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WO/2002/091433A2 |
The invention relates to a method for grinding the back sides of wafers using foils having a carrier layer known per se and a gradually polymerizable adhesive layer. The invention also relates to foils having said gradually polymerizable...
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WO/2002/084918A2 |
A shaped sealing material for electrical/electronic appliances which is free from dust particle adhesion thereto and is easy to handle although it is a sealing material obtained by forming a pressure-sensitive adhesive layer on a foam. A...
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WO/2002/081586A1 |
The invention relates to a hot melt processable pressure sensitive adhesive comprising at least one elastomer, organophilic clay plate-like particles, and at least one non-volatile organophilic exfoliating agent. Also disclosed are artic...
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WO/2002/079337A1 |
The present invention is directed to structural bonding tapes and methods of making such tapes. The present invention further directed to articles of manufacture containing one or more components bonded together with structural bonding t...
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WO/2002/070582A1 |
Compounds of the formula I wherein Q denotes a n-valent residue of an aliphatic polyol having a weight average molecular weight m¿w? of 100 to 25000, n is an integer from 2 to 512, R¿1? is hydrogen or methyl, A denotes a m-valent aliph...
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WO/2002/070583A2 |
The invention is directed to a method for preparing an environmentally degradable polymeric compound as well as to such a compound per se and to its use. A compound of the present invention is comprised of a polycondensated lactic acid c...
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WO/2002/062864A2 |
Disclosed is a two-part polyurethane structural adhesive and method of bonding structural components, that exhibits at least 25 minutes of open time at 32 °C in large beads and cures to high strength under ambient conditions. The adhesi...
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WO/2002/045763A2 |
Hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a bacteriostat. The bacteriostat is incorporated into the adhesi...
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WO/2002/034857A2 |
Polyhydroxyalkanoate compositions including hot melt adhesive compositions, biodegradable wax compositions, and protective coating compositions are provided and include a low molecular weight polyhydroxyalkanoate, a terminally-modified p...
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WO/2002/020263A1 |
The present invention provides a coated polymer film having heat seal properties. The heat seal coating includes a propylene diol copolyester. Preferably, the copolyester is formed from 1,3-propane diol, isophthalic acid and a sulfomonom...
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WO/2002/018134A1 |
A molded laminate with excellent peel strength which is obtained from a thermoplastic polymer composition having excellent fusion bondability, especially in a high-temperature atmosphere, to thermoplastic resins, in particular a polyamid...
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WO/2002/016497A1 |
A biaxially oriented polyester film, an adhesive film or a colored hard coating film, which contains a coloring matter, and has, in the wave length range of 540 to 630 nm, (1) a wave length (X) of a maximum absorption peak of a light in ...
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WO/2002/010299A2 |
An adhesive composition having (i) a tackifying polymer and (ii) a crystalline polymer, such that the content of the tackifying polymer is from 55 to 95 wt. % based on the whole weight of the composition, and the content of the crystalli...
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WO/2002/010303A2 |
To provide an adhesive for glass, which is particularly suitable for adhering an article to a glass surface as an adhering surface, exhibits good slidability without the use of detackifying particles, and has removal cleanliness after th...
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WO/2001/092434A1 |
A composition including at least one anaerobically polymerizable compound; and at least one condensation product of an aldehyde and or ketone/with a polyol. The invention also provides a composition as described above which is in the for...
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WO/2001/074963A1 |
The invention is directed to an adhesive composition comprising a water based component including a film-forming polymer and a particulate thermoplastic component selected from the group consisting of thermoplastic polymers, thermoplasti...
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WO/2001/066666A2 |
A water-sensitive hot melt adhesive composition based on sulfonated branched copolyester polymers for use with articles such as paper products, disposable nonwoven products, tapes, labels and packaging materials. The adhesive composition...
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WO/2001/060939A1 |
The invention relates to a novel polyester tackifier, adhesive compositions comprising the tackifier and methods of preparation. More specifically, the polyester tackifier is obtainable by polymerising a mixture comprising a diacid or de...
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WO/2001/056415A2 |
Handcovering, i.e. glove (72) or mitten, comprising an outer shell (50) and an inner glove insert (52) adhered to the shell (50). The glove insert (52) comprises a lining fabric laminated to a functional layer (42) that is water vapor pe...
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WO/2001/051581A1 |
A pressure-sensitive adhesive composition which has pressure-sensitive adhesive properties at ordinary temperature, cures by the action of light, and gives a cured adhesive layer having excellent adhesion to highly polar adherends such a...
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WO/2001/049797A2 |
A multi-layered article for establishing a seal between two substrates. The multi-layered article includes a bulk layer and an adhesive layer. The layers of the article are generally epoxy-containing, photo-activated materials. Upon phot...
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WO/2001/046288A1 |
A resin composition curable with actinic energy rays which comprises (A) at least one resin curable with actinic energy rays and (B) a free-radical photopolymerization initiator. In a first embodiment of the composition, at least 50 wt.%...
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WO/2001/046294A1 |
Coating composition and its use in a one-pot system. The coating composition comprises: an oxidatively drying polyunsaturated condensation product, such as an alkyd, having pendant groups in an amount of more than 20 % by weight of the c...
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WO/2001/040336A2 |
An aqueous dispersion of an acrylate modified alkyd resin which can be produced in the following manner in the presence of at least one watermixable diol: 1) at least one alkyd resin containing 0.1. 10 % side or terminal allyloxy groups ...
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WO/2001/021725A1 |
A susceptor composition that can bond two or more layers or substrates to one another and that can be used to coat or cut a substrate. The susceptor composition is activated in the presence of radio frequency (RF) energy. In one embodime...
