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WO/2017/147184A1 |
Techniques are described for mounting a display and/or display cover to a housing of a display device, such as a mobile phone. In an embodiment, the housing and display cover include chamfered edges at complementary angles to allow for a...
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WO/2017/143997A1 |
Disclosed is a dealcoholised organic silicon sealant composition, the composition comprising: alkoxy-terminated polydimethylsiloxane, white carbon black, an organic tin catalyst, a plasticiser, a water removing agent, a tackifier, and a ...
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WO/2017/140775A1 |
The invention relates to a method for manufacturing an adhesive film (7), wherein one entire face of a fluoropolymer film (1) is activated with a plasma, an adhesive silicone substance (5) is immediately applied to the entire activated f...
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WO/2017/138447A1 |
The present invention provides a resin composition with which a substrate for electronic-circuit formation or a substrate for semiconductor-circuit formation can be bonded to a supporting substrate and which, in the state of being bondin...
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WO/2017/138463A1 |
Provided is a room-temperature-curable composition containing reactive silicon-containing groups, in particular, a curable composition which gives a cured object satisfactory in terms of initial adhesiveness to wood and water-resistant a...
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WO/2017/136188A1 |
The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer and/or silicone polyurea block copolymer and a silicate tackifying resin. Some embodiment...
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WO/2017/129429A1 |
The invention provides a silicone composition (S) crosslinkable to give silicone gel, comprising (A) polyorganosiloxane containing at least two alkenyl groups per molecule and having a viscosity at 25°C of 200 to 500 000 mPas, (B) organ...
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WO/2017/126199A1 |
The curable silicone resin composition according to the present invention contains at least component (A), component (B), and component (C). Component (A): a predetermined silicone resin represented by formula [1] and having a viscosity ...
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WO/2017/122796A1 |
Provided is an LED light emitting device which has less possibility of the occurrence of conduction failure at an electrode. This die bonding agent is a condensation reaction-type adhesive for bonding an LED element that has a connection...
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WO/2017/116935A1 |
Adhesive composition including an elastomeric silicone-based copolymer selected from the group consisting of urea-based silicone copolymers, oxamide-based silicone copolymers, amide-based silicone copolymers, urethane-based silicone copo...
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WO/2017/114298A1 |
An environmental oil-resistant sealant is prepared from, in parts by weight, 8-15 parts of ethylene glycol, 6-14 parts of talc, 8-15 parts of phenyl silicone oil, 12-24 parts of diethyl methoxy silyloxy, 15-30 parts of carbon black, 12-2...
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WO/2017/109927A1 |
This adhesive tape comprises a layered base material and an adhesive layer 5 provided on at least one surface of the layered base material. The adhesive tape is characterized in that the layered base material comprises a layered body inc...
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WO/2017/110948A1 |
The present invention relates to: a curable composition which contains a curable polysilsesquioxane compound having a repeating unit represented by formula R1-D-SiO3/2 (wherein R1 represents a fluoroalkyl group represented by composition...
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WO/2017/110947A1 |
The present invention relates to: a curable composition which contains a curable polysilsesquioxane compound having a repeating unit represented by formula (a-1) (component (A)), fine particles having an average primary particle diameter...
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WO/2017/111452A1 |
The present invention relates to a thin film of an inorganic nanoparticle-polymer complex, and a method for preparing the same. Specifically, the present invention relates to a thin film of an inorganic nanoparticle-polymer complex using...
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WO/2017/101105A1 |
UV curable adhesive compositions are provided that include 1) a UV curable poly(meth)acrylate copolymer containing monomeric units having an epoxy group wherein the poly(meth)acrylate copolymer has a glass transition temperature between ...
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WO/2017/106087A1 |
A silicone pressure-sensitive adhesive composition is curable by an addition reaction, condensation reaction, or a radical reaction with the use of an organic peroxide, and is characterized by comprising an azeotropic solvent such as a m...
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WO/2017/102851A1 |
The invention relates to a conversion product which has at least one aliphatic amidine or guanidine group and at least one polysiloxane radical, and to the use of said conversion product as a catalyst for cross-linking hardenable composi...
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WO/2017/102510A1 |
The invention relates to a curable composition comprising: a) at least one polymer having at least one silicon-containing group of formula -Si(R1)k(Y)3–k as defined herein; b) at least one titanium complex of formula TiL(OR3)2 wherein ...
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WO/2017/100502A1 |
Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions t...
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WO/2017/099154A1 |
Provided is a transparent curable composition which uses a polyoxyalkylene-based organic polymer having a reactive silicon group and a weathering stabilizer having a specific structure, a cured product of the curable composition having n...
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WO/2017/098919A1 |
Disclosed are: an adhesive composition including a crosslinked silicone component, the gel fraction (ratio of insoluble content when immersed for 1 day in toluene at normal temperature) of the adhesive composition being 45% to less than ...
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WO/2017/096945A1 |
Provided are an organic silicon compound containing boron, a sealant for a solar cell assembly and a solar cell assembly. The molecular skeleton of the organic silicon compound containing boron is composed of a cycloalkenyl, a silicon-ox...
