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Matches 1 - 50 out of 3,197

Document Document Title
WO/2017/057519A1
The purpose of the present invention is to provide an adhesive tape for an electronic component, the adhesive tape having excellent wire bonding properties and workability. Provided is an adhesive tape for an electronic component, charac...  
WO/2017/029917A1
Provided is an adhesive composition that is highly adhesive not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, ensures a high solder heat resistance ...  
WO/2017/022523A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing...  
WO/2017/011207A1
The present invention relates to curable novel bismaleimide resins and prepolymers, methods of manufacture. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular, the inventive poly...  
WO/2016/194920A1
A solvent-free light-curable adhesive composition includes: for example, a triazine ring-containing polymer including a repeating unit structure represented by formula [3] and having a weight-average molecular weight of 500-5000; and a r...  
WO/2016/185956A1
Provided is a laminate which has superior low dielectric constant characteristics, which exhibits excellent adhesion between metal substrates and not only conventional polyimide and polyester film substrates, but also low polarity resin ...  
WO/2016/173387A1
The present invention relates to an electrode binder for a lithium ion battery, which is a polymer obtained by polymerizing a diamine monomer and a dianhydride monomer. At least one of the diamine monomer and the dianhydride monomer comp...  
WO/2016/167245A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burde...  
WO/2016/158828A1
Provided is a resin composition having long-term heat resistance and rapid curing characteristics, with the adhesive strength being high when heated and the rate of change in the adhesive strength and the room temperature elastic modulus...  
WO/2016/158066A1
The present invention provides a novel cyanic acid ester compound capable of giving a cured object which has excellent solubility in solvents and a low coefficient of thermal expansion and is excellent in terms of flame retardancy and he...  
WO/2016/158829A1
Provided is a resin composition having long-term heat resistance, with which the rate of change in adhesive strength is low. The resin composition includes: (A) a compound having an OH group and any of a primary to tertiary amine in the ...  
WO/2016/159102A1
In order to provide a dispersion wherein the dispersed state of a fluorine-based resin is uniformly controlled, a polyimide precursor solution composition using this dispersion, an adhesive composition, a polyimide and polyimide film obt...  
WO/2016/129541A1
The present invention provides a heat-curable resin composition comprising: (A) a polyimide resin having a structure represented by formula (1-a) and a structure represented by formula (1-b); and (B) at least one heat-curable resin selec...  
WO/2016/129655A1
Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin ...  
WO/2016/098533A1
A cyanic acid ester compound which has a structure represented by general formula (1). (In the formula, n represents an integer of 1 or more.)  
WO/2016/067925A1
Provided is a polycarbonate-imide-based resin paste which is excellent in terms of (1) solubility in nitrogen-free solvents, (2) low-temperature dryability/curability, (3) low warpage, (4) flexing characteristics, (5) printability, and (...  
WO/2016/066023A1
Provided is an electrode binder of a lithium ion battery, which is obtained by the polymerization reaction of a diamine monomer comprising BAPP (2,2-bis[4-(4-aminophenoxy)phenyl]propane) and a dianhydride monomer. Also provided is a posi...  
WO/2016/050647A1
The invention relates to a floor structure on substrate (1) comprising a primer (2) and, provided on top of the primer, flooring (3) comprising a floor coating or a bonded material, the primer (2) being made of a hot-melt adhesive. The f...  
WO/2016/052491A1
[Problem] The objective of the present invention is to provide a polyimide copolymer having good soldering heat resistance and adhesion to metallic foil and various films, and a molded article using said copolymer. [Solution] This polyim...  
WO/2016/031552A1
The purpose of the present invention is to provide an electrically conductive adhesive composition which has excellent adhesive properties without containing harmful substances such as solder (lead). Specifically, this electrically condu...  
WO/2016/033522A1
A bond film includes a thermoplastic polyimide adhesive that contains particles which are thermally conductive and electrically conductive particles. A conductive foil layer may be placed between two layers of adhesive to form the bond f...  
WO/2016/031342A1
Provided is an adhesive composition that is highly adhesive not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, can achieve high solder heat resistanc...  
WO/2016/021646A1
The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive for...  
WO/2016/013627A1
Disclosed is a multilayer polyimide film which comprises a layer (A) containing a thermoplastic polyimide (A) having a glass transition temperature of lower than 240ÂșC and a layer (B) containing a heat-resistant polyimide (B) having a g...  
WO/2015/182469A1
Provided are: a temporary bonding film which enables a stable temporary bonding of a device wafer when the device wafer is subjected to mechanical or chemical processing, and which also enables easy termination of the temporary bonding t...  
