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Patent Searching and Data


Matches 1 - 50 out of 3,909

Document Document Title
WO/2017/097157A1
Disclosed are novel copolyester hot-melt adhesive and a preparation method therefor. The preparation method is mainly characterized by: selecting raw materials according to a preset proportion, the raw materials comprising bisphenol A, c...  
WO/2017/090440A1
Provided is a circuit member-connecting resin sheet made of a film-shaped resin composition which is interposed between facing electrodes and electrically connects the facing electrodes, the resin sheet being characterized in that the cu...  
WO/2017/090439A1
Provided is a resin sheet for connecting circuit members, said sheet being interposed between opposing electrodes and used to electrically connect the opposing electrodes. The resin sheet for connecting circuit members is characterized i...  
WO/2017/074840A1
A buttress assembly is configured to temporarily adhere to a wet surgical stapler end effector. The buttress assembly includes a buttress body and a humidity tolerant adhesive. The adhesive includes a bioabsorbable polymer having a block...  
WO/2017/055045A1
The invention pertains to a non-reactive hot-melt adhesive comprising - 10-90 wt.%, calculated on the weight of the adhesive, of amorphous thermoplastic resin which is compatible with polylactic acid, wherein the amorphous thermoplastic ...  
WO/2017/055044A1
The invention pertains to a non-reactive hot-melt adhesive comprising - 10-90 wt.%, calculated on the weight of the adhesive, of amorphous thermoplastic resin which is compatible with polylactic acid, - 10-90 wt.%, calculated on the weig...  
WO/2017/037170A1
The present patent application relates to a method for gluing two adjacent substrates together by using a radiation curable adhesive composition and a use of a radiation curable adhesive composition for gluing. In particular, the method ...  
WO/2017/030881A1
Polyester pressure-sensitive adhesives are described. The polyester includes at least two different diacid residues and at least two different diol residues. The polyester includes at least one pendant group containing an alkenyl group. ...  
WO/2017/031042A1
Polyester pressure-sensitive adhesives are described. The polyester includes at least two different diacid residues and at least two different diol residues. The at least two different diacid residues include, based on the total moles of...  
WO/2017/030877A1
A polyester including at least one crosslinkable moiety is described. Each crosslinkable moiety includes at least one crosslinkable pendent group. A ratio of a total number of the at least one crosslinkable pendent groups to a total numb...  
WO2017008242A1
The present invention relates to curable novel resins and prepolymers, methods of manufacture and compositions made therefrom. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular,...  
WO/2017/006799A1
[Problem] To provide an adhesive composition that is flexible and that realizes exceptional adhesion durability. [Means for solving problem] Provided is an adhesive composition containing (a) a 2-cyanoacrylic acid ester, (b) a polymer ha...  
WO/2016/202985A1
A composition with improved adhesive and sealant properties comprises a) a pre-polymer comprising a polymeric unit of the general formula (-A-B-)n, wherein A represents a substituted or un-substituted ester, B represents a substituted or...  
WO/2016/202984A1
A composition with improved adhesive and sealant properties comprises a) a pre-polymer comprising a polymeric unit of the general formula (-A-B-)n, wherein A represents a substituted or un-substituted ester, B represents a substituted or...  
WO/2016/199717A1
This curable resin composition includes: a resin component having ethylenically unsaturated groups; and crosslinkable particles obtained by bonding, to surfaces of base particles, polymer graft chains having ethylenically unsaturated gro...  
WO/2016/186073A1
The present invention provides: a reinforcing tape that has an excellent adhesiveness to a conductor and that can prevent a trouble such as the reinforcing tape being peeled off the conductor when a treatment such as gold plating is perf...  
WO/2016/166292A1
The present invention is directed to a polymer blend comprising at least one polyalkylencarbonate (PAC) and at least one polyhydroxyalkanoate (PHA) with low crystallinity. The invention also describes processes to prepare the blends of t...  
WO/2016/147830A1
Provided are: an adhesive coating material which, when bonding a solar cell sealing material to a base sheet, exhibits excellent adhesive strength and moist-heat resistance; a polyol composition for the coating material; a cured object o...  
WO/2016/139144A1
The invention relates to polyester-based hot-melt adhesives which have low VOC and fogging values.  
WO/2016/139146A1
The invention relates to polyester-based hot-melt adhesives which have low VOC and fogging values.  
WO/2016/125829A1
The present invention is a copolyester resin that makes it possible to obtain an adhesive agent resin having excellent color and durability when used in adhesive agents applied for various purposes, wherein the copolyester resin satisfie...  
WO/2016/107146A1
Disclosed in the present invention are a temporary bonding adhesive for processing a thin wafer and a preparation method thereof. Per 100 total parts by weight of the temporary bonding adhesive, the temporary boding adhesive comprises 55...  
WO/2016/101895A1
Disclosed are a non-crystalline high melting point polyester hot-melt adhesive and a preparation method therefor. Since a specific formulation proportion is adopted and a specific ethylene terpolymer is used to modify the polyester, the ...  
WO/2016/105722A1
The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present i...  
WO/2016/097269A1
A reaction resin composition having a resin component which contains a radically polymerizable compound and having an initiator system which contains an α-halocarboxylic acid ester and a catalyst system that comprises a nitrogen-contain...  
WO/2016/096904A1
