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Matches 1 - 50 out of 22,579

Document Document Title
WO/2017/179479A1
Provided are: a pressure-sensitive adhesive composition which can be thermally melted at a relatively low temperature to enable hot-melt bonding and which is excellent in terms of adhesive force, holding power, and tack; and a pressure-s...  
WO/2017/180961A1
The present invention relates to a method for manufacturing a multi-ply tissue paper, wherein a first tissue is adhesively bonded to a second tissue using an aqueous, repulpable adhesive composition comprising an alkali soluble acrylic c...  
WO/2017/179439A1
[Problem] To provide: an adhesive tape for semiconductor processing, which is suppressed in excessive winding around a conveyance roll, and which is able to be easily separated in a pick-up step; and a method for producing a semiconducto...  
WO/2017/179910A1
According to one embodiment of the present invention, provided is a multilayer marking film comprising: an adhesive layer; a colored substrate layer having a first color; and a colored coating layer having a second color, wherein the fir...  
WO/2017/170437A1
This adhesive sheet for semiconductor processing comprises an adhesive layer on a substrate film and the 5% modulus of the substrate film is 7.0-20.0 MPa. The substrate film is a single layer and comprises 5-39 parts by mass of a styrene...  
WO/2017/171367A1
The present invention relates to a semiconductor device comprising: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermi...  
WO/2017/170446A1
Provided is a double-sided pressure-sensitive adhesive sheet which comprises a support and, disposed respectively on both surfaces thereof, a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer, wherein...  
WO/2017/170371A1
Provided is an electroconductive adhesive tape whereby high levels of repulsion resistance and electrical characteristics can be obtained at the same time. The electroconductive adhesive tape 1 pertaining to the present invention is prov...  
WO/2017/168828A1
Provided is a tape for an electronic device package, with which it is possible to suppress the occurrence of bending and marks in a metal layer, which are caused by the edge section of the rotating stage of a pickup device when picking u...  
WO/2017/168829A1
Provided is a tape for an electronic device package which, when picking up an adhesive layer-equipped metal layer from a pressure-sensitive adhesive tape, enables appropriate recognition of individual segments of the adhesive layer-equip...  
WO/2017/170436A1
This adhesive sheet for semiconductor processing comprises an adhesive layer on a substrate film and has a loss factor of 0.08 or more but less than 0.15 at a frequency of 0.01-10 Hz. The substrate film is a single layer and comprises 5-...  
WO/2017/171492A1
The present invention relates to a semiconductor device, and a method for manufacturing a semiconductor device by using an adhesive, for a semiconductor, having a predetermined melt viscosity and thixotropic index, the semiconductor devi...  
WO/2017/168825A1
Provided is an electronic device package tape such that a metal layer can be held on a base tape during precutting and the base tape can be satisfactorily detached during use. An electronic device package tape 1 of the present invention ...  
WO/2017/168869A1
Provided are a pressure-sensitive adhesive composition for optical films and an optical film, which, even after having been placed in a high-temperature environment, has excellent reworkability and which satisfies durability. The pressur...  
WO/2017/171324A1
The present invention relates to a flexible color filter and a manufacturing method therefor, the method forming a protective layer before a black matrix layer is formed in the manufacture of a color filter being processed on a carrier s...  
WO/2017/170130A1
To provide: a printing tape which has higher resistance to temperature and water (moisture) than ever before; and a printing cassette. This printing tape 50 is provided with a heat-sensitive agent layer 592, a first protection layer 591,...  
WO/2017/168820A1
Provided is an electronic device package tape that can inhibit the occurrence of warpage in a layered product of a semiconductor, bonding adhesive layer, and semiconductor chip when precuring the bonding adhesive layer and that can inhib...  
WO/2017/170452A1
This adhesive film (50), for use in semiconductor device manufacturing, is used for temporarily fixing an electronic component (70) when sealing the electronic component (70) by means of a sealing member (60) in a semiconductor device ma...  
WO/2017/167903A1
A system for handling winding reels that comprises a cantilever expansion shaft (1) with an integrated axial sliding mechanism and a retractable shaft-end support, said axial sliding mechanism is based on at least three rollers (2) that ...  
WO/2017/168830A1
Provided is tape for electronic device package which, when picking up an adhesive layer-equipped metal from a pressure-sensitive adhesive tape, can minimize the occurrence of pin indentations due to the deformation of the metal layer by ...  
WO/2017/162641A1
The present invention relates to an aqueous dispersion of polymeric particles comprising an acrylic polymer and a hydrophobic flame retardant, methods for their production, adhesives and coating compositions comprising said dispersion, a...  
WO/2017/161543A1
A flocking adhesive for paper and a preparation method therefor. The process steps and components are as follows: dissolving an emulsifier into deionized water to obtain an emulsifier water solution, adding a mixed monomer in which rosin...  
WO/2017/165868A1
A roof system comprising a roof substrate, a first membrane including first and second opposed planar surfaces, and a second membrane including opposed first and second planar surfaces, where said second membrane is adhered to said roof ...  
WO/2017/157639A1
The invention relates to a silicone-containing pressure-sensitive adhesive in the form of an adhesive composition which contains at least one first adhesive component and one second, silicone-containing adhesive component, where the seco...  
WO/2017/159788A1
The purpose of the present invention is to provide an adhesive sheet which is formed from a dual curing adhesive composition, and which has a sufficiently low relative dielectric constant and excellent durability. The present invention r...  
WO/2017/154660A1
The purpose of the present invention is to obtain a curable composition of (meth)acrylic polymer that can be easily kneaded at the time of production, that can provide a cured product with excellent dynamic viscoelastic properties, and t...  
