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WO/2020/141130A1 |
The present invention relates to heat-curing epoxy resin compositions containing a dihydracide as a hardener, which is selected from the group consisting of glutaric acid dihydracide, adipic acid dihydracide and pimelic acid dihydracide ...
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WO/2020/136902A1 |
Provided is a die bonding film which comprises an epoxy resin, an active ester resin, an elastomer, and a filler.
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WO/2020/137947A1 |
A film-like adhesive of this embodiment is for bonding a circuit formation surface of a chip to a light-transmissive cover. At least one surface of the film-like adhesive does not substantially include an aromatic compound.
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WO/2020/138070A1 |
A purpose of the present invention is to provide an adhesive composition for fixing movable components which has excellent adhesiveness to both metals and non-metals, can be cured at low temperatures, and can prevent the movable componen...
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WO/2020/136511A2 |
The present disclosure provides a method for bonding parts, comprising the following steps (a) Providing a two-component adhesive composition precursor, comprising a first part (A) comprising at least one epoxy curing agent and preferabl...
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WO/2020/137934A1 |
A film-like adhesive agent of one embodiment contains an acrylic resin (a), an epoxy compound (b1), and a phosphorus antioxidant (z). Before being heated at 260°C, this film-like adhesive agent has a linear transmittance of 90% or great...
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WO/2020/133353A1 |
A preparation method for an emulsifier, an emulsifier, an aqueous epoxy resin dispersion, and a formulation method. The preparation method for an emulsifier comprises reacting aminosulfonic acid and/or a sulfamate as a first reaction raw...
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WO/2020/136904A1 |
This adhesive film contains an adhesive agent layer comprising a thermosetting resin composition. When the shear viscosity of the adhesive agent layer at 40°C is denoted by η40 and the shear viscosity of the adhesive agent layer at 80Â...
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WO/2020/138632A1 |
The present invention relates to a non-conductive adhesive film for a semiconductor package and a semiconductor package manufacturing method using same. The non-conductive adhesive film for a semiconductor package comprises: a substrate;...
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WO/2020/136539A1 |
Provided are curable adhesives, along with adhesive tapes, laminates, and laminated mirror buttons that include the curable adhesive. The curable adhesive includes a (meth)acrylate polymer, a curable oxetane compound, a polymer filler, a...
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WO/2020/138052A1 |
Provided is a high-purity 3,4-epoxycyclohexylmethyl methacrylate that is useful as a starting material for functional materials and optical members having excellent transparency and heat resistance. Also provided is an alicyclic epoxy co...
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WO/2020/136901A1 |
Disclosed is a method for evaluating a photocurable adhesive used for a dicing/die attach film. Additionally disclosed are: a dicing/die attach film based on such a method for evaluating a photocurable adhesive; and a method for manufact...
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WO/2020/137944A1 |
A film-like adhesive of this embodiment is for bonding a circuit formation surface of a chip to a light-transmissive cover. When phosphorus concentration V1 is measured by performing X-ray photoelectron spectroscopy analysis on one surfa...
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WO/2020/129917A1 |
A resin composition for temporary fixing use according to the present invention can be used for the formation of a temporary fixing material for use in a semiconductor wafer processing method comprising a temporary fixing step of tempora...
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WO/2020/129996A1 |
A film-form adhesive for bonding a semiconductor element and a support member for mounting the semiconductor element. This film-form adhesive contains an epoxy resin having an epoxy equivalent amount of 140-220 g/eq, a phenolic resin hav...
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WO/2020/125715A1 |
Provided is a low-viscosity mono-component epoxy resin composition which comprises at least one epoxy resin, at least one liquid anhydride curing agent, at least one curing accelerator, and at least one thixotropic assistant. The low-vis...
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WO/2020/124931A1 |
The present invention provides an anisotropic conductive adhesive and a conductive film thereof. The conductive adhesive uses a thermal-cured epoxy resin system as a base, and comprises the following components in percentage by mass: 10-...
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WO/2020/131729A1 |
One-component (1 K) adhesive compositions ("PEEP" compositions) and a process for making them are disclosed. A polyepoxide is reacted with a polyether polyol composition, a polyester polyol composition, or both in the presence of a heat-...
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WO/2020/124909A1 |
Provided by the present invention are an anisotropic conductive adhesive and a conducting film thereof. The conductive adhesive employs a cationic curing system, and comprises the following components by mass: 10-40 wt% of film-forming r...
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WO/2020/128718A1 |
A thermosettable precursor of an expanded structural adhesive composition comprising: an epoxy compound; an epoxy curing agent; an expanding agent; and a mineral pigment selected from the group of phosphate metal complexes. In addition, ...
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WO/2020/122275A1 |
method for a functional coating composition and a liquid adhesive composition for urethane foam sponge, the method comprising a process for providing a coating layer on a first surface of a urethane sponge, and a process for providing an...
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WO/2020/121197A1 |
A curable coating composition precursor comprising a first part (A) and a second part (B). The first part (A) comprises at least one first epoxy curing agent selected from aliphatic and cycloaliphatic amines and any combinations and mixt...
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WO/2020/120144A1 |
The invention relates to a cationically curable mass having at least one cationically polymerizable component; a first photoinitiator, which releases an acid upon being irradiated by actinic radiation of a first wavelength λ1; and a sec...
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WO/2020/116408A1 |
The present invention provides a resin composition that is for a millimeter-wave substrate, that provides a cured product having excellent high-frequency characteristics, a small temperature dependence of tanδ, and superior flame retard...
