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Patent Searching and Data


Matches 351 - 400 out of 2,207

Document Document Title
WO/2002/072162
Pressure sensitive adhesive articles and methods, particularly stretch removable adhesive articles that are preferably for use in adhering to skin or like deliate surfaces. Preferably, stretch removability of the article occurs as a resu...  
WO/2002/068486
The invention relates to copolymers having water-soluble blocks comprising at least one hydrophobic block and at least one hydrophilic block, said hydrophobic block having a quantity of hydrophilic units of between 33 and 99 wt.- % with ...  
WO/2002/068550
The invention concerns the use of amphiphilic block copolymer, comprising at least a hydrophilic block and at least a hydrophobic block, as additive for film-forming aqueous compositions such as, in particular, paint, latex or sealant op...  
WO/2002/068487
The invention relates to the use of an amphilic block copolymer, comprising at least one hydrophic bloc and at least one hydrophobic block, in order to create a low-energy surface such as a plastic or thermoplastic polymer based surface,...  
WO/2002/064694
The invention relates to hot-coextrudable thermofusible self-adhesives that are particularly suitable for producing multi-layer films intended to be used for easy-to-open and easy-to-reclose repositionable packaging containers. Said adhe...  
WO/2002/064676
A thermoplastic elastomer ('TPE') which is oxygen-permeable is provided with excellent barrier properties against oxygen by melt-blending with a liquid polybutene oil plasticizer in an amount insufficient to render the plasticized elasto...  
WO/2002/057384
A polymeric composition includes a first polymeric material, for example, an adhesive material, and a second polymeric material disposed as a plurality of elongated structures within the first polymeric material. Each elongated structure...  
WO/2002/057386
The invention relates to an adhesive composition comprising (i) one or more styrenic block copolymers, (ii) a tackifier resin, and (iii) one or more plasticizers, wherein the or one of the styrenic block copolymers is of the general form...  
WO/2002/055575
A process of preparing a diblock/triblock composition in a single reaction vessel includes reacting a first monomer, such as styrene, with a first portion of an anionic catalyst or initiator in a suitable solvent to form a first block of...  
WO/2002/053197
A pressure sensitive hot melt adhesive composition which comprises a high molecular weight rubber and less than about 60 parts by weight of a liquid diluent, and has a G' of less than about 15 x 10?4¿ dynes/cm?2¿ at 10 rad/s at 25°C i...  
WO/2002/053668
The present invention is generally directed to adhesive compositions comprising selected ratios of crystalline and amorphous polymers. In some versions of the invention, polymers capable of existing in different configurations (e.g., a p...  
WO/2002/053378
Hot-melt adhesive compositions of atactic polypropylene and isotactic polypropylene are particularly suitable for bonding non-woven elastic composites. A selected amount of isotactic polypropylene is blended with a selected amount of ata...  
WO/2002/053667
Elastic attachment adhesive compositions of conventional rubber-based construction adhesive and a crystalline polymer have improved bond strength over conventional elastic attachment adhesives. The addition of a crystalline polymer to co...  
WO/2002/053669
Hot-melt, pressure-sensitive adhesive compositions of amorphous polyalphaolefin and crystalline polypropylene have improved bond strength over the amorphous polyalphaolefin alone. The adhesive compositions improve dynamic shear strength,...  
WO/2002/049011
Curable (meth)acrylate adhesives are formulated with aliphatic urethane(meth)acrylate resins. The resins are urethane (meth)acrylate capped polyols wherein theurethane acrylate capping is derived from isophorone diisocyanate and a hydrox...  
WO/2002/042389
An adhesive tape having an adhesive layer formed on one face of a base layer. If this tape is adhered to a silicon wafer and the wafer is cut into chips by using a dicer, the chipping and cracking of the chips can be suppressed to the mi...  
WO/2002/040611
A block copolymer having at least one polymer block (A) consisting mainly of a-methylstyrene units and at least one polymer block (B) which consists mainly of conjugated diene units and in which at least part of the carbon-carbon double ...  
WO/2002/040610
The invention concerns a novel bonding composition comprising at least a hot-melt and at least a binder. Said composition is useful in multilayer structures, and in packages.  
WO/2002/036706
An adhesive which comprises a combination of: a main ingredient comprising a modified block copolymer of ethylene and vinyl acetate and an aqueous aqua containing a-methylstyrene and isobutyl acrylate as components; and a reactive reagen...  
WO/2002/034859
The invention is directed toward a hot melt adhesive composition and processes for producing the same. The hot melt adhesive composition comprises: at least one non-thermoplastic hydrocarbon elastomer; at least one thermoplastic additive...  
WO/2002/034850
A polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as a varnish. The composition an...  
WO/2002/026847
A block copolymer comprising two or more, mutually compatible polymer blocks (A) obtained through anionic polymerization and at least one (meth)acrylic ester polymer block (B) incompatible with the polymer blocks (A), wherein the ratio [...  
WO/2002/020688
Kit of adhesion agents for adhering substrates, wherein the kit comprises a plurality of reactive block copolymers of formula (I): R?1¿ - (AB)¿m?(A)¿n? - R?2¿ wherein n = 0 or 1 and when n = 0, R?1¿ is different from, and reacts wit...  
WO/2002/018507
A composition useful as a primer layer for a vinyl backed adhesive tape comprising at least one epoxidized conjugated diene polymer having a minimum concentration of epoxidized units of at least 3% provides increased anchorage of an adhe...  
WO/2002/018512
The present invention relates to a hot melt adhesive composition comprising a soft thermoplastic polymer component, a tackifying resin component, and a plasticizer that crystallizes in the adhesive. The soft thermoplastic polymer is pref...  
