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JP5201181B2 |
Disclosed are an adhesive composition containing a resin having piperazine skeletons, a circuit connecting structure, a semiconductor device, and an adhesion improvement agent for glass.
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JP2013098443A |
To provide an excellent semiconductor adhesive sheet which is capable of picking up a semiconductor element with an adhesive agent layer without fail even if there is heat storage of a collet.A semiconductor adhesive sheet is configured ...
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JP5199346B2 |
Branched polydiorganosiloxane polyamide, block copolymers and methods of making the copolymers are provided. The method of making the copolymers involves reacting one or more amine compounds including at least one polyamine with a precur...
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JP5176218B2 |
The invention relates to a method for applying edge strips (edge tape) onto narrow surfaces (narrow sides) of plate-shaped work pieces (material parts) by joining, wherein the edge strip is applied with a glue that can be activated by he...
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JP2013057017A |
To provide an insulating material which increases strength of a film-like insulating material or which increases strength of an insulating layer, and also which achieves good conduction in a connection structure by lowering melt viscosit...
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JP2013047355A |
To provide a new adhesive retainable of adhesiveness even under high temperature environment, and use thereof.This adhesive includes a condensation-based resin having a structural unit obtained by condensation-polymerizing polymerizable ...
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JP5087248B2 |
To provide an adhesive having high adhesiveness to various substrates such as cloth, paper and plastic films and having excellent resistance to various solvents including chlorine-based solvent, oil resistance, heat-resistance, alkali re...
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JP2012234804A |
To provide a film shaped anisotropic conductive adhesive that can shorten the heating time without impairing the connection reliability or durability even when the time required for the adherence is reduced so as not to limit the kind of...
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JP2012232413A |
To provide a coverlay including an adhesive layer which has low fluidity, superior flexibility and adhesiveness, and higher heat resistance, which should be included in a flexible printed wiring board, and an adhesive does not protrude, ...
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JP5082654B2 |
To provide a transfer sheet, wherein transfer is applied with satisfactory adhesion to both of a woody material such as an MDF board and resin-impregnated paper composing the edge parts thereof or the like, and from which a decorative sh...
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JP2012224713A |
To provide an adhesive resin composition for a flexible print wiring board by using a vegetable origin material, while securing the characteristics of almost the same extent as those of using a petroleum origin plastic material to cope w...
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JP2012219111A |
To provide a circuit connection material which gives sufficient adhesion strength, even when a circuit member having a substrate formed from polyethylene terephthalate, polyethylene naphthalate or a polycarbonate, or a circuit member on ...
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JP2012526007A |
Included are bonded laminate constructions that have a modulus which approaches the sum of the modulus of the individual components of the laminate. By reducing variation in the modulus, the stretch or elasticity of the bonded or laminat...
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JP5036930B2 |
The invention encompasses a phase change ink comprising a material of the formula wherein X1, X2, X3, and X4 are segments comprising atoms selected from groups V and VI of the periodic table; wherein at least one R1 and R5 comprises at l...
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JP5023623B2 |
To provide a halogen-free flame-retardant adhesive composition free of halogen, having high flame retardance and excellent adhesiveness and heat resistance without causing curling or cracking when formed into a film-like state and excell...
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JP5022731B2 |
A polymerizable composition is provided that includes a compound represented by Formula (I), a macromolecule having a monomer unit represented by Formula (II) and/or another addition-polymerization type macromolecule, and a macromolecula...
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JP5009947B2 |
Adhesive composition comprises: polyamide A having an average carbon atoms (4-8.5, preferably 4-7) per nitrogen atom (CA); polyamide B having a fusion temperature of >= 180[deg] C and an average number of carbon atoms (7-10, preferably 7...
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JP5002074B2 |
Disclosed is an adhesive agent composition that does not use halogens, has excellent adhesive strength, long-term reliability, and workability, and is suitable for use in anisotropic conductive paste favorably used in connecting substrat...
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JP2012143961A |
To provide a process for producing a polymer member having a part in which an immiscible substance is localized, which facilitates product designing for obtaining a desired polymer member.This process for producing the polymer member inc...
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JP4980909B2 |
Core-skin bonding is improved between honeycomb and composite face sheets by applying a nylon-based (polyamide) adhesive to the edge of the honeycomb prior to bonding. Edge coating of honeycomb with polyamide adhesives is useful in furth...
