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JP2018070871A |
To provide an adhesion aid for an aqueous adhesive for woody material, which is used for an aqueous adhesive composition, having excellent adhesive strength and water resistance.An adhesion aid for an aqueous adhesive for woody material ...
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JP6312337B2 |
A binder comprising the products of a carbohydrate reactant and polyamine is disclosed. The binder is useful for consolidating loosely assembled matter, such as fibers. Uncured fibrous products comprising fibers in contact with a carbohy...
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JP2018058966A |
To provide a resin solution containing polyamide which has high regularity of a molecular structure and has few branch structures, and a method (application) for using them.There are provided a resin solution containing polyamide imide w...
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JP6303503B2 |
[Problem] To provide a highly heat resistant resin composition which exhibits good tackiness at low temperatures less than or equal to 180°C, and whose production of a volatile portion due to decomposition or the like is small even at h...
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JP6299607B2 |
The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during co...
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JP6294220B2 |
To provide a resin composition which can form an adhesive layer and a binder layer that exhibit adequate adhesiveness to base materials formed of various materials and are excellent in solvent resistance and the like, and is useful as an...
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JP2018030294A |
To provide an adhesive laminate that makes it possible to bond a polyimide film to an adherend, and inhibit a decrease in the bonding strength even when the laminate after the bonding is exposed to a high temperature of more than 300°C....
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JP6284247B2 |
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JP6283441B2 |
To provide: an adhesive composition for a circuit board, which is low in relative dielectric constant and dielectric dissipation factor, and superior in adhesiveness, heat resistance, dimensional stability and flame retardancy, and which...
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JP6283449B1 |
[Subject] Specific inductive capacity and a dielectric dissipation factor are low, have the characteristic excellent in adhesiveness, heat resistance, dimensional stability, fire retardancy, etc., and provide an adhesive composition for ...
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JP6275019B2 |
The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bon...
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JP6274965B2 |
A method of joining two objects includes applying an adhesive composition between and in contact with a first object and a second object, and allowing the adhesive composition to harden to form an adhesive bond between the first and seco...
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JP2018502945A |
The adhesive arrangement (100) comprises an adhesive formed from an adhesive composition (101) having a thermoplastic material and a melt processable perfluoropolymer material. The adhesive arrangement further comprises a base layer (103...
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JP6262691B2 |
To provide a solvent-soluble polyimide resin capable of forming an adhesive layer which does not generate a volatile component formed of a cyclic siloxane compound and does not lower an adhesive force between a wiring layer and a coverla...
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JP6254008B2 |
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JP6252482B2 |
The present invention provides an adhesive composition containing an epoxy resin and a polyamide resin.
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JP2017222745A |
To provide a solventless silicone-modified polyimide resin composition which is preferred as an adhesive and a coating agent that can be cured with ultraviolet rays and/or visible light rays, and in which liquid sagging is prevented by l...
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JP2017536437A |
The present invention relates to 1,3-dialcohol-based polyetheramines, especially etheramine mixtures. The etheramine mixture is at least 90% by weight based on the total mass of the etheramine mixture, formulas (I) and / or (II), [Chemic...
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JP2017214501A |
To provide an electromagnetic wave-shielding adhesive having high heat resistance, and an electromagnetic wave-shielding material and a coaxial cable prepared therewith.An adhesive contains a polyimide resin having a residue of siloxane ...
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JP6241415B2 |
The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent...
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JP6226141B2 |
There is provided a novel adhesive composition or underfill composition. An adhesive composition or an underfill composition comprising: a polymer that exclusively includes at least one structural unit of Formula (1) as a repeating unit ...
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JP2017193650A |
To provide a temporary fixing material capable of peeling a resin surface where a resin is coated on a substrate of a body to be coated with a treatment by a hot water or the like without residual and a temporary fixing method using the ...
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JP6219994B2 |
Provided is a method for producing a thermosetting aqueous binder comprising a polycarboxylic acid and an amine-based compound serving as a crosslinking agent for the polycarboxylic acid and having two or more per molecule of at least on...
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JP6213977B2 |
To provide a polyimide temporary fixative enabling, on an occasion for executing a work for processing a compact semiconductor substrate having a small diameter or a small piece shape by using a semiconductor process device accessorizing...
