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Matches 1 - 50 out of 3,448

Document Document Title
WO/2018/235854A1
An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.  
WO/2018/229415A1
Sulphurised benzoxazine compound for use in the synthesis of a polybenzoxazine, corresponding to the formula (A), (formula I): wherein: each benzene ring of the two oxazine rings bears at least one radical denoted "G"; the two oxazine ri...  
WO/2018/229416A1
Sulphurised polybenzoxazine, the recurring units of which comprise at least one unit corresponding to the formulas (I) or (II): wherein the two oxazine rings are connected to one another by a central aromatic group, the benzene ring of w...  
WO/2018/229417A1
Metal or metal-plated reinforcement, at least the surface of which is at least partly made of metal, at least the metal portion being coated with a sulphur polybenzoxazine, the recurring units of which comprise at least one unit correspo...  
WO/2018/213668A1
The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without m...  
WO/2018/199117A1
Provided is a substrate laminate comprising a first substrate, an adhesive layer, and a second substrate that are laminated in this order, the adhesive layer containing a reaction product of a compound (A) having a cationic functional gr...  
WO/2018/191954A1
This invention relates to a (meth) acrylate-functionalized poly (meth) acrylate-block-polyimide-block-poly (meth) acrylate copolymer, preparation method and use thereof. The (meth) acrylate-functionalized poly (meth) acrylate-block-polyi...  
WO/2018/194133A1
The purpose of the present invention is to provide a semiconductor substrate manufacturing method, for example, which prevents detachment and the like of a semiconductor wafer being ground, and which prevents cracking or chipping in a se...  
WO/2018/193983A1
A purpose of the present invention is to provide an imide oligomer which is able to be used for a cured product that has excellent long-term heat resistance. Another purpose of the present invention is to provide: a curing agent which is...  
WO/2018/180158A1
[Problem] To provide a coating film modifier for creping which, when used together with an adhesive agent for creping, enables the uniform formation of fine wrinkles in wet paper. [Solution] The present invention is a coating film modifi...  
WO/2018/152497A1
An adhesive and method for injection or compression bonding, where the adhesive is based on a grafted polypropylene resin and at least one of maleimide compound, phenolic resin, blocked isocyanate, functionalized silane, or an epoxy resin.  
WO/2018/109711A1
The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a -COOH or -O...  
WO/2018/087858A1
Provided is a semiconductor-bonding resin composition that exhibits superior thermal conductivity and electrical conductivity, and is optimal for bonding a power semiconductor element and an element-supporting member. The semiconductor-b...  
WO/2018/078227A1
The invention relates to polybenzoxazine comprising repeating units comprising at least one motif of formula (I) or (II) in which Z1 and Z2 are the same or different and represent an at least divalent, aliphatic, cycloaliphatic or aromat...  
WO/2018/065399A1
The invention relates to a cyanate ester based adhesive comprising a component A which has at least one cyanate ester with at least two OCN groups, and a component B which comprises at least one catalyst for the trimerisation reaction of...  
WO/2018/062835A1
The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based...  
WO/2017/209043A1
This resin composition for an underfill material contains a maleimide compound (A) and a secondary monoamino compound (B), wherein said secondary monoamino compound (B) has a boiling point of greater than or equal to 120°C.  
WO/2017/204188A1
The resin composition for flat cable reinforcement tapes according to an aspect of the present invention comprises a polyester, a polyurethane, and polycarbodiimide, the mass ratio of the polyurethane to the polyester being 40/60 to 80/2...  
WO/2017/190949A1
The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt% (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a ...  
WO/2017/169574A1
The purpose of the present invention is to provide a photosensitive adhesive composition that has an excellent filler dispersibility at the time of preparation of a coating material, and a photosensitive adhesive sheet that has a high me...  
WO/2017/158917A1
Provided is an adhesive composition which is suitable for laminating a polyimide film to copper foils to produce a double-sided copper-clad laminate for use in producing flexible printed wiring boards. The adhesive composition comprises ...  
WO/2017/138447A1
The present invention provides a resin composition with which a substrate for electronic-circuit formation or a substrate for semiconductor-circuit formation can be bonded to a supporting substrate and which, in the state of being bondin...  
WO/2017/136669A1
Provided herein are debondable adhesive compositions comprising (A) one or more bis-maleimide (BMI), nadimide or itaconimide oligomer(s), (B) at least one ethylenically unsaturated co-monomer (e.g. co-monomers selected from the group con...  
WO/2017/110576A1
A solvent-free silicone-modified polyimide resin composition having fluidity and including no solvent, the composition containing (A) a silicone-modified polyimide resin of formula (1), Ee-Ff-Gg (1) (E is formula (2), F is formula (3), a...  
WO/2017/103376A1
The invention relates to a metallic or metallised reinforcement, of which at least the surface is at least partially metallic, at least said metallic part being coated with a polybenzoxazine of which the repeat units comprise at least on...  
