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JP4275224B2 |
Multilayer films that include a thermotropic liquid crystalline polymer film layer and a poly(ethylene terephthalate) or polycarbonate film layer are bound together using a hot melt adhesive, Which may be either (1) a blend of poly( alph...
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JP2009120825A |
To provide a cross-linking agent composition, which forms a cross-link by ion reaction, can be uniformly dispersed when it is mixed with a resin to be cross-linked, stably coexists with the resin to be cross-linked without reacting with ...
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JP2009084463A |
To provide an adhesive exhibiting excellent adhesiveness to a metal, and allowing large variety of operation after being coated, while having excellent initial adhesive force.The bonding is carried out by coating the first liquid contain...
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JP4246619B2 |
To join polyamide resins with each other with a sufficient joining strength. A joining auxiliary for the polyamide resin with which a predetermined joining face is coated to ensure a joining strength between the predetermined joining fac...
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JP4248514B2 |
A branched polyamide comprises unsaturated ends comprising a) at least one unit originating from a multifunctional monomer (A) having more than two functional groups, b) at least one copolyamide sequence resulting from the condensation o...
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JP4238671B2 |
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JP4238525B2 |
To provide a resin composition which has an excellent low thermal expansion coefficient and an excellent high elastic modulus, and to provide an adhesive which has excellent reflow resistance and excellent adhesiveness and is used for se...
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JP4235808B2 |
An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst....
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JP2009507956A |
The use of a polyester-amide in a hot melt adhesive formulation, wherein the polyester-amide includes a short aliphatic dicarboxylic acid functionality and a short symmetrical, crystallizing amid diol functionality.
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JP2009040814A |
To provide an adhesive tape for TAB (Tape Automated Bonding) capable of reducing the occurrence of warpage of a TAB tape and suitably used for wire bonding.The adhesive tape for TAB is produced by forming an adhesive layer comprising a p...
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JP4219660B2 |
In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy r...
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JP4212021B2 |
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JP2009001694A |
To provide a polyester for a pressure-sensitive adhesive suitably used for a pressure-sensitive adhesive composition capable of forming an adhesive layer excellent in tackiness, close adhesion with a substrate material, heat resistance, ...
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JP4204017B2 |
To obtain low-cost pressure-sensitive adhesives and pressure-sensitive adhesive sheets capable of being highly filled with a pigment and inhibiting a phenomenon such as powder fall-off, excellent in heat resistance and abrasion resistanc...
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JP4201150B2 |
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JP2008297556A |
To provide a branched polyamide comprising an unsaturated end, a thermoadhesive composed of the branched polyamide, and use of the branched polyamide as the thermoadhesive or an electrical cable sheathing.The branched polyamide comprisin...
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JP4189634B2 |
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JP4189633B2 |
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JP2008284191A |
To prevent the lowering of adhesion strength even by various sterilization methods, and to provide biocompatibility in adhesive for medical equipment and an endoscope using the same.This adhesive for medical equipment for joining materia...
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JP4181773B2 |
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JP4176833B2 |
A composition and method for repairing damaged connective tissue is provided. The composition comprises pseudo-poly(amino acids) and/or classic poly(amino acids) that exhibit adhesiveness for connective tissues. The composition is formed...
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JP4172063B2 |
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JP4172064B2 |
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JP2008255267A |
To provide a sheet and a tape comprising a moisture-permeable waterproof fabric with a lining, having high sealing performance for preventing leakage of water from seams of clothing products, preventing reduction of moisture permeability...
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JP4168456B2 |
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JP2008248019A |
To provide an aqueous adhesive composition excellent in water resistance, heat resistance, and durability.The aqueous adhesive composition comprises a carboxyl group-containing aqueous polymer as the main agent, a curing agent containing...
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JP4163436B2 |
An endless seamed flexible belt (30) has a substrate and several mutually mating elements on its ends, which are joined in an interlocking manner to form a seam (31). The seam comprises an adhesive comprising a polyamide. An independent ...
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JP2008231195A |
To provide a flame-retardant adhesive composition which excels in soldering heat resistance, adhesion after soldering treatment, and mechanical strength.The flame-retardant adhesive composition mainly comprises, as essential components, ...
