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Patent Searching and Data


Matches 701 - 750 out of 7,350

Document Document Title
WO/2008/126717A1
Disclosed is an adhesive film for semiconductors, which can be attached to a semiconductor wafer at a low temperature. This adhesive film enables to produce semiconductor chips from a semiconductor wafer with high yield, while sufficient...  
WO/2008/123552A1
Disclosed is an adhesive material which has good coatability at a low viscosity, can be produced in a solvent-free form, has good adhesion to an object and excellent removability, produces a reduced amount of electrostatic charge when th...  
WO/2008/111953A3
A thermal interface material composition including a blend of a polymer matrix and a thermally conductive filler having particles having a maximum particle diameter no greater than about 25 microns, wherein the polymer matrix includes an...  
WO/2008/111953A2
A thermal interface material composition including a blend of a polymer matrix and a thermally conductive filler having particles having a maximum particle diameter no greater than about 25 microns, wherein the polymer matrix includes an...  
WO/2008/111489A1
Disclosed is a halogen-free and phosphorus-free fire-retardant adhesive resin composition which can be compressed at a lower temperature of 250˚C or lower and has excellent heat resistance, solder heat resistance after moisture absorpti...  
WO/2008/109865A3
The disclosure is directed to a method of making a silicone composition includes mixing a silicone formulation in a mixing device and adding an in situ adhesion promoter to the mixing device. The disclosure is further directed to article...  
WO/2008/109865A2
The disclosure is directed to a method of making a silicone composition includes mixing a silicone formulation in a mixing device and adding an in situ adhesion promoter to the mixing device. The disclosure is further directed to article...  
WO/2008/108157A1
A pressure-sensitive adhesive tape which has a sufficient force of adhesion to an adherend and has excellent heat resistance. In particular, when desired to be stripped off, the adhesive tape can be easily removed without leaving an adhe...  
WO/2008/105491A1
Disclosed is an one-part polysiloxane composition which can provide a cured product having excellent transparency and heat resistance, and which has an excellent balance among storage stability, curability and workability. Specifically d...  
WO/2008/102576A1
An alkoxysilane-containing resin is obtained by reacting an oligomer containing a terminal carboxyl group with an isocyanatoalkoxysilane compound.  
WO/2008/096611A1
Disclosed is a pressure-sensitive adhesive tape which enables to adequately prevent resin leakage during a sealing process in production of a semiconductor device using a metal lead frame. In this pressure-sensitive adhesive tape, the st...  
WO/2008/096610A1
Disclosed is an adhesive tape having excellent heat resistance, which exhibits sufficient adhesion to an object to which it is adhered, while being easily separated from the object without leaving an adhesive residue on the object when i...  
WO/2008/090815A1
Disclosed is an adhesive composition comprising: (A) an acrylic resin; (B) a crosslinking agent; (C) a first organopolysiloxane having a functional group and a methoxy group and/or an ethoxy group in the molecule, and (D) a second organo...  
WO/2008/090813A1
Disclosed is an adhesive composition comprising: (A) an acrylic resin; (B) a crosslinking agent; and (C) an organopolysiloxane represented by the formula: YaR1 bSi(OCH3)c(OC2H5)d(OR2)e(OH)fO(4-a-b-c-d-e-f)/2 wherein Y represents an organ...  
WO/2008/088523A1
A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R22Si02/2)b, (R2Si03/2)c, (Si04/2)...  
WO/2008/080791A2
The present invention relates to a cross-linkable adhesive silicone composition, having a very short cross-linking time and capable of providing an adhesive having mechanical properties sufficient so that it can be used as an adhesive jo...  
WO/2008/081951A1
A peroxide-curable silicone-based pressure-sensitive adhesive composition comprising (A) a diorganopolysiloxane having silicon-bonded alkenyl groups at both molecular terminals used in amount of 100 parts by weight; (B) an organopolysilo...  
WO/2008/080791A3
The present invention relates to a cross-linkable adhesive silicone composition, having a very short cross-linking time and capable of providing an adhesive having mechanical properties sufficient so that it can be used as an adhesive jo...  
WO/2008/081913A1
A silicone-based pressure-sensitive adhesive composition comprising (A) a condensation-reaction product obtained by subjecting a diorganopolysiloxane having silanol groups on both molecular terminals and 2 or more silicon-bonded alkenyl ...  
WO/2008/076184A1
A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R2 2Si02/2)b, (R2Si03/2)c , (SiO4/2)d, (R1 ')f, and (R2 3Si01/2)g, where each...  
WO/2008/071461A1
A description is given of one-component, moisture-curing adhesive/sealant compositions comprising mixtures of at least one silane-functional polyoxyalkylene prepolymer and at least one silane-functional polyolefin. These compositions may...  
WO/2008/069095A1
Disclosed is a releasable adhesive sheet mainly used for coating films of automobiles, which is applicable to a coating film right after drying that is not sufficiently cured. Specifically disclosed is a releasable adhesive sheet for cur...  
WO/2008/069096A1
Disclosed is a releasable adhesive sheet mainly used for coating films of automobiles, which is applicable to a coating film right after drying that is not sufficiently cured. Specifically disclosed is a releasable adhesive sheet to be a...  
WO/2008/057155A1
This invention pertains to silicone gel forming compositions that have an average RHAIk of 0.7 to 1.5, typically 0.8 to 0.95 and with an average RHCE of 0.4 to 1, typically 0.8 to 0.95 and the silicone gels produced by curing the gel for...  
WO/2008/052209A3
An adhesive tape comprising a layer of metallized polymeric material having a first side and a second side, and a layer of adhesive compound applied to the first side of the layer of metallized polymeric film is provided. An adhesive tap...  
