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WO/2023/015797A1 |
The present invention discloses a zwitterionic liquid silane coupling agent, and the preparation and use thereof. According to the present invention, a series of zwitterionic liquid silane coupling agents are prepared by reacting a silox...
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WO/2023/018457A1 |
A two-part epoxy and delivery system having at least one tube containing one component of a two-part epoxy, the tube having an enlarged opening for dispensing strengthening fibers through the enlarged opening mixed with the one component...
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WO/2023/013595A1 |
[Problem] To provide an epoxy-based adhesive having excellent properties such as tensile shear properties with a base material, curability, and heat resistance. [Solution] An adhesive composition containing an epoxy resin composition (A)...
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WO/2023/014508A1 |
A reversible epoxy polymer obtainable by the reaction between at least one epoxy compound and at least one curing agent, wherein at least part of the epoxy compound contains one reversible borate moiety or derivative thereof per molecule...
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WO/2023/008183A1 |
Provided is an adhesive composition that: includes (A) an acid-modified styrene elastomer and (B) an alicyclic epoxy resin that includes a structure formed by epoxidation of the unsaturated bond of a cyclic olefin structure; but does not...
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WO/2023/008333A1 |
Provided is an adhesive composition which exhibits excellent adhesive properties and soldering heat resistance, exhibits excellent adhesive properties even after being exposed to a high temperature environment for a long time, and exhibi...
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WO/2023/005396A1 |
Disclosed in the present application are chip packaging underfill and a chip packaging structure. The underfill comprises 19-25% by mass of epoxy resin, 55-60% by mass of a filler, 15-25% by mass of a curing agent, and 0.5-0.8% by mass o...
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WO/2023/008363A1 |
The present disclosure addresses the problem of providing a reaction curable composition that makes it possible to suppress reflection of light on the surface of a cured product by producing the cured product by curing the reaction curab...
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WO/2023/007439A1 |
A curable, one-part, dual-stage thiol-ene-epoxy liquid adhesive composition, articles, and methods, wherein the composition includes: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a t...
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WO/2023/000582A1 |
The present disclosure relates to a preparation method for a two-component epoxy resin adhesive and the two-component epoxy resin adhesive prepared thereby. The preparation method comprises the following steps: mixing an epoxy compound a...
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WO/2023/003182A1 |
The present invention relates to a method for manufacturing a laminated core by bonding lamina members, the method comprising: a laminated core forming step in which lamina members having a certain shape are sequentially formed while pas...
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WO/2023/286701A1 |
The present invention addresses the problem of providing a curable resin composition which exhibits high curability even when subjected only to a heat-curing treatment and comes to have moderate flexibility and stretchability through a U...
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WO/2023/284252A1 |
A tunnel fiber composite resin pavement structure. The tunnel fiber composite resin pavement structure comprises, sequentially from bottom to top: a concrete slab (1); a toughened epoxy resin waterproof bonding layer (2); a polyurethane ...
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WO/2023/288149A1 |
Room temperature, two-component curable compositions and their uses are described. The curable compositions are alternative to isocyanate systems and are kinetically tunable to cure within seconds to months. The curable compositions are ...
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WO/2023/286389A1 |
Problem: To provide a thermoconductive film-like adhesive agent that can sufficiently cause progression of a curing reaction under a milder condition, that can, when being used as a die-attach film, effectively suppress residual voids be...
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WO/2023/286699A1 |
The present invention addresses the problem of providing a UV-curable resin composition that provides a flexible cured product having a lower crosslinking density than conventional cured products. The present invention comprises the foll...
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WO/2023/285221A1 |
The present invention relates to epoxide-acrylate hybrid molecules, and their use in the resin component of a multi-component reactive resin composition for chemical anchoring. Furthermore, the invention relates to a multi-component reac...
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WO/2023/285188A1 |
The invention relates to the use of an amine of formula (I) for curing epoxy resins. The amine of formula (I) cures surprisingly fast, and in a trouble-free manner, provides a high final hardnesses, and produces beautiful, defect-free su...
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WO/2023/285255A1 |
The invention relates to an amine of formula (I) and its use for curing epoxy resins. According to the invention, the amine of formula (I) has a low viscosity and odour, and cures surprisingly fast, at ambient temperatures, to a material...
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WO/2023/286700A1 |
The present invention addresses the problem of providing a UV/heat-curing type curable resin composition which exhibits sufficiently high adhesion strength even after having only undergone either a UV-curing treatment or a heat-curing tr...
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WO/2023/286757A1 |
The present invention addresses the problem of providing an adhesive agent composition having excellent nanocellulose dispersing ability. Said problem can be solved by an adhesive agent composition containing nanocellulose and a resin th...
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WO/2023/286644A1 |
This adhesive comprises a polyurethane resin (A), an epoxy resin (B), and an isocyanate crosslinking agent, wherein the epoxy resin (B) comprises a hydroxyl group-containing epoxy resin which has a hydroxyl group and has an epoxy equival...
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WO/2023/281996A1 |
The present invention addresses the problem of providing an adhesive tape for wafer processing that combines tensile stress and uniform expandability suitable for a step of dividing an adhesive layer by expansion, and high shrinkability ...
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WO/2023/281906A1 |
Provided is a heat-curable adhesive sheet which includes a release liner that is adherent to the adhesive surface and that, when peeled from the adhesive surface, is easy to peel off and which has excellent handleability and is less apt ...
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WO/2023/280560A1 |
The present invention is directed to a two component (2K) composition based on modified epoxy resins. More particularly, the present invention is directed to a two component (2K) composition comprising, as a first component, a silicone-b...
