Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 1,523

Document Document Title
WO/2024/038153A1
The invention relates to compositions comprising a constituent-A, which constituent-A consists of a polylysine component, a XL-component, and a fibrous component which fibrous component consists of at least one fibrous element which fibr...  
WO/2024/038152A1
The invention relates to compositions comprising a constituent-A, which constituent-A consists of a polylysine component, a XL-component, and a fibrous component which fibrous component consists of at least one fibrous element which fibr...  
WO/2024/008939A1
The invention relates to compositions comprising a constituent-A, which constituent-A consists of a polylysine component, a XL-component which is a monomeric compound having an acetoacetate group, and a fibrous component which fibrous co...  
WO/2024/008938A1
The invention relates to compositions comprising a constituent-A, which constituent-A consists of a polylysine component, a XL-component, and a fibrous component which fibrous component consists of at least one fibrous element which fibr...  
WO/2024/009969A1
This adhesive composition includes: a polyester polyamide resin (A) that has a polyester portion and a polyamide portion; and an epoxy resin (B). There are 1–60 parts by mass of the epoxy resin (B) per 100 parts by mass of the polyeste...  
WO/2024/008940A1
The invention relates to compositions comprising a constituent-A, which constituent-A consists of a polylysine component, a XL-component comprising at least two epoxy groups, and a fibrous component which fibrous component consists of at...  
WO/2023/247437A1
The invention relates to a process for producing a lignocellulosic composite comprising one or more lignocellulosic composite layers. The process comprises S1) providing or preparing a mixture, at least comprising: lignocellulosic partic...  
WO/2023/226133A1
Disclosed in the present invention are an ultralow-hardness low-temperature activated thermoplastic polyurethane hot melt adhesive film and a preparation method therefor. The hot melt adhesive film comprises 30-40 parts of a hot melt adh...  
WO/2023/223229A1
The present invention relates to a bonding resin useful for example in the manufacture of insulation, such as mineral wool insulation or glass wool insulation. The invention also relates to a method for preparing the bonding resin and to...  
WO/2023/223232A1
The present invention relates to a bonding resin useful for example in the manufacture of insulation, such as mineral wool insulation or glass wool insulation. The invention also relates to a method for preparing the bonding resin and to...  
WO/2023/212743A2
The present invention relates to non-toxic, biodegradable adhesive compositions comprising the reaction product of a linear dicarboxylic acid, a saturated triol, and an aromatic amino acid. In certain embodiments, the adhesive compositio...  
WO/2023/180824A1
A thiol-containing compound having at least two terminal groups of formula -NH-CO-CO-NH-R1 -SH where R1 is an alkylene, reaction mixtures containing the thiol-containing compound and an epoxy resin, and compositions containing a polymeri...  
WO/2023/168041A1
A phase-changing thermally conductive composition includes a non-silicone resin and a thermally stable antioxidant having a melting point temperature of between 40 and 85 oC. The thermally stable antioxidant acts as a phase-changing comp...  
WO/2023/148578A1
A board comprising cellulose-containing materials, such as plant fibres and/or wood chips and/or wood parts, and a glue which connects these cellulose-containing materials to each other, wherein the glue is a glue based on hyperbranched ...  
WO/2023/124668A1
Disclosed is a polyamide composite material, which comprises the following components in parts by weight: 100 parts of a polyamide with a terminus amino group value of 45-200 mmol/kg, and 0.1-8 parts of an epoxy resin with an epoxy value...  
WO/2023/122430A1
A method for preparing an adhesive resin for use in a coating composition for a crepe paper manufacturing process that includes the steps of reacting a polycarboxylic acid or a derivative of a polycarboxylic acid with a polyamine to form...  
WO/2023/118762A1
The invention relates to a copolymer with amide units and polyether units comprising at least one unit A, at least one unit B and at least one unit C, wherein: - unit A is a specific aliphatic amide unit comprising 10 or more carbon atom...  
WO/2023/062324A1
The invention relates to a hot-melt adhesive composition comprising: (i) at least one specific semi-crystalline aliphatic copolyamide; (ii) at least one filler, the carbon atom content of which is between 60 and 100% relative to the numb...  
WO/2023/062325A1
The invention relates to a hot-melt adhesive composition comprising: (i) at least one specific aliphatic semi-crystalline copolyamide containing a Y unit having a Tg lower than 30° C; (ii) from 3 to 35% by weight, relative to the total ...  
WO/2023/054707A1
Provided is a creping adhesive or the like having favorable stringiness and wet adhesion. This creping adhesive contains PVA (A) and satisfies at least one of (i) and (ii) below. (i) The PVA (A) contains PVA having a minimum branching de...  
WO/2023/002780A1
The present disclosure is, inter alia, a thermoplastic resin composition to be used to form a resin sheet, wherein the resin sheet is to be used in crosslinking adhesion with a rubber, the thermoplastic resin composition contains a therm...  
WO/2023/002122A1
The present invention relates to a polyamide composition comprising a polyamide which is the polycondensation product of an acid component and an amine component, the acid component comprising, per mole of acid component: - 30 to 50 mol....  
WO/2023/286757A1
The present invention addresses the problem of providing an adhesive agent composition having excellent nanocellulose dispersing ability. Said problem can be solved by an adhesive agent composition containing nanocellulose and a resin th...  
WO/2022/238526A1
The present invention relates to a hot melt adhesive composition in the form of powder comprising at least one polyamide comprising at least one unit corresponding to the formula (Ca diamine).(Cb diacid), wherein the diamine is a seconda...  
