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WO/2016/093309A1 |
Provided are: a polyarylene sulfide resin molded article that maintains the mechanical characteristics, etc. of a polyarylene sulfide resin molded article and has excellent silicone resin adhesiveness and mold release properties; a polya...
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WO/2016/086529A1 |
Provided are a thixotropic organopolysiloxane composition and semiconductor device for overcoming defects in the prior art, the composition comprising the following components: (A1) a solid organopolysiloxane having a three-dimensional s...
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WO/2016/082658A1 |
The present invention relates to a composite binder, comprising an organic-inorganic hybrid polymer and a fluorinated binder that are evenly mixed, where each repetitive unit of the organic-inorganic hybrid polymer comprises a silicon at...
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WO/2016/082332A1 |
The present invention relates to a method for preparing liquid silicone rubber for an LCD screen protection film. The method comprises the following steps: mixing vinyl silicone oil, methyl vinyl raw rubber and methyl vinyl MQ silicon re...
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WO/2016/078890A1 |
The invention relates to a highly transparent silicone composition with improved mechanics and to the use of said composition in optical components.
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WO/2016/074805A1 |
The invention relates to a method for producing wood material panels, in particular OSB wood material panels, comprising the following steps: a) providing wood strands; b) applying at least one glue system to the wood strands, wherein th...
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WO/2016/068044A1 |
Provided is an adhesive composition for oil bleeding silicone rubber comprising any of: (A) an alcohol-based organic solvent solution to which 45 to 120 parts by mass of an organometallic compound and 2 to 10 parts by mass of water have ...
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WO/2016/061121A1 |
Weldable adhesive compositions that dampen noise or vibration are described. In addition, various tape products that include the adhesive compositions are described. Also described are various methods of damping noise or vibration by use...
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WO/2016/060831A1 |
A pressure sensitive adhesive film comprising a substrate film and a pressure sensitive adhesive layer formed on a surface of the substrate film, said pressure sensitive adhesive layer being made from a silicone composition comprising: a...
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WO/2016/052521A2 |
Provided are a silicone rubber composition exhibiting excellent storage stability and post-curing compression set, and a silicone rubber crosslinked body obtained using the same. This silicone rubber composition is a thermosetting resin ...
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WO/2016/049153A1 |
Adhesive compositions are disclosed. In some embodiments, the adhesive compositions comprise an organosiloxane block copolymer, wherein the blocks of the block copolymer consist of an -Si-O-Si- backbone. The organosiloxane block copolyme...
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WO/2016/047519A1 |
The purpose of the present invention is to provide a curable composition which enables strong adhesion, without carrying out a primer treatment, to a metal, glass or coated surface, and especially to a porous base material such as mortar...
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WO/2016/044732A1 |
A process for cross-linking siloxane and organic polymers comprising reacting (a) a silyl hydride with (b) an unsaturated polymeric compound in the presence of (d) a platinum diene compound with a chelating dianionic ligand.
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WO/2016/036634A1 |
An (meth)acrylate pressure-sensitive adhesive copolymer crosslinking by a vinyl silicon crosslinking agent is described
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WO/2016/035821A1 |
A resin composition for temporary fixation for forming a temporary fixation material used in a method for working a semiconductor wafer, wherein: the resin composition contains (A) a thermoplastic resin, (B) a thermosetting resin, (C) a ...
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WO/2016/031730A1 |
The present invention is: a curable composition containing components (A) through (C), the curable composition characterized by containing component (A) and component (B) in a mass ratio of [component (A):component (B)] = 100:0.3-100:50;...
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WO/2016/029643A1 |
In order to overcome the shortcoming of bad heat resistance in prior art, the present invention provides an organopolysiloxane composition, a preparation method therefor, and a semiconductor component. The shore hardness of the cured pro...
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WO/2016/031732A1 |
The present invention is: a curable composition having components (A) through (E), the curable composition characterized by containing component (A) and component (B) in a mass ratio of [component (A):component (B)] = 100:0.3-100:20; a c...
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WO/2016/031731A1 |
The present invention is: a curable composition containing components (A) through (D), the curable composition containing component (A) and component (B) in a mass ratio indicated by the expression [component (A):component (B)] = 100:0.3...
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WO/2016/031733A1 |
The present invention relates to: a curable composition which contains the components (A)-(E) described below so that the mass ratio of the component (A) to the component (B), namely (A):(B) is from 100:0.3 to 100:20; a cured product; a ...
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WO/2016/031728A1 |
The present invention is: a curable composition that contains components (A) to (C), the composition characterized by containing component (A) and component (B) at a mass ratio of [component (A) : component (B)]=100:0.3 to 100:50; a meth...
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WO/2016/031729A1 |
The present invention is: a curable composition containing components (A) through (C), the curable composition characterized by containing component (A) and component (B) in a mass ratio of [component (A):component (B)] = 100:0.3-100:50;...
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WO/2016/031551A1 |
Provided are: an adhesive film which has excellent stress relaxation properties while also having excellent heat resistance, is capable of achieving high conductivity allowing use thereof in a power semiconductor back-side electrode with...
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WO/2016/026205A1 |
The present invention provides UV/moisture dual curable organic silicon glue. The components and contents of the glue?s raw materials are listed as follows (parts by weight): 97-98 parts of polymer and 2-3 parts of photoinitiator. The UV...
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WO/2016/021646A1 |
The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive for...
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WO/2016/015176A1 |
An adhesion promoter for silicone gel is obtained by mixing component A chosen from at least one compound represented by formulae (1), (2), (3) and (4), with component B chosen from at least one compound represented by formula (5), the m...