Curable formaldehyde-free resin dispersions for the manufacture of improved mineral fiber products such as mineral wool insulating products. The curable resins comprise an aqueous dispersion of a) a water-insoluble native starch, b) a no...  
WO/2016/077355A1
The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present i...  
WO/2016/068197A1
This release sheet 1 comprises a base 12 and a release agent layer 11 disposed on the base 12. The release agent layer 11 is constituted of a cured object of a release agent composition containing 50 mass% or more diene-based polymer. Th...  
WO/2016/070067A1
Embodiments of the present disclosure relate to adhesive compositions containing an adhesive resin and a crosslinkable component. The novel compositions can exhibit synergistic improvements in parameters such as modulus, overlap shear st...  
WO/2016/037062A1
Hot melt adhesive with renewable raw materials are described. The hot melt adhesives comprise (a) a polyester-based resin; (b) a functionalized polyolefin or a functionalized wax; and (c) a tackifier. The hot melt adhesive has similar pe...  
WO/2016/036701A1
Optically clear curable adhesive films that are heat conformable prior to setting include a reactive composition. The curable films are flexible and free-standing, and have a complex viscosity of greater than 100,000 poise (10,000 Pascal...  
WO/2016/031786A1
A conductive adhesive sheet which comprises at least an adhesive conductive layer (X) and a non-adhesive conductive layer (Y), and wherein: the adhesive conductive layer (X) is a layer that is formed from an adhesive composition containi...  
WO/2016/031787A1
A conductive adhesive sheet which comprises at least an adhesive conductive layer (X) and a non-adhesive conductive layer (Y), and wherein: the adhesive conductive layer (X) has a surface resistivity (ρSX) of from 1.0 × 102 Ω/□ to 1...  
WO/2016/024612A1
 A polyester resin characterized in that the glass transition temperature is from -40 to 40°C, the number of inflection points in a temperature-deformation curve measured by a softening temperature test method by thermomechanical anal...  
WO/2016/021409A1
The purpose of the present invention is to provide an adhesive composition that has excellent post-hardening heat resistance, appearance, flame retardancy, and electrical characteristics. The adhesive composition according to one embodim...  
WO/2016/011923A1
Disclosed in the present invention is a method for preparing a polyester hot melt adhesive with a high viscosity and a locally sensitive viscosity-temperature property, which comprises the following steps: (1) subjecting terephthalic aci...  
WO/2016/010132A1
Provided are: an adhesive for solar-cell backsheets which has an excellent curing rate and can exhibit excellent adhesion performance in a short aging period; a polyol composition for use in the adhesive; a solar-cell backsheet obtained ...  
WO/2015/197646A1
The invention relates to a two- or multi-component system having: at least one polyester component 1 which comprises: i) at least one unsaturated polyester; ii) at least one ethylenically unsaturated monomer; iii) at least one inorganic ...  
WO/2015/194805A1
The present invention provides an adhesive composition comprising a polyester resin and a crosslinking agent, a polarizing plate comprising the same, and a liquid crystal display. The adhesive composition for a polarizing plate according...  
WO/2015/174550A1
Provided is a transfer sheet comprising a support layer, a first layer, and a second layer. The second layer is a layer that is thermocompression bonded to an object to be transferred and is at least one type selected from the group cons...  
WO/2015/169897A1
The present invention encompasses a one-pack binder for heat-seal applications, useful for sealing polyester films, especially polyethylene terephthalate (PET) films, to polystyrene, PVC and polyester receptacles. Said polyesters may in ...  
WO/2015/166796A1
Provided is a flat-cable reinforcing tape whereby adequate adhesive force can be maintained for a long period of time in a high-temperature, high-humidity environment, and a flat cable which uses the flat-cable reinforcing tape. The pres...  
WO/2015/153226A1
A hot melt adhesive including a poly(lactide) homopolymer or copolymer with a molecular weight of about 1000 to about 40000 Daltons; and a plasticizer including an ester with about 50% to about 99% bio-based content; wherein the viscosit...  
WO/2015/151551A1
 The present invention provides a polyester adhesive composition having high wettability and exceptional adhesiveness and light-release properties, and an adhesive sheet using the same. This polyester adhesive composition contains a bi...  
WO/2015/150580A1
The invention relates to a non-reactive hot melt adhesive containing a copolymer being substantially composed of a reaction product of lactide (L) and caprolactone (C) in a molar ratio (L/C) of at least 1.5. According to the invention, t...  
WO/2015/137033A1
An anisotropic conductive film for connecting a terminal of a first electronic component and a terminal of a second electronic component to one another in an anisotropic conductive manner, having an adhesive-layer-forming component and a...  
WO/2015/108026A1
The present invention is a co-polyester resin which contains a dicarboxylic acid component and a glycol component as the main constituent components; which satisfies such a requirement (1) that the co-polyester resin contains a flange ca...  
WO/2015/104992A1
An electric wire with connector (1) having a coated electric wire (2), a terminal fitting (3), a connector housing (4), and an adhesive (5). The coated electric wire (2) has a conductor (21) and a coating material (22) comprising a cross...  
WO/2015/098949A1
This film for temporary fixing is used in a processing method for a semiconductor wafer, said method comprising: a temporary fixing step wherein a semiconductor wafer is temporarily fixed to a supporting body with this film for temporary...  
WO/2015/093526A1
 Provided are a polyester-based adhesive layer, adhesive tape, and double-sided adhesive tape having excellent durability (storability in warm, humid conditions) and adhesive characteristics through use of a polyester-based adhesive co...  

Matches 1 - 50 out of 3,909