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Matches 1 - 50 out of 29,682

Document Document Title
WO/2018/147351A1
A dielectric heating adhesive film for adhesion of a plurality of adherends comprising the same material or different materials, by dielectric heating. The dielectric heating adhesive film is characterized by: containing a thermoplastic ...  
WO/2018/147247A1
Provided is an actinic-ray-curable adhesive composition which has excellent adhesive force, is suitable for use in laminating any of various protective films for polarizers to a polarizing element, and is excellent in terms of curability...  
WO/2018/147284A1
The present invention uses an adhesive composition for polarizing films, which contains an active energy ray-curable component and an air bubble inhibitor that has a reactive group. It is preferable that a silicone-based air bubble inhib...  
WO/2018/147686A1
Provided is a substrate-less transfer tape comprising: a release liner comprising a heavy release surface and a light release surface; and a transfer film layer provided on the heavy release surface, wherein the peeling force of the heav...  
WO/2018/147352A1
A dielectric heating adhesive film for adhesion of a plurality of adherends comprising the same material or different materials, by dielectric heating. The dielectric heating adhesive film is characterized by: containing a thermoplastic ...  
WO/2018/142997A1
Provided is a water dispersion body comprising a resin component and water. The resin component comprises: composite particles (D) having an ethylene-unsaturated carboxylic acid copolymer (A) and a polymer (B) the polymer units of which ...  
WO/2018/145002A1
A moisture-curable adhesive composition comprises a polymer component selected from a silane-terminated polyalkylene oxide and/or a polyurethane; a plurality of amino-silane modified wollastonite fibers having an average aspect ratio of ...  
WO/2018/142982A1
Provided is an adhesive composition that has adequate adhesive strength when affixed to an adherend having fine surface irregularities and that does not readily increase in adhesive strength even when exposed to high temperatures such as...  
WO/2018/143343A1
The present invention pertains to an adhesive sheet for producing a semiconductor device. This adhesive sheet for producing a semiconductor device is provided with a substrate, and a thermosetting adhesive agent layer provided on one sur...  
WO/2018/142815A1
[Problem] To provide an adhesive composition with which it is possible to form an adhesive layer that exhibits excellent durability even under rigorous durability conditions. [Solution] An adhesive composition including a silane compound...  
WO/2018/143501A1
The present invention relates to a method for manufacturing a fine-pitch anisotropic conductive adhesive, and a fine-pitch anisotropic conductive adhesive manufactured by the method. The method for manufacturing a fine-pitch anisotropic ...  
WO/2018/143159A1
Provided is a chloroprene-based polymer latex composition which is capable of being used for a mixed latex composition having favorable adhesive strength with respect to a hard adherend such as concrete and mortar. This chloroprene-based...  
WO/2018/135544A1
The present invention provides a laminated film with which it is possible to suitably heat weld together two or more members. This laminated film is used for bonding a first member and a second member, and is at least provided with a fir...  
WO/2018/135546A1
An adhesive film (50) according to the present invention can be used for temporally fixing an electronic component in the sealing of the electronic component with a sealing material in the process of manufacturing an electronic device, a...  
WO/2018/131570A1
Provided is an epoxy resin composition capable of achieving excellent low dielectric properties and high adhesion to metal. Specifically, an epoxy resin composition is provided that contains organic particles and an epoxy resin having a ...  
WO/2018/131569A1
Provided is an epoxy resin composition having excellent electrical characteristics (especially a low dielectric loss tangent) and being capable of achieving high adhesion to metal. Specifically, an epoxy resin composition containing an...  
WO/2018/131713A1
Provided are: an adhesive composition which has a novel deodorizing effect; and an article which uses this adhesive composition. An adhesive composition which contains a porous granular deodorant and an adhesive base, and which is charac...  
WO/2018/131571A1
Provided is an epoxy resin composition having excellent adhesion and low dielectric properties. Specifically, an epoxy resin composition is provided that contains an acid-modified polyolefin resin and an epoxy resin having a specific str...  
WO/2018/123665A1
The purpose of the present invention is to provide a hot melt composition which has excellent volatilization resistance, workability, flow resistance and adhesiveness. The present invention is a hot melt composition which contains a styr...  
WO/2018/119625A1
A strong adhesive is prepared by using the following raw materials in parts by weight: 3.6 to 5.8 parts of ethylene glycol, 5.6 to 7.4 parts of styrene, 2.5 to 4.6 parts of tetrahydrofuran, 5.6 to 8.3 parts of butyl acrylate, 4.1 to 6.3 ...  
WO/2018/121656A1
Disclosed is a white polyolefin packaging film, which comprises the following components in terms of parts by weight: polyolefin resin A 100 parts; polyolefin resin B 20-50 parts; an organic peroxide compound initiator 0.6-2.0 parts; a c...  
WO/2018/123615A1
The present invention addresses the problem of providing an adhesive tape: that possesses superior adhesiveness before being heated; that can be expanded by being heated; and that is capable of exhibiting superior adhesiveness even after...  
WO/2018/121048A1
A heat-resistant packaging adhesive for a high-power LED and a manufacturing method thereof. The adhesive is based on an epoxy resin material and contains an active toughening diluent and an active filler. The adhesive is made under cert...  
WO/2018/120741A1
A barrier material, a polyurethane adhesive containing same, a skin and an aircraft. The barrier material comprises a povidone and an ethylene/vinyl alcohol copolymer coupled with a coupling agent. After coupling the povidone and the eth...  
