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Matches 1 - 50 out of 32,020

Document Document Title
WO/2019/172434A1
A petroleum resin having a content of volatile organic compound ingredients of less than 100 wt ppm; and a hydrogenated petroleum resin having a content of volatile organic compound ingredients of less than 100 wt ppm.  
WO/2019/171709A1
[Problem] To provide an adhesive composition which can be applied even by low-temperature drying, exhibits satisfactory water resistance and adhesiveness to olefinic resin bases such as polyethylene and polypropylene, and has satisfactor...  
WO/2019/172136A1
The purpose of the present invention is to provide a multilayer film which has excellent transparency and adhesiveness, while having excellent electrical conductivity at the same time. A multilayer film according to the present invention...  
WO/2019/172137A1
The purpose of the present invention is to provide a multilayer film which has excellent electrical conductivity, while having excellent transparency at the same time. A multilayer film according to the present invention is provided with...  
WO/2019/169595A1
A photocurable adhesive composition for assembling optical electronic devices is provided, which offers a good flexibility and excellent optical properties when cured.  
WO/2019/172109A1
Provided is an adhesive composition that is characterized by containing a modified polypropylene-based resin (A), an epoxy resin (B) and an unmodified polypropylene-based resin (C), with the modified polypropylene-based resin (A) being a...  
WO/2019/104002A3
An electrically debondable adhesive composition is described. The adhesive is comprised of a basic ionic liquid and an optionally crosslinked polymer, wherein the basic ionic liquid is comprised of an amino-ammonium cation and a bis(fluo...  
WO/2019/167824A1
A paste adhesive composition which contains silver particles and a monomer, and forms a silver particle-linking structure in which the interfaces between the silver particles have been eliminated by a heat treatment, wherein: the silver ...  
WO/2019/167922A1
The present invention addresses the problem of providing a pressure-sensitive adhesive tape that has excellent adhesiveness and followability with respect to an adherend, particularly, to a hard adherend, that, when the pressure-sensitiv...  
WO/2019/167638A1
This production method is for a flexible packaging film that is a laminate of a first substrate and a second substrate having interposed therebetween a reactive adhesive of a polyisocyanate composition (X) and a polyol composition (Y), t...  
WO/2019/167675A1
Provided are: an endoscope adhesive agent which is a two-liquid type and has a main agent and a curing agent, wherein the main agent contains epoxy resin (A), and the epoxy resin (A) contains an epoxy resin (a) having an average degree o...  
WO/2019/167621A1
Provided is a thermoplastic adhesive sheet that exhibits temporary bonding properties and deformation recovery properties, and that is capable of fulfilling a preferable bonding function. The thermoplastic adhesive sheet according to the...  
WO/2019/167819A1
A paste adhesive composition which is to be used as a highly reflective adhesive and contains silver particles, a monomer and a principal agent, wherein condition (A), condition (B) and condition (C) are satisfied by the reflectivity pro...  
WO/2019/167745A1
Provided is a tetra-block copolymer having an aromatic vinyl block (A1), a conjugated diene block (B1), an aromatic vinyl block (A2), and a conjugated diene block (B2) in that order, wherein Mw(A2)/Mw(A1) is 1.2-5, Mw(A2) is 12,000 or mo...  
WO/2019/165586A1
A preparation method for a waterproof binder, the preparation method comprising: raising the temperature of the following parts by weight of components to 60 °C at a heating rate of 4 °C/min: 10-16 parts of sodium octadecyl sulfonate, ...  
WO/2019/167544A1
The purpose of the present invention is to provide a battery that is capable of suppressing melting or decomposition of a tab tape for covering an electrode tab even in the case when the temperature of the electrode tab rises to a high l...  
WO/2019/167479A1
The present invention pertains to an adhesive film having a silicone adhesive layer on one or both surfaces of a substrate film, wherein a silicone adhesive material constituting the silicon adhesive layer has an elongation at break (at ...  
WO/2019/167287A1
Provided is a method for manufacturing a lead frame with a heat dissipation sheet comprising a step of bonding the heat dissipation sheet including at least an adhesive layer and an insulating layer to a lead frame on which a chip is mou...  
WO/2019/167460A1
An adhesive for a semiconductor, said adhesive being to be used for at least partly sealing connection parts of a semiconductor device wherein electrodes in respective connection parts of a semiconductor chip and a wiring circuit board a...  
WO/2019/167712A1
The present invention provides a double-sided pressure-sensitive adhesive sheet which is thin and, despite this, has high adhesive force and which is inhibited from increasing in adhesiveness and has suitability for reapplication. The do...  
WO/2019/165585A1
A waterproof adhesive for bonding a base layer of a photovoltaic panel, comprising the following components in parts by weight: 10-16 parts of sodium octadecyl sulfonate, 4-8 parts of diisooctyl phthalate, 4-8 parts of pentadiene, 6-12 p...  
WO/2019/167286A1
This heat dissipation sheet for a lead frame is provided with an adhesive layer and an insulation layer, the insulation layer being in an A-stage or B-stage state.  
WO/2019/166224A1
The present invention pertains to novel reactive (moisture curing) plasticizers of formula (I), as described herein, and adhesives and sealants containing them to bond and seal substrates.  
WO/2019/163743A1
This actinic ray-curable adhesive composition contains actinic ray-curable compounds (A), (B), and (C) as curable components. The content of the actinic ray-curable compound (A) having a SP value of 29.0 to 32.0 (MJ/m3)1/2 is 0.0 to 4.0 ...  
WO/2019/164166A1
An embodiment of the present application relates to an adhesive composition comprising: a first polymer, which is an acrylic-based polymer having a glass transition temperature value of 0°C or lower; a second polymer comprising a unit d...  