WO/2017/155644A1
The present disclosure provides an oil-resistant adhesive comprising a crosslinked copolymer of (meth)acrylic ester monomers, methyl (meth)acrylate monomers, vinyl ester monomers, and a functional monomer selected from one of (meth)acryl...  
WO/2017/154224A1
Provided is an adhesive film which is used for various surface protective films and the like, and which has excellent mechanical strength, excellent heat resistance and good adhesive properties, while having few fish eyes. An adhesive fi...  
WO/2017/154226A1
Provided is an adhesive film having few fish eyes, exceptional mechanical strength and heat resistance, little dust adhesion, and excellent adhesive characteristics, the adhesive film being used in various types of surface protection fil...  
WO/2017/150463A1
The purpose of the present invention is to provide a pressure-sensitive adhesive tape which has excellent sebum resistance and which, even when applied to portions to be frequently touched with human hands, can retain the adhesive force;...  
WO/2017/149982A1
The purpose of the present invention is to provide: an adhesive composition that, without requiring curing for forming an adhesive layer, has a satisfactorily high adhesive strength before ultraviolent irradiation, a satisfactorily large...  
WO/2017/149981A1
The purpose of the present invention is to provide: an adhesive composition that, regardless of being heated, has a high adhesive strength before ultraviolent irradiation, a satisfactorily large range of decline in the adhesive strength ...  
WO/2017/150676A1
This adhesive tape for semiconductor processing is used by attaching said adhesive tape to the surface of a semiconductor wafer in a step in which the rear surface of a semiconductor wafer having a groove or a modified area formed on the...  
WO/2017/145545A1
Disclosed are: an adhesive agent composition containing a (meth)acrylic polymer (A) including a monomeric unit which is two or more types of hydroxy group-containing (meth)acrylate monomers represented by formulae (A1) and (A2), and 5.1-...  
WO/2017/146108A1
The purpose of the present invention is to provide: a two-sided adhesive tape that has excellent heat resistance and repulsion resistance and is unlikely to peel off, in particular, even when a cover of a vehicle-mounted panel or vehicle...  
WO/2017/147184A1
Techniques are described for mounting a display and/or display cover to a housing of a display device, such as a mobile phone. In an embodiment, the housing and display cover include chamfered edges at complementary angles to allow for a...  
WO/2017/145624A1
An adhesive film which comprises an acrylic resin (a), an epoxy resin (b), a hardener (c), and an α-alumina filler (d), wherein the α-alumina filler (d) comprises a polyhedral α-alumina filler having a purity of 99.90 mass% or higher ...  
WO/2017/140459A1
The invention relates to a crosslinkable adhesive compound comprising at least a first base polymer component having functional groups suitable for covalent crosslinking and for coordinative crosslinking, and comprising at least one cova...  
WO/2017/141449A1
One aspect of the present invention is a pressure-sensitive adhesive which comprises 100 parts by mass of (A) an acrylic polymer having a glass transition temperature of -50 to -25ºC, 0.01-3 parts by mass of (B) a silane coupling agent ...  
WO/2017/138544A1
Proposed is a new transparent double-sided pressure-sensitive adhesive sheet for image display devices which has an ultraviolet-absorbing function and which can be used in such a manner that the pressure-sensitive adhesive sheet is prima...  
WO/2017/138609A1
The present invention provides a UV curable acrylic polymer which can be used as a UV curable hot melt adhesive that exhibits excellent heat stability and coatability when melted, without requiring a stabilizer and that achieves desired ...  
WO/2017/139572A1
Copolymers prepared by a reaction of (1) an unactivated olefin, (2) an activated olefin, and (3) a hydroxyl functional activated olefin and/or a hydroxyl functional unactivated olefin are described. The copolymers have a backbone of pola...  
WO/2017/139052A1
Removable, aqueous-based compositions, especially sealants useful for, inter alia, temporary craft applications and seasonal weatherization of buildings and methods of their use are disclosed. These sealants reduce the flammability risks...  
WO/2017/138567A1
[Problem] To improve long-term storage stability of a polymerizable composition containing an organoborane and a polymerizable monomer. [Solution] Provided is a polymerizable composition which contains an organoborane (A), a polymerizabl...  
WO/2017/138310A1
Provided is an adhesive sheet which is able to be suppressed in changes of the characteristics of a bonding film X due to migration of an additive in the bonding film X to an adhesive tape in the adhesive sheet. The present invention pro...  
WO/2017/138463A1
Provided is a room-temperature-curable composition containing reactive silicon-containing groups, in particular, a curable composition which gives a cured object satisfactory in terms of initial adhesiveness to wood and water-resistant a...  
WO/2017/133121A1
The present invention provides a UV-crosslinked hot-melt pressure-sensitive adhesive used for a polyvinyl-chloride insulated adhesive tape, made by mixing a vinyl monomer, functional monomer, special soft monomer, and photoinitiator poly...  
WO/2017/136669A1
Provided herein are debondable adhesive compositions comprising (A) one or more bis-maleimide (BMI), nadimide or itaconimide oligomer(s), (B) at least one ethylenically unsaturated co-monomer (e.g. co-monomers selected from the group con...  
WO/2017/136219A1
The present disclosure generally relates to adhesive compositions, adhesive articles including the adhesive compositions, methods of making the adhesive compositions and articles, and methods of using the adhesive compositions and articl...  
WO/2017/135299A1
Provided are features by which it is possible to form a coated layer such as a coated film or printed film on polyethylene with sufficient adhesive strength, to bond polyethylene materials together with sufficient adhesive strength, and ...  

Matches 1 - 50 out of 22,579