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Matches 1 - 50 out of 3,417

Document Document Title
WO/2019/127239A1
A low-modulus high-adhesion fabricated silane modified polyether adhesive used for a building. The low-modulus high-adhesion fabricated silane modified polyether adhesive is divided into a component A and a component B, wherein the compo...  
WO/2019/124712A1
The present invention relates to a single-component epoxy-based adhesive composition which enables compensation of brittleness of an epoxy-based adhesive by means of using together at least three toughening agents comprising phenoxy resi...  
WO/2019/126648A1
Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leavi...  
WO/2019/115952A1
The present invention concerns an adhesive multicomponent composition comprising: a composition A comprising: o at least one silylated polymer comprising at least one hydrolysable alkoxysilane group; o at least one tackifying resin; a co...  
WO/2019/117302A1
The present invention provides: a water-based temporary adhesive agent which comprises a thermoplastic resin having at least (A) a hydroxyl group and has both excellent temporary adhesion performance, excellent application performance, a...  
WO/2019/109328A1
Disclosed is a moisture curable hot-melt adhesive composition, comprising a silane modified polymer, a ethylenically unsaturated carboxylic acid graft modified polymer, and a tackifying agent. The moisture curable hot-melt adhesive compo...  
WO/2019/086716A1
The present invention consists in a new type of adhesion material and the method of production. This material is used in the medical area, or in areas where is necessary to connect a device to the skin. This connection occurred due to th...  
WO/2019/077942A1
A room temperature-curable composition which comprises: (a) an organosilicon compound containing a polyoxyalkylene group, said organosilicon compound having one or more hydrolyzable silyl group-containing monovalent organic groups repres...  
WO/2019/058795A1
[Problem] To provide a curable composition, a sealing material composition, and an adhesive composition having excellent workability and providing a cured product with excellent mechanical properties and weather resistance. [Solution] Di...  
WO/2019/057670A1
The invention relates to an adhesive composition, comprising at least polymer containing silane groups, between 15 and 35 wt.-% of at least one polymeric plasiticzer, between 0.5 and 2.5 wt.-% of at least one monomeric or oligomeric amin...  
WO/2019/053164A1
Disclosed is a polymer-metal junction including a polymer composition in contact with a metal substrate, where the polymer composition comprises a polymer component including a PEEK-PEDEK copolymer having a PEEK/PEDEK mole ratio ranging ...  
WO/2019/021557A1
Provided is a laminated body comprising a thinned glass plate and a resin film which are bonded together by means of an adhesive and having excellent bending resistance. A laminated body according to the present invention has a configura...  
WO/2019/002360A1
The present invention relates to adhesive compositions containing at least one aromatic epoxy resin, at least one compound having at least one oxetane group and at least one photoinitiator, to a method for gluing at least two components ...  
WO/2018/230249A1
This resin-metal composite member for a tire has a metal member, an adhesive layer, and a cover resin layer in the stated order, wherein the adhesive layer has: a continuous phase containing a polyester thermoplastic elastomer having a p...  
WO/2018/229417A1
Metal or metal-plated reinforcement, at least the surface of which is at least partly made of metal, at least the metal portion being coated with a sulphur polybenzoxazine, the recurring units of which comprise at least one unit correspo...  
WO/2018/213695A1
The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without m...  
WO/2018/203527A1
Provided are: an adhesive film comprising an adhesive agent layer containing a thermosetting resin, a thermoplastic resin, and a heat conductive filler, wherein the heat conductive filler has a thermal conductivity of 12 W/m·K or more a...  
WO/2018/181536A1
The present invention provides an adhesive composition containing: an anionic polymerizable or cationic polymerizable epoxy resin or oxetane resin; a first silane compound having a functional group that reacts with the epoxy resin or oxe...  
WO/2018/179682A1
Provided are: a wiring substrate having a low dielectric constant and a low dielectric tangent; and a copper foil having an adhesive agent adhered thereto and a copper-clad laminated plate, each of which is suitable for the production of...  
WO/2018/180685A1
The present invention provides: an anisotropic electroconductive adhesive which improves the reaction rate at a light-shielding part and which is capable of achieving excellent conduction resistance; and a production method for a connect...  
WO/2018/181846A1
Provided are: a curable composition which has low viscosity and enables the achievement of a cured product that has excellent adhesiveness; a method for producing a cured product; a cured product of the curable composition; and an adhesi...  
WO/2018/163445A1
Provided is a polyoxyalkylene group-containing organosilicon compound which contains at least one group represented by structural formula (1) in one molecule and has a polyoxyalkylene structure in the main chain. This polyoxyalkylene gro...  
WO/2018/152489A1
A curable adhesive that is particularly well suited for use in an injection or compression molding operation. The adhesive is based on polymeric resins having carboxylic acid and acrylate ester functionality, such as grafted phenoxy resi...  
WO/2018/147247A1
Provided is an actinic-ray-curable adhesive composition which has excellent adhesive force, is suitable for use in laminating any of various protective films for polarizers to a polarizing element, and is excellent in terms of curability...  
WO/2018/101438A1
The purpose of the present invention is to provide: an electrode structure which is free of the problem of dryness caused by the volatilization of water or an organic solvent and is provided with an adhesive agent layer having sufficient...  
WO/2018/078423A1
One component RTV-1 moisture-curable tile adhesives having properties superior to conventional cementitious and RTU tile adhesives contain at least one low viscosity alkoxysilyl- functional polymer, a silicone resin, an aminoalkyl-functi...  
