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Matches 1 - 50 out of 3,362

Document Document Title
WO/2018/213695A1
The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without m...  
WO/2018/203527A1
Provided are: an adhesive film comprising an adhesive agent layer containing a thermosetting resin, a thermoplastic resin, and a heat conductive filler, wherein the heat conductive filler has a thermal conductivity of 12 W/m·K or more a...  
WO/2018/181536A1
The present invention provides an adhesive composition containing: an anionic polymerizable or cationic polymerizable epoxy resin or oxetane resin; a first silane compound having a functional group that reacts with the epoxy resin or oxe...  
WO/2018/179682A1
Provided are: a wiring substrate having a low dielectric constant and a low dielectric tangent; and a copper foil having an adhesive agent adhered thereto and a copper-clad laminated plate, each of which is suitable for the production of...  
WO/2018/180685A1
The present invention provides: an anisotropic electroconductive adhesive which improves the reaction rate at a light-shielding part and which is capable of achieving excellent conduction resistance; and a production method for a connect...  
WO/2018/181846A1
Provided are: a curable composition which has low viscosity and enables the achievement of a cured product that has excellent adhesiveness; a method for producing a cured product; a cured product of the curable composition; and an adhesi...  
WO/2018/163445A1
Provided is a polyoxyalkylene group-containing organosilicon compound which contains at least one group represented by structural formula (1) in one molecule and has a polyoxyalkylene structure in the main chain. This polyoxyalkylene gro...  
WO/2018/152489A1
A curable adhesive that is particularly well suited for use in an injection or compression molding operation. The adhesive is based on polymeric resins having carboxylic acid and acrylate ester functionality, such as grafted phenoxy resi...  
WO/2018/147247A1
Provided is an actinic-ray-curable adhesive composition which has excellent adhesive force, is suitable for use in laminating any of various protective films for polarizers to a polarizing element, and is excellent in terms of curability...  
WO/2018/101438A1
The purpose of the present invention is to provide: an electrode structure which is free of the problem of dryness caused by the volatilization of water or an organic solvent and is provided with an adhesive agent layer having sufficient...  
WO/2018/078423A1
One component RTV-1 moisture-curable tile adhesives having properties superior to conventional cementitious and RTU tile adhesives contain at least one low viscosity alkoxysilyl- functional polymer, a silicone resin, an aminoalkyl-functi...  
WO/2018/074925A1
The present invention is in the field of a two component adhesive, a method of making said adhesive, and use of said adhesive. The first component of the two component adhesive comprises a silyl modified polymer and/or hybrid polymer, a ...  
WO/2018/043342A1
[Problem] To provide a novel photosensitive adhesive composition. [Solution] A photosensitive adhesive composition which comprises components (A), (B), (C), and (D), the component (B) being contained in a higher mass proportion than the ...  
WO/2018/024744A1
A polymer composition includes at least one poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound. A polymer metal junction including the polymer composition and a method of making a polymer met...  
WO/2018/020939A1
Provided is a pressure-sensitive adhesive which comprises silicone release paper and a pressure-sensitive adhesive layer of a cured object obtained from a photocurable composition comprising (A) an organic polymer having a number-average...  
WO/2018/001470A1
The invention relates to crosslinkable materials comprising (A) 100 parts by weight of silane-crosslinking polymers, selected from polymers (A1) of the formula R2-O-Z1-O-CO-NH-(CH2)-SiRa (OR1)3-a (I) and polymers (A2) of the formula R4-O...  
WO/2017/213248A1
The present disclosure relates to a thermosetting adhesive film. This adhesive film comprises (a) a polymer, (b) an epoxy resin that is in liquid form at 50°C, (c) a curing agent and/or a curing accelerator, and (d) a filler having a th...  
WO/2017/191455A1
The present invention relates to compounds of formula (I) that function as adhesion promoters: wherein R1, R2, R3, R4, R5, W, L, Q, x and n are each as defined herein. The present invention also relates to processes for the preparation o...  
WO/2017/168830A1
Provided is tape for electronic device package which, when picking up an adhesive layer-equipped metal from a pressure-sensitive adhesive tape, can minimize the occurrence of pin indentations due to the deformation of the metal layer by ...  
WO/2017/159650A1
The purpose of the present invention is to provide a polyester-based resin composition whereby the water contact angle of a coating film surface thereof is 30° or less and the peel strength thereof with respect to a metal or a resin fil...  
WO/2017/158994A1
A film-like adhesive composition containing each of an epoxy resin, an epoxy resin curing agent, a phenoxy resin and an aluminum nitride filler, wherein the content of the aluminum nitride filler is 30-60% with respect to the total amoun...  
WO/2017/137281A1
The invention relates to crosslinkable materials containing: (A) 100 parts of compounds of formula (I), (B) at least 5 parts by weight of silicon resins containing units of formula (II), where the groups and indices have the meaning indi...  
WO/2017/138463A1
Provided is a room-temperature-curable composition containing reactive silicon-containing groups, in particular, a curable composition which gives a cured object satisfactory in terms of initial adhesiveness to wood and water-resistant a...  
WO/2017/118374A1
Provided are a silane-modified polyether sealant composition and a silane-modified polyether sealant and a preparation method therefor. The silane-modified polyether sealant composition contains: an alkoxy-terminated polyether, calcium c...  
WO/2017/110202A1
A tape for semiconductor processing is provided which enables excellent singulation of semiconductor wafers during dicing and which enables preventing package cracking during packaging. This semiconductor processing tape 10 is characteri...  
