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Matches 1 - 50 out of 3,585

Document Document Title
WO/2020/178380A1
The present invention relates to a thermosetting resin composition, in particular for the use as adhesive, obtained or obtainable from the reaction of at least: a polycarbodiimide (i), wherein the number of carbodiimide groups per molecu...  
WO/2020/157828A1
A resin composition comprising (a) a high-molecular-weight component having a weight average molecular weight of 10000 or more, (b) a heat-curable resin having a weight average molecular weight of less than 10000, (c) a curing agent and ...  
WO/2020/155846A1
The present invention provides a graphite adhesive tape, comprising: a graphite layer, the upper surface and/or lower surface of the graphite layer being provided with a plurality of holes; and polyimide covering the surfaces of the grap...  
WO/2020/109723A1
The invention relates to the use of a benzoxazine resin (12) for bonding a monofilament (10), consisting of a glass-resin composite that comprises glass filaments (101) embedded into a thermoset polyester resin (102), to a thermoplastic ...  
WO/2020/109721A1
The invention relates to a multi-composite material (R1, R2) comprising at least one monofilament (10) made of a glass-resin composite which comprises glass filaments (101) embedded into a thermoset polyester resin (102), characterised i...  
WO/2020/109722A1
The invention relates to a multi-composite material (R1, R2) comprising at least one monofilament (10) made of a glass-resin composite that comprises glass filaments (101) embedded into a thermoset polyester resin (102), said monofilamen...  
WO/2020/071364A1
Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhes...  
WO/2020/071363A1
Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhes...  
WO/2020/070687A1
The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is i...  
WO/2020/056788A1
The present invention relates to a high-strength metal glue, the parts by weight of each raw material of the glue being as follows: 40-50 parts of bisphenol A epoxy resin, 1-3 parts of nano-silica, 3-6 parts of an organic silicone rubber...  
WO/2020/059476A1
The present invention provides a cyanic acid ester compound represented by formula (1). In formula (1), each of R1, R2, R3 and R4 independently represents a monovalent substituent that is a hydrogen atom, a linear or branched alkyl group...  
WO/2020/035906A1
Disclosed is an adhesive composition containing a resin component, a thermal crosslinking agent, and a curing agent, wherein the resin component includes a resin having a maleimide group.  
WO/2020/012978A1
An adhesive composition containing (A) a bismaleimide resin represented by general formula (1), (B) an epoxy resin represented by general formula (2), and (C) a curing accelerator. [In formula (1), R1 represents a divalent hydrocarbon gr...  
WO/2020/006159A1
Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.  
WO/2019/244452A1
The present invention provides an adhesive composition which has improved solder heat resistance after moisture absorption, excellent flowability and excellent B-stage adhesive film provisional bondability, while exhibiting adhesiveness,...  
WO/2019/231875A1
Anaerobic paste compositions and uses are disclosed. The anaerobic paste compositions remain stable at room temperature for a prolong time without phase separating, making these compositions particularly well suited for long term storage...  
WO/2019/230445A1
Provided is an adhesive composition having high adhesion not only to a conventional polyimide or polyester film, but also to a metal substrate, and whereby high solder heat resistance can be obtained, and which also has excellent low-die...  
WO/2019/162206A3
The invention relates to a method for producing articles coated with adhesive, wherein an aqueous dispersion adhesive composition, containing a dispersed adhesive polymer and a dissolved polyvinylpyrrolidone, is applied to a film substra...  
WO/2019/226108A1
The present invention relates to an adhesive aqueous composition comprising a polysaccharide or a residual fraction from a pulping process comprising polysaccharide and an amine-functional polymer. The weight ratio between the polysaccha...  
WO/2019/208513A1
A resin composition which contains (A) a thermosetting component, and which is characterized in that: the thermosetting component (A) contains (A1) a maleimide resin and (A2) a phosphorus-based curing accelerator; and the peel strength a...  
WO/2019/203572A1
The present invention relates to: a resin composition for semiconductor adhesion, comprising a thermoplastic resin, a thermosetting resin, a curing agent, and a compound having a specific structure; and a semiconductor adhesive film manu...  
WO/2019/156717A3
The present disclosure provides novel polyimides having a high aliphatic monomer-content and improved optical properties and solubility relative to conventional polyimides. Also provided are methods of making the polyimides, articles of ...  
WO/2019/198626A1
A cyanic acid ester compound represented by formula (1). (In formula (1), R's each independently represent a hydrogen atom, a linear or branched C1-6 alkyl group, or a halogen atom, and n is an integer of 1-4.)  
WO/2019/198550A1
Provided are: a cyanic acid ester compound which can exhibit excellent heat conductivity; a method for producing the cyanic acid ester compound; a resin composition; a cured article; a single-layer resin sheet; a laminated resin sheet; a...  
WO/2019/185761A1
A method of manufacturing a composite product, comprising: - applying a binder composition, notably in the form of an aqueous solution, to non or loosely assembled matter to provide resinated matter, wherein the binder composition consis...  