WO/2017/103375A1
A polybenzoxazine of which the repeating units comprise at least one unit corresponding to formulae (I) or (II): in which: - Z1 represents an at least divalent, aliphatic, cycloaliphatic, or aromatic linking group, comprising at least on...  
WO/2017/095884A1
A metal-on-ceramic substrate comprises a ceramic layer (210), a first metal layer (240), and a bonding layer (220) joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that conta...  
WO/2017/077912A1
Provided is a laminate that exhibits good adhesion properties with respect to not only conventional polyimide and polyester films but also to metal substrates and low polarity resin substrates, such as LCP, and that can attain high solde...  
WO/2017/073507A1
The present invention provides a laminate film for temporary affixing, which has excellent heat resistance, which can form a flat coating across a substrate, extending to a periphery of the substrate, which can be used to bond a semicond...  
WO/2017/057519A1
The purpose of the present invention is to provide an adhesive tape for an electronic component, the adhesive tape having excellent wire bonding properties and workability. Provided is an adhesive tape for an electronic component, charac...  
WO/2017/029917A1
Provided is an adhesive composition that is highly adhesive not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, ensures a high solder heat resistance ...  
WO/2017/022523A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing...  
WO/2017/011207A1
The present invention relates to curable novel bismaleimide resins and prepolymers, methods of manufacture. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular, the inventive poly...  
WO/2016/194920A1
A solvent-free light-curable adhesive composition includes: for example, a triazine ring-containing polymer including a repeating unit structure represented by formula [3] and having a weight-average molecular weight of 500-5000; and a r...  
WO/2016/185956A1
Provided is a laminate which has superior low dielectric constant characteristics, which exhibits excellent adhesion between metal substrates and not only conventional polyimide and polyester film substrates, but also low polarity resin ...  
WO/2016/173387A1
The present invention relates to an electrode binder for a lithium ion battery, which is a polymer obtained by polymerizing a diamine monomer and a dianhydride monomer. At least one of the diamine monomer and the dianhydride monomer comp...  
WO/2016/167245A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burde...  
WO/2016/158828A1
Provided is a resin composition having long-term heat resistance and rapid curing characteristics, with the adhesive strength being high when heated and the rate of change in the adhesive strength and the room temperature elastic modulus...  
WO/2016/158066A1
The present invention provides a novel cyanic acid ester compound capable of giving a cured object which has excellent solubility in solvents and a low coefficient of thermal expansion and is excellent in terms of flame retardancy and he...  
WO/2016/158829A1
Provided is a resin composition having long-term heat resistance, with which the rate of change in adhesive strength is low. The resin composition includes: (A) a compound having an OH group and any of a primary to tertiary amine in the ...  
WO/2016/159102A1
In order to provide a dispersion wherein the dispersed state of a fluorine-based resin is uniformly controlled, a polyimide precursor solution composition using this dispersion, an adhesive composition, a polyimide and polyimide film obt...  
WO/2016/129541A1
The present invention provides a heat-curable resin composition comprising: (A) a polyimide resin having a structure represented by formula (1-a) and a structure represented by formula (1-b); and (B) at least one heat-curable resin selec...  
WO/2016/129655A1
Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin ...  
WO/2016/098533A1
A cyanic acid ester compound which has a structure represented by general formula (1). (In the formula, n represents an integer of 1 or more.)  
WO/2016/067925A1
Provided is a polycarbonate-imide-based resin paste which is excellent in terms of (1) solubility in nitrogen-free solvents, (2) low-temperature dryability/curability, (3) low warpage, (4) flexing characteristics, (5) printability, and (...  
WO/2016/066023A1
Provided is an electrode binder of a lithium ion battery, which is obtained by the polymerization reaction of a diamine monomer comprising BAPP (2,2-bis[4-(4-aminophenoxy)phenyl]propane) and a dianhydride monomer. Also provided is a posi...  
WO/2016/050647A1
The invention relates to a floor structure on substrate (1) comprising a primer (2) and, provided on top of the primer, flooring (3) comprising a floor coating or a bonded material, the primer (2) being made of a hot-melt adhesive. The f...  
WO/2016/052491A1
[Problem] The objective of the present invention is to provide a polyimide copolymer having good soldering heat resistance and adhesion to metallic foil and various films, and a molded article using said copolymer. [Solution] This polyim...  
WO/2016/031552A1
The purpose of the present invention is to provide an electrically conductive adhesive composition which has excellent adhesive properties without containing harmful substances such as solder (lead). Specifically, this electrically condu...  
WO/2016/033522A1
A bond film includes a thermoplastic polyimide adhesive that contains particles which are thermally conductive and electrically conductive particles. A conductive foil layer may be placed between two layers of adhesive to form the bond f...  

Matches 1 - 50 out of 3,448