WO/2018/074925A1
The present invention is in the field of a two component adhesive, a method of making said adhesive, and use of said adhesive. The first component of the two component adhesive comprises a silyl modified polymer and/or hybrid polymer, a ...  
WO/2018/043342A1
[Problem] To provide a novel photosensitive adhesive composition. [Solution] A photosensitive adhesive composition which comprises components (A), (B), (C), and (D), the component (B) being contained in a higher mass proportion than the ...  
WO/2018/024744A1
A polymer composition includes at least one poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound. A polymer metal junction including the polymer composition and a method of making a polymer met...  
WO/2018/020939A1
Provided is a pressure-sensitive adhesive which comprises silicone release paper and a pressure-sensitive adhesive layer of a cured object obtained from a photocurable composition comprising (A) an organic polymer having a number-average...  
WO/2018/001470A1
The invention relates to crosslinkable materials comprising (A) 100 parts by weight of silane-crosslinking polymers, selected from polymers (A1) of the formula R2-O-Z1-O-CO-NH-(CH2)-SiRa (OR1)3-a (I) and polymers (A2) of the formula R4-O...  
WO/2017/213248A1
The present disclosure relates to a thermosetting adhesive film. This adhesive film comprises (a) a polymer, (b) an epoxy resin that is in liquid form at 50°C, (c) a curing agent and/or a curing accelerator, and (d) a filler having a th...  
WO/2017/191455A1
The present invention relates to compounds of formula (I) that function as adhesion promoters: wherein R1, R2, R3, R4, R5, W, L, Q, x and n are each as defined herein. The present invention also relates to processes for the preparation o...  
WO/2017/168830A1
Provided is tape for electronic device package which, when picking up an adhesive layer-equipped metal from a pressure-sensitive adhesive tape, can minimize the occurrence of pin indentations due to the deformation of the metal layer by ...  
WO/2017/159650A1
The purpose of the present invention is to provide a polyester-based resin composition whereby the water contact angle of a coating film surface thereof is 30° or less and the peel strength thereof with respect to a metal or a resin fil...  
WO/2017/158994A1
A film-like adhesive composition containing each of an epoxy resin, an epoxy resin curing agent, a phenoxy resin and an aluminum nitride filler, wherein the content of the aluminum nitride filler is 30-60% with respect to the total amoun...  
WO/2017/137281A1
The invention relates to crosslinkable materials containing: (A) 100 parts of compounds of formula (I), (B) at least 5 parts by weight of silicon resins containing units of formula (II), where the groups and indices have the meaning indi...  
WO/2017/138463A1
Provided is a room-temperature-curable composition containing reactive silicon-containing groups, in particular, a curable composition which gives a cured object satisfactory in terms of initial adhesiveness to wood and water-resistant a...  
WO/2017/118374A1
Provided are a silane-modified polyether sealant composition and a silane-modified polyether sealant and a preparation method therefor. The silane-modified polyether sealant composition contains: an alkoxy-terminated polyether, calcium c...  
WO/2017/110202A1
A tape for semiconductor processing is provided which enables excellent singulation of semiconductor wafers during dicing and which enables preventing package cracking during packaging. This semiconductor processing tape 10 is characteri...  
WO/2017/103080A1
The invention relates to a composition comprising at least one structural adhesive and at least one chemically crosslinked elastomer based on a silane-functional, non-polar polymer, said elastomer being provided in the form of a penetrat...  
WO/2017/089068A1
The invention relates to curable mixtures containing at least one binder composition and at least one curing agent mixture and optionally one or more alkoxysilane compounds, and the use thereof.  
WO/2017/072119A1
The invention relates to a tyre comprising an inner surface and an outer surface, a receiving area arranged on one of said inner and outer surfaces, an adhesive layer arranged on the receiving area, and an element attached to the receivi...  
WO/2017/057920A1
The present invention relates to an anisotropic conductive film and a display device comprising the same, the anisotropic conductive film being formed of a composition for an anisotropic conductive film, containing 1-14 wt% of a silsesqu...  
WO/2017/053402A1
An adhesive for bonding comprising a blocked isocyanate and organic carbonate, and optionally a phenoxy resin, catalyst, metal acetylacetonate, and a process for using such an adhesive to bond elastomers, such as liquid silicone rubber t...  
WO/2017/037074A1
The subject matter is a new curable composition comprising at least one hydroxyl-group containing resin, at least one nitroso-containing compound or at least one nitroso precursor compound, at least one hydrophopic silica and at least on...  
WO/2017/006799A1
[Problem] To provide an adhesive composition that is flexible and that realizes exceptional adhesion durability. [Means for solving problem] Provided is an adhesive composition containing (a) a 2-cyanoacrylic acid ester, (b) a polymer ha...  
WO/2016/208816A1
The present invention relates to a polymer resin comprising: (1) a polycyclic aromatic hydrocarbon-containing group; and (2) C6-30 aromatic or cycloaliphatic -containing group, to a method for preparing the same, to an adhesive film comp...  
WO/2016/202359A1
The present invention relates to the field of adhesives and especially to the field of moisture curing, or hardening, adhesives. The present adhesives provide high strength, i.e. at least more than 4 N/mm2, adhesion of materials such as ...  
WO/2016/196082A1
A one part moisture curable adhesive composition having improved heat stability is comprised of a silyl terminated polymer, a catalyst and a particular phosphite compound. The phosphite compound has three groups wherein at least two of t...  

Matches 1 - 50 out of 3,417