Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 14,037

Document Document Title
WO/2017/045120A1
The present disclosure relates to a B-stageable adhesive composition and a coating prepared by the same. In the present disclosure, the adhesive composition comprises the following components in solid content percentage: (A) 15% to 50...  
WO/2017/045119A1
The present disclosure relates to a B-stageable adhesive composition and an article prepared by the same. In the present disclosure, the adhesive composition comprises the following components in solid content percentage: (A) 10% to 50...  
WO/2017/043283A1
A metal panel reinforcement material that comprises a resin composition, said resin composition at least comprising a plastic component for a curable crosslinked polymer matrix, a curing agent for the plastic component, a curing accelera...  
WO/2017/041150A1
"ARRANGEMENT APPLIED TO A POLYMER MATRIX COMPOSITE FOR MANUFACTURING DOORS, PARTITIONS, FURNITURE, INTER ALIA" relates to a type of finish for doors, door frames, door surrounds, laminates for furniture, partitions, windows and doors in ...  
WO/2017/044359A1
One-component toughened epoxy structural adhesives contain fibrous mineral fillers that have an aspect ratio of ≥6. The presence of the fibrous filler leads to a significant increase in elastic modulus while having little if any advers...  
WO/2017/044401A1
Epoxy adhesives include a latent curing agent, a reactive toughener having capped isocyanate groups, and certain urea compounds. The toughener is made by chain extending and capping a mixture of isocyanate-terminated prepolymers. The pre...  
WO/2017/043405A1
The present invention provides a resin composition which can be thermally cured at a temperature of approximately 80°C and exhibits excellent PCT resistance, and is therefore suitable as a one-component adhesive used when producing an i...  
WO/2017/044402A1
The invention is directed to a toughener for epoxy adhesives, the toughener comprising both soft and rubber units, and may be described as a capped soft-rubber PU toughener. The invention includes the tougheners and methods of making the...  
WO/2017/043455A1
[Problem] In the case of fabricating a flexible wiring device, for example, when the final curing and bonding time during final curing and bonding of an electroconductive reinforcing board and a flexible wiring board is reduced, peeling ...  
WO/2017/037951A1
The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) a radical-polymerizable compound, (c) a free-radical polymerization initiator, and (d) an epoxy resin containing no (meth)acryloyloxy...  
WO/2017/037074A1
The subject matter is a new curable composition comprising at least one hydroxyl-group containing resin, at least one nitroso-containing compound or at least one nitroso precursor compound, at least one hydrophopic silica and at least on...  
WO/2017/037524A1
The present invention pertains to an adhesive resin composition having excellent adhesive strength and durability, a production method for an adhesive, an adhesive, an adhesive laminate, and a laminate. More specifically, the present inv...  
WO/2017/037170A1
The present patent application relates to a method for gluing two adjacent substrates together by using a radiation curable adhesive composition and a use of a radiation curable adhesive composition for gluing. In particular, the method ...  
WO/2017/037525A1
The present invention pertains to: a hot-melt adhesive resin film that, with respect to a variety of flat or film-shaped adherends made of metal, glass, plastic, or the like, does not develop peeling between layers and has excellent adhe...  
WO/2017/033956A1
The purpose of the present invention is to provide: a resin composition which exhibits good adhesion to a copper surface, a polyimide surface and a gold-plated surface, while having excellent adhesiveness after heat resistance test and a...  
WO/2017/033932A1
To provide an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and improve conduction reliability. In the electroconductive material according to the prese...  
WO/2017/029917A1
Provided is an adhesive composition that is highly adhesive not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, ensures a high solder heat resistance ...  
WO/2017/030083A1
The purpose of the present invention is to provide a resin composition which is composed of an epoxy resin having a specific structure and a rubber-modified polyamide resin having a phenolic hydroxyl group and exhibiting excellent adhesi...  
WO/2017/025687A1
The present invention relates to the use of bis-anhydrohexitol ethers as reactive diluents in a crosslinkable resin, adhesive, coating or matrix composition for composites. Said products not only help advantageously reduce the viscosity ...  
WO/2017/027482A1
The present invention provides compositions, including die attach adhesives, coatings and underfill materials, which are useful in electronics packaging and the composite fields. Specifically, the invention provides liquid and very low m...  
WO/2017/022523A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing...  
WO/2017/018472A1
The present invention provides an active-energy-ray curing adhesive composition for a plastic film, having low viscosity, excellent curability, excellent adhesiveness with respect to a plastic film or the like made of a cellulose-acetate...  
WO/2017/010401A1
The present invention provides: an epoxy resin composition giving a hardened object which retains excellent dielectric properties (low permittivity and low dielectric dissipation factor) and has high strength of bonding to metals; a proc...  
WO2017008242A1
The present invention relates to curable novel resins and prepolymers, methods of manufacture and compositions made therefrom. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular,...  
WO2017010754A1
The present invention relates to a resin composition for semiconductor adhesion, the composition containing: a thermoplastic resin having a low absorption rate; an epoxy resin including a biphenyl-based epoxy resin having a softening poi...  
