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WO/2023/090026A1 |
The present invention provides a microcapsule type curable resin composition which is applied to a screw member so as to reduce the generation of dust when the screw member is screwed into a base material, while additionally having excel...
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WO/2023/089122A1 |
A curable epoxy resin adhesive, the adhesive comprising an epoxy resin component and a curing agent component, wherein the epoxy resin component and the curing agent component are in a separated form, and wherein providing a mixture of t...
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WO/2023/090347A1 |
A purpose of the present invention is to provide a curable resin composition having excellent heat resistance, thermal conductivity, and adhesiveness, and low linear expansion. Another purpose of the present invention is to provide a cur...
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WO/2023/089863A1 |
[Problem] To provide a low-viscosity electroconductive adhesive that can be suitably used in a jet dispenser, can maintain a constant discharge shape and a constant discharge rate, can be discharged continuously due to being unlikely to ...
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WO/2023/082473A1 |
Disclosed in the present application are a liquid-agent formula for hanging a simple flexible LED screen on a wall, and a laminated structure. The structure comprises a flexible transparent substrate, wherein PVB layers are fixedly conne...
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WO/2023/086555A2 |
An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine con...
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WO/2023/085280A1 |
A curable resin composition containing a prepolymer (A) having a reactive silyl group, an epoxy compound (B), and a photoacid generator (C).
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WO/2023/086039A1 |
The present invention relates to a thermal latent curing agent comprising one or more polyoxazoline based polymers and one or more curing agents, wherein the curing agents are: (i) physically entrapped in a matrix of the polyoxazoline ba...
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WO/2023/085883A1 |
The present invention relates to an isocyanate prepolymer composition and use thereof and, more particularly, to: an isocyanate prepolymer composition which is prepared by a urethane reaction of an anhydrosugar alcohol-alkylene glycol co...
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WO/2023/083685A1 |
The invention relates to a method for bonding at least one sheet-metal part having a zinc-based corrosion-protection coating, with a further sheet metal or sheet-metal part, an epoxy adhesive being used for bonding. A silicon-containing ...
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WO/2023/075000A1 |
The present invention relates to a nail art semi-cured sticker on which nail accessories are coupled and, more particularly, to a nail art semi-cured sticker on which nail accessories are coupled, the nail art semi-cured sticker having v...
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WO/2023/076650A1 |
A color-changing two-part system for indicating proper mixing. The two-part system comprises a A-side and a B-side. The A-side and/or B-side comprises a reactive color-change agent (e.g., a pH sensitive dye). The B-side comprises one or ...
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WO/2023/072940A1 |
The present invention relates to a two-component epoxy resin composition, consisting of - a first component K1 comprising at least one epoxy resin A that contains on average more than one epoxy group per molecule; and - a second componen...
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WO/2023/074474A1 |
The present invention provides a film-like adhesive 1 for semiconductors, the film-like adhesive 1 comprising a first adhesive region 2 and a second adhesive region 3 in the thickness direction. With respect to this film-like adhesive 1 ...
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WO/2023/065802A1 |
The present invention belongs to the field of polythiol compounds and uses thereof, relating in particular to a polythiol compound and a preparation method therefor, a curing agent, a resin composition, an adhesive, and a sealant. The po...
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WO/2023/068277A1 |
An adhesive tape for circuit connection provided with a first base material, an adhesive film, and a second base material, in that order, the adhesive film containing a cationic polymerizable compound, a thermal cationic polymerization i...
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WO/2023/068559A1 |
An anisotropic conductive adhesive film according to the present invention minimizes the movement of conductive particles in a compression process by fixing the conductive particles with strong force through the high modulus of a polymer...
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WO/2023/065803A1 |
The present invention belongs to the field of adhesives and sealants, and relates to a photo/thermal dual-curing resin composition, and a preparation method therefor and the use thereof. The photo/thermal dual-curing resin composition co...
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WO/2023/068558A1 |
An anisotropic conductive adhesive film according to the present invention minimizes the movement of conductive particles in a compressing process by fixing the conductive particles by means of strong force through a high modulus of a po...
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WO/2023/067662A1 |
This thermosetting resin composition contains: an epoxy resin that is solid at 25°C; an epoxy resin that is non-solid at 25°C; a finely particulate rubber that is dispersed in the non-solid epoxy resin; a setting agent; an inorganic fi...
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WO/2023/068109A1 |
The purpose of the present invention is to provide a curable resin composition which makes it possible to obtain a cured product having excellent conductivity and curing properties. The present invention is a curable resin composition ...
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WO/2023/063386A1 |
A purpose of the present invention is to provide an adhesive sheet having excellent insulation breakdown reliability and sheet life at room temperature while having high adhesiveness, high heat resistance, and high strength between a res...
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WO/2023/060639A1 |
The present invention relates to a chip-level underfill adhesive with low precipitation overflow on a silicon surface. Raw materials thereof include, in parts by weight: 20-30 parts of an epoxy resin, 0.5-1 part of a coupling agent, 0.5-...
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WO/2023/058303A1 |
A thermosetting film containing a binder (a), an epoxy resin (b1), a thermosetting agent (b2), a curing accelerator (c), and a layered compound (z), wherein the curing accelerator (c) is supported on the layered compound (z), forming a c...
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WO/2023/057837A1 |
A cooling plate assembly comprises at least two component plates bonded together by an adhesive. The adhesive and the at least two component plates collectively define at least one fluid conduit having an inlet and an outlet. The adhesiv...
