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JP2022046213A |
To provide an adhesive for a flexible copper-clad laminate, capable of achieving dielectric characteristics, thermal characteristics, working characteristics, adhesion characteristics, and moisture absorption characteristics, and costs i...
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JP7029774B2 |
To provide a method corresponding to the generation of a thermosetting material on the basis of sydnone showing high heat resistance, and a platform.Provided is a method for generating a thermosetting resin composition including the givi...
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JP7022147B2 |
This invention relates to a (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer, preparation method and use thereof. The (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-blo...
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JP7018942B2 |
The present invention aims to provide a curable resin composition excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. The present inventio...
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JP2022017947A |
To provide a thermosetting adhesive sheet which has properties of low dielectric constant and low dielectric loss tangent and exhibits good laser processability and drilling processability and high adhesive strength before and after sold...
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JP7003794B2 |
The present invention relates to a polyimide, adhesive, film-shaped adhesive material, adhesive layer, adhesive sheet, resin-attached copper foil, copper clad laminate, printed circuit board, and a multilayer circuit board and a method f...
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JP7003795B2 |
To provide a polyimide, an adhesive, a film-like adhesive, an adhesion layer, an adhesive sheet, a copper foil with resin, a copper-clad laminate, a printed wiring board, and a multilayer wiring board and a method of producing the same.T...
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JP7003572B2 |
To provide a solventless type laminate adhesive which is excellent in laminate adhesive strength, in particular, in laminate adhesive strength after boil treatment as an adhesive suitable for non-isocyanate soft packaging laminate, and a...
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JP2022009110A |
To provide a resin film for interlayer insulation, a resin film for interlayer insulation with an adhesive auxiliary layer, and a printed wiring board using the resin film for interlayer insulation or the resin film for interlayer insula...
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JP6990699B2 |
A cyanate ester based adhesive comprising component A which has at least one cyanate ester with at least two OCN groups, and component B which comprises at least one catalyst for the trimerisation reaction of OCN groups to form a triazin...
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JP6993476B2 |
The disclosure provides a thermosetting polyimide resin and a manufacturing method thereof, a composition, a prepolymer, a film, an adhesive, and a use thereof. The composition includes at least: (a) a maleimide compound and (b) the ther...
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JP2021194823A |
To provide an adhesive sheet which prevents thermal damage of insert parts by local heating in an insert part formation step of injection forming a coating resin layer on a back surface of the insert parts, suppresses generation of air b...
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JP6984701B2 |
Provided is a laminate which has superior low dielectric constant characteristics, which exhibits excellent adhesion between metal substrates and not only conventional polyimide and polyester film substrates, but also low polarity resin ...
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JP6984602B2 |
Provided is a laminate which exhibits high adhesion not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, and which is able to achieve a high solder hea...
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JP6979695B2 |
To provide a method for producing a hot melt adhesive obtained by chemical recycling of a waste material of polyurethane or an unsaturated polyester, especially a method capable of desirably recycling a waste material of a polyurethane-b...
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JP2021183381A |
To provide a primer layer for improving low-temperature adhesiveness between a layer having a tetrafluoroethylene-based polymer and various substrates, a laminate having a layer having a tetrafluoroethylene-based polymer and a primer lay...
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JP6969290B2 |
To provide an adhesive composition for a ceramic base material, a ceramic base material with an adhesive, and a laminate.An adhesive composition for a ceramic base material contains a polyamide-imide (A-1), which is a condensate of an ac...
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JP6971139B2 |
An object of the present invention is to provide an adhesive composition, a supporting body having an adhering layer using the same, an adhering film, a laminate, a method for manufacturing the same, and a method for manufacturing electr...
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JP6968143B2 |
A temporary bonding composition is provided. The temporary bonding composition includes a polyfunctional crosslinker, a polymer and a solvent. The polyfunctional crosslinker includes a compound containing at least two functional groups s...
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JP6968099B2 |
A curable system containing a benzoxazine and a benzothiazole sulfenamide. The curable system may be catalyzed at temperatures generally used to cure multifunctional epoxy resins yet exhibits improved pot-life and processing times and pr...
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JP2021161130A |
To provide an adhesive composition that excels in adhesiveness, dry solder heat resistance, curability and low dielectric properties.A polyimide urethane resin (A) contains, as copolymerization components, a polycarboxylic acid derivativ...
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JP2021161240A |
To provide a polyimide that is made from a dimer diamine and can effectively reduce transmission loss of high frequency signals while being capable of suppressing the weakening of a resin film.A polyimide contains a tetracarboxylic acid ...
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JP2021161129A |
To provide an adhesive composition that excels in adhesiveness, dry solder heat resistance and low dielectric properties.An adhesive composition contains a polyimide urethane resin (A) containing, as copolymerization components, a polyca...
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JP2021161285A |
To provide a polyimide system adhesive capable of contributing to high-speed transmission and low loss required in 5G communication system, by providing low dielectric property and copper foil adhesiveness in combination, by utilizing ch...
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JP2021155494A |
To provide a curable resin composition which is excellent in adhesion to titanium, heat resistance and water resistance, and an adhesive and an adhesive film including the curable resin composition.A curable resin composition gives a cur...