WO/2018/124200A1
The present invention relates to a polyester adhesive composition which contains a polyester resin (I) having a glass transition temperature of from -20°C to +30°C; and this polyester adhesive composition enables the achievement of an ...  
WO/2018/124319A1
The present invention relates to an insulative substrate-less heat-radiation tape and a manufacturing method therefor, and more specifically, to an insulative substrate-less heat-radiation tape exhibiting excellent insulation and adhesiv...  
WO/2018/123734A1
Provided is a resin composition containing a polyester polyol and a partial lithium-fixed smectite.  
WO/2018/117264A1
The present invention relates to a double-sided adhesive tape provided with a layered structure having an adhesive layer (I), a base material, and an adhesive layer (II) in that order. The ratio (Y/X) of the thickness (Y) of adhesive lay...  
WO/2018/118898A1
Adhesive articles are provided that can be repositioned (moved) prior to final adherence to a substrate. More specifically, the adhesive articles include a pressure-sensitive adhesive layer that contains an elastomeric (meth)acrylic-base...  
WO/2018/117670A9
An embodiment of the present invention provides: an adhesive coating composition capable of attaching (coupling) an electrical steel sheet without using an existing coupling method, such as welding, clamping, or interlocking; an electric...  
WO/2018/117262A1
The present invention relates to a double-sided adhesive tape provided with a layered structure having an adhesive layer (IA), a base material, and an adhesive layer (IIA) in that order. A flame retardant (C) is included in adhesive laye...  
WO/2018/116813A1
The present invention provides: a bonding film which is capable of bonding a semiconductor element to a substrate to produce a semiconductor device having improved mechanical strength and thermal cycling characteristics; and a tape for w...  
WO/2018/117694A1
The present invention provides an adhesive composition characterized in that the kisstack, which is defined as the force measured when a sheet coated with the adhesive composition is instantaneously peeled off after being attached, is ab...  
WO/2018/117750A1
An embodiment of the present invention provides: an adhesive coating composition capable of adhering (coupling) non-oriented electrical steel sheets without using a conventional coupling method such as welding, clamping, and interlocking...  
WO/2018/117670A2
An embodiment of the present invention provides: an adhesive coating composition capable of attaching (coupling) an electrical steel sheet without using an existing coupling method, such as welding, clamping, or interlocking; an electric...  
WO/2018/116205A1
The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive...  
WO/2018/116555A1
Provided is an adhesive which, when used as an adhesive for laminating a metal foil to a resin film, can stably exhibit satisfactory adhesiveness and can give a laminate highly excellent in terms of electrolyte resistance and heat resist...  
WO/2018/117564A1
The present invention relates to a metal composite sheet having a heat radiating function and provides a metal composite sheet and a coverlay-integrated metal composite film comprising the same, the metal composite sheet comprising: a fi...  
WO/2018/117080A1
Provided is a battery packaging material which exhibits excellent molding properties, and after heat fusion of sealant layers to one another in order to seal the battery element, does not exhibit a decline in interlayer adhesion strength...  
WO/2018/116967A1
This adhesive composition is characterized by containing (A) a modified polyolefin resin and (B) an epoxy compound, and is also characterized in that: the modified polyolefin resin (A) is obtained by graft modifying a polyolefin resin wi...  
WO/2018/109547A1
The present invention provides an adhesive resin composition to be used in the adhesion of fluorine resins, wherein the purpose of the adhesive resin composition is to bond fluorine resins to each other or to bond a fluorine resin and a ...  
WO/2018/110285A1
The problem that the present invention attempts to address is to provide a thin-profile electroconductive adhesive tape having exceptional adhesive strength, said thin-profile electroconductive adhesive tape allowing air bubbles to quick...  
WO/2018/110754A1
The present invention relates to an adhesive sheet or an adhesive tape which has an electromagnetic wave-blocking function, and provides a method for producing a UV-curable adhesive sheet in which an electromagnetic wave filler has enhan...  
WO/2018/110755A1
The present invention relates to an adhesive tape exhibiting electromagnetic wave absorption anisotropy by imparting orientation to an electromagnetic wave-absorbing filler, and to a method for producing the adhesive tape, and provides a...  
WO/2018/110666A1
Provided is a composition having a low curing shrinkage, which contains the components (A)-(D) described below. (A) 100 parts by mass of an oligomer which has a (meth)acryloyl group, while having a diene skeleton or a hydrogenated diene ...  
WO/2018/110967A1
Provided is a means capable of allowing durability and reworkability to co-exist under severe environments (high temperature, high moisture, and heat shock) in an adhesive composition used in image display devices and optical members, wh...  
WO/2018/110705A1
Provided is a composition having exceptional adhesiveness to difficult adherends such as polyolefins. The means of solution is a composition containing (1) and (2) below, where the content ratio of (1-1), (1-2), and (1-3) is (1-1):(1-2):...  
WO/2018/109322A1
The invention relates to a method for bonding two parts (10, 20) using a heat activated glue, in which, after the parts (10, 20) have been assembled, at least part of the glue (30) is heated, generating a current in a resistive coating (...  
WO/2018/109711A1
The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a -COOH or -O...  
WO/2018/110493A1
[Problem] To provide a heat-shrinkable polyester-based label and a package, wherein the heat-shrinkable polyester-based label has a solvent adhesive part which does not cause a solvent to penetrate out of a film even when the film is thi...  

Matches 1 - 50 out of 29,682