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Matches 1 - 50 out of 15,536

Document Document Title
WO/2018/143189A9
The present invention achieves: a graphite-based thermal interface material that exhibits excellent thermal resistance properties even when used between members having uneven surfaces; and a production method for such a thermal interface...  
WO/2019/135857A1
Disclosed are one-component epoxy resin adhesive compositions which include (a) one or more non-rubber-modified epoxy resins; (b) one or more latent epoxy curing agents; (c) one or more toughening agents; and (d) zinc oxide nanoparticles...  
WO/2019/127172A1
This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present inventio...  
WO/2019/132365A1
An embodiment of the present invention provides: an adhesive coating composition enabling adherence (coupling) of an electrical steel sheet without using conventional coupling methods such as welding, clamping and interlocking; an electr...  
WO/2019/131591A1
Provided are an adhesive excellent in adhesion between a non-polar base such as an olefin resin and a metal base and thermal resistance, and a laminate and a battery packing material excellent in thermal resistance obtained by using the ...  
WO/2019/131852A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a linear transmit...  
WO/2019/131854A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a total light tra...  
WO/2019/124192A1
The purpose of the present invention is to improve storage stability of a resin composition used for applications such as semiconductor sealing materials. Provided is a resin composition, comprising: (A) an epoxy resin; (B) a curing agen...  
WO/2019/121682A1
The invention relates to a method for joining substrates having different coefficients of thermal expansion, in particular in the body shell of means of transportation or white goods, using a single-component heat-curing epoxy resin comp...  
WO/2019/124713A1
The present invention relates to a single-component epoxy-based adhesive composition for adhering a component comprising heterogeneous material, and an article using same. The present invention enables both excellent elongation propertie...  
WO/2019/124751A1
Provided are a polarizing plate and an optical display device comprising the same, the polarizing plate comprising a polarizer, and an adhesive layer and a first polarizer protective film sequentially stacked on the lower surface of the ...  
WO/2019/119782A1
The present invention relates to a halogen-free flame retardant H-class slot insulating material for nuclear power or a transformer, comprising a first polyimide film layer, a first mixed glue layer, a second mixed glue layer, a first wo...  
WO/2019/125341A2
The present invention relates to a vinyl ester latex adhesive composition with improved stability and tensile adhesion at elevated temperatures, produced by the delayed addition of silane compounds. The present invention also relates to ...  
WO/2019/123941A1
The present invention provides an epoxy compound A represented by formula (1). (In formula (1), each Ar independently represents a structure having an aromatic ring having an unsubstituted or substituted group, R1 and R2 each independent...  
WO/2019/123885A1
The objective of the present invention is to provide a radical-polymerizable adhesive composition which is for an adhesive laminated steel sheet and from which an adhesive laminate that contributes to the simplification of an adhesive la...  
WO/2019/115203A1
The invention relates to a single-component compound, which is liquid at room temperature and which can be fixed by radiation and cured by heat, and comprises the following components: (A) at least one difunctional compound containing ep...  
WO/2019/114047A1
A reactive thermally conductive insulating double sided adhesive tape and a preparation method therefor. The method comprises the following steps: taking raw materials of the following weight percentages: 5%-30% of an epoxy resin, 3%-50%...  
WO/2019/117428A1
The present invention relates to a dicing die bonding film and a dicing method of a semiconductor wafer using the dicing die bonding film, the dicing bonding film comprising: a substrate; an antistatic layer formed on the substrate and i...  
WO/2019/113780A1
Provided herein is a pressure sensitive adhesive (PSA) composition having high levels of removability, peel strength and solvent resistance. This PSA composition comprises a unique mixture of a polyacrylate base polymer, an epoxy crossli...  
WO/2019/117462A1
The present application can provide a method for manufacturing a battery module. The present application can provide a method for manufacturing a battery module with a simple process and at low cost without the generation of a reverse di...  
WO/2019/116348A1
Structural adhesive films are presented which comprise branched or networked polymers which are the reaction product of one or more polyether sulfone polymers, which may include amine-terminated polyether sulfone polymers and/or hydroxy-...  
WO/2019/111978A1
Achieved are: a nitride ceramic resin composite body that has further improved reliability in terms of heat resistance during the reflow process, while exhibiting heat conductivity, electrical insulation and adhesion to an adherend, whic...  
WO/2019/112168A1
Provided are a polarizing plate and an optical display device comprising the same. The polarizing plate comprises: a polarizer; and a first protective layer laminated on one surface of the polarizer through an adhesive layer, wherein the...  
WO/2019/111778A1
The pasty adhesive composition of an embodiment according to the present invention comprises an epoxy resin and silver particles and, upon a heat treatment, comes to have connected-silver-particle structures each formed therein from two ...  