WO/2017/103080A1
The invention relates to a composition comprising at least one structural adhesive and at least one chemically crosslinked elastomer based on a silane-functional, non-polar polymer, said elastomer being provided in the form of a penetrat...  
WO/2017/089068A1
The invention relates to curable mixtures containing at least one binder composition and at least one curing agent mixture and optionally one or more alkoxysilane compounds, and the use thereof.  
WO/2017/072119A1
The invention relates to a tyre comprising an inner surface and an outer surface, a receiving area arranged on one of said inner and outer surfaces, an adhesive layer arranged on the receiving area, and an element attached to the receivi...  
WO/2017/057920A1
The present invention relates to an anisotropic conductive film and a display device comprising the same, the anisotropic conductive film being formed of a composition for an anisotropic conductive film, containing 1-14 wt% of a silsesqu...  
WO/2017/053402A1
An adhesive for bonding comprising a blocked isocyanate and organic carbonate, and optionally a phenoxy resin, catalyst, metal acetylacetonate, and a process for using such an adhesive to bond elastomers, such as liquid silicone rubber t...  
WO/2017/037074A1
The subject matter is a new curable composition comprising at least one hydroxyl-group containing resin, at least one nitroso-containing compound or at least one nitroso precursor compound, at least one hydrophopic silica and at least on...  
WO/2017/006799A1
[Problem] To provide an adhesive composition that is flexible and that realizes exceptional adhesion durability. [Means for solving problem] Provided is an adhesive composition containing (a) a 2-cyanoacrylic acid ester, (b) a polymer ha...  
WO/2016/208816A1
The present invention relates to a polymer resin comprising: (1) a polycyclic aromatic hydrocarbon-containing group; and (2) C6-30 aromatic or cycloaliphatic -containing group, to a method for preparing the same, to an adhesive film comp...  
WO/2016/202359A1
The present invention relates to the field of adhesives and especially to the field of moisture curing, or hardening, adhesives. The present adhesives provide high strength, i.e. at least more than 4 N/mm2, adhesion of materials such as ...  
WO/2016/196082A1
A one part moisture curable adhesive composition having improved heat stability is comprised of a silyl terminated polymer, a catalyst and a particular phosphite compound. The phosphite compound has three groups wherein at least two of t...  
WO/2016/182215A1
The present invention relates to a polyarylene sulfide resin composition with a low out-gas content, comprising: a polyarylene sulfide; and a phenoxy resin. The polyarylene sulfide resin composition of the present invention exhibits a lo...  
WO/2016/182212A1
The present invention relates to a polyarylene sulfide resin composition which contains polyarylene sulfide and a polyvinyl butyral resin and has a low outgas content. The polyarylene sulfide resin composition of the present invention ex...  
WO/2016/171269A1
Provided is a method for producing a pressure-sensitive adhesive, in which a cured product of a curable composition that contains an organic polymer having a crosslinkable silicon group and an adhesion-imparting resin is provided as a pr...  
WO/2016/167303A1
 Although cationic photocurable compositions of the prior art had photocuring properties, the curing process was extremely slow, ultimately making it difficult to obtain cured products that had cured adequately. This photocurable compo...  
WO/2016/164535A1
The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.  
WO/2016/140204A1
[Problem] Conventional conductive adhesives had difficulty with balancing storage stability and low-temperature curability, and with manifesting adhesive strength and conductivity when used on poorly-adhesive metal adherends such as gold...  
WO/2016/125537A1
Provided are: a film-shaped adhesive suitable as an NCF and being void-free, having excellent electrical connection properties and reliability thereof, having excellent surface flatness, and not being prone to cracking; and a semiconduct...  
WO/2016/097040A1
The present invention primarily relates to a multi-component adhesive for producing an adhesive hydrogel, comprising the following defined compound of formula (I) and one, two, three, four or more further components. The invention also r...  
WO/2016/093114A1
The purpose of the present invention is to provide an adhesive composition in which recognition of an alignment mark is possible, solder wettability of a joining section is adequately ensured, and suppression of void occurrence is excell...  
WO/2016/047519A1
The purpose of the present invention is to provide a curable composition which enables strong adhesion, without carrying out a primer treatment, to a metal, glass or coated surface, and especially to a porous base material such as mortar...  
WO/2016/024492A1
Provided are an ultraviolet-ray-curable resin composition having superior transparency, and a laminate using the same. The ultraviolet-ray-curable resin composition contains: (A) at least one polymer selected from the group consisting of...  
WO/2016/019248A1
There is provided cured coating compositions derived from a one-part, moisture curable composition comprising (a) a polyoxyalkylene polymer having at least one end group derived from an alkoxy silane, and (b) a plasticizer selected from ...  
WO/2015/198063A1
A component comprising a first part and a second part, wherein a third part is positioned between the first and second parts, wherein: (i) said first part comprises a polymeric material (A) which comprises a repeat unit of formula (XI) w...  
WO/2015/178313A1
A printed wiring board provided with: a first insulating substrate (11) produced from a liquid crystal polymer; a first signal line (131) formed on one principal surface (11a) of the first insulating substrate (11); a second insulating s...  
WO/2015/170374A1
Provided is a polycarbonate/(polyoxy ethylene) block copolymer for aqueous compositions, which contains a polycarbonate structure represented by general formula (1) and a polyoxy ethylene structure represented by general formula (2), whe...  

Matches 1 - 50 out of 3,362