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WO/2022/086726A1 |
A two-component dual-cure adhesive having a first component and a second component that partially react when mixed to provide some adhesive strength plus processing capability and further reacts upon exposure to a secondary stimulus to p...
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WO/2022/085698A1 |
Provided are an adhesive composition capable of maintaining an applied shape after UV irradiation and having good adhesive strength after curing and a method for producing a bonded body using the same. The adhesive composition contains...
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WO/2022/080048A1 |
Provided are: an epoxy resin curing agent including an amine composition or a modified product thereof, the amine composition containing m-xylylenediamine and p-xylylenediamine at a mass ratio of 99/1 to 51/49; an epoxy resin composition...
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WO/2022/080470A1 |
Provided is a crosslinked polyester resin that exhibits self-adherence, remoldability, and a damage repair capacity. Due to dynamic covalent bond crosslinking that is capable of bond exchange at elevated temperatures, the crosslinked pol...
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WO/2022/076985A1 |
An epoxy resin for use in chemically resistant two component epoxy linings and composites is produced through the reaction of resorcinol, cresol novolak and polyhydoxystyrene with epichlorohydrin and subsequent reaction with caustic. The...
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WO/2022/075193A1 |
The present invention provides an edge bond material which satisfies at least one of the requirements (1) to (3) described below. (1) The edge bond material contains a curable resin, while having a thixotropic index of 1.0 or more at a t...
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WO/2022/070503A1 |
The present invention pertains to: a transparent adhesive composition which contains an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), and in which the epoxy resin curing agent (B) satisfies (1) and (2); a fil...
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WO/2022/070809A1 |
The present invention addresses the problem of providing an endoscope adhesive suitable for bonding members that constitute an endoscope, wherein the endoscope adhesive can maintain a satisfactory adhesive strength while in use for bondi...
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WO/2022/064972A1 |
An epoxy resin composition is provided which has excellent adhesiveness to dissimilar materials. This epoxy resin composition contains (A) to (E) below: (A) a compound which is liquid at 25°C, has two or more epoxy groups in one mol...
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WO/2022/065206A1 |
The present invention addresses the problem of providing an adhesive composition for rubber/resin bonding which is reduced in environmental burden and can make adhesion between a resin and a coating rubber composition satisfactory. The a...
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WO/2022/059095A1 |
An adhesive for semiconductors, said adhesive containing a thermoplastic resin, a thermosetting resin, a curing agent, and a flux compound that has an acid group, wherein: the heat quantity from 60°C to 155°C of the DSC curve is 20 J/g...
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WO/2022/053954A2 |
A curable composition includes a non-aromatic epoxy resin; a non-aromatic curing agent; and a colorant. The cured composition that is the reaction product of the curable composition exhibits a non-overlap shear value on etched aluminum o...
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WO/2022/056096A1 |
Provided herein is a two-component thermal interface material.
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WO/2022/046836A1 |
Two-part curable compositions capable of demonstrating substantially no phase separation at room temperature over time and improved adhesion strength retention at elevated temperature conditions.
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WO/2022/043844A1 |
Thermally curable compositions with excellent storage stability are provided that include a thermal curing system comprising a compound of Formula (I). In Formula (I), L+n is a cation of an alkali metal or alkaline earth metal and n is e...
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WO/2022/044543A1 |
The adhesive sheet according to the present invention is provided with different material sheets that are flush with each other.
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WO/2022/043160A1 |
The present invention is directed to an electrically conductive composition comprising: a) a resin component comprising: 1) a first epoxy resin; and, 2) a second epoxy resin and/or a functionalised polybutadiene resin and/or a functional...
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WO/2022/045157A1 |
Provided is an adhesive composition that makes it possible to prevent resin flow on the occasion of thermocompression bonding by controlling mechanical characteristics, that exhibits suitable electrical characteristics, and whereby it is...
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WO/2022/045053A1 |
This adhesive substrate is used for forming a structure by adhering the adhesive substrate to an adherend. The adhesive substrate includes a substrate, and an entangled polymer layer that has a thickness of 1-20 nm and that is formed of ...
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WO/2022/038109A1 |
The invention relates to a chemically curable, aqueous two-component adhesive formulation for producing pressed material molded bodies, in particular pressed plates. A component A of the adhesive formulation comprises 20 wt.% to 100 wt.%...
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WO/2022/039176A1 |
The purpose of the present invention is to provide a thermally foamable sheet whereby it is possible to suitably perform bonding in a gap between two adherends. The present invention also relates to a bonding method using such a thermall...
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WO/2022/039676A1 |
Herein disclosed is an adhesive additive for magnetically curing an adhesive. The adhesive additive includes a magnetic nanoparticle that includes (i) a metal, wherein the metal comprises iron, manganese, cobalt, nickel, and/or zinc, or ...
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WO/2022/039121A2 |
Provided are: a thermosetting resin composition which has excellent workability at approximately 50°C by the viscosity thereof being lowered, and of which the obtained cured product has excellent heat resistance in high temperature regi...
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WO/2022/036099A1 |
The present disclosure provides epoxy adhesive compositions with increased adhesion to surfaces, including metal surfaces, comprising a catechol modifier and methods of use thereof.
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WO/2022/024838A1 |
The present disclosure provides a thermosetting composition that contains an epoxy resin and a thiol compound, enables temporary adhesion, and exhibits favorable storage stability. The thermosetting composition according to the present d...
