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Matches 1 - 50 out of 15,226

Document Document Title
WO/2018/218596A1
Disclosed in the present invention is a light-emitting diode (LED) packaging material having a high hardness, comprising the following raw materials in parts by weight: 30-70 parts by weight of bisphenol A type epoxy resin, 30-60 parts b...  
WO/2018/219961A1
The invention relates to heat-curing epoxy resin compositions, which can be used in particular as body-in-white adhesives for vehicle construction. The heat-curing epoxy resin compositions contain a curing agent, which can be activated b...  
WO/2018/221331A1
The present invention addresses the problem of providing the following: a coating agent that exhibits an excellent low-temperature workability, overcoatability, and adhesion and that provides a coating film that has an excellent adhesive...  
WO/2018/221574A1
Provided is an adhesive composition containing: component (A) a modified polyolefin resin; component (B) a polyfunctional epoxy compound which is a liquid at 25°C; and component (C) a polyfunctional epoxy compound which is a solid at 25...  
WO/2018/221573A1
Provided is an adhesive composition containing: component (A) a modified polyolefin resin and component (B) a polyfunctional epoxy compound which is a liquid at 25°C, and optionally containing component (C) a polyfunctional epoxy compou...  
WO/2018/221981A1
The present invention relates to a method for manufacturing a lightweight high-strength material using a shell fragment and to a material. According to the present invention, fragments are collected from shells and are laminated or align...  
WO/2018/219574A1
The present application is directed to a method for preparing an amino and hydroxyl-functional polyester, said method comprising: i) preparing an unsaturated polyester by the polycondensation reaction, optionally in the presence of a cat...  
WO/2018/221571A1
The present invention pertains to an adhesive sheet having a thermosetting adhesive layer containing a polyfunctional epoxy compound, said adhesive sheet being characterized by having a specific shear characteristic and the content of th...  
WO/2018/221572A1
Provided is an adhesive composition comprising: component (A) a modified polyolefin resin, and component (B) a polyfunctional epoxy compound not having an aromatic ring, characterized in that when this adhesive composition is formed in a...  
WO/2018/221898A1
The present invention relates to an acryl-based adhesive composition that comprises acrylate-based compounds of particular ingredients and can realize excellent lap shear strength and adhesive strength.  
WO/2018/221510A1
The sheet-shaped adhesive according to the present invention is formed from an adhesive composition containing (A) a modified polyolefin resin and (B) a thermosetting component, and satisfies the following conditions (I) and (II). Condit...  
WO/2018/221217A1
The purpose of the present invention is to provide a curable resin composition which exhibits excellent fluidity prior to curing, and excellent adhesive properties, heat resistance and flexing resistance following curing. In addition, th...  
WO/2018/217729A1
A hard-point fixture placement system places a fixture that is pre-loaded with a curable adhesive by mechanically extruding the adhesive between the fixture and a target surface to which the fixture is to be attached. The placement syste...  
WO/2018/213695A1
The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without m...  
WO/2018/213668A1
The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without m...  
WO/2018/212233A1
The present invention addresses the problem of providing a curable composition for an adhesive agent, said curable composition being able to be cured at a lower temperature to form a cured article having excellent heat resistance, cracki...  
WO/2018/212064A1
Provided are: a low-viscosity solvent composition which comprises organic solvents and core/shell polymer particles stably dispersed therein in a high concentration; and a method for producing the solvent composition. The solvent composi...  
WO/2018/208073A1
In an additive for an epoxy adhesive and an epoxy adhesive composition for construction including same, the additive for an epoxy adhesive is formed by atomic transfer radical polymerization (ATRP) of a polyacrylate of which one terminal...  
WO/2018/208072A1
A structural adhesive composition having high elongation and impact resistance contains an epoxy resin, a urethane resin formed by using a polyol comprising a long chain as a functional group, and an epoxy curing agent.  
WO/2018/206976A1
A sealing element (10) for use in a fluid-carrying pipeline (16) comprising a substantially central core (14) surrounded by a coating (12). The outer coating (12) is adapted to perform a partial extrusion through an opening (15) in a pip...  
WO/2018/203667A1
The present invention relates to an acryl-based adhesive composition containing an adhesion enhancer of a specific component, thereby enabling excellent lap shear strength and adhesion to be implemented.  
WO/2018/203527A1
Provided are: an adhesive film comprising an adhesive agent layer containing a thermosetting resin, a thermoplastic resin, and a heat conductive filler, wherein the heat conductive filler has a thermal conductivity of 12 W/m·K or more a...  
WO/2018/195524A1
The present invention provides fast fixturing two part adhesive compositions which include a first part containing a (meth)acrylic componet and a cure system for an epoxy resin component of the second part and a second part containing an...  
WO/2018/194099A1
This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; and (D) a magnetic filler, wherein the modulus of elasticity of a cured product at 23°C is 7-18 GPa, the cured product being obta...  
WO/2018/194100A1
This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; (D) a magnetic filler; and (E) an inorganic filler other than the magnetic filler, wherein, when a content mass of component (D) i...  
WO/2018/189989A1
Provided is an optical component array in which optical components are arranged in an array, and in which the optical component array can be affixed directly to a substrate, the distance between the optical components and the substrate c...  
