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WO/2010/038753A1 |
Disclosed is an anisotropic electroconductive adhesive that, even when a heating tool is contacted and pressed at a slow speed, can realize high electrical connection reliability. The anisotropic electroconductive adhesive comprises an...
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WO/2010/038574A1 |
A radical-polymerizable acrylic dielectric adhesive for NCF bonding of an electronic device to a wiring board, which comprises a (meth)acrylate monomer, a film-forming resin, an inorganic filler, a silane coupling agent, and a radical po...
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WO/2010/021167A1 |
Disclosed is an insulating sheet that has excellent handleability in an uncured state, can suppress excessive flow during lamination pressing, and further can provide a cured product having excellent dielectric breakdown properties, ther...
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WO/2010/013653A1 |
Disclosed is an adhesive material that has low viscosity, has good coatability, can be rendered solventless, has low adhesive strength while causing little increase in adhesive strength with the elapse of time, has good adhesion to an ad...
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WO/2010/008079A1 |
Disclosed is a curable resin composition with reduced environmental burden, which is safe and has a sufficient curing rate. The composition contains a curable resin (A) having a hydrolyzable silicon group (1) in each molecule, a curable ...
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WO/2009/113538A1 |
Provided is a curable composition which has excellent curing properties and excellent storage stability, without use being made of a toxic organo-tin-based curing catalyst. The curable composition contains (A) an organic polymer having s...
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WO/2009/102000A1 |
Disclosed is a transparent adhesive sheet for flat panel displays, which has excellent light resistance. The transparent adhesive sheet for flat panel displays is mainly composed of a polyoxyalkylene polymer, and contains a hindered amin...
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WO/2009/060199A2 |
A two-part sealant composition, wherein this composition comprises a first part and a second part. The first part comprises a polymer selected from a silane- terminated polyurethane or a silane-terminated polyether, wherein this polymer ...
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WO/2009/028241A1 |
This invention provides an anisotropic electroconductive film, which can realize a high level of connection reliability, and a process for producing a connection structure using the anisotropic electroconductive film. An anisotropic elec...
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WO/2009/022574A1 |
[PROBLEMS] To provide an adhesive having excellent adhesiveness after initial and reliability tests even after being heated and cured at low temperature. [MEANS FOR SOLVING PROBLEMS] An adhesive containing a silicone compound having an a...
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WO/2008/149727A1 |
Disclosed is a flame-retardant adhesive resin composition which shows no cracking, peeling or the like before being cured into a film and therefore has excellent workability, which shows excellent adhesion properties including peel adhes...
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WO/2008/149528A1 |
[PROBLEMS] To provide a transport case for an electronic component, which can reliably hold an electronic component, can remove static electricity to prevent breaking of the electronic component and the deposition of dust and can reduce ...
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WO/2008/145458A1 |
Provided is an adhesive composition for adhesively bonding floor coverings to floor base elements. A floor and method for constructing the floor using the adhesive composition to adhesively and securely bond floor coverings to the floor ...
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WO/2008/133253A1 |
Disclosed is an anisotropic conductive film composed of a thermosetting acrylic resin composition. The thermosetting acrylic resin composition contains at least a thermal curing agent (A), a thermosetting component (B), an acrylic rubber...
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WO/2008/133193A1 |
A transparent pressure-sensitive adhesive sheet for flat panel displays which has such excellent adhesive properties that after application to a display module (display panel) and a protective transparent plate, the adhesive sheet can be...
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WO/2008/133265A1 |
Disclosed is a two-component or multi-component curable composition characterized by having good workability, particularly long working life without deteriorating good adhesion to general-purpose bases. Specifically disclosed is a curabl...
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WO/2008/123474A1 |
Disclosed is a novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of a divalent aliphatic carboxylic acid having 15-64 carbon atoms and glycidyl...
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WO/2008/123552A1 |
Disclosed is an adhesive material which has good coatability at a low viscosity, can be produced in a solvent-free form, has good adhesion to an object and excellent removability, produces a reduced amount of electrostatic charge when th...
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WO/2008/114711A1 |
[PROBLEMS] A solder ball mounter is used in mounting solder balls on a printed board. Fine solder balls having a particle diameter of not more than 0.2 mm have a small self-weight and, thus, upon the generation of static electricity, nec...
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WO/2008/111598A1 |
Disclosed is a curable composition having excellent curability without containing a toxic organotin curing catalyst. This curable composition enables to obtain a cured product having excellent mechanical strength and suppressed in surfac...
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WO/2008/105563A1 |
Provided is a flame-retardant adhesive resin composition to be used for a flexible wiring board. The composition contains, as essential components, (a) a specified epoxy resin, (b) a specified phosphorus-containing phenoxy resin, (c) a c...
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WO/2008/099858A1 |
Disclosed is a curable composition which is commercially highly practical and exhibits excellent curability even when a filler and a non-organotin catalyst are used. Specifically disclosed is a curable composition obtained by mixing (A) ...
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WO/2008/096661A1 |
Disclosed is a method for producing an adhesive layer, which comprises the step of irradiating a photopolymerizable acrylic adhesive composition layer provided between two films with active energy ray to cause the polymerization of the p...
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WO/2008/094796A1 |
A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40°C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether),...
