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Matches 1 - 50 out of 14,734

Document Document Title
WO/2018/008741A1
Provided are: a structure adhesive composition which exhibits favorable thread breakage and improved shower resistance, and prevents stringiness when stitch-coating; a method for producing a vehicle structure using the same; and a vehicl...  
WO/2018/008742A1
Provided are: a structure adhesive composition which changes color when heat-cured; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition which changes color when heat-cured ...  
WO/2018/008592A1
[Problem] To provide an adhesive agent composition which exhibits not only adhesiveness to a polyimide film or a copper foil, but also high adhesiveness to a gold-plated copper foil, and superior heat resistance, such as soldering heat r...  
WO/2018/007123A1
The invention relates to a dispersion comprising one or more protic solvents as dispersion agents as well as the following base components dispersed therein: - one or more matrix polymers, - one or more epoxides, - at least one type of a...  
WO/2018/002064A1
An adhesive composition degradable by dielectric heating. The adhesive composition comprises a thermosetting polymer and a material sensitive to dielectric heating. The material sensitive to dielectric heating is selected from any one or...  
WO/2017/220583A1
The present invention relates to thermosetting epoxy resin compositions which on the one hand at room temperature in the incompletely cured state exhibit extremely slight alteration in shape and on the other hand develop a high surface t...  
WO/2017/213025A1
Provided is a photo-curable resin composition which comprises a radically polymerizable group-containing compound, a cationically polymerizable group-containing compound, a photoradical initiator, and a photoacid generator, wherein: the ...  
WO/2017/213248A1
The present disclosure relates to a thermosetting adhesive film. This adhesive film comprises (a) a polymer, (b) an epoxy resin that is in liquid form at 50°C, (c) a curing agent and/or a curing accelerator, and (d) a filler having a th...  
WO/2017/204218A1
Provided is an electroconductive adhesive composition which comprises: a thermosetting resin having a functional group capable of reacting with an epoxy group; an epoxy resin; an electroconductive filler; and urethane resin particles hav...  
WO/2017/205175A1
The teachings herein are directed at solid polymeric adhesive compositions for adhering metal components, methods for compounding the polymeric adhesive compositions, articles including a component having the polymeric adhesive compositi...  
WO/2017/204012A1
This adhesive composition contains an epoxy resin as a main component, and includes an inorganic zwitterion exchanger.  
WO/2017/201792A1
A waterproof and mildewproof coating adhesive, comprising the following components in parts by weight: 40-80 parts of isopropyl acrylate, 12-16 parts of epoxy resin, 40-50 parts of ethylene glycol monopropyl ether, 20-40 parts of ethyl a...  
WO/2017/198675A1
The invention relates to a structural adhesive formulation, which is heat activatable at a heat activation temperature; meltable without heat activation at an application temperature above its melting point and below the heat activation ...  
WO/2017/198820A1
The present invention relates to adhesive formulations for bonding materials, comprising 40 to 80 wt.-% of an epoxy monomer, and 15 to 30 wt.-% of an oxetane monomer, and 0.1 to 10 wt.-% of an adhesion promotor, and 0.1 to 5 wt.-% of a s...  
WO/2017/195400A1
The present invention addresses the problem of providing an electrically conductive adhesive which has superior heat cycle properties and good reflow properties, and is less likely to come off a substrate. The problem is solved by an ele...  
WO/2017/195266A1
The present invention addresses the problem of providing: an adhesive composition for laminates, which composition provides superior adhesion between a metal layer and a plastic layer in a layered body, which composition has electrolytic...  
WO/2017/195808A1
The present invention relates to an aluminum alloy material that comprises: an aluminum alloy base material; and a coating film that is formed on at least one portion of the surface of the aluminum alloy base material and that comprises ...  
WO/2017/195517A1
Disclosed is a method for manufacturing a semiconductor device provided with a semiconductor chip having connection parts, and a wiring circuit substrate having connection parts, the respective connection parts being electrically connect...  
WO/2017/195805A1
The present invention relates to an aluminum alloy material that comprises: an aluminum alloy base material; and a coating film that is formed on at least one portion of the surface of the aluminum alloy base material and that comprises ...  
WO/2017/191801A1
The present invention provides a resin composition characterized by containing a polycyclic aromatic epoxy resin (A1), a non-aromatic epoxy resin (A2) having a C6 or higher aliphatic hydrocarbon structure and not having an aromatic ring ...  
WO/2017/190023A1
A roof structure (1 0) comprises a roof membrane (16) and a roof substrate (1 2). A first surface of the roof membrane (16) is adhered to the roof substrate (12) by a two component adhesive, the adhesive being capable of adhering the fir...  
WO/2017/186057A1
Disclosed in the embodiments of the present invention are a sealant and method for preparation thereof, a display panel and method for fabrication thereof, and a display device. The sealant comprises a main-body adhesive, and a glass fib...  
WO/2017/186528A1
The present invention relates to a presuure-sensitive adhesive tape comprising or consisting of a moisture-curing composition comprising or consisting of: A 5 to 60 parts by weight of at least one film-former component; B 40 to 95 parts ...  
WO/2017/188615A1
A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may inc...  
WO/2017/186192A1
A preparation method for a highly-conductive oxidation-resistant copper-silver composite powder. The method comprises the following steps: (1) using gas atomization to prepare a copper-silver alloy powder, the mass percentage of silver i...  
