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Matches 1 - 50 out of 15,085

Document Document Title
WO/2018/169609A1
The invention relates to a two-component adhesive based on hybrid urethane-acrylate epoxies comprising a core/shell rubber demonstrating good T-peel strength. The adhesives are suitable for use in industry, e.g., as adhesives for transpo...  
WO/2018/168862A1
A resin composition containing an epoxy compound and partially immobilized lithium smectite.  
WO/2018/168115A1
The present invention is a method for producing a laminate, wherein a second substrate having an electrode pad is laminated on a first substrate having an electrode pad, with an underfill material being interposed therebetween. This meth...  
WO/2018/168358A1
A surface-treated metal plate for polyolefin adhesion is provided with a metal plate, a first layer provided on at least one surface of the metal plate, and a second layer provided on the first layer, the first layer including an epoxy r...  
WO/2018/163999A1
The purpose of the present invention is to provide: a metal clad laminated plate in which bonding strength between a liquid-crystal polymer film and a metal foil is high even if surface roughness of the metal foil is low, a transmission ...  
WO/2018/165445A1
An electrically conductive adhesive composition with one or more epoxy resins, one or more nanoparticulate conductive metals having a functionalized coating, and one or more electrically conductive nanoscopic carbon materials with a coat...  
WO/2018/159267A1
[Problem] In recent years, epoxy resin compositions are used with electronic components such as camera modules. These electronic components often use Ni-plated members from the standpoint of conductivity, but conventional epoxy resin com...  
WO/2018/159260A1
Provided is an active-energy-ray-curable adhesive composition for a plastic film or a sheet, said composition having exceptional curability, exceptional adhesive force with respect to various types of plastic films and sheets including c...  
WO/2018/155801A1
The present invention provides an adhesive composition which comprises a carbon nanotube and exhibits high adhesive strength due to excellent tensile lap-shear strength.  
WO/2018/153066A1
Disclosed are a sealing glue, a liquid crystal panel, a liquid crystal display and a manufacturing method therefor. The sealing glue comprises a graphene-polymer composite material and a sealing glue matrix; the graphene-polymer composit...  
WO/2018/155032A1
Provided is a curable aqueous resin emulsion composition which comprises: 100 parts by mass of (a) a (meth)acrylate epoxy resin; 1 to 200 parts by mass of (b) a polymerizable unsaturated monomer; 0.1 to 10 parts by mass of (c) a curing a...  
WO/2018/156450A1
A one-component toughened epoxy-modified polyurethane and/or urea adhesive includes a mixture of dicyandiamide and a dihdyrazide as curing agents. The mixture of curing agents permits the adhesive to be cured at lower temperatures while ...  
WO/2018/146670A1
Disclosed is a structural adhesive comprising an epoxy component and a curing agent, wherein the epoxy component comprises at least 10% w/w of a brominated epoxy. Disclosed also is a process for preparing such a structural adhesive. Furt...  
WO/2018/147247A1
Provided is an actinic-ray-curable adhesive composition which has excellent adhesive force, is suitable for use in laminating any of various protective films for polarizers to a polarizing element, and is excellent in terms of curability...  
WO/2018/143343A1
The present invention pertains to an adhesive sheet for producing a semiconductor device. This adhesive sheet for producing a semiconductor device is provided with a substrate, and a thermosetting adhesive agent layer provided on one sur...  
WO/2018/143189A1
The present invention achieves: a graphite-based thermal interface material that exhibits excellent thermal resistance properties even when used between members having uneven surfaces; and a production method for such a thermal interface...  
WO/2018/139559A1
One purpose of the present invention is to provide a curable resin composition which has a high glass transition temperature after curing, and which enables the achievement of a cured product that has excellent thermal decomposition resi...  
WO/2018/134476A1
In a manufacturing method of a laminate structure according to the invention, a manufacturing apparatus (100) of the laminate structure is used, which apparatus comprises material containers (10, 11,12) for the glue paste components, a s...  
WO/2018/129731A1
An adhesive composition includes an epoxy component and an additive component reactive with the epoxy component. The additive component includes an imidazole present in an amount of less than or equal to 10 parts by weight based on 100 p...  
WO/2018/131570A1
Provided is an epoxy resin composition capable of achieving excellent low dielectric properties and high adhesion to metal. Specifically, an epoxy resin composition is provided that contains organic particles and an epoxy resin having a ...  
WO/2018/131569A1
Provided is an epoxy resin composition having excellent electrical characteristics (especially a low dielectric loss tangent) and being capable of achieving high adhesion to metal. Specifically, an epoxy resin composition containing an...  
WO/2018/131571A1
Provided is an epoxy resin composition having excellent adhesion and low dielectric properties. Specifically, an epoxy resin composition is provided that contains an acid-modified polyolefin resin and an epoxy resin having a specific str...  
WO/2018/121048A1
A heat-resistant packaging adhesive for a high-power LED and a manufacturing method thereof. The adhesive is based on an epoxy resin material and contains an active toughening diluent and an active filler. The adhesive is made under cert...  
WO/2018/119833A1
A cationically curable sealant composition for liquid crystal sealing is suitable to be used in one drop filling (ODF) process for manufacturing liquid crystal display device without the concern of moisture resistance and liquid crystal ...  