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JP2021155493A |
To provide a thermosetting adhesive film which is excellent in handling property and storage stability before curing, and is excellent in adhesion and heat resistance after curing.A thermosetting adhesive film has a glass transition temp...
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JP2021147610A |
To further improve dielectric characteristics and effectively reduce transmission loss of a high-frequency signal, in an adhesive layer using polyimide containing dimer diamine as a raw material.Polyimide satisfies the following a) to c)...
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JP6939017B2 |
To provide a new polyimide exhibiting high storage modulus of rigidity even on a B-stage temperature condition; a new polyimide-based adhesive which is a composition using the polyimide and provides an adhesive layer having good adhesion...
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JP6938595B2 |
The present invention relates to a flexible photo imageable coverlay (FPIC) film comprising a photosensitive adhesive layer, and to a manufacturing method thereof and, more specifically, to a FPIC film with excellent developability and e...
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JPWO2020071364A1 |
Provided is an excellent adhesive composition which is excellent in adhesiveness, heat resistance, handleability and insulation reliability, and is suitable for an adhesive film, a coverlay film, a copper-clad laminate and the like. An a...
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JP2021140867A |
To provide a laminate including a polyelectrolyte membrane and a base material, in which a polyelectrolyte membrane with high hydrophilicity and a base material that is often hydrophobic are strongly bonded to each other.There is provide...
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JP2021138905A |
To provide an adhesive that is convenient and has broad options of base material, has no problem of strong coloring, also has high biological safety, and can bond a material composed of metal, resin, carbon or ceramic.An adhesive contain...
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JP2021141108A |
To develop an adhesive for a flexible copper clad laminate that achieves both characteristics comparable to a 2-layer FCCL manufactured by a casting method and productivity equal to or higher than the productivity of a 2-layer FCCL manuf...
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JP6932349B2 |
To provide a polyimide that is soluble in a low-boiling-point solvent, has excellent heat resistance, and is composed of inexpensive raw material.A solvent soluble polyimide contains a group represented by formula (2-1) and a group repre...
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JP6912870B2 |
To provide a colored, thermosetting resin composition that has high insulating performance even when colored with a pigment or a dye, and excels at heat resistance, electric characteristics (low dielectric constants and low dielectric lo...
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JPWO2020012978A1 |
An adhesive composition containing (A) a bismaleimide resin represented by the following general formula (1), (B) an epoxy resin represented by the following general formula (2), and (C) a curing accelerator. .. [Chemical 1][In equation ...
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JP6909171B2 |
The present invention provides: an adhesive sheet that, before a peeling step, stays fully and stably stuck to a back surface of a lead frame and a back surface of a sealing resin and does not leak sealing resin, even after being subject...
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JP6908088B2 |
The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive for...
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JP6901086B2 |
To provide a resin composition which is further excellent in gas barrier property, in particular, water vapor barrier property and oxygen barrier property, compared to a conventional resin composition.A resin composition contains a polya...
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JP6902969B2 |
To provide a thermosetting adhesive sheet which can strongly bond adherends with poor flatness such as a friction material having a roughened surface (porous surface) and a metal member having a smooth surface, and adherends with poor pa...
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JP2021088649A |
To provide a thermosetting resin composition having heat resistance, adhesiveness and low dielectric properties after curing.The thermosetting resin composition is provided which contains the following components (A)-(D): (A) a polymalei...
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JP6879451B2 |
To provide a cyanate compound that expresses excellent thermal conductivity and a method for producing the same, and a resin composition, a cured product, a monolayer resin sheet, a laminate resin sheet, a prepreg, a metal foil-clad lami...
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JP6881664B1 |
To provide a polyimide resin composition which provides a polyimide resin layer in which an organic solvent easily volatilizes when dried under heating, and has a low dielectric constant, a low dielectric loss tangent, and excellent sold...
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JP6858111B2 |
To provide a method for producing a solvent-soluble polyimide resin capable of forming an adhesive layer which prevents occurrence of a volatile component formed of a cyclic siloxane compound, and prevents lowering of an adhesive force b...
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JP6850432B2 |
To provide a cyanate compound having excellent heat resistance and moisture resistance, particularly thermal decomposition resistance, and provide a resin composition, a cured product, a prepreg for structural material, a sealing materia...
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JP6848916B2 |
A purpose of the present invention is to provide a polyimide resin composition which provides a cured material having excellent applicability, adhesiveness with various metal frames, high moisture proofness, and exhibiting low elasticity...
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JP6847956B2 |
Polymeric materials are disclosed herein that include a reaction product of components comprising: a) a first amine component having at least two and at most three primary amino groups, secondary amino groups, or a mixture thereof, with ...
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JP6844928B2 |
To provide an adhesive for film laminated metal can excellent in printability and adhesiveness of a processing part, and excellent in blocking resistance and storage stability.There is provided an adhesive for film laminated metal can co...
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JP2021036022A |
To provide a thermoconductive adhesive sheet excellent in temporary adhesiveness and sheet performance, having a high thermal conductivity even under low-temperature sintering conditions, and capable of giving a semiconductor device exce...
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JP6839092B2 |
The invention relates to the use of an epoxy resin composition, containing at least one reaction product from the reaction of at least one amine of formula (I) with at least one carbonyl compound of formula (II) and hydrogen, as a cold c...
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