WO/2022/136613A1
The present invention relates to a binder composition comprising a) component A comprising polymer(s) A1 having primary and/or secondary amino groups, wherein polymer(s) A1 has(have) a primary and secondary amine group nitrogen content o...  
WO/2022/136612A1
The present invention relates to a binder composition comprising component A comprising polymer(s) A1 and optionally component B comprising component B1 which is selected from the group consisting of a mono-saccharides, disaccharides, hy...  
WO/2022/136614A1
The present invention relates to a binder composition comprising a) component A comprising polymer(s) A1 having primary and/or secondary amino groups wherein polymer(s) A1 has(have) a primary and secondary amine group nitrogen content (N...  
WO/2022/136611A1
The present invention relates to a binder composition comprising a) Component A comprising amino acid polymer(s) A1 and b) Component B comprising component B1 selected from the group consisting of pentoses, hexoses, disaccharides of pent...  
WO/2022/122882A1
The invention relates to a process for producing a benzoxazine containing free aliphatic hydroxyl groups and monoester comprising the steps of: a) a reaction of a phenolic acid derivative with a monofunctional oligomer or molecule at a t...  
WO/2022/116364A1
The present disclosure relates to a copolymer A, comprising (i) at least one repeat unit having an amide group and carboxyl and/or ammonium salt thereof, (ii) at least one repeat unit derived from linear or branched C2-C18 α-monoolefins...  
WO/2022/116362A1
The present disclosure relates to an adhesive. The adhesive contains at least one copolymer A, and the copolymer A has at least one repeating unit having an amide group and a carboxyl group and/or ammonium salt thereof and at least one r...  
WO/2022/116363A1
The present disclosure relates to an adhesive, the adhesive comprising at least one copolymer A, the copolymer A having at least one repeating unit with an amide group and a carboxyl group and/or an ammonium salt thereof, and at least on...  
WO/2022/074331A1
The present invention relates to a polyamide, a composition comprising said polyamide, the use thereof, and a moulded article derived from same and its production method. The polyamide is the result of polycondensation of an acid compone...  
WO/2022/075030A1
Provided is a resin composition containing poly(aspartic acid), which is a biodegradable material. This resin composition has excellent gas-barrier properties and, when used in layered-product formation, does not especially require a pos...  
WO/2021/246482A1
Provided are a method for producing a bonded body capable of obtaining exceptional adhesive strength and connection reliability, a bonded body, and a hot melt adhesive sheet containing electroconductive particles. A method for producing ...  
WO/2021/246484A1
Provided are: a production method that is for a smart card and that can impart excellent connection reliability and bending resistance to the smart card; a smart card; and a conductive particle-containing hot-melt adhesive sheet. Accordi...  
WO/2021/246483A1
Provided are a method for producing an assembly capable of obtaining exceptional adhesive strength and connection reliability, an assembly, and an electroconductive particle-containing hot melt adhesive sheet. A method for producing an a...  
WO/2021/209728A2
The invention relates to a semi-crystalline copolyamide comprising at least two units corresponding to the following formula: X/Y where - the X unit is a crystalline unit obtained by polycondensation of a unit selected from a C6-C12 alph...  
WO/2021/209729A2
The invention relates to a semi-crystalline copolyamide comprising at least two units corresponding to the following formula: X/Y where - the X unit is a crystalline unit obtained by polycondensation of a unit selected from a C6-C12 alph...  
WO/2021/209730A2
The invention relates to a semi-crystalline copolyamide comprising at least two units corresponding to the following formula: X/Y where - the X unit is a crystalline unit obtained by polycondensation of a unit selected from a C5-C12 alph...  
WO/2021/181314A1
The present invention provides an adhesive resin composition that exhibits both adhesive properties and gas barrier properties, an adhesive resin molded article, an adhesive resin laminate, and a housing sealing member. More specifically...  
WO/2021/047639A1
Disclosed is a composite floor, comprising a wear-resistant layer, a polyvinyl chloride patterned fabric layer, a base material layer, a balance layer, and a muting layer that are sequentially arranged, the wear-resistant layer being a m...  
WO/2021/028457A1
The invention concerns a removable composition formed by at least: - a polyamide or a copolyamide or a mixture of polyamides or a mixture of copolyamides or a mixture of at least one polyamide and at least one copolyamide, the polyamide(...  
WO/2020/231417A1
The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt% to about 90 wt% with ...  
WO/2020/149439A1
The present invention relates to a conductive adhesive film with excellent heat resistance and moisture resistance, in which an adhesive layer made of a conductive adhesive composition comprising: 100 parts by weight of a polyamide resin...  
WO/2020/136525A1
There is described a hot-melt resin for dissipating heat produced by devices to which the resin is applied, comprising an adhesive loaded with boron nitride. Said resin has a percentage by weight of adhesive between 62% and 72%, and a pe...  
WO/2020/091349A1
The present invention relates to a breathable waterproof membrane (100) capable of being heat-bonded to a fabric by using a hot melt adhesive dot-coated on the surface thereof, and a method for manufacturing same. In particular, the pres...  
WO/2020/044995A1
Provided are a curable resin composition having high adhesiveness to a base material such as a metal and high durability, a molded composite member formed by coating this curable resin composition onto a base material and performing resi...  
WO/2020/039372A1
The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer, silicone polyurea block copolymer, and/or an addition cure silicone, a silicate tackifyi...  
WO/2019/231875A1
Anaerobic paste compositions and uses are disclosed. The anaerobic paste compositions remain stable at room temperature for a prolong time without phase separating, making these compositions particularly well suited for long term storage...  

Matches 1 - 50 out of 1,523