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WO/2022/025234A1 |
The present invention addresses the problem of obtaining an adhesive that has excellent adhesion strength (storage elasticity) after curing, that has an excellent elongation rate after curing, and that does not readily peel due to heat h...
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WO/2022/025207A1 |
An adhesive film for circuit connection contains electroconductive particles, and includes, in the film thickness direction, a region A containing a cationically polymerizable compound, a thermal cationic polymerization initiator, and an...
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WO/2022/021389A1 |
An underfill and a preparation method therefor, and a dispensing method applied to an LED display screen (100). The underfill comprises the following raw materials in percentage by mass: epoxy resin: 50%-70%; latent curing agent: 1%-20%;...
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WO/2022/024510A1 |
The present invention provides: a composition for an adhesive, the composition containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D), the phenoxy resin (C) having an elastic modu...
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WO/2022/019095A1 |
This thermosetting resin composition contains: an epoxy resin that is solid at 25°C; an epoxy resin that is non-solid at 25°C; fine particulate rubber that is dispersed in the non-solid epoxy resin; a setting agent; an inorganic filler...
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WO/2022/017815A1 |
The present invention relates to an electrically conductive, room temperature stable, one-component (1K) epoxy adhesive composition comprising: a) an epoxy resin; b) at least one ionic constituent as a catalyst for epoxy homo-polymerizat...
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WO/2022/019075A1 |
This thermally conductive adhesive sheet is formed by molding, into a sheet shape, a resin composition comprising (A) conductive particles, (B) a thermosetting resin, (C) a block copolymer, and (D) a binder resin, wherein the (C) block c...
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WO/2022/014531A1 |
An adhesive composition which contains (a) an acid-modified polyolefin, (b) a phenolic resin that has a polycyclic structure and (c) an epoxy resin, and which additionally contains at least one of (d) an inorganic filler and (e) a flame ...
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WO/2022/014552A1 |
The main purpose of the present disclosure is to provide a composition having excellent dimensional stability, adhesive strength, and deep curability. The present disclosure achieves the above purpose by providing a composition containin...
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WO/2022/014626A1 |
The present invention provides a conductive adhesive composition which is able to achieve a good bonding strength, while achieving a good thickness between adherends in cases where the blending amount of a conductive powder is relatively...
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WO/2022/011494A1 |
Disclosed is a conductive epoxy resin composition, in particular for bonding copper substrate, and the cured product, and the use thereof as well as a semiconductor device comprising the cured product.
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WO/2022/009513A1 |
Provided is an adhesive material for easy disassembly which combines satisfactory adhesion strength with suitability for easy disassembly. The adhesive material for easy disassembly comprises an epoxy resin and a polyaddition-type curi...
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WO/2022/009570A1 |
Disclosed is an integrated dicing die-bonding film. Said integrated dicing die-bonding film comprises: dicing tape that has a substrate and an adhesive layer provided upon the substrate; and a die-bonding film that is disposed upon the a...
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WO/2022/009571A1 |
Disclosed is an integrated dicing die-bonding film. Said integrated dicing die-bonding film comprises: dicing tape that has a substrate and an adhesive layer provided upon the substrate; and a die-bonding film that is disposed upon the a...
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WO/2022/010403A1 |
The present invention refers to a radiation curable composition, comprising 51-100 wt% of a cationic curable resin, further comprising a cycloaliphatic epoxide, at least one vinyl compound, selected from the group consisting of methyl vi...
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WO/2022/010972A1 |
Disclosed herein are curable compositions comprising an epoxide-functional polymer, a curing agent capable of reacting with the epoxide-functional polymer that is activatable by an external energy source, and a fluoropolymer that is subs...
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WO/2022/006023A1 |
The present disclosure relates to compositions derived from bioreachable molecules, such as amino acids or hydroxy acids. In particular, the composition can be a monomer, a polymer, or a copolymer derived from an amino acid dimer or a hy...
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WO/2022/004476A1 |
The present invention provides an adhesive composition for forming a low-dielectric adhesive layer that has both heat resistance and chemical resistance (solvent resistance), the adhesive composition exhibiting satisfactory bonding prope...
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WO/2021/260557A1 |
The present invention relates to an epoxy adhesive composition, comprising: a) 10-50 parts by weight of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a combination of a bisphenol A epoxy resin and a bisphenol F epoxy resin, wh...
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WO/2021/251099A1 |
This easily disintegrable adhesive material contains a thermosetting resin and thermally expandable particles. The thermosetting resin contains an epoxy resin and a curing component that contains one or both of a curing agent and a curin...
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WO/2021/248724A1 |
An underfill resin having stable adhesiveness under high temperature and preparation method therefor, comprising 20~60 parts by mass of epoxy resin, 5~30 parts by mass of curing agent, 0.1~5 parts by mass of solid or liquid latent curing...
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WO/2021/247532A1 |
Provided are flux-compatible epoxy-anhydride compositions useful as low-gap underfill adhesives. The flux-compatible epoxy-anhydride compositions include an epoxy component and an anhydride composition comprising a monofunctional anhydri...
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WO/2021/240328A1 |
The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a thermally curable resin; a thermal curing initiator for the thermally curable resin; a radiation self-polymerizable multi-functiona...
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WO/2021/240071A1 |
According to an example aspect of the present invention, there is provided a composition comprising colloidal lignin particles and an epoxy compound.
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WO/2021/241359A1 |
The present invention provides: an adhesive sheet which sufficiently and stably adheres to the back surface of a lead frame and the back surface of a sealing resin, and is not separated therefrom before a separation step even if subjecte...
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