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WO/2020/115041A1 |
An adhesive composition comprising a silane-modified epoxy resin, a dicyclopentadiene novolac epoxy resin and a curing agent. The composition shows good oily steel bonding, even in the absence of CTBN rubber or rubber adducts as tougheni...
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WO/2020/116101A1 |
Provided is an adhesive composition that includes a hydroxy-group-containing (meth)acrylic resin (a), a hydroxy-group-containing modified unsaturated epoxy ester resin (b), a polyisocyanate compound (c), and a photopolymerization initiat...
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WO/2020/117005A1 |
An electronic device is provided that includes a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the front...
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WO/2020/107506A1 |
The present invention relates to an EB curing-specific packaging adhesive, a preparation method, and a method for packaging a film capacitor. S1, hexanediol diacrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate, and ...
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WO/2020/110785A1 |
Provided is a film-like adhesive agent 1 for a semiconductor, the adhesive agent 1 having a first thermosetting adhesive agent layer 2 and a second thermosetting adhesive agent layer 3 laid on the first thermosetting adhesive agent layer...
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WO/2020/103228A1 |
The present application relates to an adhesive composition, and an electronic product and preparation method therefor. The adhesive composition is prepared from the following raw materials in parts by weight: 20-40 parts of a thermosetti...
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WO/2020/105438A1 |
The present invention addresses the problem of providing a tire, which is provided with a composite body of a member composed of a polyester material and a member composed of a rubber material, wherein the adhesiveness between the member...
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WO/2020/101236A1 |
The present invention relates to a resin composition for semiconductor adhesion, a semiconductor adhesive film produced therefrom, a dicing die bonding film and a semiconductor wafer dicing method, the resin composition for semiconductor...
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WO/2020/093595A1 |
Disclosed are a frame sealant (10) and a liquid crystal display panel (20). The frame sealant (10) is used for the liquid crystal display panel (20). The frame sealant (10) comprises epoxy resin, acrylic-based resin, a light initiator, a...
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WO/2020/095995A1 |
The present invention addresses the problem of providing an adhesive for structural material bonding, which is capable of bonding materials other than iron, while having properties equivalent to those of adhesives for structural material...
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WO/2020/092360A1 |
A material comprising an epoxy/elastomer adduct, a polymeric particle, from about 0.05 to about 20 weight percent of an epoxy/diacid adduct, and optionally, an amine reaction product.
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WO/2020/085316A1 |
The present invention provides a conductive adhesive sheet which exhibits good provisional bondability even in cases where the surface smoothness is low. A conductive adhesive sheet which has a peak top temperature of storage elastic mod...
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WO/2020/080618A1 |
A mixture for adhering fluororesin material comprises 80% to 90% by weight of tetrahydrofuran (THF), 5% to 15% by weight of naphthalene, 1% to 5% by weight of metallic sodium, and 1% to 5% by weight of coating additive.
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WO/2020/080389A1 |
Provided is a resin composition containing: (A) an epoxy resin that does not contain an aromatic ring; (B) at least one type of a bifunctional thiol compound selected from the group consisting of a bifunctional thiol compound containing,...
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WO/2020/080158A1 |
[Problem] To provide a resin composition that enables forming of a cured product having high thermal conductivity and adhesiveness. [Solution] This resin composition is characterized by containing an epoxy compound (A), an amine curing a...
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WO/2020/082006A1 |
A two part adhesive formulation is provided that is REACH and RoHS compliant and cures at room temperature of 23 degrees Celsius at 1 atm. The two part adhesive has a first component part (component A) that is a resin that is a blend of ...
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WO/2020/080390A1 |
Provided is a resin composition that contains: (A) an epoxy resin; (B) at least one type of bifunctional thiol compound selected from a group consisting of bifunctional thiol compounds containing, in a molecule thereof, an aromatic ring ...
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WO/2020/071391A1 |
An adhesive for semiconductors, which contains (a) an inorganic filler, and which is configured such that the inorganic filler (a) contains 50% by mass or more of a surface-treated inorganic filler that has a glycidyl group based on the ...
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WO/2020/071633A1 |
The present invention relates to an adhesive composition and a deco sheet comprising same, and the adhesive composition includes, together with an epoxy resin, an organic acid, an aromatic alcohol, and/or a polar aprotic solvent, and thu...
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WO/2020/071364A1 |
Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhes...
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WO/2020/071363A1 |
Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhes...
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WO/2020/070687A1 |
The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is i...
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WO/2020/070084A1 |
The present invention relates to a hardener for epoxy resins, containing at least one amine A1 of formula (I) and at least one amine A2 of formula (II), the weight ratio of amine A1 to amine A2 ranging between 20/1 and 1/2. The inventive...
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WO/2020/065783A1 |
Disclosed is a film-shaped adhesive for adhering together a semiconductor element and a support member upon which the semiconductor element is placed. The film-shaped adhesive includes a thermosetting resin, a curing agent, and an acryli...
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WO/2020/066830A1 |
This optical laminate comprises a first optical layer, a first adhesive layer comprising a cured active energy ray curable adhesive, and a second optical layer, in said order. The first optical layer is a liquid crystal layer having a su...
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WO/2020/067270A1 |
The present disclosure provides an adhesive composition which contains an epoxy resin, an acrylic resin that is compatibilized with the epoxy resin, a curing agent and a foaming agent. This adhesive composition contains, as the epoxy res...
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