WO/2015/182161A1
Provided is an adhesive composition using a polyamide-imide resin which is suitable for uses such as flexible printed wiring boards. This adhesive composition in which a polyamide-imide resin and an epoxy resin are combined is characteri...  
WO/2015/177114A1
The present invention relates to a water-soluble carbohydrate-polyamino acid-based pre-reacted binder composition,a method of its manufacture, use of the pre-reacted binder composition, a method of manufacturing a collection of matter bo...  
WO/2015/129682A1
Provided are a polyimide resin having high heat resistance which is free of voids even in a large area and is capable of uniform temporary adhesion, and a resin composition and a laminated film using the same. The present invention is a ...  
WO/2015/129682A9
Provided are a polyimide resin having high heat resistance which is free of voids even in a large area and is capable of uniform temporary adhesion, and a resin composition and a laminated film using the same. The present invention is a ...  
WO/2015/127179A1
Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for t...  
WO/2015/107990A1
The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), a polyfunctional epoxy compound (B), an epoxy curing agent (...  
WO/2015/048575A1
Curable functionalized imide-linked polyimides compounds have been synthesized that have been found to possess very low dielectric constant and extremely low dissipation factor. These compounds also have a range of high to low modulus, e...  
WO/2015/042391A1
The technology is directed towards soy-based adhesive compositions having improved viscosity properties due to the use of soy flour having a particular particle size distribution. These compositions are useful for making lignocellulosic ...  
WO/2015/037555A1
A purpose of the present invention is to provide an adhesive composition for printed wiring boards, which exhibits excellent heat resistance. Another purpose of the present invention is to provide: a coverlay for printed wiring boards, w...  
WO/2015/033703A1
Provided is an adhesive agent composition which has good pot life properties and good adhesion to a metallic base material and a polyolefin-type resin base material, and comprises a modified polyolefin and a carbodiimide compound. An adh...  
WO/2015/020016A1
A polyimide resin containing a repeating constituent unit represented by formula (1), a repeating constituent unit represented by formula (2), and a repeating constituent unit represented by formula (A) or a constituent unit represented ...  
WO/2015/020323A1
The present invention relates to an adhesive composition and a composite polarizing plate using same, more specifically to an adhesive composition and a composite polarizing plate using same, in which the adhesive composition is interpos...  
WO/2015/019802A1
The objective of the present invention is to obtain a photosensitive resin composition which does not have the defects of conventional technology and which is capable of forming an accurate polyimide pattern easily by a low-temperature p...  
WO/2015/020020A1
[1] A polyimide resin composition comprising a polyimide resin (A) and an additive (B), wherein the polyimide resin (A) contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by form...  
WO/2015/013219A1
Curable compositions comprising a benzoxazine component, a polyamine component and a fluoropolymer component are described. The compositions may be cured to produce compositions useful in coating, sealants, adhesive and many other applic...  
WO/2014/203735A1
[Problem] To provide a novel heat-curable resin composition. [Solution] A heat-curable resin composition which contains a polymer having a repeating structural unit represented by formula (1-a) (wherein R1 and R2 independently represent ...  
WO/2014/181659A1
This invention provides a transparent-circuit-board manufacturing method that makes it possible to perform desired patterning in a clean fashion while reducing outgassing due to a temporary affixing material even if a high-temperature tr...  
WO/2014/181658A1
This invention provides a transparent-circuit-board manufacturing method that makes it possible to perform desired patterning in a clean fashion while reducing outgassing due to a temporary affixing material even if a high-temperature tr...  
WO/2014/179100A1
A polymerizable composition is described comprising a benzoxazine, and a tosylate, which when thermolyzed, forms a (meth)acrylamide, a (meth)acrylate, a vinyl ketone, a vinyl ether or a styrenic compound.  
WO/2014/157151A1
A resin according to the present invention is produced by reacting a reaction product, which is a product produced by carrying out a Michael addition reaction between a component (A) as mentioned below and a component (B) as mentioned be...  
WO/2014/115637A1
The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during co...  
WO/2014/105422A1
A polymerizable composition, articles, and methods are provided, wherein the polymerizable composition includes a benzoxazine, an acid-forming peroxide catalyst and optionally a film- forming polymer, a co-catalyst, a curative, or a comb...  
WO/2014/103637A1
The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent...  
WO/2014/086777A3
The present invention relates to binder compositions with an improved amine component, and a method of manufacturing a collection of matter bound by said binder compositions.  
WO/2014/086775A3
The present invention relates to binder compositions with improved amine components, and a method of manufacturing a collection of matter bound by said binder compositions.  

Matches 1 - 50 out of 3,197