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Patent Searching and Data


Matches 251 - 300 out of 7,309

Document Document Title
WO/2016/035821A1
 A resin composition for temporary fixation for forming a temporary fixation material used in a method for working a semiconductor wafer, wherein: the resin composition contains (A) a thermoplastic resin, (B) a thermosetting resin, (C)...  
WO/2016/031730A1
 The present invention is: a curable composition containing components (A) through (C), the curable composition characterized by containing component (A) and component (B) in a mass ratio of [component (A):component (B)] = 100:0.3-100:...  
WO/2016/029643A1
In order to overcome the shortcoming of bad heat resistance in prior art, the present invention provides an organopolysiloxane composition, a preparation method therefor, and a semiconductor component. The shore hardness of the cured pro...  
WO/2016/031732A1
 The present invention is: a curable composition having components (A) through (E), the curable composition characterized by containing component (A) and component (B) in a mass ratio of [component (A):component (B)] = 100:0.3-100:20; ...  
WO/2016/031731A1
 The present invention is: a curable composition containing components (A) through (D), the curable composition containing component (A) and component (B) in a mass ratio indicated by the expression [component (A):component (B)] = 100:...  
WO/2016/031733A1
The present invention relates to: a curable composition which contains the components (A)-(E) described below so that the mass ratio of the component (A) to the component (B), namely (A):(B) is from 100:0.3 to 100:20; a cured product; a ...  
WO/2016/031728A1
The present invention is: a curable composition that contains components (A) to (C), the composition characterized by containing component (A) and component (B) at a mass ratio of [component (A) : component (B)]=100:0.3 to 100:50; a meth...  
WO/2016/031729A1
 The present invention is: a curable composition containing components (A) through (C), the curable composition characterized by containing component (A) and component (B) in a mass ratio of [component (A):component (B)] = 100:0.3-100:...  
WO/2016/031551A1
Provided are: an adhesive film which has excellent stress relaxation properties while also having excellent heat resistance, is capable of achieving high conductivity allowing use thereof in a power semiconductor back-side electrode with...  
WO/2016/026205A1
The present invention provides UV/moisture dual curable organic silicon glue. The components and contents of the glue?s raw materials are listed as follows (parts by weight): 97-98 parts of polymer and 2-3 parts of photoinitiator. The UV...  
WO/2016/021646A1
The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive for...  
WO/2016/015176A1
An adhesion promoter for silicone gel is obtained by mixing component A chosen from at least one compound represented by formulae (1), (2), (3) and (4), with component B chosen from at least one compound represented by formula (5), the m...  
WO/2016/013421A1
This curable silicone resin composition is characterized by comprising component (A), which is a silicone resin containing hydrogen atoms each bonded to a silicon atom (SiH groups), component (B), which is a silicone resin containing vin...  
WO/2016/013625A1
 The present invention is: a curable composition containing as a component (A) a curable polysilsesquioxane compound having repeating units represented by formula (a-1): R1SiO3/2, and as a component (B) at least one species selected fr...  
WO/2016/009845A1
The problem to be solved by the present invention is to provide a double-sided adhesive tape that has outstanding reworkability and air-bleeding properties as well as outstanding impact resistance and scattering prevention properties. Th...  
WO/2016/006058A1
Provided is a holding jig (1) for holding a thin plate, including: a carrier (10); a plurality of spacers (11) that are formed on a surface of the carrier; an adhesive film (13) that adheres at least to the periphery of the carrier so as...  
WO/2015/197004A1
Disclosed is an emulsion type silicone pressure sensitive adhesive composition and a process for the production thereof. Also provided is an emulsion type silicone pressure sensitive adhesive composition, comprising: (A) 100 parts by wei...  
WO/2015/197829A1
The invention relates to a curable composition, which comprises: a) at least one polymer having at least one silicon-containing group of the formula -Si(R1)k(Y)3-k, as defined herein, b) at least one titanium compound of the formula Ti(L...  
WO/2015/196345A1
One-component UV and thermal curable temporary adhesives for use in high temperature applications are provided. Said adhesives comprise (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on l,3,5,7-...  
WO/2015/196400A1
This invention relates to an emulsion type silicone pressure sensitive adhesive composition and a process for the production thereof. This invention provides an emulsion type silicone pressure sensitive adhesive composition, comprising: ...  
WO/2015/194340A1
This room-temperature-curable organopolysiloxane composition includes: component (A); 0.1-30 parts by mass of component (B) per 100 parts by mass of component (A); and 0.001-20 parts by mass of component (D) per 100 parts by mass of comp...  
WO/2015/195355A1
A pressure sensitive adhesive composition is described comprising at least one low Tg (meth)acrylic polymer, and at least one silsesquioxane polymer crosslinker comprising a plurality of ethylenically unsaturated groups. The low Tg (meth...  
WO/2015/195391A1
Pressure sensitive adhesive compositions are described comprising at least one low Tg ethylenically unsaturated monomer, and at least one silsesquioxane polymer crosslmker comprising a plurality of ethylenically unsaturated groups. The l...  
WO/2015/194158A1
Provided is a silicone exhibiting hot-melt properties which is obtained by inducing, in the presence of a hydrosilylation reaction catalyst (C), a hydrosilylation reaction between an alkenyl-group-containing organopolysiloxane (A) in whi...  
WO/2015/194389A1
 Provided are a silicone adhesive composition whereby adhesion to a substrate can be enhanced by a single coating, and an adhesive product. A silicone adhesive composition including components (A) through (F). (A): An organopolysiloxan...  