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WO/2023/273538A1 |
Disclosed in the present invention are a thermally conductive structural adhesive for a new energy power battery and a manufacturing method therefor, comprising: 3-14% a component A containing at least one of a block polymerized telechel...
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WO/2023/276690A1 |
A conductive resin composition according to the present invention includes (A) silver-containing particles, and (B) a trifunctional or higher aliphatic epoxy compound, wherein the content of (A) the silver-containing particles is at leas...
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WO/2022/270826A1 |
Disclosed is a structural adhesive composition having excellent weather resistance and impact resistance, the composition being capable of solving the problem of deterioration in durability of automotive and building adhesives, caused by...
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WO/2022/270154A1 |
The objective of the present invention is to provide an adhesive composition for laminating an electrical steel sheet, the adhesive composition having excellent tack-free properties before being manufactured as a laminated electrical ste...
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WO/2022/270613A1 |
A method for manufacturing a bonded body, having: a pre-bonding step in which a substrate A, a solid bonding agent, and a substrate B are positioned in this order to prepare a layered body, said solid bonding agent having, as the primary...
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WO/2022/263943A1 |
A curable composition and a method of making a cured composition are provided. The curable composition contains at least two parts with the first part containing three different types of curing agents that contain multiple -NHR1 groups (...
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WO/2022/255078A1 |
Provided is a resin composition for adhesive films which has a low dielectric loss and nevertheless attains a sufficient adhesion strength and which can give adhesive films inhibited from suffering resin flow. The resin composition compr...
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WO/2022/255012A1 |
Provided is an adhesive agent composition having high adhesion strength and an excellent storage life. The adhesive agent composition according to the present invention comprises a binder composition containing a cation-polymerizable com...
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WO/2022/253878A1 |
The present application is directed to a dual curing composition which may be cured at room temperature but which is also heat- and photo-curable, said composition comprising, based on the weight of the composition: from 10 to 95 wt.% of...
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WO/2022/254906A1 |
A thermoplastic epoxy resin including a product of reaction between a bifunctional epoxy compound, which has two glycidyl groups in the molecule, and one or more bifunctional thiol compounds, which each have two mercapto groups in the mo...
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WO/2022/254329A1 |
A thermally curable epoxy system is disclosed. Said epoxy system comprises of 94 to 99.98 wt% of an epoxide component, 0.01 to 5% wt% of a toughener, 0.005 to 1.5 wt % of a catalyst, and 0.005 to 1.5 wt% of a co-catalyst.
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WO/2022/250884A1 |
The present disclosure relates generally to two part adhesive compositions comprising a resin part including a curable resin selected from multifunctional, hydroxyl di-terminated polymer having alkene segments and epoxide segments in the...
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WO/2022/244535A1 |
The present invention provides a thermally expandable sheet which sufficiently bonds two surfaces to be bonded by being thermally expanded therebetween, while being capable of suppressing the occurrence of resin flow, the two surfaces to...
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WO/2022/244880A1 |
Provided is a curable resin composition containing the following components (A)-(E). (A) A compound having two or more glycidyl groups per molecule (however, not including (B)). (B) A glycidyl-group-containing acrylic polymer. (C) A tack...
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WO/2022/239806A1 |
This silver-containing paste contains: silver-containing particles; a cyanamide derivative; a solvent; and a polyfunctional compound comprising one or both of (A) an epoxy compound having two or more intramolecular epoxy groups and (B) a...
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WO/2022/230768A1 |
Provided is an epoxy resin curable composition that cures quickly and has a high hardness and excellent color tone after curing. This epoxy resin curable composition, which contains an epoxy resin having two or more epoxy groups per mole...
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WO/2022/230767A1 |
Provided is an epoxy resin curable composition that cures quickly and has high hardness and exceptional color tone after curing. Provided is an epoxy resin curable composition containing an epoxy resin having two or more epoxy groups per...
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WO/2022/231233A1 |
The present invention relates to an epoxy resin with improved water resistance and a composition comprising same and, more specifically, to: an epoxy resin which is prepared by the reaction of epihalohydrin and a diol component including...
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WO/2022/220253A1 |
The purpose of the present invention is to provide a curable resin composition that has excellent heat resistance, thermal conductivity, and adhesiveness. Another purpose of the present invention is to provide a cured product of said cur...
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WO/2022/220285A1 |
A hardener comprising a pyridinium salt, wherein the pyridinium salt has a benzyl group at the 1-position and has an electron-attracting group at the 2-position, the benzyl group having an electron-donating group; an adhesive composition...
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WO/2022/215521A1 |
The present invention provides a two-part curable resin composition that does not use a dibutyltin catalyst, has exceptional storage stability, cures quickly upon mixing, and yields a cured product having high elongation and high strengt...
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WO/2022/213324A1 |
Provided is a UV curable adhesive composition, an adhesive tape comprising the UV curable adhesive composition, an adhesive film formed by UV curing of the adhesive composition, and a corresponding bonding member. The UV curable adhesive...
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WO/2022/215522A1 |
The present invention provides a two-part curable resin composition that, while maintaining the adhesive strength with respect to metals, can provide a cured product having high strength and high elongation. Provided is a two-part cura...
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WO/2022/209901A1 |
An epoxy resin adhesive for medical instruments which comprises the following components (A) to (C); a cured object obtained from the epoxy resin adhesive; a medical-instrument member; and a medical instrument. (A) An epoxy resin (B) A...
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WO/2022/209875A1 |
According to the present invention, in a semiconductor device in which a plurality of connection portions of a semiconductor chip and a plurality of connection portions of a wiring circuit board are electrically connected to each other o...
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