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Matches 1 - 50 out of 14,602

Document Document Title
WO/2017/177827A1
Disclosed are a frame sealing glue, a preparation method therefor, and a liquid crystal display device. The frame sealing glue comprises modified epoxide obtained in a manner in which a piperidine compound and an epoxy compound are combi...  
WO/2017/179536A1
A curable composition which contains 100 parts by mass of (A) a flexible epoxy resin, 1-150 parts by mass of (B) polymer fine particles, each having a core-shell structure having at least two layers that are a core layer and a shell laye...  
WO/2017/176832A1
A weldable adhesive or sealant formulation comprising a structural tape including a solid rubber, a liquid rubber, a tackifier, and an epoxy, wherein the tape is weldable and substantially free of any fibrous filler and includes less tha...  
WO/2017/175740A1
Provided are: an amine compound represented by general formula (1), which has a low active hydrogen equivalent, and which, when used as an epoxy resin curing agent, exhibits sufficient curing properties even when a small amount thereof i...  
WO/2017/171367A1
The present invention relates to a semiconductor device comprising: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermi...  
WO/2017/168828A1
Provided is a tape for an electronic device package, with which it is possible to suppress the occurrence of bending and marks in a metal layer, which are caused by the edge section of the rotating stage of a pickup device when picking u...  
WO/2017/168829A1
Provided is a tape for an electronic device package which, when picking up an adhesive layer-equipped metal layer from a pressure-sensitive adhesive tape, enables appropriate recognition of individual segments of the adhesive layer-equip...  
WO/2017/171492A1
The present invention relates to a semiconductor device, and a method for manufacturing a semiconductor device by using an adhesive, for a semiconductor, having a predetermined melt viscosity and thixotropic index, the semiconductor devi...  
WO/2017/169574A1
The purpose of the present invention is to provide a photosensitive adhesive composition that has an excellent filler dispersibility at the time of preparation of a coating material, and a photosensitive adhesive sheet that has a high me...  
WO/2017/168825A1
Provided is an electronic device package tape such that a metal layer can be held on a base tape during precutting and the base tape can be satisfactorily detached during use. An electronic device package tape 1 of the present invention ...  
WO/2017/171324A1
The present invention relates to a flexible color filter and a manufacturing method therefor, the method forming a protective layer before a black matrix layer is formed in the manufacture of a color filter being processed on a carrier s...  
WO/2017/168820A1
Provided is an electronic device package tape that can inhibit the occurrence of warpage in a layered product of a semiconductor, bonding adhesive layer, and semiconductor chip when precuring the bonding adhesive layer and that can inhib...  
WO/2017/168830A1
Provided is tape for electronic device package which, when picking up an adhesive layer-equipped metal from a pressure-sensitive adhesive tape, can minimize the occurrence of pin indentations due to the deformation of the metal layer by ...  
WO/2017/164536A1
The present invention provides a thermosetting adhesive composition and an adhesive film formed by drying the composition, the thermosetting adhesive composition having a Cl content of 100 ppm or less and comprising 0.01-2 parts by weigh...  
WO/2017/163900A1
Provided are: a two-part curable laminate adhesive characterized by containing, as essential components, a polyurethane polyurea resin (A) having a primary amino group in the molecular structure thereof, and a polyglycidyl ether of a lin...  
WO/2017/158917A1
Provided is an adhesive composition which is suitable for laminating a polyimide film to copper foils to produce a double-sided copper-clad laminate for use in producing flexible printed wiring boards. The adhesive composition comprises ...  
WO/2017/158994A1
A film-like adhesive composition containing each of an epoxy resin, an epoxy resin curing agent, a phenoxy resin and an aluminum nitride filler, wherein the content of the aluminum nitride filler is 30-60% with respect to the total amoun...  
WO/2017/160310A1
A composition and method for a spray applied BPA free two-part, self-setting composition adapted for delivering the components of the composition at a temperature that promotes their spray application at a proper viscosity as well as ind...  
WO/2017/154281A1
Provided is a method with which it is possible to select, with high-precision, an adhesive agent with excellent alkali resistance and suitable for manufacturing an alkaline secondary battery. This method for selecting an adhesive agent i...  
WO/2017/154405A1
An organosilicon compound represented by formula (1), which has, per alkoxysilyl group, a plurality of epoxy groups each capable of reacting with an organic resin moiety to form a bond and which hence is useful as a primer, a resin modif...  
WO/2017/151898A1
A curable adhesive composition includes a curable epoxy resin, an amine curing agent, a toughening agent, and aluminum flakes. The aluminum flakes include a fatty acid milling aid on at least a portion of their surfaces. The aluminum fla...  
WO/2017/147184A1
Techniques are described for mounting a display and/or display cover to a housing of a display device, such as a mobile phone. In an embodiment, the housing and display cover include chamfered edges at complementary angles to allow for a...  
WO/2017/145624A1
An adhesive film which comprises an acrylic resin (a), an epoxy resin (b), a hardener (c), and an α-alumina filler (d), wherein the α-alumina filler (d) comprises a polyhedral α-alumina filler having a purity of 99.90 mass% or higher ...  
