first substrate adhered to the first adhesive layer; and first foamer particles distributed wit...  
WO/2017/022666A1
The purpose of the present invention is to provide a urethane-based adhesive composition which exhibits excellent adhesiveness without a primer, while providing a cured product having excellent physical properties. The present invention ...  
WO/2017/024211A1
A film forming aqueous dispersion having utility as heat seal coatings for blister packaging applications comprises a blend of 10-90% by weight of one or more polyurethane dispersions; 90-10% by weight one or more compatible ethylenic co...  
WO/2017/023563A1
A tackifying resin includes a farnesene-based polymer having monomeric units derived from a farnesene monomer and one or more optional comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics an...  
WO/2017/022523A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing...  
WO/2017/022285A1
Provided is a method for manufacturing an optical member with which it is possible to improve the fit between a first member and a second member that are optically transparent. The present invention comprises: a temporary-curing step for...  
WO/2017/018125A1
Provided is an adhesive composition for polarizing plates, which does not deteriorate the optical characteristics of a polarizing plate even in cases where an adhesive layer is formed on a polarizing plate having a polarizer protective l...  
WO/2017/018472A1
The present invention provides an active-energy-ray curing adhesive composition for a plastic film, having low viscosity, excellent curability, excellent adhesiveness with respect to a plastic film or the like made of a cellulose-acetate...  
WO/2017/018486A1
Provided is a (meth) acrylic adhesive composition having excellent peeling strength at low-temperatures and resistance to strong impact. The composition comprises an elastomer having a (meth) acrylonitrile content of 10-30 mol% and not c...  
WO/2017/018459A1
Provided is an adhesive composition that contains: (a) a (meth)acrylic polymer; (b) a compound having at least two (meth)acryloyl groups; (c) a polymerization initiator; and (d) a filler.  
WO/2017/018270A1
Provided are: an adhesive sheet for semiconductor processing, which is capable of suppressing chipping and chip scattering during a dicing step, and which is not susceptible to leaving adhesive residue; and a method for producing a semic...  
WO/2017/014269A1
Provided is an adhesive composition for conductive members, which is capable of preventing oxidation degradation of a bonded member in cases where a conductive member such as an ITO film is bonded thereby, even if the adhesive compositio...  
WO/2017/014124A1
[Problem] To provide: a curable composition which has excellent storage stability and is capable of quickly forming a cured resin part (a film or the like) that exhibits excellent concealability of a defect part (a foundation) in the sur...  

Matches 1 - 50 out of 25,246