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JP4977294B2 |
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JP4970551B2 |
Polyamidoamine (PAE) resins are prepared from polyamidoamine made with excess amine, which are reacted with a specifically defined amount of difunctional crosslinker. The amount of difunctional crosslinker used is based on the polyamidoa...
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JP4970964B2 |
Production of a hybrid component (I) containing a metal and polymer comprises connecting the metal with the polymer using a copolyamide-based adhesive melt. An independent claim is included for a hybrid component, prepared by the process...
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JP4920699B2 |
A composition comprising one or more polyaminoaminde epihalohydrin resins and one or more polyamides in a ratio of about 1:99 to about 99:1 based on polymer actives and use of the composition for creping paper webs.
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JP4917593B2 |
The present invention relates to a polymeric adhesive matrix and to a process for producing such a polymeric adhesive matrix, wherein the matrix comprises either: 1) a substantially uniform thickness nonwoven web comprising Nylon (12) or...
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JP4900579B2 |
To provide a polyamide resin composition that can be used for producing a large-size molded product or a part having a complicated shape, with no damage to the intrinsic property of crystalline polyamide resin and maintain high welding p...
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JP4900244B2 |
The object of the present invention is to provide an adhesion film for semiconductor that is capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional...
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JP4888565B2 |
A circuit connecting adhesive film comprising an insulating adhesive, conductive particles and a particulate non-conductive phase containing a polyamide-based elastomer and/or a polyester-based elastomer, wherein the conductive particles...
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JP2012025888A |
To provide an adhesive resin composition that can sufficiently prevent phase separation in application and drying, has low moisture absorbency, and is excellent in soldering heat resistance after moisture absorption; and to provide a cov...
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JP4864366B2 |
To provide an aqueous emulsion composition excellent in water resistance, especially boiling water resistance and viscosity stability in standing alone for long time, and to provide an adhesive and a coating agent. The aqueous emulsion c...
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JP2012012526A |
To provide an adhesive film which can control flow out during press cure while showing outstanding soldering heat resistance and blanking processability.The adhesive film comprises carrying out partial curing of an adhesive composition i...
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JP2012007066A |
To provide a resin composition for adhesion to polyamide/polyphenylene ether-based resins excellent in adhesion to both sides of a polyamide resin and a polyphenylene ether resin.The resin composition for adhesion to polyamide/polyphenyl...
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JP2012007095A |
To provide a method for adhering a composite material using aliphatic polyamide as the matrix.This method is used for adhering the composite material using aliphatic polyamide as the matrix with a composite material using, as the matrix,...
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JP4827214B2 |
To provide an adhesive composition for lamination used in a flexible printed circuit board that has excellent thermal impact resistance and press workability, and an adhesive film. This adhesive film is composed of an adhesive compositio...
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JP2011528745A |
Polymer obtainable by polycondensation or polyadduct formation from monomeric compounds, wherein accompanying use is made as monomeric compound of 2-isopropyl-2-alkyl-1,3-propanediols of the formula I or alkoxylated derivatives thereof.
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JP2011236422A |
To provide a hot-melt pressure-sensitive adhesive (HMPSA) composition in which the debonding is possible (removing is possible) from an article (package and/or container, for example glass bottle) to which a self adhesive label is attach...
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JP2011219590A |
To provide a composition satisfying requests about solder heat resistance and a flow characteristic after absorbing moisture, while maintaining characteristics required inherently for a flame-retardant adhesive composition for a flexible...
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JP2011190416A |
To provide an adhesive composition which has appropriate viscoelasticity before curing, is press-bonded to an adherend with weak pressure, and exhibits high cohesive force without being subjected to a reaction at a high temperature for a...
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JP2011522946A |
1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: —f...
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JP4738849B2 |
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JP4738859B2 |
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JP4730698B2 |
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JP4725704B2 |
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JP4718448B2 |
A sizing composition for the manufacture of a thermal and/or acoustic insulation product based on mineral fibers, especially glass and rock which comprises at least on carboxylic polyacid and at least one polyamine. Independent claims ar...
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JP4691878B2 |
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JP4689854B2 |
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JP4688373B2 |
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JP4668618B2 |
A hot melt adhesive composition that includes thermoplastic polymer, a source of zinc, at least one of aluminum trihydrate and magnesium hydroxide, and no greater than 70% by weight of a source of halogen. Articles that include a porous ...
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JP4669196B2 |
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JP2011066448A |
To provide a bonding tape which can suppress deterioration in the yield of a product and improve the operability of solar cell connection.The bonding tape for connecting a plurality of solar cells electrically is equipped with a metal fo...
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