WO/2017/142094A1
An adhesive film for multilayer printed wiring boards, which comprises a resin composition layer that is obtained by forming a layer from a resin composition on a supporting film, said resin composition containing (A) a novolac phenolic ...  
WO/2017/141449A1
One aspect of the present invention is a pressure-sensitive adhesive which comprises 100 parts by mass of (A) an acrylic polymer having a glass transition temperature of -50 to -25ºC, 0.01-3 parts by mass of (B) a silane coupling agent ...  
WO/2017/137796A8
The present invention provides an adhesive resin composition excellent in terms of adhesive strength and durability, a method for bonding adherends, and an adhesive resin film. Specifically, the present invention relates to: an adhesive ...  
WO/2017/138447A1
The present invention provides a resin composition with which a substrate for electronic-circuit formation or a substrate for semiconductor-circuit formation can be bonded to a supporting substrate and which, in the state of being bondin...  
WO/2017/138253A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138255A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/137796A1
The present invention provides an adhesive resin composition excellent in terms of adhesive strength and durability, a method for bonding adherends, and an adhesive resin film. Specifically, the present invention relates to: an adhesive ...  
WO/2017/138252A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/133120A1
Disclosed are a frame sealing adhesive, a liquid crystal panel, a liquid crystal display and a preparation method belonging to the technical field of liquid crystal display. The disclosed frame sealing adhesive comprises a frame sealing ...  
WO/2017/126568A1
The purpose of this invention is to provide an epoxy resin composition with which it is possible to form a cured epoxy resin having excellent initial transparency and weather resistance as well as excellent adhesion to various substrates...  
WO/2017/127253A1
A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at ...  
WO/2017/126766A1
The present invention relates to a method for manufacturing a mobile phone antenna using a flat coil, wherein the method does not use a round coil but uses a flat coil having a certain pattern made of flat wire, and can thereby maximise ...  
WO/2017/121826A1
The invention relates to a single-component thermosetting epoxy resin comprising a) at least one epoxy resin with more than one epoxy group per molecule on average; b) at least one latent curing agent for epoxy resins; and c) at least on...  
WO/2017/119323A1
Provided are: a photocurable adhesive for bonding a thermoplastic resin film to a polyvinyl alcohol-based polarizer; and a polarizing plate which uses this photocurable adhesive. This photocurable adhesive contains, per 100 parts by weig...  
WO/2017/118226A1
Disclosed is a frame sealant composition, comprising a main component and high-strength fibers with a specific surface area of 2,000-30,000 m2/g. The amount of high-strength fibers added is equal to 0.5-3% of the weight of the main compo...  
WO/2017/119274A1
Provided is an adhesive composition having excellent life properties. This adhesive composition achieves excellent life properties by containing an epoxy compound, an aluminum chelating agent and a hindered amine compound. This is consid...  
WO/2017/117163A1
Provided are methods and associated compositions directed to a structural bonding adhesive. The structural bonding adhesive is made by mixing a curable composition comprising a mixture of a first curable resin and a second curable resin ...  
WO/2017/110202A1
A tape for semiconductor processing is provided which enables excellent singulation of semiconductor wafers during dicing and which enables preventing package cracking during packaging. This semiconductor processing tape 10 is characteri...  
WO/2017/109011A1
The invention relates to an adhesive tape, particularly a transfer adhesive tape, comprising an epoxy-based thermally-curable adhesive compound which consists of approximately 10 to approximately 60 percent by weight of at least one epox...  
WO/2017/109620A1
An epoxy resin component for an adhesive composition is disclosed. Said epoxy resin component comprises of an epoxy resin premix; and a filler composition comprising cenospheres and wollastonite in a w/w (weight / weight) ratio in a rang...  
WO/2017/104298A1
The present invention provides an epoxy resin composition which is suitable as an under-fill material for three-dimensional packaging, and has a low uranium content and excellent filling properties, and in which the occurrence of voids i...  
WO/2017/104670A1
Provided are: a heat-curable adhesive sheet that reduces warping of a semiconductor wafer and reduces the occurrence of chipping; and a production method for a semiconductor device. The heat-curable adhesive sheet has a heat-curable adhe...  
WO/2017/104165A1
An adhesive composition which comprises a polyfunctional epoxy compound (a) that contains an added poly(alkylene oxide) and is represented by the following general formula (A), a polyfunctional (meth)acrylate monomer (b), and a photo-aci...  
WO/2017/103080A1
The invention relates to a composition comprising at least one structural adhesive and at least one chemically crosslinked elastomer based on a silane-functional, non-polar polymer, said elastomer being provided in the form of a penetrat...  
WO/2017/100750A1
An adhesive comprising an allyl (urethane) silane, where the allyl (urethane) silane comprises at least one allyl-functional group and one silane-functional group connected through a urethane linkage. Preferably, the allyl(urethane) sila...  
WO/2017/099449A1
The present invention relates to a complex polarizing plate and, more specifically, to a complex polarizing plate comprising: a polarizer; and complex phase difference layers disposed on at least one surface of the polarizer, and having,...  
WO/2017/098879A1
Provided are: an epoxy resin which has high flowability and, despite this, gives cured objects excellent in terms of heat resistance and moist-heat resistance; a process for producing the epoxy resin; a cured object obtained from the epo...  

Matches 1 - 50 out of 14,602