WO/2015/190438A1
[Problem] To provide a heat-resistant temporary adhesive agent that is easily washed off and capable of being easily peeled off after the rear side of a wafer has been polished. [Solution] Provided is a layered body used a temporary adhe...  
WO/2015/186323A1
An adhesion promoter represented by an average formula; a curable silicone composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane having, per molecule,...  
WO/2015/186324A1
An organosiloxane represented by a general formula; a curable silicone composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane having, per molecule, at ...  
WO/2015/182766A1
The present invention provides an adhesive composition with which the decomposition of a cured silicone resin layer is suppressed even after high-temperature heat treatment. Provided is an adhesive composition that is characterized by in...  
WO/2015/170709A1
Provided is a curable polysilsesquioxane compound which has at least one type of constituent unit represented by expression CHR1X0-D-SiO3/2 (In the expression, R1 is a hydrogen atom or an alkyl group of 1-6 carbon atoms, X0 is a halogen ...  
WO/2015/165899A1
The invention relates to a tyre comprising an inner liner facing an inner cavity of the tyre, a layer of adhesive disposed on the inner liner, and a strip of sound-damping foam secured to the inner liner by the adhesive layer, characteri...  
WO/2015/163201A1
 This first curable composition has fluid properties and includes a photopolymerizable-group-containing silicone compound (A), a photopolymerization initiator, a photoacid generator, and at least one type of metal compound selected fro...  
WO/2015/163115A1
 An adhesive sheet (10) has a base material (12) and an adhesive layer (14) layered on at least one side of the base material (12). The adhesive sheet (10) is configured so that the adhesive force (N1) thereof after the adhesive layer ...  
WO/2015/158860A1
The invention relates to a composition comprising at least one polymer that contains silane groups and at least one catalyst of formula (I), said catalyst having specific amidine groups or guanidine groups. The composition is low in emis...  
WO/2015/158257A1
A high-adhesive one-component deoximation type room-temperature vulcanized silicone rubber sealant comprises the following components (A) to (F) in parts by weight: 100 parts of modified α,ω-dihydroxylpolydimethylsiloxane (A), 10 to 30...  
WO/2015/158862A1
The invention relates to a composition, comprising a) at least one silane-functional polymer; and b) at least one carbodimide and/or at least one guanidine, which is an adduct of the carbodiimide and an amino silane. The composition is i...  
WO/2015/158863A1
The invention relates to a composition comprising at least one organic polymer that contains silane groups and at least one catalyst of formula (I). The composition is low in emissions and low-odour, has a good shelf-life, cures rapidly ...  
WO/2015/158624A1
The invention relates to cross-linkable masses containing A) 100 parts by weight of compounds of formula (I): Y-[(CR1 2)3-SiRa(OR2)3-a]b; B) at least 5 parts by weight of silicon resins containing units of formula (II): R3 c(R4O)dR5 eSiO...  
WO/2015/155950A1
Provided are: a curable organopolysiloxane composition which exhibits an excellent improving effect on initial adhesive properties with respect to a variety of base materials, and which, when cured, achieves particularly excellent adhesi...  
WO/2015/155949A1
Provided are: an adhesion promoter that has an excellent initial adhesion improvement effect with respect to a variety of substrates, that has particularly excellent adhesion durability after curing, and that makes it possible to achieve...  
WO/2015/151221A1
A double-sided pressure-sensitive adhesive sheet (1) used to adhere a first hard object (4) and a second hard object (5) together. Said double-sided pressure-sensitive adhesive sheet (1) has a first pressure-sensitive adhesive surface (1...  
WO/2015/151222A1
A double-sided pressure-sensitive adhesive sheet (1) used to adhere a first hard object (4) and a second hard object (5) together. Said double-sided pressure-sensitive adhesive sheet (1) has a first pressure-sensitive adhesive surface (1...  
WO/2015/151352A1
Provided are: an adhesive composition which has excellent weather resistance and contains, as a base material, a silicone polymer having excellent curability; and an adhesive sheet. An adhesive composition which contains an addition-cura...  
WO/2015/143592A1
Provided is a method for preparing an MT resin, comprising the following steps: a first step: adding anhydrous toluene, anhydrous ethanol and an alkoxyl silane into a reaction vessel, and then adding acetic acid dropwise into the reactio...  
WO/2015/148318A1
Compositions, particularly photocurable compositions that can cure upon irradiation, cured compositions, and methods of making such cured compositions, wherein the photocurable compositions include a polydiorganosiloxane having vinyl fun...  
WO/2015/143591A1
Provided is a transparent organic silicone gel binder. The transparent organic silicone gel binder is prepared by mixing components A and B in a mass ratio of 1 : 1, wherein the component A consists of the following materials: 60 - 95 pa...  
WO/2015/148255A1
A copolymer composition is provided that is formed as the reaction product of (I) a cured polyorganosiloxane intermediate having repeating Si-O-Si units and at least one Si-OH functional group and (II) a polyfluoropolyether silane. The c...  
WO/2015/141294A1
This temperature sensitive adhesive includes a side chain crystalline polymer obtained by polymerizing (meth)acrylate having a straight chain alkyl group with at least 16 carbon atoms, and adhesion of the temperature sensitive adhesive d...  
WO/2015/141156A1
The present invention is a temporary bonding material for wafer processing, which is used for the purpose of temporarily bonding a wafer having a front surface serving as a circuit surface and a back surface to be processed to a supporti...  
WO/2015/132975A1
An adhesive scattering prevention sheet (1) which is bonded to at least one surface of a cover glass that is used for a capacitive touch panel. This adhesive scattering prevention sheet (1) is provided with a base (11), a hard coat layer...  

Matches 251 - 300 out of 7,309