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JP6093639B2 |
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JP6084633B2 |
A two-component curable adhesive or sealant composition is provided. The first component may comprise a mixture of at least one polyol selected from the group comprising a polyester polyol, a polyester-polycarbonate copolymer polyol, and...
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JP6071120B2 |
The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1): wherein n represents an integer of 1 or larger.
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JP6061091B2 |
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JP6053617B2 |
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JP6049055B2 |
The present invention relates to: an optical member which is obtained by bonding two or more optical bases with use of a cured product of an ultraviolet curable resin composition that is characterized by containing (A) a novolac compound...
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JP6043696B2 |
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JP6044820B2 |
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JP6038217B2 |
The present invention relates to a film for a tire inner liner including: a base film layer including polyamide-based resin and a copolymer including polyamide-based segments and polyether-based segments; and an adhesive layer including ...
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JP6040751B2 |
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JP6040737B2 |
To provide an adhesive film capable of improving the reliability of a solder joint part.An adhesive film 10 is used when circuit members, in each of which a circuit is formed, are connected electrically to each other and has a base mater...
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JP6034925B2 |
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JP6031264B2 |
The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive...
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JP6032039B2 |
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JP2016536763A |
Structure and a manufacturing method of an ACF array which are transferred by the micro cavity array of the form and shape where especially un-random particles were decided beforehand, and size. This manufacturing method includes the flu...
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JP6030061B2 |
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JP6025313B2 |
Adhesion promoter comprises at least one carbodiimide compound, which is surface-deactivated by reacting with at least one amine. Adhesion promoter comprises at least one carbodiimide compound of formula (R11-(N=C=N-R) m-R22) (I), which ...
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JP2016190968A |
To provide a resol type phenolic resin for a friction material capable of achieving a high adhesive strength in a short adhesion time, and to provide a method for producing the same.A resol resin which is a resol type phenolic resin used...
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JP2016188344A |
To form unevenness having a high roughed effect and a random pattern on a release surface of a release film with an easy method.A release film 10 is a release film having a substrate 11, a resin layer 12 provided on the substrate 11, and...
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JP2016533000A |
In particular, a method of providing an outer casing on an elongated article such as a wire or cable room, including a textile support and a curable adhesive applied on at least one surface of the support. The adhesive tape is spirally g...
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JP6008680B2 |
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JP5998805B2 |
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JP5990825B2 |
An aqueous adhesive composition includes: a phenol/aldehyde resin; and an unsaturated elastomer latex. The phenol/aldehyde resin is based on at least: an aromatic polyaldehyde bearing at least two aldehyde functional groups and including...
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JP5990824B2 |
An aqueous adhesive composition includes: a phenol/aldehyde resin and an unsaturated elastomer latex. The phenol/aldehyde resin is based on: an aromatic polyaldehyde bearing at least two aldehyde functional groups and including at least ...
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JP5983614B2 |
An adhesive composition containing a latex of highly saturated nitrile rubber (A) which has ±,²-ethylenically unsaturated nitrile monomer units 10 to 55 wt%, conjugated diene monomer units 25 to 89 wt%, and ±,²-ethylenically unsatura...
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JP2016157781A |
To provide a conductive adhesive sheet which imparts electromagnetic wave shield effect reliably to a printed wiring board, while achieving excellent storage stability, tack-free, low resin flow, and flexibility simultaneously.A conducti...
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JP2016153453A |
To provide an adhesive for laminate steel sheet used for an adhesive for film of inner and outer surfaces of a body or a cover of laminate type beverage can, food can or the like and having reduced generation of fume during heat hardenin...
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JP5979237B2 |
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JP5976326B2 |
The purpose of the present invention is to provide a semiconductor device manufacturing method, whereby cutting reliability of an adhesive film can be improved and debris contamination due to the adhesive film can be suppressed. Provided...
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JP5966069B2 |
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JP5963027B2 |
To provide an industrially useful pressure-sensitive adhesive sheet that can be used to adhere various adherends and achieves both of superior peel adhesion force and superior push strength.The pressure-sensitive adhesive sheet has a pre...
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JP5953328B2 |
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JP5952078B2 |
Disclosed is a conductive adhesive tape which can exhibit extremely stable electroconductivity upon use over a long duration and/or use under severe environmental conditions even when applied in a small area. The conductive thermosetting...
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JP5950127B2 |
To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excelle...
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JP2016125042A |
To provide an adhesive composition having excellent B stage stability and C stage curability, a light control panel comprising the same, a method for producing the same, and an optical imaging device.An adhesive composition comprises pol...
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JP5942382B2 |
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JP5942421B2 |
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JP5938857B2 |
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JP2016108364A |
To provide an anionic aqueous dispersion of α-olefin-vinyl acetate-based elastomer particles having excellent storage stability and oil resistance to a molded product and further to provide a method for producing the aqueous dispersion,...
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JP5928556B2 |
This electroconductive adhesive includes a thermosetting resin (A) having a carboxyl group, an epoxy resin (B), an elastomer (C) having a reactive functional group, an electroconductive filler (D), and a curing agent (E). Through this co...
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JP5924410B2 |
An aqueous adhesive composition includes: a phenol/aldehyde resin; and an unsaturated elastomer latex. The phenol/aldehyde resin is based on at least: an aromatic polyaldehyde bearing at least two aldehyde functional groups and including...
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JP5928770B2 |
To provide a resin composition which is excellent in e.g. adhesiveness to polyester film and the like and with which an adhesive layer, a heat sealing agent layer, and a coated film can be formed which do not cause the degradation of the...
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JP5924145B2 |
To provide a film-like adhesive capable of improving connection reliability in connection between a semiconductor element and a support member.A film-like adhesive 1 includes: a thermosetting component containing (a1) at least either of ...
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JP5922222B2 |
The invention relates to a method for producing a binder composition, wherein the method comprises the following steps: (i) forming an aqueous composition comprising reactant components including lignin, a polymerizable substance and a c...
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JP5908306B2 |
To provide an adhesive for semiconductor bonding, which achieves both storage stability and quick curability to suppress voids and is excellent in physical properties of cured products, and to provide an adhesive film for semiconductor b...
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JP5908543B2 |
To provide a method of manufacturing a semiconductor device comprising a die-bonding film which is properly broken by tensile force.In the method of manufacturing the semiconductor device, a die-bonding film is used. The breaking energy ...
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JP5899443B2 |
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JP5888805B2 |
To provide an adhesive film which can obtain sufficient adhesive force to a body to be adhered regardless of heat curing treatment for a short period of time without requiring high temperature capable of controlling increase in viscosity...
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JP5890950B2 |
A chlorosulfonated polyethylene latex, which is safe for living bodies and the environment and can be used as a latex component in a resorcin-formalin-latex adhesive, contains an aqueous dispersion medium, chlorosulfonated polyethylene, ...
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JP5881609B2 |
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