WO/2018/117607A1
The present invention relates to an adhesive composition having excellent heat resistance and a flexible flat cable using the same, and the adhesive composition comprises: (a) a urethane modified polyester resin having a carboxyl group a...  
WO/2018/115080A1
The present invention relates to heat-curing epoxy resin compositions which exhibit a good storage stability and a low curing temperature. The epoxy resin compositions are particularly suitable for use as a structural adhesive and for pr...  
WO/2018/116967A1
This adhesive composition is characterized by containing (A) a modified polyolefin resin and (B) an epoxy compound, and is also characterized in that: the modified polyolefin resin (A) is obtained by graft modifying a polyolefin resin wi...  
WO/2018/110754A1
The present invention relates to an adhesive sheet or an adhesive tape which has an electromagnetic wave-blocking function, and provides a method for producing a UV-curable adhesive sheet in which an electromagnetic wave filler has enhan...  
WO/2018/109711A1
The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a -COOH or -O...  
WO/2018/110801A1
Provided are an adhesive composition for a polarizing plate, a polarizing plate, and an optical display device, the adhesive composition comprising an epoxy-based compound, a (meth)acrylate-based compound, a photo-acid generator, and an ...  
WO/2018/108707A1
The present invention relates to an epoxy resin adhesive comprising at least one epoxy resin in the resin component, at least one adduct AD which is flowable at room temperature, comprises primary amino groups and is formed of (i) at lea...  
WO/2018/102198A1
An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and opt...  
WO/2018/097660A1
The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesive ability and liquid crystal aligning ability at the same time before or after curing, and thus can be...  
WO/2018/097663A1
The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesive ability and liquid crystal aligning ability at the same time before or after curing, and thus can be...  
WO/2018/092463A1
[Problem] To provide a cationically curable adhesive composition that combines low-temperature curability with adhesiveness to engineering plastics (in particular, LCPs). [Solution] A cationically curable adhesive composition for camera ...  
WO/2018/092800A1
The present invention provides: an adhesive composition which contains (A) a modified polyolefin resin, (B) a multifunctional epoxy compound, (C) a curing accelerator and (D) a silane coupling agent, and which is characterized in that if...  
WO/2018/092452A1
Provided is an adhesive composition which contains: a poly(vinyl acetal) or polyethersulfone; a phenoxy resin; and a novolac type epoxy resin. The glass transition temperature of the phenoxy resin is 90-140°C.  
WO/2018/081941A1
Provided in the present invention are a structural adhesive tape, a preparation method therefor, and a method for reserving a tab space in an electrode plate. The structural adhesive tape comprises: an adhesive layer, for affixing to an ...  
WO/2018/079466A1
Provided is a resin composition which is able to be cured fast at low temperatures, while having high bonding strength (especially, high peel strength) after curing, and which is capable of suppressing decrease in the bonding strength (e...  
WO/2018/080747A1
Epoxy adhesives are made using core-shell rubbers and small amounts if any of other elastomeric materials. The epoxy adhesives contain a mixture of latent curing agents and/or high levels of calcium oxide. The adhesives exhibit excellent...  
WO/2018/074316A1
Thermally expandable, liquid curable resin compositions for use in, for example, clearance filling and bonding rarely combine dryability with film formation properties, and have a problem concerning storage stability. The above-mentioned...  
WO/2018/068268A1
A binder and an electrochemical energy storage device thereof. A binder comprises a first component and a second component that are separated from each other. The first component comprises at least one compound comprising a first reactiv...  
WO/2018/066257A1
Provided is an adhesive composition which has excellent heat resistance, thermal cycle resistance and adhesion, and contributes to low outgassing, and which can thus be suitably used as an adhesive for a gas barrier property evaluation a...  
WO/2018/062205A1
The present invention provides an epoxy adhesive composition which is excellent in terms of compatibility and storage stability and has high strength and excellent adhesiveness. When used to bond materials of different kinds, the epoxy a...  
WO/2018/053455A1
A polymeric material comprising from about 5% to about 60% of a Diels-Alder additive, wherein the additive crosslinks at a temperature below 100°C, an adhesive or sealant component, wherein the viscosity of the adhesive or sealant is re...  
WO/2018/052777A1
An adhesive composition for joining optical components is described. The adhesive composition comprises at least one epoxy resin, a visible light photoinitiating system comprising at least one of a cationic photoinitiator and a sensitize...  
WO/2018/047422A1
Provided is a gas barrier laminate having a structure wherein a gas barrier layer and an adhesive layer are directly laminated, said gas barrier layer including a polymer compound and having been modified. An adhesive composition being a...  
WO/2018/047868A1
An adhesive composition containing a modified polyolefin resin (A) and a polyfunctional epoxy compound (B) and whereby a sheet-shaped object formed from said adhesive composition fulfills requirements (I) and (II). ・Requirement (I): Th...  
WO/2018/047920A1
Provided is an adhesive composition containing a component (A) being a modified polyolefin resin and a component (B) being a polyfunctional epoxy compound, said adhesive composition being characterized by having no more than 20 mg of out...  
WO/2018/047597A1
In the past, for many types of thermosetting curable resins, it was difficult to achieve an electrically conductive adhesive that would reduce connection resistance when the adherend was nickel, etc. In addition to reducing connection re...  

Matches 1 - 50 out of 15,085