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JP2008214597A |
To provide an adhesive composition for electronic parts superior in chemical resistance, insulation durability and reservation stability, an adhesive sheet for electronic parts using the same, and a tape with an adhesive for electronic p...
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JP2008201884A |
To provide a halogen free adhesive composition having excellent flame-retardancy and high electric insulation reliability without containing a halogen compound and excellent in a characteristic required for the flexible print wiring boar...
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JP2008201111A |
To provide an optical laminated film immune to problems such as inter-film shifting or light leakage, despite exposure to high temperature/high humidity conditions.The optical laminated film of present invention consists of at least one ...
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JP2008184495A |
To provide a cross-linkable aqueous dispersion excellent in water resistance and heat resistance and excellent in left viscosity stability, to provide its production method, to provide an adhesive, and to provide a coating agent.The pres...
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JP2008530293A |
A crosslinkable hot-melt adhesive for coating and/or laminating sheeting materials is described, whereby the hot-melt adhesive is an amino-terminated copolyamide and the crosslinking agent belongs to the chemical class of multifunctional...
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JP2008528760A |
One-part epoxy adhesive formulations, and methods of using the same, are described. The formulations include, among other things, powdered methacrylate butadiene styrene and aramid pulp to, among other things, improve the wash off resist...
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JP2008528784A |
A process for preparing an aqueous polymer dispersion, in which, in an aqueous medium, in a first reaction stage, an aminocarboxylic acid compound is reacted in the presence of a hydrolase and of a dispersant, and, if appropriate, of an ...
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JP2008162401A |
To provide a resin tank welding member capable of clearing more stringent regulation and reducing its production cost by forming the resin-made tank welding member of a single layer material of a polyamide/poly-olefin resin composition h...
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JP2008163330A |
To provide a polyamide resin-containing varnish from which a solvent is easily removed during film formation and which gives a film or adhesive layer with a reduced residual solvent content and is excellent in workability.The polyamide r...
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JP2008161939A |
To provide a process which can dimensionally repair a metallic detail part joined to a substrate positioned below, without degrading the bonding function and also without thermally damaging the substrate during repairing the metallic det...
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JP2008150493A |
To provide an aqueous adhesive composition having biodegradability and affording high adhesive performance through forming an adhesive layer without infiltrating inside even if the adherend in question is a woody material.The aqueous adh...
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JP4109863B2 |
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JP2008521416A |
A process for preparing an aqueous polyamide dispersion by hydrolase-catalyzed reaction of an aminocarboxylic acid compound in aqueous medium.
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JP2008521747A |
Formulation comprising a polymerizable monomer and/or a polymer and, dispersed therein, a superparamagnetic powder, which comprises aggregated primary particles, the primary particles being built up from magnetic metal oxide domains havi...
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JP2008143925A |
To provide a polyamide resin excellent in ion migration resistance, bonding property under a high humidity and solder heat resistance, and suitably used as the adhesive for an FPC (flexible printed circuit) substrate plate.This polyamide...
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JP2008143974A |
To provide a composition for adhesive layer formation provided between a substrate and a photosensitive resin layer and sufficiently adhering both members.The composition for adhesive layer formation comprising an amide resin and a polym...
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JP2008520453A |
A stamped product for permanently obturating holes, especially in metal sheets or plastic parts of automobile bodies, having an at least partly single-sidedly self-adhesively treated base layer comprising a heat-resistant backing whose a...
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JP4095381B2 |
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JP2008124296A |
To provide a semiconductor device made of a chip which exhibits wafer reinforcement effects during a manufacturing process, is excellent in handleability, exhibits stable mounting characteristics during a mounting process, and exhibits h...
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JP4083569B2 |
An adhesive for resin roll assembly which is to be used in such a manner that the adhesive is injected into the space between a cylindrical object made of a resin and either a roll core or a fiber-reinforced underlayer formed by winding ...
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JP2008510851A |
Polymer blend compositions that include diacetylene segments are provided. The polymers containing diacetylene segments are capable of a colorimetric indication in response to stimuli, such as heat, an analyte or exposure to certain envi...
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JP2008081717A |
To provide a resin composition excellent in colorless transparency and heat resistance, a composition obtained by dissolving the same in an organic solvent, a heat resistant adhesive excellent in colorless transparency and heat resistanc...
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