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WO/2017/099415A1 |
The present invention relates to a base film for an FPCB and a method for manufacturing the same, the base film for an FPCB, as a heat resistant plastic film, comprising: a polyimide film used as a base material; a copper foil film attac...
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WO/2017/085296A1 |
Silicone room temperature curable sealant/adhesive compositions, in particular such compositions which (upon several hours of contact with water) do not repel water, but rather retain and pick-up water and/or can be wetted by aqueous mat...
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WO/2017/073507A1 |
The present invention provides a laminate film for temporary affixing, which has excellent heat resistance, which can form a flat coating across a substrate, extending to a periphery of the substrate, which can be used to bond a semicond...
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WO/2017/072119A1 |
The invention relates to a tyre comprising an inner surface and an outer surface, a receiving area arranged on one of said inner and outer surfaces, an adhesive layer arranged on the receiving area, and an element attached to the receivi...
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WO/2017/073883A1 |
The present invention relates to a silicone adhesive composition comprising: organopolysiloxane including a hydroxyl group or an alkoxy group; and polydimethylsiloxane including an epoxy group and a hydroxyl group or an alkoxy group. The...
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WO/2017/068762A1 |
This invention relates to an active energy ray curable hot melt silicone composition that is non-flowable at 25°C and has a viscosity of 1,000 Pa・s or less at 100°C, and that comprises: (A) a mixture of an organopolysiloxane having a...
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WO/2017/069383A1 |
The present invention relates to a silicone adhesive composition containing: an organopolysiloxane comprising a vinyl silane group; an organopolysiloxane comprising a hydrosilyl group; and an addition reaction catalyst, wherein the organ...
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WO/2017/065131A1 |
Provided is a shock-absorbing screen protection film having better impact resistance than in the past. The shock-absorbing screen protection film has an adhesive layer comprising a cured product of an addition-curable silicone adhesive c...
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WO/2017/061778A1 |
The present invention relates to: an adhesion increasing composition capable of improving adhesion between two interfaces through thermal cross-linking and photo-cross-linking of a substrate and a resin, or of two resins, when processing...
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WO/2017/061549A1 |
The purpose of the present invention is to provide: an interlayer filler material for touch panels that is used to fill the interlayer space between a touch panel and another member or the interlayer space between a plurality of transpar...
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WO/2017/061552A1 |
The purpose of the present invention is to provide: an interlayer filler material for touch panels that is used to fill the interlayer space between a touch panel and another member or the interlayer space between a plurality of transpar...
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WO/2017/060572A1 |
A display has a plurality of pixels in a matrix, the pixels each comprising a liquid crystal layer and/or light emitting diode layer, a plurality of substrates, at least a first substrate being optically transmissive to visible light, an...
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WO/2017/055555A1 |
The present invention relates to a process for the granulation of ground plants, comprising a step of spraying an aqueous solution comprising maltodextrin and silicone. The invention also relates to a pellet thus obtained and its uses, i...
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WO/2017/057719A1 |
Provided is a curable composition which has a low viscosity and good workability before curing, the cured product having good adhesiveness with various kinds of adherends. It is possible to ensure good workability by using a curable comp...
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WO/2017/056667A1 |
A waterproof sheet which is for application to a site to be waterproofed in order to prevent rainwater infiltration thereinto and retard deteriorations which proceed with time, the waterproof sheet comprising: a base layer that comprises...
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WO/2017/055557A1 |
The present invention relates to a composition comprising ground plants containing proteins, maltodextrin and silicone. It also relates to an adhesive composition and articles comprising it, the preparation processes and uses thereof.
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WO/2017/048890A1 |
Curable silicone pressure sensitive adhesive compositions and films suitable for sealing and adhering substrates for optically clear electronic devices are described. The curable silicone pressure sensitive adhesive compositions are suit...
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WO/2017/047805A1 |
The present invention provides a curable resin composition which can maintain excellent fluidability thereof over a long period when melted by heating for the application onto an adherend and therefore has excellent coatability, and whic...
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WO/2017/043256A1 |
Provided is a composition which includes: powdered silver in which grain distribution of primary particles has a first peak in a particle size range of 20 to 70 nm and a second peak in a particle size range of 200 to 500 nm, in which 50%...
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WO/2017/037597A1 |
Some embodiments of the present invention provide a method of fabricating a coating. The method may comprise providing a substrate comprising a metallic material, at least a portion of a surface of the metallic material having an exposed...
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WO/2017/036618A1 |
The present invention relates to a silicone rubber composition for an airbag sealing material that achieves an appropriate viscosity during coating and forms a cured product having excellent adhesion property and elongation.
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WO/2017/037123A1 |
The invention relates to copolymers obtainable from polysiloxane containing macromonomers, and a process for preparation thereof. The invention further relates to the use of the copolymers as additives in compositions such as coating com...
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WO/2017/038917A1 |
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising: a substrate (11); an adhesive agent layer (12) including an adhesive agent; and an...
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WO/2017/038922A1 |
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12). The surface free energy of the a...
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WO/2017/038920A1 |
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12) including an adhesive agent. When...
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WO/2017/038921A1 |
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12). The surface free energy of the a...
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WO/2017/038919A1 |
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12) including an adhesive agent. Afte...
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