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Matches 601 - 650 out of 7,310

Document Document Title
WO/2010/131616A1
In conventional adhesive sheets in each of which a die-attach film is laminated thereon, the die-attach film is often detached from die chips when a wafer is diced to form the die chips and picking up the die chips. Disclosed is an adhes...  
WO/2010/124187A3
Silicone acrylic hybrid compositions prepared by reacting together silicone polymers, silicone resins, and silyl containing acrylic polymers are useful in adhesive compositions that find use in skin contact applications.  
WO/2010/124187A2
Silicone acrylic hybrid compositions prepared by reacting together silicone polymers, silicone resins, and silyl containing acrylic polymers are useful in adhesive compositions that find use in skin contact applications.  
WO/2010/121033A3
A silicone gel adhesive construction comprises (a) a porous backing, (b) an acrylic copolymer pressure sensitive adhesive layer on at least a portion of one side of the porous backing, and (c) a cured silicone gel adhesive on the pressur...  
WO/2010/121033A2
A silicone gel adhesive construction comprises (a) a porous backing, (b) an acrylic copolymer pressure sensitive adhesive layer on at least a portion of one side of the porous backing, and (c) a cured silicone gel adhesive on the pressur...  
WO/2010/103244A1
The invention relates to a hydrocarbon diluent for diluting a polymer having a pour point that is less than -15°C according to the ASTM D97 standard and a boiling temperature of 280 to 450°C, including more than 50 wt % of isoparaffins...  
WO/2010/100024A1
The present invention relates to the use of an adhesive compound, in particular a pressure-sensitive adhesive compound, based on polysiloxane for bonding optical components, in particular optical films, wherein the adhesive compound has ...  
WO/2010/098314A1
Provided is a pressure-sensitive adhesive composition which, when peeling off, can prevent even a non-antistatic adherend from being electrified, rarely stains an adherend, and thus exhibits excellent removability. Also provided are both...  
WO/2010/077487A3
Methods for preparing silicone-containing polymers by essentially adiabatic polymerization methods are disclosed. The polymerization system includes free radically polymerizable monomers. The monomers include ethylenically unsaturated si...  
WO/2010/082488A1
A curable composition that has excellent curability without using an organotin-based curing catalyst, the toxicity of which has been pointed out, and that gives a cured object suffering no surface discoloration even through long-term exp...  
WO/2010/077487A2
Methods for preparing silicone-containing polymers by essentially adiabatic polymerization methods are disclosed. The polymerization system includes free radically polymerizable monomers. The monomers include ethylenically unsaturated si...  
WO/2010/078251A1
Amino alkoxy-modified silsesquioxanes (amino AMS), and/or amino co-AMS compounds that also comprise a mercaptosilane or a blocked mercaptosilane, are excellent adhesives for coating plated or unplated metal wire for adherence of the wire...  
WO/2010/073649A1
A pressure-sensitive adhesive composition characterized by comprising (a) a C1-12-alkyl (meth)acrylate/acrylamide copolymer (ingredient a) as a pressure-sensitive adhesive component, (b) a photopolymerizable compound (ingredient b), and ...  
WO/2010/057963A1
The object of the present invention is a two-component silicone composition containing a component A comprising i) at least one polydiorganosiloxane P which terminates hydroxyl groups; ii) at least one catalyst K for cross-linking polydi...  
WO/2010/056543A1
Methods of preparing silicone pressure sensitive adhesives are described. The methods include electron beam curing nonfunctionalized silicone materials, e.g., silicone fluids and gums. Hot melt processing the nonfunctionalized silicone m...  
WO/2010/056541A1
Methods of preparing silicone materials using electron beam curing are described. The materials are hot melt processed and cured in the absence of an effective amount of catalysts and initiators. Both functional and nonfunctionalized sil...  
WO/2010/056546A1
Methods of electron beam curing nonfunctional polysiloxanes and silanol terminated polysiloxanes are described. The resulting release materials are also described.  
WO/2010/056544A1
Electron beam and gamma radiation crosslinked, silicone gel adhesives are described. Both nonfunctional and functional poly diorganosiloxanes are used. Methods of forming the adhesives, and medical articles incorporating such adhesives a...  
WO/2010/044467A1
Disclosed is a transparent adhesive sheet for a flat panel display for which, even when the display undergoes twisting, bending, or similar stress, peeling does not occur at the face which adheres to the glass plate and bubbles are not g...  
WO/2010/041708A1
Disclosed is a heat-conductive moisture-curable resin composition having high adhesion properties and rapid curability. The composition comprises (A) a polypropylene glycol having a hydrolyzable silyl group at one end of the molecule cha...  
WO/2010/038715A1
A mixture is obtained by uniformly mixing a tackifier resin and a specific terminally silylated polymer which contains a hydrolyzable silyl group at an end, while having a urethane bond and/or a urea bond in the main chain or a side chai...  
WO/2010/032870A1
A liquid die bonding agent comprising (A) an organopolysiloxane that has at least 2 alkenyl groups in one molecule, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms in one molecule, (C) a hydrosilylation reacti...  
WO/2010/032728A1
A simple silicone-rubber bonded object is provided in which nonflowable substrates, i.e., a three-dimensional elastic silicone rubber substrate molded beforehand and an adherend substrate, were able to be tenaciously bonded to each other...  
WO/2010/026995A1
An adhesive material which can be solvent-free, while having low viscosity, good coatability, low adhesive force, small adhesive force increase over time, good adhesion to a base, excellent adhesion and releasability to and from an objec...  