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WO/2016/013421A1 |
This curable silicone resin composition is characterized by comprising component (A), which is a silicone resin containing hydrogen atoms each bonded to a silicon atom (SiH groups), component (B), which is a silicone resin containing vin...
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WO/2016/013625A1 |
The present invention is: a curable composition containing as a component (A) a curable polysilsesquioxane compound having repeating units represented by formula (a-1): R1SiO3/2, and as a component (B) at least one species selected from ...
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WO/2016/009845A1 |
The problem to be solved by the present invention is to provide a double-sided adhesive tape that has outstanding reworkability and air-bleeding properties as well as outstanding impact resistance and scattering prevention properties. Th...
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WO/2016/006058A1 |
Provided is a holding jig (1) for holding a thin plate, including: a carrier (10); a plurality of spacers (11) that are formed on a surface of the carrier; an adhesive film (13) that adheres at least to the periphery of the carrier so as...
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WO/2015/197004A1 |
Disclosed is an emulsion type silicone pressure sensitive adhesive composition and a process for the production thereof. Also provided is an emulsion type silicone pressure sensitive adhesive composition, comprising: (A) 100 parts by wei...
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WO/2015/197829A1 |
The invention relates to a curable composition, which comprises: a) at least one polymer having at least one silicon-containing group of the formula -Si(R1)k(Y)3-k, as defined herein, b) at least one titanium compound of the formula Ti(L...
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WO/2015/196345A1 |
One-component UV and thermal curable temporary adhesives for use in high temperature applications are provided. Said adhesives comprise (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on l,3,5,7-...
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WO/2015/196400A1 |
This invention relates to an emulsion type silicone pressure sensitive adhesive composition and a process for the production thereof. This invention provides an emulsion type silicone pressure sensitive adhesive composition, comprising: ...
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WO/2015/194340A1 |
This room-temperature-curable organopolysiloxane composition includes: component (A); 0.1-30 parts by mass of component (B) per 100 parts by mass of component (A); and 0.001-20 parts by mass of component (D) per 100 parts by mass of comp...
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WO/2015/195355A1 |
A pressure sensitive adhesive composition is described comprising at least one low Tg (meth)acrylic polymer, and at least one silsesquioxane polymer crosslinker comprising a plurality of ethylenically unsaturated groups. The low Tg (meth...
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WO/2015/195391A1 |
Pressure sensitive adhesive compositions are described comprising at least one low Tg ethylenically unsaturated monomer, and at least one silsesquioxane polymer crosslmker comprising a plurality of ethylenically unsaturated groups. The l...
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WO/2015/194158A1 |
Provided is a silicone exhibiting hot-melt properties which is obtained by inducing, in the presence of a hydrosilylation reaction catalyst (C), a hydrosilylation reaction between an alkenyl-group-containing organopolysiloxane (A) in whi...
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WO/2015/194389A1 |
Provided are a silicone adhesive composition whereby adhesion to a substrate can be enhanced by a single coating, and an adhesive product. A silicone adhesive composition including components (A) through (F). (A): An organopolysiloxane h...
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WO/2015/190438A1 |
[Problem] To provide a heat-resistant temporary adhesive agent that is easily washed off and capable of being easily peeled off after the rear side of a wafer has been polished. [Solution] Provided is a layered body used a temporary adhe...
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WO/2015/186323A1 |
An adhesion promoter represented by an average formula; a curable silicone composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane having, per molecule,...
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WO/2015/186324A1 |
An organosiloxane represented by a general formula; a curable silicone composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane having, per molecule, at ...
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WO/2015/182766A1 |
The present invention provides an adhesive composition with which the decomposition of a cured silicone resin layer is suppressed even after high-temperature heat treatment. Provided is an adhesive composition that is characterized by in...
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WO/2015/170709A1 |
Provided is a curable polysilsesquioxane compound which has at least one type of constituent unit represented by expression CHR1X0-D-SiO3/2 (In the expression, R1 is a hydrogen atom or an alkyl group of 1-6 carbon atoms, X0 is a halogen ...
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WO/2015/165899A1 |
The invention relates to a tyre comprising an inner liner facing an inner cavity of the tyre, a layer of adhesive disposed on the inner liner, and a strip of sound-damping foam secured to the inner liner by the adhesive layer, characteri...
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WO/2015/163201A1 |
This first curable composition has fluid properties and includes a photopolymerizable-group-containing silicone compound (A), a photopolymerization initiator, a photoacid generator, and at least one type of metal compound selected from t...
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WO/2015/163115A1 |
An adhesive sheet (10) has a base material (12) and an adhesive layer (14) layered on at least one side of the base material (12). The adhesive sheet (10) is configured so that the adhesive force (N1) thereof after the adhesive layer is ...
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WO/2015/158860A1 |
The invention relates to a composition comprising at least one polymer that contains silane groups and at least one catalyst of formula (I), said catalyst having specific amidine groups or guanidine groups. The composition is low in emis...
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WO/2015/158257A1 |
A high-adhesive one-component deoximation type room-temperature vulcanized silicone rubber sealant comprises the following components (A) to (F) in parts by weight: 100 parts of modified α,ω-dihydroxylpolydimethylsiloxane (A), 10 to 30...
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WO/2015/158862A1 |
The invention relates to a composition, comprising a) at least one silane-functional polymer; and b) at least one carbodimide and/or at least one guanidine, which is an adduct of the carbodiimide and an amino silane. The composition is i...
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