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Matches 1 - 50 out of 27,663

Document Document Title
WO/2017/200054A1
A curable composition which contains a blocked isocyanate wherein an NCO group of an isocyanate compound having an H6XDI skeleton is blocked by a blocking agent having an O=C-CH-C=O skeleton, a curable functional group-containing fluorin...  
WO/2017/195899A1
Provided is a heat-peelable pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer which, even when heated under severe conditions (for example, 100°C, 3 hours), can retain the expanded state without shrinking and ...  
WO/2017/195400A1
The present invention addresses the problem of providing an electrically conductive adhesive which has superior heat cycle properties and good reflow properties, and is less likely to come off a substrate. The problem is solved by an ele...  
WO/2017/196765A1
The present invention provides adhesive compositions, sometimes in a two part configuration which includes a first part containing a (meth)acrylic component, an organic peroxide and a silsesquioxane and a second part containing a (meth)a...  
WO/2017/195266A1
The present invention addresses the problem of providing: an adhesive composition for laminates, which composition provides superior adhesion between a metal layer and a plastic layer in a layered body, which composition has electrolytic...  
WO/2017/195506A1
The present invention is an optical film for organic EL display devices, which is characterized by comprising: a retardation film that functions as a λ/4 plate; and an adhesive layer that has a water vapor permeability of 50 g/(m2·day)...  
WO/2017/195808A1
The present invention relates to an aluminum alloy material that comprises: an aluminum alloy base material; and a coating film that is formed on at least one portion of the surface of the aluminum alloy base material and that comprises ...  
WO/2017/195517A1
Disclosed is a method for manufacturing a semiconductor device provided with a semiconductor chip having connection parts, and a wiring circuit substrate having connection parts, the respective connection parts being electrically connect...  
WO/2017/195805A1
The present invention relates to an aluminum alloy material that comprises: an aluminum alloy base material; and a coating film that is formed on at least one portion of the surface of the aluminum alloy base material and that comprises ...  
WO/2017/195456A1
The film-forming composition of the invention is a pH 6-9 solution including an aromatic compound having an amino group and an aromatic ring in the molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The conte...  
WO/2017/191835A1
Provided is an adhesive sheet having good adhesion in a normal state, excellent release properties when releasing from an adherend, and excellent nonflammability. This adhesive sheet is provided with an adhesive layer having a surface A ...  
WO/2017/191815A1
This resin film for temporary fixation is equipped with a first layer including a first thermoplastic resin having a glass transition temperature of -50 to 50°C and a second layer including a second thermoplastic resin having a glass tr...  
WO/2017/190935A1
The invention relates to a self-adhesive compound consisting of a mixture containing: rubber, particularly natural rubber; at least one adhesive resin where said adhesive resins are present at an amount of 40 to 130 phr; and expanded pol...  
WO/2017/190455A1
Disclosed are a method for manufacturing a modified ABS material, a method for manufacturing a cambered rear shell of a display terminal, and the cambered rear shell of the display terminal. The method for manufacturing a modified ABS ma...  
WO/2017/190387A1
A method for preparing quantum dot glue, the quantum dot glue and a quantum dot polaroid. As to the method for preparing the quantum dot glue, the quantum dot glue is obtained by adding a water-soluble quantum dot material into polyvinyl...  
WO/2017/191801A1
The present invention provides a resin composition characterized by containing a polycyclic aromatic epoxy resin (A1), a non-aromatic epoxy resin (A2) having a C6 or higher aliphatic hydrocarbon structure and not having an aromatic ring ...  
WO/2017/189389A1
Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperatur...  
WO/2017/188411A1
Disclosed are a sulfur-containing silane compound that is a product of a reaction between a compound expressed by general formula (1) and a compound expressed by general formula (2), and a synthesis method therefor, as well as a rubber c...  
WO/2017/188281A1
The present invention provides a glass laminate, in which cohesive failure of resin layers in high temperature heating is limited, and a manufacturing method therefor. The present invention is a glass laminate provided with a supporting ...  
WO/2017/188223A1
The present invention addresses the problem of providing a two-sided adhesive sheet provided with both contour conforming properties and outgas resistance. The present invention is the two-sided adhesive sheet comprising: a base material...  
WO/2017/188118A1
Provided is a self-adhesive layer formed from a reaction product of a resin composition, said resin composition including a resin as well as a cross-linking agent and/or an initiator, wherein the self-adhesive force is between 25gf/3cm a...  
WO/2017/186057A1
Disclosed in the embodiments of the present invention are a sealant and method for preparation thereof, a display panel and method for fabrication thereof, and a display device. The sealant comprises a main-body adhesive, and a glass fib...  
WO/2017/188615A1
A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may inc...  
WO/2017/188120A1
Provided is a self-adhesive layer formed from a reaction product of a resin composition, said resin composition including a resin as well as a cross-linking agent and/or an initiator, wherein the glossiness is between 33 and 90 inclusive...  
WO/2017/187904A1
An adhesive composition for laminating which comprises a modified polyolefin resin (A) having a melting point of 90°C or lower, a modified polyolefin resin (B) having a melting point that is higher than that of the modified polyolefin r...  
WO/2017/187968A1
The moisture-curable reactive hot-melt adhesive composition according to the present invention comprises: an isocyanate group-containing urethane prepolymer which is a reaction product between an isocyanate component and a polyol compone...  