WO/2018/184486A1
Provided in the present invention is a silicone oil-treated fumed silica, which has the following physical properties of A) to C): A) a hydrophobicity of 68% by volume or higher; B) a silicone oil immobilization ratio of 60%-95% by mass;...  
WO/2018/184151A1
Provided is a light curable composition comprising a) an epoxy resin component; b) epoxy silane oligomer having a general structure (1) or (2) or (3); and c) a cationic photoinitiator. The said composition provides good adhesion properti...  
WO/2018/187193A1
In one aspect of the present disclosure, there is provided a sealant precursor, comprising a first part (A) comprising (a1) an epoxy curing agent having an amine equivalent weight of at least 150 grams per mole of amine equivalents; (b1)...  
WO/2018/181536A1
The present invention provides an adhesive composition containing: an anionic polymerizable or cationic polymerizable epoxy resin or oxetane resin; a first silane compound having a functional group that reacts with the epoxy resin or oxe...  
WO/2018/180955A1
Provided are: a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects caused by open-state standing, and is excellent in terms of rust-pr...  
WO/2018/179707A1
The purpose of the present invention is to provide a carboxylic acid group-containing polyester adhesive composition having an excellent sheet life and having sufficiently high wet heat resistance to withstand lead-free soldering under h...  
WO/2018/176782A1
A frame sealant, a preparation method therefor, a display panel and a display device, the frame sealant comprising a frame sealant base component and an amine-modified nano-material.  
WO/2018/182229A1
One embodiment of the present invention provides an adhesive composition comprising, on the basis of the total weight thereof, 0.5-4.0 wt% of an epoxy compound, 1.0-8.0 wt% of an isocyanate compound, 1.7-22 wt% of a rubber latex, 1.0-8.0...  
WO/2018/180685A1
The present invention provides: an anisotropic electroconductive adhesive which improves the reaction rate at a light-shielding part and which is capable of achieving excellent conduction resistance; and a production method for a connect...  
WO/2018/179458A1
The present invention relates to: a gas barrier laminate having a gas barrier layer, an adhesiveness-improving layer directly contacting the gas barrier layer, and an adhesive layer directly contacting the adhesiveness-improving layer on...  
WO/2018/180962A1
The gas-barrier film according to the present invention comprises a layered product obtained by superposing a release sheet, an undercoat layer, a gas-barrier layer, and an adhesive layer in this order, wherein the adhesive layer is a la...  
WO/2018/180158A1
[Problem] To provide a coating film modifier for creping which, when used together with an adhesive agent for creping, enables the uniform formation of fine wrinkles in wet paper. [Solution] The present invention is a coating film modifi...  
WO/2018/173991A1
The purpose of the present invention is to provide a resin composition that can be cured in a short time and is excellent in drop impact resistance after curing, a semiconductor device including a cured product of the resin composition, ...  
WO/2018/174217A1
The present invention provides a self-adhesive prepreg which is characterized by comprising: a base prepreg that is composed of reinforcing fibers and a thermosetting resin composition (I), some or all of which is impregnated into a rein...  
WO/2018/173898A1
According to the present invention, an adhesive sheet is sequentially provided with a first adhesive layer, a substrate sheet and a second adhesive layer. At least one of the first adhesive layer and the second adhesive layer is cured by...  
WO/2018/174177A1
Provided is an adhesive with which it is possible to suppress the infiltration of air bubbles and non-curing of the adhesive, said adhesive also being applicable the bonding of a member having low optical transparency. This adhesive comp...  
WO/2018/169609A1
The invention relates to a two-component adhesive based on hybrid urethane-acrylate epoxies comprising a core/shell rubber demonstrating good T-peel strength. The adhesives are suitable for use in industry, e.g., as adhesives for transpo...  
WO/2018/168862A1
A resin composition containing an epoxy compound and partially immobilized lithium smectite.  
WO/2018/168115A1
The present invention is a method for producing a laminate, wherein a second substrate having an electrode pad is laminated on a first substrate having an electrode pad, with an underfill material being interposed therebetween. This meth...  
WO/2018/168358A1
A surface-treated metal plate for polyolefin adhesion is provided with a metal plate, a first layer provided on at least one surface of the metal plate, and a second layer provided on the first layer, the first layer including an epoxy r...  
WO/2018/163999A1
The purpose of the present invention is to provide: a metal clad laminated plate in which bonding strength between a liquid-crystal polymer film and a metal foil is high even if surface roughness of the metal foil is low, a transmission ...  
WO/2018/165445A1
An electrically conductive adhesive composition with one or more epoxy resins, one or more nanoparticulate conductive metals having a functionalized coating, and one or more electrically conductive nanoscopic carbon materials with a coat...  
WO/2018/159267A1
[Problem] In recent years, epoxy resin compositions are used with electronic components such as camera modules. These electronic components often use Ni-plated members from the standpoint of conductivity, but conventional epoxy resin com...  
WO/2018/159260A1
Provided is an active-energy-ray-curable adhesive composition for a plastic film or a sheet, said composition having exceptional curability, exceptional adhesive force with respect to various types of plastic films and sheets including c...  

Matches 1 - 50 out of 15,226