WO/2010/015491A3
The object of the invention is a method for the production of foams on silicon basis from polymer mixtures (A) containing silicon, wherein at least one compound (V) is used that contributes to the formation of the polymer network, and wh...  
WO/2010/015491A2
The object of the invention is a method for the production of foams on silicon basis from polymer mixtures (A) containing silicon, wherein at least one compound (V) is used that contributes to the formation of the polymer network, and wh...  
WO/2010/015491A8
The object of the invention is a method for the production of silicone-based foams from polymer mixtures (A) containing silicone, wherein at least one compound (V) is used that contributes to the formation of the polymer network, and whi...  
WO/2010/014494A3
Disclosed herein is a surface active adhesion promoting agent and a coating composition comprising the surface active adhesion promoting agent. The adhesion promoting agent is a blocked isocyanate functional siloxane containing material....  
WO/2010/014494A2
Disclosed herein is a surface active adhesion promoting agent and a coating composition comprising the surface active adhesion promoting agent. The adhesion promoting agent is a blocked isocyanate functional siloxane containing material....  
WO/2010/008749A1
A hot melt adhesive composition can be used to laminate substrates together in construction industry and industrial maintenance and assembly applications. The hot melt adhesive composition is sprayable to form a thin layer (1 to 200 micr...  
WO/2010/005719A3
The present invention provides glass laminate structures and methods of making them, wherein the structures can comprise, in various combinations, a first glass, a first film, and an adhesion promoter. The glass laminate structures of th...  
WO/2010/005719A8
The present invention provides glass laminate structures and methods of making them, wherein the structures can comprise, in various combinations, a first glass, a first film, and an adhesion promoter. The glass laminate structures of th...  
WO/2010/003800A3
The present invention relates to a polymerizable composition comprising, as a component A, at least one silicon-organic compound having at least two ≡Si-H groups that are reactive in the hydrosilylation reaction and, as a component B, ...  
WO/2010/005719A2
The present invention provides glass laminate structures and methods of making them, wherein the structures can comprise, in various combinations, a first glass, a first film, and an adhesion promoter. The glass laminate structures of th...  
WO/2010/000096A1
Provided is a semiconductor packaging applicable conductive composition using silver coated material flakes as a conductive filler, curable epoxy, acrylate, bismaleimide chemical,or the like or their combination as organic resin, and the...  
WO/2009/158383A3
A method of forming a curable adhesive tape comprising a partially cured reaction intermediary comprises applying a silicone composition onto a flexible substrate. The method further comprises heating the silicone composition to a first ...  
WO/2009/158383A2
A method of forming a curable adhesive tape comprising a partially cured reaction intermediary comprises applying a silicone composition onto a flexible substrate. The method further comprises heating the silicone composition to a first ...  
WO/2009/144192A1
The invention relates to a silicone composition that includes: a hydroxylated silicone resin A of the MQ(OH) type; a hydroxylated silicone gum B; and a third component comprising a vinylated silicone resin E of the MQ or MQ(OH) type with...  
WO/2009/144985A1
With the invented dicing method, by increasing the cohesive strength while decreasing the adhesive strength of an ultraviolet-curing adhesive in advance, mixing of the ultraviolet-curing adhesive layer of an adhesive sheet with a die att...  
WO/2009/131838A1
An adhesive composition, the modification method of the adhesives and the articles of the same are described. The organosilicone pressure-sensitive adhesive composition comprises an organosilicone pressure-sensitive adhesive and a compou...  
WO/2009/125126A2
The present invention relates to novel polysiloxanes that are grafted by at least one polyhydroxylated amino compound, method of preparing same and uses thereof.  
WO/2009/125126A3
The present invention relates to novel polysiloxanes that are grafted by at least one polyhydroxylated amino compound, method of preparing same and uses thereof.  
WO/2009/118307A3
The invention relates to novel compounds having a guanidine structure and to the use of same as organopolysiloxane polycondensation catalysts.  
WO/2009/118307A2
The invention relates to novel compounds having a guanidine structure and to the use of same as organopolysiloxane polycondensation catalysts.  
WO/2009/111193A1
A borosiloxane composition comprising a borosiloxane having an average of at least two alkenyl groups per molecule, an organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule, and a hydro silyl...  
WO/2009/104766A1
Provided is a new compound that can substantially decrease hysteresis loss of rubber compositions, and substantially increase rub resistance. More specifically, this compound is an organic silicon compound characterized in that the follo...  
WO/2009/105297A3
Temporarily repositionable pressure sensitive adhesive compositions which are blends of a silicone-modified pressure sensitive adhesive component, a high Tg polymer component and a crosslinker are presented. The silicone-modified pressur...  
WO/2009/104505A1
Disclosed is an adhesive characterized by containing a ladder polysilsesquioxane having a repeating unit represented by formula (I) in a molecule. The adhesive contains a specific ladder polysilsesquioxane, and exhibits good adhesion to ...  
WO/2009/105297A2
Temporarily repositionable pressure sensitive adhesive compositions which are blends of a silicone-modified pressure sensitive adhesive component, a high Tg polymer component and a crosslinker are presented. The silicone-modified pressur...  
WO/2009/102000A1
Disclosed is a transparent adhesive sheet for flat panel displays, which has excellent light resistance. The transparent adhesive sheet for flat panel displays is mainly composed of a polyoxyalkylene polymer, and contains a hindered amin...  

Matches 601 - 650 out of 7,310