| Document |
Document Title |
|
WO/2012/061296 |
Adhesive compositions, including pressure sensitive adhesives, are the reaction product of free radically polymerizable mixtures. The free radically polymerizable mixtures include a free radically polymerizable urethane-based or urea-bas...
|
|
WO/2012/056183 |
The subject matter of the invention is a method for producing an article comprising a multilayer structure containing: - a first layer based on a metal or on an organic polymer; - and a second layer of an adhesive composition comprising ...
|
|
WO/2012/056905 |
Provided is a sealing material that cures at a low temperature (for example, 100-300°C), has excellent adhesion to partition walls of a ceramic honeycomb fired body and has excellent heat resistance. The sealing material contains an aqu...
|
|
WO/2012/054701 |
The present invention is directed to a third generation form of creatine, specifically a creatine hydrochloride salt, that drives significant improvements in muscle development and recovery due to its enhanced bio-availability, while cau...
|
|
WO/2012/054922 |
[00154] A robust, two component adhesive for laminating flexible packaging material comprising a mixture of Component A and Component B. Component A comprises an isocyanate-functionalized compound. Component B comprises a mixture of a hi...
|
|
WO/2012/053478 |
Provided is a moisture-curable reactive hot-melt adhesive which includes a less toxic polymer having a reactive silicon group and which has the controlled properties of relatively slowly curing at high temperatures (excellent high-temper...
|
|
WO/2012/053589 |
The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connec...
|
|
WO/2012/053373 |
The present invention addresses the problem of providing an electronic device in which a conductive layer has excellent adhesiveness and low surface resistivity, and a production method therefor. The problem is solved by a conductive adh...
|
|
WO/2012/050046 |
[Problem] To provide a block copolymer for adhesive that has a good finish, and an adhesive composition that has an excellent adhesive property and a good performance balance, and further an excellent solubility and coatability. [Solutio...
|
|
WO/2012/049938 |
The method of the present invention is provided as a method for manufacturing an electronic component that improves the chip retention characteristics, pickup characteristics, and contamination prevention characteristics for a semiconduc...
|
|
WO/2012/048985 |
The invention relates to encapsulated iron oxide particles having a needle shape, and comprising a core containing magnemite and magnetite, and a shell containing a metal oxide or metalloid oxide. Said particles are produced in that an a...
|
|
WO/2012/050049 |
The present invention provides an adhesive composition for optical components that is capable of achieving both reworkability and durability and that is capable of inhibiting unevenness in color and light leakage when applied to image di...
|
|
WO/2012/048979 |
The invention relates to hot-melt adhesive compositions containing, in relation to the total weight of the composition, the following constituents: (a) between 20 wt. % and 98.9999 wt. % of at least one thermoplastic base polymer; (b) be...
|
|
WO/2012/046710 |
Provided are: a heat-conductive adhesive agent comprising an adhesive resin and a heat-conductive filler, wherein the heat-conductive filler comprises plate-shaped metal particles; an adhesive sheet which has, formed on at least one surf...
|
|
WO/2012/046761 |
The present invention relates to: a binder for use in the production of an inorganic fiber product, which comprises a phenolic resin and a sugar; a binder for use in the production of an inorganic fiber product, which comprises a first p...
|
|
WO/2012/046720 |
A surface protection film is provided with a polyolefin base material layer and an adhesive layer, wherein the adhesive layer has a hardness (Martens hardness) of 1-2.5 N/mm2 and a loop tack of 0.02-0.1 N/25mm. Therefore, the surface pro...
|
|
WO/2012/046952 |
The present invention relates to an adhesive composition and to a polarizing plate and a liquid crystal display device comprising the same, and more specifically relates to an adhesive composition which comprises specific amounts of an a...
|
|
WO/2012/046695 |
This method for manufacturing a semiconductor device is characterized by providing: a first step for providing a resin paste coating (30) by applying a resin paste for bonding that has 5% by mass or less content of a solvent that contain...
|
|
WO/2012/044529 |
The methods of preparing hot melt processable pressure sensitive adhesives include combining an elastomeric (meth)acrylate random copolymer contained within a thermoplastic pouch and greater than 50 parts by weight per 100 parts by weigh...
|
|
WO/2012/043664 |
The present invention provides a curable resin composition that exhibits excellent adhesive durability and contains: (A) an oligomer that has a diene-based or a hydrogenated diene-based skeleton; (B) a meth (acrylate) that exhibits a hom...
|
|
WO/2012/043764 |
The present invention relates to an adhesive composition for encapsulating connection parts in a semiconductor device in which respective connection parts of a semiconductor chip and a wiring circuit board are electrically connected with...
|
|
WO/2012/043025 |
The present invention provides a conductive adhesive composition that has superior adhesive properties and low surface resistance and is capable of use as a buffer layer foran electronic device. This conductive adhesive composition conta...
|
|
WO/2012/043450 |
According to the present invention, a liquid resin composition that has good wettability and spreadability after chip mounting and exhibits superior solder cracking resistance even with high temperature solder reflow treatment at roughly...
|
|
WO/2012/043545 |
Disclosed is an adhesive composition having high electrical conductivity and thermal conductivity even with no load and at curing temperatures of less than or equal to 200C, and having a high adhesive strength even at 260C; also disclose...
