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Matches 1 - 50 out of 13,977

Document Document Title
WO/2017/025687A1
The present invention relates to the use of bis-anhydrohexitol ethers as reactive diluents in a crosslinkable resin, adhesive, coating or matrix composition for composites. Said products not only help advantageously reduce the viscosity ...  
WO/2017/027482A1
The present invention provides compositions, including die attach adhesives, coatings and underfill materials, which are useful in electronics packaging and the composite fields. Specifically, the invention provides liquid and very low m...  
WO/2017/022523A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing...  
WO/2017/018472A1
The present invention provides an active-energy-ray curing adhesive composition for a plastic film, having low viscosity, excellent curability, excellent adhesiveness with respect to a plastic film or the like made of a cellulose-acetate...  
WO2017010401A1
The present invention provides: an epoxy resin composition giving a hardened object which retains excellent dielectric properties (low permittivity and low dielectric dissipation factor) and has high strength of bonding to metals; a proc...  
WO2017008242A1
The present invention relates to curable novel resins and prepolymers, methods of manufacture and compositions made therefrom. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular,...  
WO2017010754A1
The present invention relates to a resin composition for semiconductor adhesion, the composition containing: a thermoplastic resin having a low absorption rate; an epoxy resin including a biphenyl-based epoxy resin having a softening poi...  
WO2017010224A1
Provided is a curable adhesive composition for a polarizing film that is for adhering a transparent protective film to at least one surface of a polarizer, said curable adhesive composition for a polarizing film being characterized by co...  
WO/2017/006460A1
Provided are: a thermoconductive member that has a combination of properties including (A) having high thermoconductivity, (B) adaptability to the irregularities in the surface of an electronic component and the surface of a heat-dissipa...  
WO/2017/006854A1
The thermally conductive composition according to the present invention comprises metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, the metal particles (A) sintering upon a heat treatment to ...  
WO/2017/006681A1
To provide an adhesive composition containing a crystalline acid-modified polyolefin and an epoxy resin, which has good pot life properties and achieves good adhesion between a metal base, especially a steel sheet, and a polyolefin resin...  
WO/2017/001126A1
The invention relates to an adhesive composition, preferably pressure-sensitive adhesive composition, comprising a) at least one (co)polymer containing at least isobutylene and/or butylene as comonomer type and, optionally but preferably...  
WO/2017/002753A1
The present invention provides a laminate (10A) which comprises a first gas-barrier layer (11) constituted of a gas-barrier transparent resin film and a second gas-barrier layer (12) constituted of a metal foil. The laminate (10A) includ...  
WO/2017/002315A1
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. According to the present invention, a heat dissipation material...  
WO/2016/208617A1
Provided are: a bonding agent for bonding a film containing a PVA-based polymer and a protective film, which is an active energy ray curable bonding agent comprising a PVA-based polymer (A), a cationic polymerizable compound (B) and a ca...  
WO/2016/204114A1
Provided is a curable composition that, by being cured, is capable of forming a cured product having an excellent ability to adhere to and remain closely adhered to a body adhered thereto. The curable composition is characterized by in...  
WO/2016/201520A1
A method for cross-linking an uncured or partially-cured epoxy resin system, the epoxy resin system including at least one epoxy compound, the epoxy compound including at least one glycidyl chemical group attached to at least one aniline...  
WO/2016/204115A1
Provided is a cured object which is excellent in terms of heat resistance, crack resistance (or thermal shock resistance), adhesiveness to adherends, and adhesive property. The cured object according to the present invention is obtained ...  
WO/2016/196448A1
The invention is directed to a toughener for epoxy adhesives, the toughener being a reaction product of a bisphenolic blocked PU toughener with a diglycidyl ether-bisphenol product such as liquid DGEBA. The invention includes adhesives c...  
WO/2016/194952A1
An adhesive composition which can have excellent life performance and can have a wide margin for mounting, the composition comprising a cationically polymerizable compound, a hardening catalyst based on both an aluminum chelate and a sil...  
WO/2016/196561A1
Methods of bonding hardware to glass and other substrates are provided that do not require use of primers, mixing, fixturing, or autoclaving. These methods include the steps of disposing an adhesive layer on a bonding surface of either t...  
WO/2016/196778A1
The present teachings relate generally to a one-part epoxy-based adhesive paste composition, comprising: at least about 20% by weight of a liquid epoxy resin component; an amount sf a halogen-free flame retardant sufficient so that the r...  
WO/2016/191403A1
A novel 2K adhesive composition with its epoxy resin part comprising an organic polymeric solid containing a vinyl phenol moiety. Such adhesive composition provides a strong bond to oil-contaminated metal substrates when cured at room te...  
WO/2016/185956A1
Provided is a laminate which has superior low dielectric constant characteristics, which exhibits excellent adhesion between metal substrates and not only conventional polyimide and polyester film substrates, but also low polarity resin ...  
WO/2016/180574A1
The use of an electrically conductive composition for the adhesive bonding of an electronic component having a contact surface to a substrate having a contact surface via said contact surfaces, wherein the electrically conductive composi...  
WO/2016/177685A1
The invention relates to an adhesive strip, containing a temporary fixing adhesive for a first temporary fixing of two substrates to one another as a preliminary stage to a second final fixing of the two substrates, wherein the second fi...  
