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WO/2013/121701A1 |
The present invention provides a protective film for semiconductor wafers which is provided with a base film and a protective membrane formed on the upper side of the base film, wherein the protective film for a semiconductor wafer is ch...
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WO/2013/112445A1 |
Disclosed is a method of preparing a lignocellulosic composite; the method comprising the steps of combining one or more dry protein sources as powders and one or more lignocellulosic materials; subsequently combining with the protein an...
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WO/2013/089410A1 |
The present invention relates to an adhesive resin composition for manufacturing a circuit board and the use thereof. The adhesive resin composition according to the present invention comprises: a cyanate ester resin; fluorinated resin p...
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WO/2013/079680A1 |
An aqueous binder composition comprises: (1) a water-soluble binder component obtainable by reacting at least one alkanolamine with at least one polycarboxylic acid or anhydride and, optionally, treating the reaction product with a base;...
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WO/2013/058054A1 |
In order to provide a thermally-detachable sheet that detaches at higher temperatures, this thermally-detachable sheet has a shear bond strength with respect to a silicon wafer of 0.25 kg/5 × 5 mm or larger, at a temperature of 200°C, ...
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WO/2013/057432A1 |
The present invention relates to a sizing composition containing a thermosetting resin and an amine-carboxylic acid resin as fire retardant. The preparation of said amine-carboxylic acid resin does not involve formaldehyde. The invention...
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WO/2013/048851A1 |
Novel oligomers and polymers derived from the reaction of benzoxazine compounds with a mixture of thiol compounds and amine compounds are disclosed. The compositions are useful in coating, sealants, adhesive and many other applications.
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WO/2013/039029A1 |
Provided are: a polyimide film in which volatile matter is not generated due to decomposition etc., and which has good adhesiveness, even at high temperatures of 250°C and above; and a resin composition and a laminated film that use the...
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WO/2013/035787A1 |
[Problem] To provide a novel polymer, a composition containing the polymer, and a novel adhesive composition whereby a cured film having desired characteristics is obtained. [Solution] A polymer having structural units represented by for...
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WO/2013/015469A1 |
A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Pref...
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WO/2013/008437A1 |
The present invention addresses the problem of providing a resin composition including a polyimide that is soluble in a solvent and from which a resulting film will be highly viscoelastic and flexible at high temperatures. In order to re...
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WO/2013/008667A1 |
Provided is a curable resin composition which is liquid at ordinary temperatures and exhibits excellent heat resistance and which can yield cured products having a low coefficient of thermal expansion. The curable resin composition compr...
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WO/2012/172972A1 |
Disclosed is a cross-linked polyimide resin produced by reacting (A) a polyimide siloxane having a ketone group with (B) an amino compound having at least two primary amino groups as functional groups. Each of the amino groups in the ami...
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WO/2012/160916A1 |
The present invention provides an adhesive composition which comprises a polyurethane resin and a thermosetting component and which exhibits a flow of 500μm or more in B-stage at 120°C and a flow of less than 500μm in C-stage at 120°...
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WO/2012/141271A1 |
This adhesive comprises a condensed resin having a structural unit obtained by condensation polymerization of polymerizable monomers, which include a monomer (A) having at least two carboxyl groups and a monomer (B) having at least two a...
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WO/2012/141267A1 |
A pressure-sensitive adhesive that satisfies at least one of the belowmentioned conditions (1 and/or 2) and contains a condensation resin that has a structural unit obtained by condensation-polymerizing polymerizable monomers including t...
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WO/2012/140740A1 |
A pressure-sensitive adhesive composition that satisfies at least one of the belowmentioned conditions (1 and/or 2) and contains a condensation resin that has a structural unit obtained by condensation-polymerizing polymerizable monomers...
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WO/2012/141266A1 |
This adhesive comprises a condensed resin having a structural unit obtained by condensation polymerization of polymerizable monomers, which include a monomer (A) having at least two carboxyl groups and a monomer (B) having at least two a...
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WO/2012/134454A1 |
Disclosed herein is a process to produce a laminate comprises coating at least an outer surface of a dynamically vulcanized alloy film with an adhesive composition to produce the laminate, wherein the adhesive layer has a thickness of le...
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WO/2012/105659A1 |
This adhesive tape has a structure in which an adhesive layer and a radiation-curable pressure-sensitive adhesive layer are layered, said radiation-curable pressure-sensitive adhesive layer being capable of pattern formation by exposure ...
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WO/2012/105558A1 |
Provided are: a thermosetting polyimide resin composition that has excellent dimensional stability when cured, excellent low-temperature solubility when semi-cured (transitioned to the B-stage), and excellent fire resistance after being ...
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WO/2012/105547A1 |
Provided is a curable resin composition which enables the production of a cured article that does not crack upon curing and has both a low thermal expansion coefficient and a low water absorbability. A curable resin composition comprisin...
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WO/2012/075344A2 |
One or more embodiments contained herein disclose an adhesive layer for printed circuit board (PCB) applications. The improved adhesive film layer may comprise a benzoxazine resin and a phenoxy resin. According to some embodiments, the i...
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WO/2012/073851A1 |
The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition i...
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WO/2012/066897A1 |
An anisotropic conductive film for electrically connecting a first circuit member to a second circuit member, the first circuit member having an insulating film formed in at least part thereof. The anisotropic conductive film comprises a...