|
|
WO/2012/043657 |
The present invention addresses the problem of further improving bonding reliability of an object in which a metal plate and a porous material are attached together, in a history of harsh environments and high load conditions. The presen...
|
|
WO/2012/043472 |
Provided are: conductive particles, each of which is not susceptible to a large crack in a conductive layer even in cases where a large force is applied thereto; an anisotropic conductive material which uses the conductive particles; and...
|
|
WO/2012/038373 |
The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar module...
|
|
WO/2012/037509 |
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from e...
|
|
WO/2012/036442 |
The present invention relates to an adhesive composition comprising tannin, polyethylene glycol, and water, wherein the adhesive composition has little toxicity, can be adhered even without a thermosetting curing agent which is different...
|
|
WO/2012/032995 |
Provided is a method for producing a laminate for configuring an image display device, said laminate being capable of achieving followability to recesses/projections and foaming resistance reliability at the same time. Proposed is a meth...
|
|
WO/2012/033355 |
The present invention relates to a phase retardation device comprising a base substrate, a liquid crystal polymer layer formed on the base substrate and oriented in one direction and hardened, an optical adhesive layer interposed between...
|
|
WO/2012/033998 |
An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plur...
|
|
WO/2012/033030 |
Provided is a moisture-curable reactive hot-melt adhesive agent composition which does not contain any vinyl chloride resin, has excellent adhesion to a steel sheet having an oily surface or an electrodeposited steel sheet, can exhibit s...
|
|
WO/2012/029536 |
Adhesive particles (2) comprising inorganic particles (21) and a polymer (22) are mixed with a binder (3) and form an adhesive sheet (1). The inorganic particles (21) and the polymer (22) are chemically bonded. Some of the adhesive parti...
|
|
WO/2012/029737 |
Provided is an adhesive composition for a two-pack type laminate having excellent film adhesion even in an environment requiring heat and moisture resistance. The adhesive composition comprises: a principal agent containing, for every 10...
|
|
WO/2012/029960 |
The present invention provides a resin composition that is suitable for non-solvent adhesives and exhibits high adhesive strength, the resin composition comprising: component (A), which is a (meth)acrylate having one or more (meth)acrylo...
|
|
WO/2012/026456 |
[Problem] To provide an adhesive agent composition that is used in the adhesion of an optical film, exhibits superior durability even in high-temperature high-humidity environments, and has an excellent ability to suppress white spots fr...
|
|
WO/2012/027450 |
It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105°C and viscosity of less than about 1,900cP at 190°C possesses desirable properties and may be used to make a low appl...
|
|
WO/2012/022011 |
A conductive curable composition filled with silver coated material, and more particularly, an organic curable composition comprising micron meter scale fine silver coated material with flaky shape, which have stabilized against prematur...
|
|
WO/2012/023555 |
The purpose of the present invention is to provide a two-component curable oxygen-absorbing resin composition that has both oxygen-absorbing and adhesive properties and cohesive power. The resin for an oxygen-absorbing adhesive is a poly...
|
|
WO/2012/020750 |
The present invention provides a resin composition which comprises (1) a polyester, (2) a polyolefin, (3) an epoxy compound, and (4) a tackifier at a (1)/(2)/(3)/(4) weight ratio of 100/1-50/1-30/1-30 and in which the polyester (1) conta...
|
|
WO/2012/021721 |
A pressure sensitive adhesive composition comprising the polymerization product of: (A) a monomer selected from the group consisting of alkyl acrylates, alkyl methacrylates, and combinations thereof; and (B) a macromonomer comprising the...
|
|
WO/2012/020764 |
Provided are: an adhesive composition that is capable of providing an adhesive layer in which titanium-based nanoparticles are stably dispersed, said adhesive layer having more enhanced mechanical characteristics, excellent refractive in...
|
|
WO/2012/018232 |
The present invention relates to an aqueous tackifier composition and to a method for preparing same. More particularly, when the aqueous tackifier composition of the present invention is mixed with glue or an adhesive, the physical prop...
|
|
WO/2012/018123 |
An anisotropic conductive adhesive film which comprises: an organic binder that contains a cationically polymerizable substance; 0.01 to 15 parts by mass of a cation generator represented by general formula (1) per 100 parts by mass of t...
|
|
WO/2012/017057 |
Curing through large bond gaps, of approximately 0.5 - 1.0 mm, has proven particularly challenging in the field of adhesives technology. Most noteworthy is the difficulty associated with providing one-part adhesive formulations capable o...
|
|
WO/2012/017568 |
Provided are a pressure-sensitive film and tape for semiconductor wafer processing, which are capable of reducing the occurrence of reflow cracks in packages, even if a package is picked up in a state in which a pressure-sensitive adhesi...
|
|
WO/2012/018142 |
This adhesive for crystalline metal oxide conducting film is characterized in containing: (A) an alkylester acrylate-based copolymer containing (a-1) 50 to 99% by weight of an alkylester acrylate unit wherein the alkyl group of the ester...
|
|
WO/2012/018232 |
The present invention relates to an aqueous tackifier composition and to a method for preparing same. More particularly, when the aqueous tackifier composition of the present invention is mixed with glue or an adhesive, the physical prop...
|
|
WO/2012/013543 |
The invention relates to an insulation system (20) having improved partial discharge strength, to an insulating tape (10) and to a method for producing such an insulation system (20). The insulating tape (10) comprises a mica paper (5) a...
|
