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WO/2019/182001A1 |
A film-like adhesive having the following characteristics: (I) when an initial detected temperature of the melt viscosity of the film-like adhesive after being stored for 168 hours at 40°C is T168, and when the initial detected temperat...
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WO/2019/167824A1 |
A paste adhesive composition which contains silver particles and a monomer, and forms a silver particle-linking structure in which the interfaces between the silver particles have been eliminated by a heat treatment, wherein: the silver ...
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WO/2019/145302A1 |
The present invention relates to a composition comprising a plurality of water-insoluble particles; and to a copolymer obtainable by the polymerization of dicyclopentadiene or cyclopentadiene and an ester of an unsaturated fatty acid. Th...
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WO/2019/127239A1 |
A low-modulus high-adhesion fabricated silane modified polyether adhesive used for a building. The low-modulus high-adhesion fabricated silane modified polyether adhesive is divided into a component A and a component B, wherein the compo...
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WO/2019/124712A1 |
The present invention relates to a single-component epoxy-based adhesive composition which enables compensation of brittleness of an epoxy-based adhesive by means of using together at least three toughening agents comprising phenoxy resi...
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WO/2019/126648A1 |
Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leavi...
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WO/2019/115952A1 |
The present invention concerns an adhesive multicomponent composition comprising: a composition A comprising: o at least one silylated polymer comprising at least one hydrolysable alkoxysilane group; o at least one tackifying resin; a co...
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WO/2019/117302A1 |
The present invention provides: a water-based temporary adhesive agent which comprises a thermoplastic resin having at least (A) a hydroxyl group and has both excellent temporary adhesion performance, excellent application performance, a...
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WO/2019/109328A1 |
Disclosed is a moisture curable hot-melt adhesive composition, comprising a silane modified polymer, a ethylenically unsaturated carboxylic acid graft modified polymer, and a tackifying agent. The moisture curable hot-melt adhesive compo...
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WO/2019/086716A1 |
The present invention consists in a new type of adhesion material and the method of production. This material is used in the medical area, or in areas where is necessary to connect a device to the skin. This connection occurred due to th...
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WO/2019/077942A1 |
A room temperature-curable composition which comprises: (a) an organosilicon compound containing a polyoxyalkylene group, said organosilicon compound having one or more hydrolyzable silyl group-containing monovalent organic groups repres...
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WO/2019/058795A1 |
[Problem] To provide a curable composition, a sealing material composition, and an adhesive composition having excellent workability and providing a cured product with excellent mechanical properties and weather resistance. [Solution] Di...
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WO/2019/057670A1 |
The invention relates to an adhesive composition, comprising at least polymer containing silane groups, between 15 and 35 wt.-% of at least one polymeric plasiticzer, between 0.5 and 2.5 wt.-% of at least one monomeric or oligomeric amin...
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WO/2019/053164A1 |
Disclosed is a polymer-metal junction including a polymer composition in contact with a metal substrate, where the polymer composition comprises a polymer component including a PEEK-PEDEK copolymer having a PEEK/PEDEK mole ratio ranging ...
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WO/2019/021557A1 |
Provided is a laminated body comprising a thinned glass plate and a resin film which are bonded together by means of an adhesive and having excellent bending resistance. A laminated body according to the present invention has a configura...
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WO/2019/002360A1 |
The present invention relates to adhesive compositions containing at least one aromatic epoxy resin, at least one compound having at least one oxetane group and at least one photoinitiator, to a method for gluing at least two components ...
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WO/2018/230249A1 |
This resin-metal composite member for a tire has a metal member, an adhesive layer, and a cover resin layer in the stated order, wherein the adhesive layer has: a continuous phase containing a polyester thermoplastic elastomer having a p...
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WO/2018/229417A1 |
Metal or metal-plated reinforcement, at least the surface of which is at least partly made of metal, at least the metal portion being coated with a sulphur polybenzoxazine, the recurring units of which comprise at least one unit correspo...
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WO/2018/213695A1 |
The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without m...
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WO/2018/203527A1 |
Provided are: an adhesive film comprising an adhesive agent layer containing a thermosetting resin, a thermoplastic resin, and a heat conductive filler, wherein the heat conductive filler has a thermal conductivity of 12 W/m·K or more a...
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WO/2018/181536A1 |
The present invention provides an adhesive composition containing: an anionic polymerizable or cationic polymerizable epoxy resin or oxetane resin; a first silane compound having a functional group that reacts with the epoxy resin or oxe...
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WO/2018/179682A1 |
Provided are: a wiring substrate having a low dielectric constant and a low dielectric tangent; and a copper foil having an adhesive agent adhered thereto and a copper-clad laminated plate, each of which is suitable for the production of...
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WO/2018/180685A1 |
The present invention provides: an anisotropic electroconductive adhesive which improves the reaction rate at a light-shielding part and which is capable of achieving excellent conduction resistance; and a production method for a connect...
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WO/2018/181846A1 |
Provided are: a curable composition which has low viscosity and enables the achievement of a cured product that has excellent adhesiveness; a method for producing a cured product; a cured product of the curable composition; and an adhesi...
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WO/2018/163445A1 |
Provided is a polyoxyalkylene group-containing organosilicon compound which contains at least one group represented by structural formula (1) in one molecule and has a polyoxyalkylene structure in the main chain. This polyoxyalkylene gro...
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WO/2018/152489A1 |
A curable adhesive that is particularly well suited for use in an injection or compression molding operation. The adhesive is based on polymeric resins having carboxylic acid and acrylate ester functionality, such as grafted phenoxy resi...