WO/2002/015953
A process for producing medical devices by bonding members made of olefin resins and/or thermoplastic elastomers with an adhesive, the adhesive being a solution obtained by dissolving a block copolymer comprising 10 to 40 wt% of an aroma...  
WO/2002/014063
Coated articles, methods for making such articles, and waterproofing systems (10) incorporating these. An exemplary coated article comprises a body with surface coating of inorganic particles (14) reactive with hydroxide generated from h...  
WO/2002/014448
An adhesive blend is comprised of a hydrophilic pressure sensitive adhesive comprising the polymerization product of (a) about 15 to about 85 parts by weight of an (meth)acrylate ester monomer wherein the (meth)acrylate ester monomer, wh...  
WO/2002/012404
An antisoiling hardcoated film comprising a substantially transparent substrate, a hardcoat layer comprising inorganic oxide particles dispersed in a binder matrix, and an antisoiling layer comprising a perfluoropolyether. The antisoilin...  
WO/2002/013224
Information display protectors for display devices having an information display area, comprising a stack of flexible substantially transparent sheets, the sheets having on one side thereof an adhesive layer and having on the other side ...  
WO/2002/012364
The invention relates to a polyurethane (polymer hybrid) dispersion with reduced hydrophilicity that is produced by reacting a) 50 to 100 parts by weight of a hydrophobically modified block copolymer (A)(i) having two or more hydroxyl gr...  
WO/2002/012857
A cover slip material and a method of making and using the same are provided. The material comprises (a) a light transmissible polymeric backing having first and second surfaces; (b) a tack free bonding layer disposed on the first surfac...  
WO/2002/010301
The invention relates to an adhesive tape which proves that a package has been opened in an unauthorised manner, comprising a composite cyclic polyolefin based support covered on one side with an adhesive material.  
WO/2002/010310
The invention concerns hot-melt glues for making pressure-sensitive adhesives, based on thermoplastic rubber, comprising 5 to 40 wt. % of thermoplastic rubber, 20 to 80 wt. % of so-called tacky resin, 0 to 30 wt. % of aromatic resin, 0.0...  
WO/2002/010309
The invention relates to an adhesive material based on block copolymers of general type P(A)-P(B)-P(A), wherein each block copolymer consists of a central (co)polymer block P(B) and two terminal (co)polymer blocks P(A). The invention is ...  
WO/2002/010308
The invention relates to an adhesive material based on block copolymers of general type P(A/C)-P(B)-P(A/C), wherein each block copolymer consists of a central copolymer block P(B) and two terminal polymer blocks P(A/C). The invention is ...  
WO/2002/010307
The invention relates to an adhesive material based on block copolymers of general type P(B)-P(A/C)-P(B), wherein each block copolymer consists of a central copolymer block P(A/C) and terminal polymer blocks P(B). The invention is charac...  
WO/2002/000806
Improved adhesives are provided through the use of styrenic tetrablock or pentablock copolymers which have a reduced elastomeric behavior under the die-cutting conditions used in label production.  
WO/2002/000805
Improved label adhesives are provided through the use of selected mixtures of styrenic di- and tri-block copolymers, which have a reduced elastic behavior under die cutting conditions.  
WO/2001/098427
The invention relates to a hot-melt contact adhesive, containing at least one unsaturated polymer and a particulate inorganic compound which has an average particle diameter d50 of between 0.05 and 300 $g(m)m. The invention also relates ...  
WO/2001/096488
An adhesive construction, characterized by excellent converting and adhesive performance, comprises a facestock, a face-side adhesive (FSA) in contact with a first surface of the facestock, and a liner-side adhesive (LSA) in contact with...  
WO/2001/096491
The present invention is a hot melt pressure sensitive adhesive composition having high heat resistance and a relatively low complex viscosity, methods of use and articles constructed therefrom. The novel adhesive composition is suitable...  
WO/2001/096291
The present invention is directed to multireactivity polymercaptans, star-shaped copolymers and methods of preparing wherein the polymer comprises a polyvalent mercaptan core and three or more polymeric arms which extend radially from th...  
WO/2001/096432
The invention relates to a bonding agent composition containing at least one block copolymer which can be produced by means of radical polymerisation, at least two blocks of different monomer compositions, and at least 2 wt. % of at leas...  
WO/2001/094491
The invention relates to star-branched polymers containing pendent olefinic groups which have been crosslinked using actinic radiation and the use of these polymers in adhesives and coating applications.  
WO/2001/094490
This invention relates to pressure sensitive adhesives, and processes of preparing such adhesives, comprising random star polymers which are crosslinked by reaction with multifunctional crosslinking agent. These adhesives can be used in ...  
WO/2001/092344
In one embodiment, this invention provides a composition comprising a functionalized block copolymer crosslinked with acetylacetonate. The crosslinked block copolymer has improved solvent resistance and improved cohesive strength at high...  
WO/2001/085818
A hydrogenated block copolymer which gives a polyolefin resin composition capable of giving a molded article having an excellent balance between impact resistance and moldability and gives a pressure-sensitive adhesive composition excell...  
WO/2001/083634
Disclosed are curable strippable adhesives, coating films and high performance pressure sensitive adhesives. The adhesives and films are prepared from formulations including: (a) from 10 to 90 percent by weight of a crosslinkable epoxidi...  
WO/2001/081494
This invention is a process for making UV curable adhesives, sealants, coatings, ink, flexible printing plates, laminating adhesives, fibers, gaskets, and related compositions, films, and thin parts, wherein an epoxidized monohydroxylate...  

Matches 351 - 400 out of 2,207