WO/2008/052209A2
An adhesive tape comprising a layer of metallized polymeric material having a first side and a second side, and a layer of adhesive compound applied to the first side of the layer of metallized polymeric film is provided. An adhesive tap...  
WO/2008/044521A1
A polymeric composition comprising: a reaction product (c) produced by reacting an organic silane compound (a) represented by the formula: R4-n-Si-(OR')n [wherein R represents an organic group containing an amino group; R' represents a m...  
WO/2008/044884A1
The present invention relates to a laminating film of plastic/Teflon-silicon and a method for preparing the same, more precisely a laminating film of plastic/Teflon-silicon with improved bond strength between plastic or Teflon with silic...  
WO/2008/027498A2
This invention relates to a laminate having a facestock and silicone pressure sensitive adhesion compositions releasably adhered to a conventional silicone release coated liner.  
WO/2008/025812A1
The present invention relates to silicone compositions which comprise at least one ketoximosilane-terminated polydiorganosiloxane and also at least one alkoxysilane. These compositions are neutrally crosslinking and combine a low odour w...  
WO/2008/027498A3
This invention relates to a laminate having a facestock and silicone pressure sensitive adhesion compositions releasably adhered to a conventional silicone release coated liner.  
WO/2008/023537A1
A curable organopolysiloxane composition comprising at least the following components: (A) a linear diorganopolysiloxane with a mass average molecular weight of at least 3,000, (B) a branched organopolysiloxane, (C) an organopolysiloxane...  
WO2007145996A9
A silicone acrylate hybrid composition includes the reaction product of a silicon-containing pressure sensitive adhesive composition, an ethylenically unsaturated monomer, and an initiator. The silicon-containing pressure sensitive adhes...  
WO/2008/018589A1
A water-compatible reactive resin giving a film which is equal in gloss, transparency, solvent resistance, and adhesion to films obtained from conventional water-compatible acrylic resins but is improved in water resistance, especially r...  
WO/2008/013301A1
Disclosed is a photocurable organopolysiloxane composition improved in adhesion to slightly adhesive materials. This photocurable organopolysiloxane composition is obtained by blending an N,N-disubstituted acrylamide into a photocurable ...  
WO/2008/011452A1
Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a thermally activated free radical curing agent, and elect...  
WO/2008/001919A1
A silicone rubber composition comprising at least the following components: a diorganopolysiloxane (A) having in one molecule at least two alkenyl groups; an organopolysiloxane (B) having in one molecule at least three silicon-bonded hyd...  
WO/2007/145996A3
A silicone acrylate hybrid composition includes the reaction product of a silicon-containing pressure sensitive adhesive composition, an ethylenically unsaturated monomer, and an initiator. The silicon-containing pressure sensitive adhes...  
WO/2007/145996A2
A silicone acrylate hybrid composition includes the reaction product of a silicon-containing pressure sensitive adhesive composition, an ethylenically unsaturated monomer, and an initiator. The silicon-containing pressure sensitive adhes...  
WO/2007/146521A1
A method of bonding a first article to a second article is provided. The method involves the use of a flowable, adhesive composition that contains non-aggregated, surface-modified silica nanoparticles dispersed in an epoxy resin.  
WO/2007/142067A1
Disclosed is a curable composition having good adhesion to a thermoplastic polyolefin substrate. The curable composition comprises: (A) a polyoxyalkylene polymer having a reactive silicon group; (B) a polyolefin polymer; and (C) an adhes...  
WO/2007/132910A1
An adhesion-promoting agent represented by the following average formula: R1 aSiO(4-a/2 (where R1is a group selected from an optionally substituted alkyl group with 1 to 10 carbon atoms, an alkenyl group with 2 to 20 carbon atoms, an ary...  
WO/2007/129777A1
A silicone rubber composition comprising: 100 parts by mass of a diorganopolysiloxane (A) having on average at least two alkenyl groups in one molecule; 5 to 100 parts by mass of a quartz powder (B) with an average particle size in the r...  
WO/2007/128320A3
Accordingly, the present invention relates to a pressure sensitive adhesive composition consisting of a continuous phase comprising cross-linked polyalkyleneoxide polymer and a discontinuous phase comprising water absorbent hydrophilic a...  
WO/2007/128320A2
Accordingly, the present invention relates to a pressure sensitive adhesive composition consisting of a continuous phase comprising cross-linked polyalkyleneoxide polymer and a discontinuous phase comprising water absorbent hydrophilic a...  
WO/2007/123167A1
Disclosed is a curable composition which exhibits excellent curability while using a non-organic-tin catalyst. Specifically disclosed is a curable composition which is characterized by containing (A) a polymer having a silicon group whic...  
WO/2007/120197A3
This invention relates to a photovoltaic cell module and a process of applying a silicone based hot melt encapsulant material (102a, 104a) onto photovoltaic cells (103a) to form a photovoltaic cell module. There is provided a photovoltai...  
WO/2007/120197A2
This invention relates to a photovoltaic cell module and a process of applying a silicone based hot melt encapsulant material (102a, 104a) onto photovoltaic cells (103a) to form a photovoltaic cell module. There is provided a photovoltai...  
WO/2007/108659A1
Disclosed herein is an adhesive composition for transporting a flexible substrate, which is used to manufacture a flexible display device using a flexible substrate such as a plastic substrate by using a conventional line for manufacturi...  
WO/2007/107216A1
The invention relates to a mixture from an oligomeric, blocked aminosilane (azomethine structure) and a monomeric, blocked, primary amine (azomethine structure). Said mixture is suitable as a curing agent, cross-linking agent or bonding ...  

Matches 701 - 750 out of 7,350