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WO/2008/084651A1 |
The invention aims at providing a curable composition which is free from organotin curing catalysts whose toxicity has been pointed out or from volatile compounds and which is excellent in curability, storage stability, and the strength ...
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WO/2008/078654A1 |
Disclosed is a curable composition having excellent curability and storage stability without containing a toxic organotin curing catalyst or a volatile compound. This curable composition enables to obtain a cured product having excellent...
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WO/2008/068996A1 |
[PROBLEMS] To provide: a thermosetting resin which can be used in the production of a laminate for use in an destiné à être employé dans un component, an electrical product or a fiber, particularly can be used in a multilayer circuit...
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WO/2008/056773A1 |
Disclosed is an adhesive film wherein a conductive adhesive layer containing a conductive particle and an insulating adhesive layer are laminated. When this adhesive film is heated and pressed in the lamination direction under certain co...
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WO/2008/054012A1 |
In a chip-on-chip type semiconductor device, an adhesive tape electrically connects between a semiconductor chip (10) and a semiconductor chip (20). The adhesive tape contains; (A) a film forming resin of 10-50 wt%, (B) a thermosetting r...
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WO/2008/054011A1 |
A chip-on-chip type semiconductor electronic component which meets requirement of further density increase of semiconductor integrated circuits is provided. A semiconductor device is also provided. In the chip-on-chip type semiconductor ...
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WO/2008/044330A1 |
Disclosed is an adhesive tape containing a flux activation compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In this adhesive tape, the thermosetting resin may be an epoxy ...
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WO/2008/041409A1 |
A cation-polymerizable resin composition comprising a multi-branched polyether polyol (A) produced by conducting the ring-opening reaction of a hydroxyalkyl oxetane (a1) and a unifunctional epoxy compound (a2), an alicyclic epoxy compoun...
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WO/2008/032539A1 |
Disclosed are a moisture-curable polymer having excellent curability, and a curable composition. Specifically disclosed is a polymer having a silicon group represented by the following general formula: -SiFaR1 bZc (wherein R1 represents ...
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WO/2008/020984A2 |
A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene...
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WO/2008/015852A1 |
An adhesion composition comprising (a) a thermoplastic resin, (b) a radically polymerizable compound having one or more fluorene structure in the molecule, and (c) a radical polymerization initiator.
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WO/2007/142067A1 |
Disclosed is a curable composition having good adhesion to a thermoplastic polyolefin substrate. The curable composition comprises: (A) a polyoxyalkylene polymer having a reactive silicon group; (B) a polyolefin polymer; and (C) an adhes...
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WO/2007/141089A1 |
The invention relates to solid or liquid universal pigment compounds, consisting of at least one pigment and one resin, their production process, and their utilization in paints, varnishes, adhesives, inks, or printing colors.
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WO/2007/123167A1 |
Disclosed is a curable composition which exhibits excellent curability while using a non-organic-tin catalyst. Specifically disclosed is a curable composition which is characterized by containing (A) a polymer having a silicon group whic...
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WO/2007/119582A1 |
Disclosed is an ultraviolet-curable resin composition characterized by containing a urethane prepolymer (A) having a structure represented by the general formula (1) below and a cationic photopolymerization initiator (B). [Chemical formu...
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WO/2007/119867A1 |
Disclosed is a curable resin composition containing an organic polymer having a reactive silicon group, which composition has excellent workability (thixotropy and coating workability) required for adhesives for floor coverings and the l...
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WO/2007/099851A1 |
A protective sheet for coating film having a base material sheet provided with a pressure sensitive adhesive layer, characterized in that the pressure sensitive adhesive layer is one obtained by crosslinking with actinic energy ray irrad...
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WO/2007/097365A1 |
A pressure-sensitive adhesive layer of pressure-sensitive adhesive sheet is prepared by the use of a pressure-sensitive adhesive composition comprising (A) polyrotaxane having a linear-chain molecule passing through opening portions of a...
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WO/2007/094273A1 |
Disclosed is a curable composition using an amidine compound as a non-organic tin catalyst, which is good in elongation, flexibility, surface curability, deep-section curability and adhesion. Specifically disclosed is a curable compositi...
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WO/2007/094274A1 |
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties, while securing practical surface cura...
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WO/2007/094275A1 |
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties and good weather resistance, while sec...
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WO/2007/094276A1 |
Disclosed is a curable composition which is excellent in surface curability and deep-section curability without using an organotin curing catalyst which is pointed out to be toxic. This curable composition enables to obtain a cured produ...
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WO/2007/094272A1 |
The invention aims at providing a curable composition containing a guanidine as a nonorganotin catalyst which is little discolored and is excellent in the curability of both the surface and the depths and in the rising of strength and wh...
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WO/2007/055176A1 |
A pressure-sensitive adhesive base characterized by comprising a polymer having carboxy groups in the molecule and a crosslinking agent which crosslinks the polymer. It is further characterized in that the crosslinking agent is a compoun...
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WO/2007/048538A1 |
The invention relates to a-ethoxysilane-modified polymers of average general formula (I), wherein R represents a monovalent to quadrivalent polymer radical, no more than one third of the radicals R1, R2, and R3 contained in the polymer o...
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WO/2007/040090A1 |
Disclosed is an anisotropic conductive adhesive containing an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler and conductive particles. By using a phenoxy resin having a glass transition temperature (Tg) of not less tha...
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