WO/2017/186192A1
A preparation method for a highly-conductive oxidation-resistant copper-silver composite powder. The method comprises the following steps: (1) using gas atomization to prepare a copper-silver alloy powder, the mass percentage of silver i...  
WO/2017/183515A1
Provided is transparent flame retardant tape having superior transparency and high flame retardance, the tape including an acrylic film layer and an acrylic adhesive layer. Also provided is a flame retardant structure rendered flame reta...  
WO/2017/184953A1
Compositions comprising thiol-terminated sulfur-containing prepolymers, curing agents reactive with the thiol-terminated sulfur-containing prepolymers, and ionic liquid catalysts, useful in aerospace sealant applications are disclosed. T...  
WO/2017/181489A1
Provided are a structural adhesive paper and a preparation method therefor. The structural adhesive paper comprises a first adhesive layer and a first substrate. The first adhesive layer comprises: a first adhesive for bonding to an obje...  
WO/2017/183722A1
Provided is an adhesive film to be used in a multilayer printed circuit board and exhibiting excellent uneven-surface embedding properties even when densely packing a silica filler. Specifically, this adhesive film has a resin compositio...  
WO/2017/183333A1
Disclosed is an active-energy-ray-curable adhesive composition comprising at least a radical-polymerizable compound, the active-energy-ray-curable adhesive composition being characterized in that the radical-polymerizable compound includ...  
WO/2017/183721A1
An adhesive film to be used in a multilayer printed circuit board and having a resin composition layer obtained by forming a layer, on a support film, of a resin composition that contains: (a) a novolac phenolic resin in which the disper...  
WO/2017/184431A1
Complexes, compositions, articles of manufacture, and method for making the same are provided herein. In one embodiment, a borate-polyol complex may be prepared by reacting a boron-containing compound and a polyol to form a reaction mixt...  
WO/2017/183335A1
Disclosed is a polarizing film having a transparent protection film provided on both surfaces of a polarizer with respective adhesive layers (a) and (b) sandwiched therebetween, wherein: the adhesive layer (a) on one surface has a glass ...  
WO/2017/183332A1
Disclosed is an active-energy-ray-curable adhesive composition comprising at least a radical-polymerizable compound, the active-energy-ray-curable adhesive composition being characterized in that, when the total amount of the radical-pol...  
WO/2017/184974A1
A dual cure, all epoxy adhesive that is both photochemically and thermally curable is disclosed. The adhesive may comprise at least about 93% by weight of one or more polymerizable epoxides, a catalytic amount of a photo-acid generator (...  
WO/2017/183334A1
Disclosed is a polarizing film having a transparent protection film provided on both surfaces of a polarizer with respective adhesive layers (a) and (b) sandwiched therebetween, wherein: the adhesive layer (a) on one surface has a glass ...  
WO/2017/179899A2
Provided is an optical adhesive composition comprising a monofunctional urethane (meth)acrylate-based oligomer and a polyfunctional urethane (meth)acrylate-based oligomer, wherein the weight ratio of the monofunctional urethane (meth)acr...  
WO/2017/179439A1
[Problem] To provide: an adhesive tape for semiconductor processing, which is suppressed in excessive winding around a conveyance roll, and which is able to be easily separated in a pick-up step; and a method for producing a semiconducto...  
WO/2017/179536A1
A curable composition which contains 100 parts by mass of (A) a flexible epoxy resin, 1-150 parts by mass of (B) polymer fine particles, each having a core-shell structure having at least two layers that are a core layer and a shell laye...  
WO/2017/179579A1
This granular adhesive contains an adhesive particle. The adhesive particle comprises a core containing an adhesive composition, a shell covering the core, and an encapsulated gas. The shell comprises a solid particle.  
WO/2017/175480A1
This sheet 1 for producing a three-dimensional integrated laminated circuit, which is interposed between a plurality of semiconductor chips having through-electrodes and is used to adhere the semiconductor chips to each other and obtain ...  
WO/2017/175740A1
Provided are: an amine compound represented by general formula (1), which has a low active hydrogen equivalent, and which, when used as an epoxy resin curing agent, exhibits sufficient curing properties even when a small amount thereof i...  
WO/2017/168812A1
Disclosed is an adhesive tape including, on at least one surface of a base material, an adhesive layer (which preferably contains a rubber adhesive) in which not only adhesive portions 2 but also non-adhesive portions 1 partially exist i...  
WO/2017/169661A1
The objective of the present invention is to provide a photocurable resin composition which exhibits sufficient curability in a deep portion. This photocurable resin composition is characterized by containing an allyl polymer (a) that is...  
WO/2017/171367A1
The present invention relates to a semiconductor device comprising: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermi...  
WO/2017/171025A1
The main objective of the present invention is to provide a modified hydrocarbon resin that imparts a hot-melt adhesive composition which is low-odor, has excellent thermal stability, and has high adhesive performance. The present invent...  
WO/2017/166116A1
The present invention provides a structural adhesive tape, the structural adhesive tape comprising: a first adhesive layer for adhering to an adhered object and comprising a first adhesive, the surface of the first adhesive layer adherin...  
WO/2017/170371A1
Provided is an electroconductive adhesive tape whereby high levels of repulsion resistance and electrical characteristics can be obtained at the same time. The electroconductive adhesive tape 1 pertaining to the present invention is prov...  

Matches 1 - 50 out of 27,663