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JP6209876B2 |
A method for producing a semiconductor device having a semiconductor element obtained by dividing a semiconductor wafer comprises a temporary securing step of arranging a temporary securing film between a support member and the semicondu...
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JP2017168808A |
To provide a thermosetting white ink for CSP-LED which prevents migration and shows high reliability of CSP-LED.A thermosetting white ink 9 for CSP-LED includes, as essential components, (A) thermosetting resin, (B) white pigment, and (C...
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JP6195719B2 |
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JP2017524753A |
Provided is a curable composition for adhering windings or core laminates of electromechanical machines. The curable composition comprises (A) about 10% to about 25% by weight of the polyfunctional cyanate ester and (B) about 35% by weig...
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JP6188051B2 |
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JP2017141317A |
To provide a resin composition which is excellent in heat resistance after a polishing step of a non-circuit formation surface (rear face) of a semiconductor circuit formation substrate, can bond the semiconductor circuit formation subst...
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JP6179720B2 |
To provide a one pack-type curable cyanate ester resin composition being liquid at 25°C and having no solvent and having heat curability having storage stability (latent) while maintaining storage stability at low viscosity.There is pro...
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JP2017139322A |
To provide: a method of producing a device substrate capable of preventing the device substrate from being cracked in peeling the device substrate from a support plate; and a laminate.A method of producing a device substrate is a method ...
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JP2017133001A |
To provide a polyimide resin adhesive having no generation of a volatile component consisting of a cyclic siloxane compound and no reduction of adhesive force of a wiring layer and a coverlay film even when exposed to a high temperature ...
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JP2017128637A |
To provide an adhesive composition which has high light reflectance, excellent heat resistance, and excellent insulating properties while having high thermal conductivity by controlling dispersibility of a thermally conductive filler and...
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JP2017122157A |
To provide a heat-resistant adhesive resin and a heat-resistant adhesive composition that have sufficient adhesive force at 150-250°C, have a small change in adhesive force in the temperature range and can be easily peeled, and can, opt...
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JP6161293B2 |
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JP6156479B2 |
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JP6156638B2 |
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JP6136268B2 |
Provided are a die attach film, a semiconductor wafer, and a semiconductor packaging method. The die attach film can prevent generation of burrs or scattering of chips in a dicing process, and exhibits excellent expandability and pick-up...
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JP6138943B2 |
The objective of the present invention is to obtain a photosensitive resin composition which does not have the defects of conventional technology and which is capable of forming an accurate polyimide pattern easily by a low-temperature p...
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JP2017088732A |
To provide an adhesive composition for the lamination of semiconductors that quickly solidifies by heating and drying, has no adhesiveness in a distribution process, and quickly cures at such a temperature that reduces damage to semicond...
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JP6130980B1 |
In order to paste a polyimide film and copper foil together in a double-sided copper-clad laminate sheet used for a flexible printed wiring board, a suitable adhesive composition is provided. It is an adhesive composition in which polyam...
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JP6121405B2 |
The present disclosure relates to a curing agent for a curable resin which is a reaction product obtained from the reaction of a liquid epoxy and a polyamine component. The curing agent may be used as part of a two component curable syst...
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JP6112013B2 |
An adhesive sheet for production of a semiconductor device with bump electrode, including a soft film and an alkali-soluble adhesive film formed on the soft film is capable of exposing the bump electrode without imparting damage to the b...
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JP2017057340A |
To provide a resin composition capable of providing a thermal conductive glue film having excellent adhesiveness, high thermal conductivity and good electrical insulation properties by dispersing an inorganic filler having specific parti...
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JP6094031B2 |
To improve moisture absorption reflow resistance of a semiconductor device.An adhesive composition 2 contains: a thermoplastic resin containing two or more acid anhydrides and two or more diamines as a monomer unit; an imide compound con...
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JP2017048392A |
To provide a resin sheet which can improve balance of implantation for lower circuits and adhesion for electronic parts.A resin sheet 10 is used to bond electronic parts together, and tacking power at 25°C is 80 gf/5 mmφ or more. When ...
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JPWO2015033703A1 |
It is an object of the present invention to provide an adhesive composition containing a modified polyolefin and a carbodiimide compound, which has good pot life and good adhesiveness between a metal base material and a polyolefin-based ...
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JP6082439B2 |
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JP6065495B2 |
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