WO/2019/106835A1
Provided is a resin composition containing 40-60 vol% of an inorganic filler, wherein (1) the resin composition has a thixotropic index of 1.2-10 at 25°C, has a viscosity of 3.5-50 Pa・s as measured under the conditions of 25°C and 5 ...  
WO/2019/101918A1
The invention relates to an adhesive tape comprising at least one layer of an adhesive adhesion compound which comprises a polymer film-forming agent matrix and a curable composition, said curable composition having at least one epoxy re...  
WO/2019/103515A1
The present specification relates to a polarizing plate and an image display device comprising same.  
WO/2019/103513A1
The present specification relates to a polarizing plate and an image display device comprising same.  
WO/2019/103514A1
The present specification relates to a polarizing plate, an image display device comprising same and a photocurable composition for a polarizing plate protection layer.  
WO/2019/101913A1
The invention relates to a process for producing pressure-sensitive adhesive compositions which comprise at least one elastomer component and at least one reactive adhesive, comprising one or more reactive resins, at least one of the rea...  
WO/2019/101914A1
The invention relates to an adhesive tape comprising at least one layer of an adhesive adhesion compound which comprises a polymer film-forming agent matrix (M) and a curable composition, said curable composition comprising at least one ...  
WO/2019/099227A1
A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerize...  
WO/2019/095397A1
Disclosed is a highly thermally and electrically conductive environmentally-friendly adhesive comprising the following components: a modified epoxy resin, konjak glucomannan, chitosan, a thermally conductive filler, an electrically condu...  
WO/2019/092968A1
Provided is a resin composition having excellent preservation stability and solubility in a low-boiling point solvent such as methyl ethyl ketone. The resin composition is produced through a melt-mixing step of melt-mixing a resin mixtur...  
WO/2019/092933A1
The purpose of the present invention is to provide: a filmy adhesive capable of preventing the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially damaged by th...  
WO/2019/059666A3
The present specification relates to an adhesive composition and a polarizing plate comprising an adhesive layer formed using same.  
WO/2019/088009A1
Provided is a laminate having excellent flexibility and high flexural strength. Also provided is a reinforcing sheet comprising said laminate. This laminate has an adhesive layer and a constraining layer, wherein the constraining layer i...  
WO/2019/059667A3
The present specification relates to an adhesive composition and a polarizing plate comprising an adhesive layer formed using same.  
WO/2019/059630A3
The present specification relates to an adhesive composition and to a polarization plate comprising an adhesive layer formed using the same.  
WO/2019/081581A1
The present invention relates to heat-curing one-component epoxy resin compositions which exhibit a good storage stability. The epoxy resin compositions are particularly suitable for use as a structural adhesive and for producing structu...  
WO/2019/083006A1
The purpose of the present invention is to provide a curable resin composition which has superior flame retardancy, adhesiveness, high-temperature long-term heat resistance, and moisture-absorption reflow resistance, and low environmenta...  
WO/2019/082962A1
The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy com...  
WO/2019/080540A1
A gearbox-oil-resistant and halogen-free flame-retardant groove insulating material of an electric vehicle motor and an application thereof, comprising first weaving glass cloth, a polyphenylene sulfide thin film, and second weaving glas...  
WO/2019/079026A1
An epoxy-based crash durable adhesive composition including: (I) a liquid resin system comprising: (a) at least one epoxy resin; and (b) at least one toughener; wherein the viscosity of the above liquid resin system is less than about 80...  
WO/2019/072017A1
Disclosed are a photovoltaic assembly bus-bar insulating tape, a bus-bar containing same, and a photovoltaic assembly. The tape includes an insulating substrate layer and an adhesive layer formed on a surface of one side of the insulatin...  
WO/2019/069866A1
Provided are: a curable composition of which a cured product after being cured has high strength, high rigidity and flexibility; and a cured product obtained by curing said composition. The present invention provides a multi-pack type cu...  
WO/2019/069896A1
The present invention provides an adhesive that is characterized by containing an acid-group-containing resin and an epoxy compound A that contains an aromatic ring, a C4–10 alkylene chain, and at least two epoxy groups. Also provided ...  
WO/2019/069895A1
The present invention addresses the problem of providing: a curable adhesive sheet that can provide reinforcement to a level capable of preventing detachment or the like of mounted components, without using a reinforcing plate which may ...  
WO/2019/065268A1
The present invention relates to a method for producing a layered product including an adherend (C1) and a joining material (X), the method including, in this order, a step [1] of activating a reaction site in the joining material (X), a...  
WO/2019/060513A1
Disclosed is a tielayer composition having an epoxy-containing compound, a polythiol curing agent, a curing catalyst, and a solvent present in an amount of at least 25% by weight, based on the total weight of the tielayer composition. Al...  

Matches 1 - 50 out of 15,536