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WO/2023/056758A1 |
Disclosed in the present application is a molding sealant for chip packaging, using an epoxy resin as shown in formula (I). The epoxy resin having flexible units such as polyether of formula (I) is combined with components such as a curi...
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WO/2023/054449A1 |
The present invention provides a sheet-like curable adhesive which is able to be suppressed in bleeding. The sheet-like curable adhesive is formed of an adhesive composition which contains (A) a phenoxy resin having a hydroxyl group and ...
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WO/2023/054479A1 |
The present invention addresses the problem of providing a curable resin composition that can provide a cured product having exceptional adhesive strength, rigidity at high temperatures, and vibration damping properties. This problem is ...
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WO/2023/054211A1 |
A bonding kit that comprises: a pressure-sensitive adhesive layer (1) comprising an epoxy resin and an elastomer; and a liquid hardener composition (3) which, when brought into contact with the pressure-sensitive adhesive layer (1), can ...
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WO/2023/052002A1 |
The present application is directed to a two component (2K) composition which is snap curable at room temperature, said composition comprising: a first component comprising, based on the weight of said component: from 60 to 100 wt.% of a...
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WO/2023/053566A1 |
Provided is a composition for an adhesive agent, the composition containing an epoxy resin (A), an epoxy resin curing agent (B), a polyurethane resin (C), and an inorganic filler material (D), wherein: the polyurethane resin (C) has a ta...
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WO/2023/047579A1 |
One aspect of the present disclosure pertains to a one component adhesive that contains a (meth)acrylate compound, an epoxy compound, and a curing agent having a secondary or tertiary amino group.
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WO/2023/044701A1 |
Provided is a thermally conductive adhesive composition, comprising: a) from 0.5 to 30%, preferably from 2 to 20% by weight of an epoxy resin, b) from 0.5 to 30%, preferably from 2 to 20% by weight of an anhydride, c) from 0.1 to 5%, pre...
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WO/2023/043930A1 |
A fire-resistant two-part system comprising a first component and a second component. The first component comprises one or more fire resistance improving additives. The second component comprises one or more acids.
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WO/2023/043757A1 |
Adhesive compositions having optical clarity are disclosed. The compositions include saturated epoxy-functionalized compound; a heat cure system which includes an alicyclic anhydride and a cationic catalyst; a predominantly hydrophobic c...
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WO/2023/038146A1 |
Provided is an electroconductive resin composition that can cure at a temperature of 150°C or less and has exceptional electroconductivity, adhesive strength, and solvent resistance after curing. An electroconductive resin composition...
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WO/2023/036748A1 |
The present invention relates to a one-component thermosetting epoxy resin adhesive, comprising heat-expandable microspheres with an expansion-initiation temperature (Ts) between 90 °C - 115 °C and a mean particle size D (0.5) between ...
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WO/2023/039504A1 |
An adhesive composition including an adhesive compound; and a plurality of particles each comprising an exterior surface comprising a coating deposited thereon wherein the coating comprises a thermoset material and a method or forming an...
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WO/2023/034485A1 |
A composition comprising a two-component liquid reinforcing adhesive comprising a first part having at least one epoxide functional constituent, an optional foaming agent, and a particulate filler and a second part having at least one ac...
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WO/2023/033075A1 |
Provided is an adhesive composition having both high adhesive strength and improved cohesive failure rate. An adhesive composition that includes a thermosetting resin (component (A)), a toughening agent (component (B)), a curing agent ...
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WO/2023/033074A1 |
The present invention provides an adhesive composition which has achieved a good balance between high bonding strength and improvement of cohesive failure ratio. The present invention provides an adhesive composition which contains a t...
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WO/2023/033076A1 |
Provided is an adhesive composition having both a high adhesion strength and an improved cohesive failure rate. The adhesive composition comprises a heat-curable resin [referred to as component (A)], thermoplastic-resin particles [refe...
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WO/2023/032888A1 |
The present invention addresses the problem of providing an adhesive which exhibits adhesive properties and heat resistance and is capable of transferring/mounting a large number of semiconductor elements all at once even in a step in wh...
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WO/2023/023966A1 |
A UV adhesive for packaging, and a preparation therefor. The UV adhesive for packaging at least comprises, in percentages by weight: 5%-26% of a modified bisphenol A epoxy resin, 16%-42% of an acrylate prepolymer and 6%-10% of inorganic ...
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WO/2023/026584A1 |
A film-like adhesive agent comprising an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), wherein the contained amount of the epoxy resin curing agent (B) in the film-like adhesive agent is 0.30-12.0 mass%, the ...
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WO/2023/026872A1 |
A problem addressed by the present invention is to provide a resin composition, an adhesive, or a sealing material that gives a cured product having reworkability at a specific temperature that does not have a thermal effect on parts. Th...
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WO/2023/023205A1 |
A power transmission belt having a belt body, a tensile cord embedded in the belt body, and a jacket defining a pulley contact surface, where the jacket has been treated on at least the pulley contact surface with an aqueous fabric treat...
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WO/2023/022148A1 |
The present invention provides: an epoxy composition configured for reduced viscosity, etc., where even when some heat is applied, progression of curing and a subsequent rise in viscosity are not promoted; an adhesive agent containing th...
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WO/2023/020226A1 |
The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silico...
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WO/2023/018212A1 |
The present invention relates to a composition for adhesion of dissimilar materials, and a preparation method therefor, and, more specifically, to a composition for adhesion of dissimilar materials, and a preparation method therefor, the...
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