WO/2019/163812A1
Provided is a hot-melt adhesive sheet comprising a hot-melt adhesive which comprises a styrene-based block copolymer and a tackifier, wherein the styrene-based block copolymer comprises a hard segment constituted of a polystyrene block a...  
WO/2019/163804A1
Provided are: a curable composition giving a cured object which has high strength, high rigidity, and flexibility; and the cured object obtained by curing the curable composition. The curable composition is a multi-pack type curable comp...  
WO/2019/158638A1
The invention relates to a method for producing a hydrocarbon resin from at least one cyclic diolefin component and at least one ethylenically unsaturated aromatic component having 8 to 13 carbon atoms, in which method the monomer mixtur...  
WO/2019/159566A1
[Problem] Provided is a conductive adhesive capable of suppressing erosion on polycarbonate, and forming a cured product having excellent conductivity at low temperature. Also provided is a conductive adhesive capable of forming a cured ...  
WO/2019/159611A1
The present invention relates to a silicone pressure-sensitive adhesive composition containing: (A) a straight chain organopolysiloxane having at least 2 alkenyl groups in the molecule; (B) an organopolysiloxane having a siloxane unit re...  
WO/2019/160033A1
The present invention address the problem of providing an image display device and a photosensitive adhesive-attached circularly polarizing plate, wherein destruction of an image display panel due to the static electricity of a phase dif...  
WO/2019/159695A1
An electroconductive pressure-sensitive adhesive gel sheet which comprises: a continuous phase comprising a hydrophilic crosslinked polymer and an electrolytic solution; and hydrophobic crosslinked-polymer particles having a particle dia...  
WO/2019/159681A1
Provided is an adhesive layer-attached optical film having good conductivity and excellent adhesive layer anchoring properties. The adhesive layer-attached optical film 10 comprises: an optical film 11; an antistatic layer 13 disposed on...  
WO/2019/155926A1
A block copolymer which comprises a polymer block (A) that is mainly composed of a vinyl aromatic monomer unit and a polymer block (B) that is mainly composed of a conjugated diene monomer unit, and which is represented by general formul...  
WO/2019/155361A1
Provided are a heat-stretchable decorative film for light projection that exhibits decorativeness when light is not projected, functions as a screen when light is projected, and can reduce the generation of hot spots, and an article to w...  
WO/2019/153464A1
Disclosed are a binder composition and an application thereof in clothing manufacture. The composition is prepared from a hot melt adhesive and silicone hydrogel, and the hot melt adhesive is selected from PU or TPU. By utilizing the bin...  
WO/2019/156154A1
The present invention is a negative photosensitive resin composition which contains (A) an epoxy resin, (B) a compound that has a phenolic hydroxyl group and (C) a cationic photopolymerization initiator. This negative photosensitive resi...  
WO/2019/155896A1
The problem to be solved by the present invention is to provide an adhesive tape that has adhesiveness at normal temperature, is capable of actualizing excellent adhesive strength even after thermal expansion, and incurs little manufactu...  
WO/2019/155970A1
Provided is adhesive tape for semiconductor fabrication constituted by adhesive tape comprising a substrate and an adhesive layer provided on one side of the substrate, the adhesive tape being characterized in that, before energy irradia...  
WO/2019/154300A1
The present invention relates to an encapsulation adhesive film for a solar cell, comprising a transparent layer in contact with a cell sheet and a first adhesive film layer in contact with the transparent layer. The raw material of the ...  
WO/2019/156227A1
An adhesive composition that easily disintegrates in water, wherein the adhesive composition contains a 2-cyanoacrylate compound and a water-soluble compound, and a cured article of the adhesive composition has a water absorption rate of...  
WO/2019/150995A1
Disclosed is a thermosetting resin composition comprising: an epoxy resin; a hardening agent; a first elastomer having a weight-average molecular weight of 200,000 to 1,300,000, and having at least one type of functional group selected f...  
WO/2019/150433A1
Disclosed is a thermosetting resin composition comprising: an epoxy resin; a hardening agent; a first elastomer having at least one type of functional group selected from a group consisting of a carboxy group and a hydroxy group; and a s...  
WO/2019/151398A1
The purpose of the present invention is to provide an electroconductive pressure-sensitive adhesive tape excellent in terms of electromagnetic shielding property and electroconductivity. The present invention is an electroconductive pres...  
WO/2019/150446A1
Disclosed is an adhesive composition which comprises one or more thermosetting resins, a hardener, and an elastomer, wherein the thermosetting resins comprise an epoxy resin having an alicyclic ring. Also disclosed is a filmy adhesive ob...  
WO/2019/151192A1
Provided is a method for peeling an adhesive sheet adhered to a polarization plate. The adhesive sheet is provided with an adhesive layer, wherein the adhesive layer includes a layer A that constitutes at least one surface of the adhesiv...  
WO/2019/151369A1
The present invention provides an elastic hot melt composition that exhibits an excellent extensibility and an excellent stretch recovery after extension, a moderate stress during extension, and an excellent heat stability and that can b...  
WO/2019/150449A1
The present invention pertains to a semiconductor device production method which is provided with: a first die bonding step for electrically connecting a first semiconductor element onto a substrate via a first wire; a lamination step fo...  
WO/2019/151645A1
The present invention relates to an adhesive film for a semiconductor, comprising: an adhesive binder; a first layer comprising a heat dissipating filler; and a second layer formed on at least one surface of the first layer and comprisin...  
WO/2019/151188A1
Provided is a conductive adhesive composition that is capable of being worked at no more than 120°C and has both isotropic conductivity and excellent adhesion properties. The conductive adhesive composition contains 50–300 parts by ma...  

Matches 1 - 50 out of 32,020