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WO/2012/053589A1 |
The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connec...
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WO/2012/043025A1 |
The present invention provides a conductive adhesive composition that has superior adhesive properties and low surface resistance and is capable of use as a buffer layer foran electronic device. This conductive adhesive composition conta...
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WO/2012/005079A1 |
The disclosed photosensitive adhesive composition contains (A) an alkali-soluble polyimide having a particular structural unit and having a particular structure at at least one principal chain terminus, (B) a glycidylamine epoxy composit...
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WO/2012/002134A1 |
Disclosed are a photosensitive resin composition and a photosensitive resin composition film, each of which has small stress after curing and exhibits excellent adhesion after thermal compression bonding. Specifically disclosed is a phot...
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WO/2011/162256A1 |
A process margin can be improved, and high connection reliability can be achieved. Disclosed is an anisotropic conductive material comprising an adhesive agent composition and electrically conductive particles dispersed in the adhesive a...
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WO/2011/128431A1 |
Disclosed are novel cross-linkable end-cappers for oligo-and polyimides. End-capped oligo-and polyimides comprising such an end-capper may be cured at a lower temperature compared to oligo-and polyimides end-capped with PEPA.
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WO/2011/126707A2 |
This invention provides an adhesive for roll-shaped paper which has a high initial adhesiveness and causes the paper to peel easily without making the application surface sticky, and a roll-shaped paper on which this adhesive for roll-sh...
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WO/2011/125778A1 |
Disclosed is an adhesive composition which contains (A) a thermoplastic resin that has a weight average molecular weight of 10,000-150,000 and a viscosity at 25˚C of 5-300 poises as dissolved in N-methyl-2-pyrrolidone such that the resi...
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WO/2011/089922A1 |
A polyimide resin composition containing a polyimide produced by fusing a diamine component comprising an aromatic diamine (A) represented by general formula (1-1) or the like, a silicone diamine (B) represented by general formula (2) an...
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WO/2011/077917A1 |
Provided is a polyimide resin obtained by reacting an amino compound, said amino compound having at least two primary amino groups as functional groups, with a ketone group in a polyimide-siloxane that has constituent units represented b...
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WO/2011/068157A1 |
Disclosed is a resin composition which prevents B-stage cracking, and prevents dust fall which can occur, for example, during a manufacturing process of flexible printed circuit boards, and which exhibits a good balance of fold resistanc...
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WO/2011/055580A1 |
Disclosed are an adhesive composition containing a resin having piperazine skeletons, a circuit connecting structure, a semiconductor device, and an adhesion improvement agent for glass.
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WO/2011/052376A1 |
Disclosed is an adhesive resin composition containing 100 parts by weight of component (a) which is a polyimide siloxane containing the structural units represented by general formula (1) and (2) (in the formula, Ar represents a tetraval...
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WO/2011/051412A1 |
The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. I...
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WO/2011/049011A1 |
A photosensitive adhesive composition which comprises (A) an epoxy compound, (B) a soluble polyimide that contains residues of a diamine represented by general formula (2), (C) a photopolymerizable compound, and (D) a photopolymerization...
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WO/2011/040399A1 |
A resin composition which comprises both a polyamideimide and a polyfunctional glycidyl compound, said polyamideimide having two or more carboxylic groups at at least one terminal of the molecular chain.
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WO/2011/040415A1 |
Disclosed is a multilayer resin sheet comprising a resin layer containing an epoxy resin having a mesogenic skeleton, a curing agent, and an inorganic filler, and an insulating adhesive layer provided on at least one surface of the resin...
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WO/2011/040416A1 |
Disclosed is a resin composition comprising an epoxy resin monomer having a mesogenic skeleton, a novolak resin containing a compound having a structural unit represented by general formula (I), and an inorganic filler. The resin composi...
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WO/2011/040194A1 |
An adhesive resin composition which contains a polyimide resin comprising group Ar (tetravalent aromatic group), group R1 (divalent diaminosiloxane residue), and group R2 (divalent aromatic diamine residue) and which has a P value of 0.7...
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WO/2011/040442A1 |
Disclosed is a conductive connection material which has a laminated structure comprising a resin composition and metal foil selected from solder foil or tin foil. The resin composition of the conductive connection material has a minimum ...
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WO/2011/022222A1 |
Provided are nonwoven polymeric fiber webs using an improved curable composition. Such curable composition comprises a reaction product of an amine and a reactant in the form of an ammo-amide intermediate. To the ammo-amide is added an a...
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WO/2011/022668A1 |
Binder compositions for making fiberglass products and methods for making and using same are provided. The binder composition can include a phenol-aldehyde resin or a mixture of Maillard reactants and one or more modifiers selected from ...
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WO/2011/022224A1 |
Provided is a cellulosic composite comprised of cellulosic material and a binder. The binder comprises a reaction product of an amine and a reactant in the form of an amino- amide intermediate. To the ammo-amide is added an aldehyde or k...
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WO/2011/019593A1 |
A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an addition product of an amine and a reactant to form an amino-amide intermediate. To the amino-amide is added an al...
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WO/2011/019598A1 |
A curable formaldehyde-free binding composition for use with fiberglass is provided Such curable composition comprises an addition product of an amine and a reactant to form an ammo-amide intermediate To the ammo-amide is added an aldehy...
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