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Patent Searching and Data


Matches 1 - 50 out of 14,392

Document Document Title
WO/2017/138447A1
The present invention provides a resin composition with which a substrate for electronic-circuit formation or a substrate for semiconductor-circuit formation can be bonded to a supporting substrate and which, in the state of being bondin...  
WO/2017/138253A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138255A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/137796A1
The present invention provides an adhesive resin composition excellent in terms of adhesive strength and durability, a method for bonding adherends, and an adhesive resin film. Specifically, the present invention relates to: an adhesive ...  
WO/2017/138252A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/133120A1
Disclosed are a frame sealing adhesive, a liquid crystal panel, a liquid crystal display and a preparation method belonging to the technical field of liquid crystal display. The disclosed frame sealing adhesive comprises a frame sealing ...  
WO/2017/126568A1
The purpose of this invention is to provide an epoxy resin composition with which it is possible to form a cured epoxy resin having excellent initial transparency and weather resistance as well as excellent adhesion to various substrates...  
WO/2017/127253A1
A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at ...  
WO/2017/126766A1
The present invention relates to a method for manufacturing a mobile phone antenna using a flat coil, wherein the method does not use a round coil but uses a flat coil having a certain pattern made of flat wire, and can thereby maximise ...  
WO/2017/121826A1
The invention relates to a single-component thermosetting epoxy resin comprising a) at least one epoxy resin with more than one epoxy group per molecule on average; b) at least one latent curing agent for epoxy resins; and c) at least on...  
WO/2017/119323A1
Provided are: a photocurable adhesive for bonding a thermoplastic resin film to a polyvinyl alcohol-based polarizer; and a polarizing plate which uses this photocurable adhesive. This photocurable adhesive contains, per 100 parts by weig...  
WO/2017/118226A1
Disclosed is a frame sealant composition, comprising a main component and high-strength fibers with a specific surface area of 2,000-30,000 m2/g. The amount of high-strength fibers added is equal to 0.5-3% of the weight of the main compo...  
WO/2017/119274A1
Provided is an adhesive composition having excellent life properties. This adhesive composition achieves excellent life properties by containing an epoxy compound, an aluminum chelating agent and a hindered amine compound. This is consid...  
WO/2017/117163A1
Provided are methods and associated compositions directed to a structural bonding adhesive. The structural bonding adhesive is made by mixing a curable composition comprising a mixture of a first curable resin and a second curable resin ...  
WO/2017/110202A1
A tape for semiconductor processing is provided which enables excellent singulation of semiconductor wafers during dicing and which enables preventing package cracking during packaging. This semiconductor processing tape 10 is characteri...  
WO/2017/109011A1
The invention relates to an adhesive tape, particularly a transfer adhesive tape, comprising an epoxy-based thermally-curable adhesive compound which consists of approximately 10 to approximately 60 percent by weight of at least one epox...  
WO/2017/109620A1
An epoxy resin component for an adhesive composition is disclosed. Said epoxy resin component comprises of an epoxy resin premix; and a filler composition comprising cenospheres and wollastonite in a w/w (weight / weight) ratio in a rang...  
WO/2017/104298A1
The present invention provides an epoxy resin composition which is suitable as an under-fill material for three-dimensional packaging, and has a low uranium content and excellent filling properties, and in which the occurrence of voids i...  
WO/2017/104670A1
Provided are: a heat-curable adhesive sheet that reduces warping of a semiconductor wafer and reduces the occurrence of chipping; and a production method for a semiconductor device. The heat-curable adhesive sheet has a heat-curable adhe...  
WO/2017/104165A1
An adhesive composition which comprises a polyfunctional epoxy compound (a) that contains an added poly(alkylene oxide) and is represented by the following general formula (A), a polyfunctional (meth)acrylate monomer (b), and a photo-aci...  
WO/2017/103080A1
The invention relates to a composition comprising at least one structural adhesive and at least one chemically crosslinked elastomer based on a silane-functional, non-polar polymer, said elastomer being provided in the form of a penetrat...  
WO/2017/100750A1
An adhesive comprising an allyl (urethane) silane, where the allyl (urethane) silane comprises at least one allyl-functional group and one silane-functional group connected through a urethane linkage. Preferably, the allyl(urethane) sila...  
WO/2017/099449A1
The present invention relates to a complex polarizing plate and, more specifically, to a complex polarizing plate comprising: a polarizer; and complex phase difference layers disposed on at least one surface of the polarizer, and having,...  
WO/2017/098879A1
Provided are: an epoxy resin which has high flowability and, despite this, gives cured objects excellent in terms of heat resistance and moist-heat resistance; a process for producing the epoxy resin; a cured object obtained from the epo...  
WO/2017/094591A1
The present invention is: an adhesive composition containing an (A) component that is a modified polyolefin resin, a (B) component that is a multifunctional epoxy compound, and a (C) component that is an imidazole curing catalyst; a seal...  
WO/2017/095912A1