WO2017010224A1
Provided is a curable adhesive composition for a polarizing film that is for adhering a transparent protective film to at least one surface of a polarizer, said curable adhesive composition for a polarizing film being characterized by co...  
WO/2017/006460A1
Provided are: a thermoconductive member that has a combination of properties including (A) having high thermoconductivity, (B) adaptability to the irregularities in the surface of an electronic component and the surface of a heat-dissipa...  
WO/2017/006854A1
The thermally conductive composition according to the present invention comprises metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, the metal particles (A) sintering upon a heat treatment to ...  
WO/2017/006681A1
To provide an adhesive composition containing a crystalline acid-modified polyolefin and an epoxy resin, which has good pot life properties and achieves good adhesion between a metal base, especially a steel sheet, and a polyolefin resin...  
WO/2017/001126A1
The invention relates to an adhesive composition, preferably pressure-sensitive adhesive composition, comprising a) at least one (co)polymer containing at least isobutylene and/or butylene as comonomer type and, optionally but preferably...  
WO/2017/002753A1
The present invention provides a laminate (10A) which comprises a first gas-barrier layer (11) constituted of a gas-barrier transparent resin film and a second gas-barrier layer (12) constituted of a metal foil. The laminate (10A) includ...  
WO/2017/002315A1
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. According to the present invention, a heat dissipation material...  
WO/2016/208617A1
Provided are: a bonding agent for bonding a film containing a PVA-based polymer and a protective film, which is an active energy ray curable bonding agent comprising a PVA-based polymer (A), a cationic polymerizable compound (B) and a ca...  
WO/2016/204114A1
Provided is a curable composition that, by being cured, is capable of forming a cured product having an excellent ability to adhere to and remain closely adhered to a body adhered thereto. The curable composition is characterized by in...  
WO/2016/201520A1
A method for cross-linking an uncured or partially-cured epoxy resin system, the epoxy resin system including at least one epoxy compound, the epoxy compound including at least one glycidyl chemical group attached to at least one aniline...  
WO/2016/204115A1
Provided is a cured object which is excellent in terms of heat resistance, crack resistance (or thermal shock resistance), adhesiveness to adherends, and adhesive property. The cured object according to the present invention is obtained ...  
WO/2016/196448A1
The invention is directed to a toughener for epoxy adhesives, the toughener being a reaction product of a bisphenolic blocked PU toughener with a diglycidyl ether-bisphenol product such as liquid DGEBA. The invention includes adhesives c...  
WO/2016/194952A1
An adhesive composition which can have excellent life performance and can have a wide margin for mounting, the composition comprising a cationically polymerizable compound, a hardening catalyst based on both an aluminum chelate and a sil...  
WO/2016/196561A1
Methods of bonding hardware to glass and other substrates are provided that do not require use of primers, mixing, fixturing, or autoclaving. These methods include the steps of disposing an adhesive layer on a bonding surface of either t...  
WO/2016/196778A1
The present teachings relate generally to a one-part epoxy-based adhesive paste composition, comprising: at least about 20% by weight of a liquid epoxy resin component; an amount sf a halogen-free flame retardant sufficient so that the r...  
WO/2016/191403A1
A novel 2K adhesive composition with its epoxy resin part comprising an organic polymeric solid containing a vinyl phenol moiety. Such adhesive composition provides a strong bond to oil-contaminated metal substrates when cured at room te...  
WO/2016/185956A1
Provided is a laminate which has superior low dielectric constant characteristics, which exhibits excellent adhesion between metal substrates and not only conventional polyimide and polyester film substrates, but also low polarity resin ...  
WO/2016/180574A1
The use of an electrically conductive composition for the adhesive bonding of an electronic component having a contact surface to a substrate having a contact surface via said contact surfaces, wherein the electrically conductive composi...  
WO/2016/177685A1
The invention relates to an adhesive strip, containing a temporary fixing adhesive for a first temporary fixing of two substrates to one another as a preliminary stage to a second final fixing of the two substrates, wherein the second fi...  
WO/2016/172911A1
The present invention relates to a one-part curable adhesive composition, in particular a one-part adhesive composition having excellent initial and aged lap shear strength as well as low viscosity, and to the use thereof.  
WO/2016/169874A1
The invention relates to a thermally curing adhesive composition, which can be used for joining components made of materials with different longitudinal expansion behaviors, to form a composite workpiece. The invention further relates to...  
WO/2016/165691A1
The aim of the invention is to provide an improved solution for an adhesive connection for the planar adhesion of components, in which the adhesive connection has a non-uniform stress distribution in different regions of the adhesive sur...  
WO/2016/165691A4
The aim of the invention is to provide an improved solution for an adhesive connection for the planar adhesion of components, in which the adhesive connection has a non-uniform stress distribution in different regions of the adhesive sur...  
WO/2016/167245A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burde...  
WO/2016/167873A1
A battery module includes a housing having an opening and an electrochemical cell disposed in the housing. The electrochemical cell includes a first cell surface having electrode terminals and a second cell surface substantially opposite...  

Matches 1 - 50 out of 14,037