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WO/2001/018144A1 |
A photocurable pressure-sensitive adhesive composition which has pressure-sensitive adhesive properties at ordinary temperature, cures upon exposure to light to give a cured film having sufficient bonding strength especially when applied...
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WO/2001/016232A1 |
The invention provides a composition that exhibits good adhesion to polyamide material and other materials, comprising 60 to 99 weight percent of a copolyester elastomer, and 1 to 40 weight percent of a novolac resin, based on the total ...
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WO/2001/010661A1 |
A glazing adhesive product comprising a thermoplastic polyester material having trapped gas bubbles dispersed therein whereby the product has surface pores to provide a suction effect. Also provided is a method of installing/removing veh...
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WO/2001/004230A1 |
An adhesive for fusion bonding which is obtained by heating a thermoplastic resin to a temperature not lower than the softening point of the resin and dispersing the resin in a softened state into an aqueous medium to form an aqueous dis...
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WO/2000/077066A2 |
The invention relates to the process for the preparation of liquid reaction products of cycloaliphatic epoxides with mono- or multifunctional hydroxy compounds. The process comprises reacting a polyfunctional cycloaliphatic epoxy resin w...
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WO/2000/075241A2 |
Radiation curable compositions for coatings, adhesives, inks, and molded articles are disclosed. The radiation curable compositions comprise: (A) at least one polymerizable, ethylenically unsaturated compound of one of formulae (I, II, I...
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WO/2000/066340A1 |
The invention relates to a method for manufacturing encapsulated electronic components (2), particularly integrated circuits, at least successively comprising the following steps: a) attaching electronic components (2) on a first side of...
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WO/2000/064959A1 |
The present invention relates to a composition comprising: a compound comprising two or more olefinically unsaturated groups comprising at least on electron-withdrawing functionality linked to a carbon atom of the unsaturated bond; a com...
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WO/2000/047654A1 |
According to the invention, a highly resistant polymeric resin modified with dendrimers is produced. The modified polymeric resin exhibits substantially improved properties in terms of impact resistance, tenacity, ageing performance, cra...
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WO/2000/046318A1 |
The present invention relates to a pressure sensitive adhesive tape comprising at least one pressure sensitive adhesive layer that is capable of being cured upon exposure to actinic radiation or electron beam radiation and comprises: (i)...
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WO/2000/042115A1 |
To provide a photo curable resin composition comprising (A) a cationically polymerizable organic compound, (B) a cationic photopolymerization initiator, (C) a polyol having two or more hydroxyl groups in the molecule, and (D) an organoti...
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WO/2000/037554A1 |
The invention relates to compositions which are based on a copolymer with at least one glass transition temperature of -30 °C or lower and groups which are reactive with epoxides or a reaction product of said copolymer with a polyepoxid...
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WO/2000/037119A1 |
The present invention relates to biodegradable PHA copolymers comprising at least two randomly repeating monomer units. The present invention further relates to a plastic article comprising a biodegradable copolymer, wherein the biodegra...
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WO/2000/034406A1 |
The invention relates to an adhesive powder for assembling flat, non-porous or porous substrates, whereby, in a first step, the adhesive powder is applied onto a first substrate, and an intermediate product is produced which is non-adher...
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WO/2000/034404A1 |
The invention relates to an adhesive which contains magnetic nanoparticles, to a method for producing said adhesive and to the use of an adhesive containing nanoparticles.
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WO/2000/029498A1 |
The invention relates to a two-component material for chemical fixing means, containing a radically hardenable synthetic resin and a hardening agent for the synthetic resin. According to the invention, a monoacrylate and/or a monomethacr...
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WO/2000/026310A1 |
A binder resin for application to polyolefin resins which is excellent in gasohole resistance, adhesion, weatherability, etc.; and a primer composition, coating composition, ink composition, and adhesive composition. The binder resin com...
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WO/2000/023536A1 |
Polyesterpolyols modified by grafting with vinyl monomers are suitable as thermoplastic hot melt adhesives and exhibit good properties in terms of resistance to tension and shear on different materials, tensile strength or elongation at ...
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WO/2000/006637A1 |
Polymer foam articles having a substantially smooth surface prepared by melt-mixing a polymer composition and a plurality of microspheres, at least one of which is an expandable polymeric microsphere, under process conditions, including ...
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WO/2000/002971A1 |
A structure adhesive resin composition is provided. The adhesive resin composition includes an unsaturated polyester, a graft copolymer and an amine activator. The polyester is a first polyester derived from dicyclopentadiene, a second p...
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WO/1999/067343A1 |
The invention relates to a thermosettable adhesive comprising a thermosettable polymer component, a thermoformable polymer component, an effective amount of a heat-activatable and/or photoactivatable curing system for curing the thermose...
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WO/1999/060070A1 |
After adhesive is applied to metal wiring, metals of the metal wiring film dissolve as ions into the adhesive as a change with time. Especially, when the adhesive is mainly composed of a polyester resin, the adhesion and insulation degra...
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WO/1999/060069A1 |
A flame-retardant adhesive or flame-retardant adhesive film which each contains a halogen-free flame retardant and comprises the following ingredients: (A) a polyester resin, (B) a nitrogenous organic compound flame retardant, and (C) a ...
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WO1999027405A9 |
A flexible energy-carrying circuit device has reduced flame retardancy while maintaining desired levels of adhesion between the energy-carrying filaments and the substrate with use of a flame-retardant pressure-sensitive adhesive compris...
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WO/1999/055793A1 |
The invention relates to a thermoplastic elastomer (TPE) article reinforced with a metal element. The reinforcing metal element comprises on its surface an adhesive tie-layer.
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