Reformable epoxy resins are disclosed for use in films, composites, and tapes and more particularly for uses of such materials for reinforcing, surface treating, adhering, laminating and stiffening.  
WO/2017/091974A1
The invention provides a B-stageable adhesive composition, based on the total weight of the adhesive composition, comprising: 13-59 wt% of an epoxy resin; 18-69 wt%of a carboxyl terminated butadiene-acrylonitrile copolymer; and 3-34 ...  
WO/2017/090875A1
The present invention relates to an anisotropic conductive film comprising a conductive layer and an insulation layer, wherein each of the conductive layer and the insulation layer comprises two types of inorganic fillers having differen...  
WO/2017/089068A1
The invention relates to curable mixtures containing at least one binder composition and at least one curing agent mixture and optionally one or more alkoxysilane compounds, and the use thereof.  
WO/2017/087651A1
The present disclosure provides a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; non-spherical particles. This composition can be useful for applications, for...  
WO/2017/082106A1
This bonding method comprises: a step (1) for disposing an adhesive layer on a first material to be bonded; a step (2) for disposing a curing agent layer, which is capable of curing the adhesive layer by coming into contact with and reac...  
WO/2017/080040A1
The present invention provides a damp-heat-resistant and highly reliable conductive silver epoxy adhesive, a method for preparing same, and an application thereof. Considering the total weight of the damp-heat-resistant and highly reliab...  
WO/2017/078157A1
This adhesive composition comprises a silane compound having a structure represented by general formula (I). (In the formula, X represents an organic group, R1 and R2 each independently represent an alkyl group, m represents an integer f...  
WO/2017/078036A1
This curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200-4000 is adhered to the surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) that have an aver...  
WO/2017/077928A1
The present invention relates to: a curable composition which contains (A) a thiol compound having at least two thiol groups in each molecule, (B2) an epoxy compound having at least two epoxy groups in each molecule, (C) a phosphine comp...  
WO/2017/077220A1
The present invention relates to a rheology additive composition based on fatty acid diamide, which is already pre-activated and pre-concentrated in fatty acid diamide and comprises: a) 5 to 30% by weight of at least one fatty acid diami...  
WO/2017/078449A1
The present invention relates to a two liquid type epoxy adhesive composition and, more specifically, to a two liquid type epoxy adhesive composition which exhibits improved adhesive and mechanical properties in a cryogenic environment, ...  
WO/2017/077912A1
Provided is a laminate that exhibits good adhesion properties with respect to not only conventional polyimide and polyester films but also to metal substrates and low polarity resin substrates, such as LCP, and that can attain high solde...  
WO/2017/074810A1
The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalen...  
WO/2017/073671A1
The present invention provides a light emitting body protective film which is provided with a first optical film and an adhesive layer having barrier properties, and wherein the first optical film is an optical barrier film that comprise...  
WO/2017/073142A1
A curable resin composition which comprises: a vinyl ester resin component comprising (A) a vinyl ester having a weight-average molecular weight of 3,000 or higher in terms of polystyrene and having a novolac skeleton in the molecular st...  
WO/2017/070820A1
The present invention provides an adhesive composition comprising, by dry weight based on total dry weight of the adhesive composition, from 70% to 96%, a polyurethane dispersion, from 1% to 20%, an epoxy resin, and from 0.5% to 15%, an ...  
WO/2017/067865A1
Thermally or photo curable adhesive compositions containing a bisphenol F epoxy resin and a bisphenol A epoxy resin in a ratio that is comprised between 2 and 10 and further containing at least an epoxy acrylate component and at least a ...  
WO/2017/070097A1
An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substanti...  
WO/2017/063081A1
There are provided a holding strap, methods of making the same, and methods using such holding strap for tying down objects on a flatbed of a vehicle, retaining underground tanks, or lifting electrodes out of an electrolytic cell. The ho...  
WO/2017/063290A1
The present invention provides a method for preparing carbon nanotube conductive spheres and a method for preparing a conductive adhesive containing the carbon nanotube spheres. The method for preparing carbon nanotube conductive spheres...  
WO/2017/063406A1
An aluminum alloy die-casting member defect repairing agent, prepared from a raw material comprising a first component and second component. The first component is prepared from the following ingredients: a poly(propylene glycol) diglyci...  
WO/2017/061625A1
Provided are: an adhesive-sheet set comprising a pair of adhesive sheets respectively including adhesive layers which, upon contact with each other, can cure and bond together; and a process for producing an article using the adhesive-sh...  
WO/2017/061549A1
The purpose of the present invention is to provide: an interlayer filler material for touch panels that is used to fill the interlayer space between a touch panel and another member or the interlayer space between a plurality of transpar...  
WO/2017/061552A1
The purpose of the present invention is to provide: an interlayer filler material for touch panels that is used to fill the interlayer space between a touch panel and another member or the interlayer space between a plurality of transpar...  

Matches 1 - 50 out of 14,392