WO/2017/183722A1
Provided is an adhesive film to be used in a multilayer printed circuit board and exhibiting excellent uneven-surface embedding properties even when densely packing a silica filler. Specifically, this adhesive film has a resin compositio...  
WO/2017/183721A1
An adhesive film to be used in a multilayer printed circuit board and having a resin composition layer obtained by forming a layer, on a support film, of a resin composition that contains: (a) a novolac phenolic resin in which the disper...  
WO/2017/181447A1
A fluid chip-level underfill resin and manufacturing method thereof. The underfill resin comprises the following components in parts by weight: 18-30 parts of an epoxy resin; 1-3 parts of a toughener; 0.1-1 parts of a wetting and dispers...  
WO/2017/184974A1
A dual cure, all epoxy adhesive that is both photochemically and thermally curable is disclosed. The adhesive may comprise at least about 93% by weight of one or more polymerizable epoxides, a catalytic amount of a photo-acid generator (...  
WO/2017/177827A1
Disclosed are a frame sealing glue, a preparation method therefor, and a liquid crystal display device. The frame sealing glue comprises modified epoxide obtained in a manner in which a piperidine compound and an epoxy compound are combi...  
WO/2017/179536A1
A curable composition which contains 100 parts by mass of (A) a flexible epoxy resin, 1-150 parts by mass of (B) polymer fine particles, each having a core-shell structure having at least two layers that are a core layer and a shell laye...  
WO/2017/176832A1
A weldable adhesive or sealant formulation comprising a structural tape including a solid rubber, a liquid rubber, a tackifier, and an epoxy, wherein the tape is weldable and substantially free of any fibrous filler and includes less tha...  
WO/2017/175740A1
Provided are: an amine compound represented by general formula (1), which has a low active hydrogen equivalent, and which, when used as an epoxy resin curing agent, exhibits sufficient curing properties even when a small amount thereof i...  
WO/2017/171367A1
The present invention relates to a semiconductor device comprising: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermi...  
WO/2017/168828A1
Provided is a tape for an electronic device package, with which it is possible to suppress the occurrence of bending and marks in a metal layer, which are caused by the edge section of the rotating stage of a pickup device when picking u...  
WO/2017/168829A1
Provided is a tape for an electronic device package which, when picking up an adhesive layer-equipped metal layer from a pressure-sensitive adhesive tape, enables appropriate recognition of individual segments of the adhesive layer-equip...  
WO/2017/171492A1
The present invention relates to a semiconductor device, and a method for manufacturing a semiconductor device by using an adhesive, for a semiconductor, having a predetermined melt viscosity and thixotropic index, the semiconductor devi...  
WO/2017/169574A1
The purpose of the present invention is to provide a photosensitive adhesive composition that has an excellent filler dispersibility at the time of preparation of a coating material, and a photosensitive adhesive sheet that has a high me...  
WO/2017/168825A1
Provided is an electronic device package tape such that a metal layer can be held on a base tape during precutting and the base tape can be satisfactorily detached during use. An electronic device package tape 1 of the present invention ...  
WO/2017/171324A1
The present invention relates to a flexible color filter and a manufacturing method therefor, the method forming a protective layer before a black matrix layer is formed in the manufacture of a color filter being processed on a carrier s...  
WO/2017/168820A1
Provided is an electronic device package tape that can inhibit the occurrence of warpage in a layered product of a semiconductor, bonding adhesive layer, and semiconductor chip when precuring the bonding adhesive layer and that can inhib...  
WO/2017/168830A1
Provided is tape for electronic device package which, when picking up an adhesive layer-equipped metal from a pressure-sensitive adhesive tape, can minimize the occurrence of pin indentations due to the deformation of the metal layer by ...  
WO/2017/164536A1
The present invention provides a thermosetting adhesive composition and an adhesive film formed by drying the composition, the thermosetting adhesive composition having a Cl content of 100 ppm or less and comprising 0.01-2 parts by weigh...  
WO/2017/163900A1
Provided are: a two-part curable laminate adhesive characterized by containing, as essential components, a polyurethane polyurea resin (A) having a primary amino group in the molecular structure thereof, and a polyglycidyl ether of a lin...  
WO/2017/158917A1
Provided is an adhesive composition which is suitable for laminating a polyimide film to copper foils to produce a double-sided copper-clad laminate for use in producing flexible printed wiring boards. The adhesive composition comprises ...  
WO/2017/158994A1
A film-like adhesive composition containing each of an epoxy resin, an epoxy resin curing agent, a phenoxy resin and an aluminum nitride filler, wherein the content of the aluminum nitride filler is 30-60% with respect to the total amoun...  
WO/2017/160310A1
A composition and method for a spray applied BPA free two-part, self-setting composition adapted for delivering the components of the composition at a temperature that promotes their spray application at a proper viscosity as well as ind...  
WO/2017/154281A1
Provided is a method with which it is possible to select, with high-precision, an adhesive agent with excellent alkali resistance and suitable for manufacturing an alkaline secondary battery. This method for selecting an adhesive agent i...  
WO/2017/154405A1
An organosilicon compound represented by formula (1), which has, per alkoxysilyl group, a plurality of epoxy groups each capable of reacting with an organic resin moiety to form a bond and which hence is useful as a primer, a resin modif...  
WO/2017/151898A1
A curable adhesive composition includes a curable epoxy resin, an amine curing agent, a toughening agent, and aluminum flakes. The aluminum flakes include a fatty acid milling aid on at least a portion of their surfaces. The aluminum fla...  

Matches 1 - 50 out of 14,734