WO/2019/188436A1
A purpose of the present invention is to provide a curable resin composition that has a high flexibility and good workability before curing and shows a high adhesiveness, high thermal resistance and excellent dielectric properties after ...  
WO/2019/182001A1
A film-like adhesive having the following characteristics: (I) when an initial detected temperature of the melt viscosity of the film-like adhesive after being stored for 168 hours at 40°C is T168, and when the initial detected temperat...  
WO/2019/172227A1
This adhesive composition comprises a resin component and a modified amine-based curing agent that is solid at ordinary temperature. The resin component contains a bismaleimide compound, a urethane-modified polyester resin, and a bisphen...  
WO/2019/169394A1
Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamine...  
WO/2019/162206A2
The invention relates to a method for producing articles coated with adhesive, wherein an aqueous dispersion adhesive composition, containing a dispersed adhesive polymer and a dissolved polyvinylpyrrolidone, is applied to a film substra...  
WO/2019/156253A1
The present invention provides: an adhesive sheet that, before a peeling step, stays fully and stably stuck to a back surface of a lead frame and a back surface of a sealing resin and does not leak sealing resin, even after being subject...  
WO/2019/111978A1
Achieved are: a nitride ceramic resin composite body that has further improved reliability in terms of heat resistance during the reflow process, while exhibiting heat conductivity, electrical insulation and adhesion to an adherend, whic...  
WO/2019/092968A1
Provided is a resin composition having excellent preservation stability and solubility in a low-boiling point solvent such as methyl ethyl ketone. The resin composition is produced through a melt-mixing step of melt-mixing a resin mixtur...  
WO/2019/080045A1
The present invention relates to a (meth)acrylate copolymer comprising, in polymerized form, (a) a hydrophobic monomer, (b) a hydrophilic monomer, and optionally a vinyl monomer other than monomers (a) and (b). In particular, the (meth)a...  
WO/2019/065819A1
A composition for forming a temporary bonding layer, which is used for the purpose of forming a temporary bonding layer that affixes a resin substrate onto a base material, and which contains (A) a polyamic acid of formula (P1), (B) a po...  
WO/2019/044754A1
The present invention is: a two-component endoscope adhesive having a main agent and a curing agent, wherein the main agent includes at least one type of epoxy resin (A) from among a bisphenol-A-type epoxy resin, a bisphenol-F-type epoxy...  
WO/2019/031178A1
A resin composition comprising a cyanic ester compound represented by formula (1) and a filler having a thermal conductivity of 3W/(m∙K) or more. NCO-Ar1-Ar2-Ar3-OCN (1) (In formula (1), Ar1 and Ar3 are the same or different and repres...  
WO/2018/235854A1
An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.  
WO/2018/229415A1
Sulphurised benzoxazine compound for use in the synthesis of a polybenzoxazine, corresponding to the formula (A), (formula I): wherein: each benzene ring of the two oxazine rings bears at least one radical denoted "G"; the two oxazine ri...  
WO/2018/229416A1
Sulphurised polybenzoxazine, the recurring units of which comprise at least one unit corresponding to the formulas (I) or (II): wherein the two oxazine rings are connected to one another by a central aromatic group, the benzene ring of w...  
WO/2018/229417A1
Metal or metal-plated reinforcement, at least the surface of which is at least partly made of metal, at least the metal portion being coated with a sulphur polybenzoxazine, the recurring units of which comprise at least one unit correspo...  
WO/2018/213668A1
The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without m...  
WO/2018/199117A1
Provided is a substrate laminate comprising a first substrate, an adhesive layer, and a second substrate that are laminated in this order, the adhesive layer containing a reaction product of a compound (A) having a cationic functional gr...  
WO/2018/191954A1
This invention relates to a (meth) acrylate-functionalized poly (meth) acrylate-block-polyimide-block-poly (meth) acrylate copolymer, preparation method and use thereof. The (meth) acrylate-functionalized poly (meth) acrylate-block-polyi...  
WO/2018/194133A1
The purpose of the present invention is to provide a semiconductor substrate manufacturing method, for example, which prevents detachment and the like of a semiconductor wafer being ground, and which prevents cracking or chipping in a se...  
WO/2018/193983A1
A purpose of the present invention is to provide an imide oligomer which is able to be used for a cured product that has excellent long-term heat resistance. Another purpose of the present invention is to provide: a curing agent which is...  
WO/2018/180158A1
[Problem] To provide a coating film modifier for creping which, when used together with an adhesive agent for creping, enables the uniform formation of fine wrinkles in wet paper. [Solution] The present invention is a coating film modifi...  
WO/2018/152497A1
An adhesive and method for injection or compression bonding, where the adhesive is based on a grafted polypropylene resin and at least one of maleimide compound, phenolic resin, blocked isocyanate, functionalized silane, or an epoxy resin.  
WO/2018/109711A1
The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a -COOH or -O...  
WO/2018/087858A1
Provided is a semiconductor-bonding resin composition that exhibits superior thermal conductivity and electrical conductivity, and is optimal for bonding a power semiconductor element and an element-supporting member. The semiconductor-b...  

Matches 1 - 50 out of 3,585