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WO/2018/147247A1 |
Provided is an actinic-ray-curable adhesive composition which has excellent adhesive force, is suitable for use in laminating any of various protective films for polarizers to a polarizing element, and is excellent in terms of curability...
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WO/2018/101438A1 |
The purpose of the present invention is to provide: an electrode structure which is free of the problem of dryness caused by the volatilization of water or an organic solvent and is provided with an adhesive agent layer having sufficient...
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WO/2018/078423A1 |
One component RTV-1 moisture-curable tile adhesives having properties superior to conventional cementitious and RTU tile adhesives contain at least one low viscosity alkoxysilyl- functional polymer, a silicone resin, an aminoalkyl-functi...
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WO/2018/074925A1 |
The present invention is in the field of a two component adhesive, a method of making said adhesive, and use of said adhesive. The first component of the two component adhesive comprises a silyl modified polymer and/or hybrid polymer, a ...
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WO/2018/043342A1 |
[Problem] To provide a novel photosensitive adhesive composition. [Solution] A photosensitive adhesive composition which comprises components (A), (B), (C), and (D), the component (B) being contained in a higher mass proportion than the ...
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WO/2018/024744A1 |
A polymer composition includes at least one poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound. A polymer metal junction including the polymer composition and a method of making a polymer met...
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WO/2018/020939A1 |
Provided is a pressure-sensitive adhesive which comprises silicone release paper and a pressure-sensitive adhesive layer of a cured object obtained from a photocurable composition comprising (A) an organic polymer having a number-average...
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WO/2018/001470A1 |
The invention relates to crosslinkable materials comprising (A) 100 parts by weight of silane-crosslinking polymers, selected from polymers (A1) of the formula R2-O-Z1-O-CO-NH-(CH2)-SiRa (OR1)3-a (I) and polymers (A2) of the formula R4-O...
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WO/2017/213248A1 |
The present disclosure relates to a thermosetting adhesive film. This adhesive film comprises (a) a polymer, (b) an epoxy resin that is in liquid form at 50°C, (c) a curing agent and/or a curing accelerator, and (d) a filler having a th...
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WO/2017/191455A1 |
The present invention relates to compounds of formula (I) that function as adhesion promoters: wherein R1, R2, R3, R4, R5, W, L, Q, x and n are each as defined herein. The present invention also relates to processes for the preparation o...
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WO/2017/168830A1 |
Provided is tape for electronic device package which, when picking up an adhesive layer-equipped metal from a pressure-sensitive adhesive tape, can minimize the occurrence of pin indentations due to the deformation of the metal layer by ...
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WO/2017/159650A1 |
The purpose of the present invention is to provide a polyester-based resin composition whereby the water contact angle of a coating film surface thereof is 30° or less and the peel strength thereof with respect to a metal or a resin fil...
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WO/2017/158994A1 |
A film-like adhesive composition containing each of an epoxy resin, an epoxy resin curing agent, a phenoxy resin and an aluminum nitride filler, wherein the content of the aluminum nitride filler is 30-60% with respect to the total amoun...
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WO/2017/137281A1 |
The invention relates to crosslinkable materials containing: (A) 100 parts of compounds of formula (I), (B) at least 5 parts by weight of silicon resins containing units of formula (II), where the groups and indices have the meaning indi...
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WO/2017/138463A1 |
Provided is a room-temperature-curable composition containing reactive silicon-containing groups, in particular, a curable composition which gives a cured object satisfactory in terms of initial adhesiveness to wood and water-resistant a...
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WO/2017/118374A1 |
Provided are a silane-modified polyether sealant composition and a silane-modified polyether sealant and a preparation method therefor. The silane-modified polyether sealant composition contains: an alkoxy-terminated polyether, calcium c...
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WO/2017/110202A1 |
A tape for semiconductor processing is provided which enables excellent singulation of semiconductor wafers during dicing and which enables preventing package cracking during packaging. This semiconductor processing tape 10 is characteri...
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WO/2017/103080A1 |
The invention relates to a composition comprising at least one structural adhesive and at least one chemically crosslinked elastomer based on a silane-functional, non-polar polymer, said elastomer being provided in the form of a penetrat...
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WO/2017/089068A1 |
The invention relates to curable mixtures containing at least one binder composition and at least one curing agent mixture and optionally one or more alkoxysilane compounds, and the use thereof.
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WO/2017/072119A1 |
The invention relates to a tyre comprising an inner surface and an outer surface, a receiving area arranged on one of said inner and outer surfaces, an adhesive layer arranged on the receiving area, and an element attached to the receivi...
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WO/2017/057920A1 |
The present invention relates to an anisotropic conductive film and a display device comprising the same, the anisotropic conductive film being formed of a composition for an anisotropic conductive film, containing 1-14 wt% of a silsesqu...
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WO/2017/053402A1 |
An adhesive for bonding comprising a blocked isocyanate and organic carbonate, and optionally a phenoxy resin, catalyst, metal acetylacetonate, and a process for using such an adhesive to bond elastomers, such as liquid silicone rubber t...
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WO/2017/037074A1 |
The subject matter is a new curable composition comprising at least one hydroxyl-group containing resin, at least one nitroso-containing compound or at least one nitroso precursor compound, at least one hydrophopic silica and at least on...
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WO/2017/006799A1 |
[Problem] To provide an adhesive composition that is flexible and that realizes exceptional adhesion durability. [Means for solving problem] Provided is an adhesive composition containing (a) a 2-cyanoacrylic acid ester, (b) a polymer ha...
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