WO/2016/172911A1
The present invention relates to a one-part curable adhesive composition, in particular a one-part adhesive composition having excellent initial and aged lap shear strength as well as low viscosity, and to the use thereof.  
WO/2016/169874A1
The invention relates to a thermally curing adhesive composition, which can be used for joining components made of materials with different longitudinal expansion behaviors, to form a composite workpiece. The invention further relates to...  
WO/2016/165691A1
The aim of the invention is to provide an improved solution for an adhesive connection for the planar adhesion of components, in which the adhesive connection has a non-uniform stress distribution in different regions of the adhesive sur...  
WO/2016/165691A4
The aim of the invention is to provide an improved solution for an adhesive connection for the planar adhesion of components, in which the adhesive connection has a non-uniform stress distribution in different regions of the adhesive sur...  
WO/2016/167245A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burde...  
WO/2016/167873A1
A battery module includes a housing having an opening and an electrochemical cell disposed in the housing. The electrochemical cell includes a first cell surface having electrode terminals and a second cell surface substantially opposite...  
WO/2016/163491A1
The present invention relates to a curable resin composition which contains, per 100 parts by mass of an epoxy resin (A), 1-100 parts by mass of polymer fine particles (B), each of which has a core/shell structure wherein the core layer ...  
WO/2016/163514A1
Disclosed is an adhesive sheet comprising a base member 1 and an expansive adhesive agent layer 2 formed on one surface or both surfaces of the base member 1, wherein the expansive adhesive agent layer 2 comprises: an epoxy resin that co...  
WO/2016/159224A1
This curable epoxy resin composition includes, per 100 parts by mass of an epoxy resin (A), 1-50 parts by mass of a core-shell polymer (B), and 1-50 parts by mass of a blocked isocyanate (C). A core layer of (B) comprises a diene rubber,...  
WO/2016/159223A1
This curable epoxy resin composition includes, per 100 parts by mass of an epoxy resin (A), 1-50 parts by mass of a core-shell polymer (B), and 1-50 parts by mass of a blocked isocyanate (C). A core layer of (B) comprises a diene rubber,...  
WO/2016/158828A1
Provided is a resin composition having long-term heat resistance and rapid curing characteristics, with the adhesive strength being high when heated and the rate of change in the adhesive strength and the room temperature elastic modulus...  
WO/2016/158066A1
The present invention provides a novel cyanic acid ester compound capable of giving a cured object which has excellent solubility in solvents and a low coefficient of thermal expansion and is excellent in terms of flame retardancy and he...  
WO/2016/158727A1
The present invention provides: a sheet for forming a resin film, which has excellent reworkability and is bonded to a silicon wafer to form a resin film on the silicon wafer, and wherein a surface (α) of the sheet, said surface being b...  
WO/2016/157594A1
Provided are: a sheet-like joining material which is used in cases such as when an electronic component provided with electrodes is to be mounted on a circuit board, exhibits excellent handling properties, and is capable of achieving rel...  
WO/2016/158523A1
A composition which is characterized by containing, as a cationically polymerizable organic material mixture (1), an aromatic epoxy compound (1-1), an alicyclic epoxy compound (1-2A) or an aliphatic epoxy compound (1-2B), and a polyfunct...  
WO/2016/159102A1
In order to provide a dispersion wherein the dispersed state of a fluorine-based resin is uniformly controlled, a polyimide precursor solution composition using this dispersion, an adhesive composition, a polyimide and polyimide film obt...  
WO/2016/158522A1
The invention of the present application provides a composition having excellent adhesive properties, heat resistance and liquid storage stability, and more specifically provides a composition that is characterized by containing a mixtur...  
WO/2016/159218A1
The present invention provides a modified phenolic resole resin composition including a modified phenolic resole resin that has structural units A, which are represented by general formula (1) and are modified using a dimethylphenol, and...  
WO/2016/151093A1
The invention relates to a reinforcement member comprising a heatcurable structural adhesive on a carrier member, wherein the carrier member comprises a fiber-reinforced polyester material. The invention further relates to a method to pr...  
WO/2016/153294A1
The present application relates to an adhesive composition and an organic electronic element comprising the same. The present invention provides: an adhesive composition, which can form a structure capable of effectively blocking the moi...  
WO/2016/152161A1
Provided is an adhesive composition whereby a layered body can be formed in which adhesive strength can be maintained at a high level even when the layered body is immersed for two weeks or more in an electrolytic solution at a temperatu...  
WO/2016/152271A1
The present invention is a resin composition used to seal an interface between an adherend and a semiconductor element that is flipchip-bonded to the adherend, wherein the resin composition contains a radical reactive compound, a thermop...  
WO/2016/148050A1
In the present invention, an optical element is provided with the following: a plurality of plate-shaped transparent bodies in which a light reflecting section is formed on at least one of two main surfaces that face each other, and whic...  
WO/2016/147830A1
Provided are: an adhesive coating material which, when bonding a solar cell sealing material to a base sheet, exhibits excellent adhesive strength and moist-heat resistance; a polyol composition for the coating material; a cured object o...  

Matches 1 - 50 out of 13,977