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WO/2024/075543A1 |
Provided are: a room-temperature-curable organopolysiloxane composition that makes it possible to bring unpleasant odors and storage stability under control; and an adhesive agent and a coating agent containing the composition. The room-...
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WO/2024/066254A1 |
Disclosed are a low-modulus die attach film adhesive for a vertically stacked package, a preparation method therefor and an application thereof. The die attach film adhesive comprises the following raw materials: 2-5 parts by mass of sil...
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WO/2024/063068A1 |
[Problem] To provide an ultraviolet-curable composition containing silicon atoms, wherein the ultraviolet-curable composition has a high ability to adjust the mechanical properties of the cured product thereof, and has excellent workabil...
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WO/2024/062968A1 |
The present invention is a cyclic organopolysiloxane characterized by being represented by general formula (1). Through this feature, provided are: a cyclic organopolysiloxane that is an adhesion promoter excellent in adhesion to a metal...
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WO/2024/063069A1 |
[Problem] To provide a silicon-atom-containing ultraviolet-curable composition which ensures high regulation ability for the mechanical properties of products to be obtained by curing the composition and which, although being of a solven...
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WO/2024/062973A1 |
The present invention is a cyclic organopolysiloxane characterized by being represented by general formula (1). Thus, provided are: a cyclic organopolysiloxane that has excellent adhesiveness to metal and resin and that provides an adhes...
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WO/2024/057924A1 |
[Problem] To provide: a curable silicone composition having UV-light delayed curability, transparency, and low yellowing under high temperature conditions, and being capable of exhibiting high adhesive strength even to a base material, s...
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WO/2024/056507A1 |
The invention relates to curable compositions based on polyorganosiloxanes with silicon-containing terminal groups, a polymer having at least one silane-functional group, and optionally at least one curing catalyst. The invention also re...
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WO/2024/046715A1 |
The present invention relates to novel silanes of the formula Si(R1)m(R2)4-m, wherein each R1 independently stands for a substituted or unsubstituted alkyl, alkenyl, or alkynyl group; a substituted or unsubstituted cycloaliphatic group o...
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WO/2024/040687A1 |
The present invention relates to the field of silicone structural sealants, and in particular to a single-component transparent silicone structural sealant for photovoltaics and a preparation method therefor. The single-component transpa...
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WO/2024/027006A1 |
The present invention relates to the field of silicone sealants, in particular to a low-toxicity single-component silicone sealant for a photovoltaic frame and a preparation method therefor. The silicone sealant is composed of raw materi...
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WO/2024/029782A1 |
The present invention may provide a light modulation device and a use thereof. The present invention may provide: a light modulation device wherein an adhesive layer or bonding layer is applied to ensure adhesion between facing substrate...
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WO/2024/027932A1 |
The present disclosure provides: a silicone composition including: (a1) a first organopolysiloxane including at least two unsaturated hydrocarbons; (a2) a second organopolysiloxane including at least one unit represented by SiO4/2; (b) a...
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WO/2024/027906A1 |
The present disclosure provides a silicone composition including: (a1) a first organopolysiloxane including a C2 to C20 alkenyl group bonded to at least one Si at both ends or a chain, the first organopolysiloxane formed from a unit repr...
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WO/2024/025185A1 |
The present invention relates to a primer composition for a glass adhesive, comprising a first silane oligomer, a second silane oligomer, and an acryl polymer, wherein the first silane oligomer contains an amino group and an epoxy group ...
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WO/2024/000245A1 |
An object of the present invention is to provide a UV curable organopolysiloxane composition without using organic solvent, in which a cured product obtained by curing has sufficient hardness and toughness, with particularly excellent wo...
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WO/2023/234084A1 |
The present invention provides a two-pack type room temperature curable organopolysiloxane composition which exhibits both excellent fast curing properties and excellent bonding properties without the addition of a metal-based condensati...
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WO/2023/232982A1 |
The present invention relates to a coating composition a substrate, comprising: a microcrystalline cellulose composition, at least one silane, at least one acid catalyst, a liquid dispersion phase, and optionally at least one inorganic f...
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WO/2023/234189A1 |
Provided are an adhesive film and an adhesive label that have good flatness and excellent adhesiveness, and in which no wrinkles or curls occur in the process of imparting adhesiveness thereto. The adhesive film comprises an adhesive l...
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WO/2023/234155A1 |
The present invention provides: a laminate having an adhesive layer that has both a bonding function and a release function in a single layer and can be released using photoradiation, the laminate being capable of firmly bonding together...
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WO/2023/228636A1 |
The present invention is an addition-curable mold-releasing silicone composition that is for a silicone adhesive and that comprises: (A) a fluorine-containing organopolysiloxane which has at least two alkenyl groups bonded to a silicon a...
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WO/2023/227714A1 |
The present invention relates to a transition metal compound, comprising at least one phosphite compound of the formula P(OR)3 wherein R represents an organic group, and wherein at least one group R is represented by the formula (II) A, ...
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WO/2023/224174A1 |
The present invention relates to an electrically conductive low-temperature-curable adhesive composition. Specifically, the present invention relates to an electrically conductive thermosetting silicone adhesive composition for LED packa...
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WO/2023/216074A1 |
An insulating, compressible, and flame-resistant foamed material comprises a polyorganosiloxane foam, a fire retardant, and micron-sized hollow ceramic particles. The foamed material is useful for providing heat insulation, flame resista...
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WO/2023/216073A1 |
A composition comprises reactive polysiloxanes and hydroxyl-containing precursors, a fire retardant, and micron-sized hollow ceramic particles. The composition is useful in the preparation of an insulating, compressible, and flame-resist...
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WO/2023/213430A1 |
The present invention relates to a medical silicone pressure-sensitive adhesive composition comprising at least one organopolysiloxane gum A comprising, per molecule, at least two C2 to C6 alkenyl radicals each bonded to a silicon atom, ...
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WO/2023/212403A1 |
The present disclosure is an adhesive composition which is compatible with propellants, suitable for deployment via a canister, and configured for use on substrates which include rubber such as thermoplastic polyolefin (TPO) and plastic ...
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WO/2023/202470A1 |
A curable siloxane composition, and a use thereof in skin care products. Provided is a curable silicone composition, comprising: (a) based on the total weight of the curable silicone composition, an organosiloxane component having an alk...
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WO/2023/205123A1 |
A liquid optically clear adhesive (LOCA) for bonding optical substrates includes siloxane and epoxy-containing oligomers, a UV-activated photo-acid generator, a cross-linker additive, a solvent; and a reactive plasticizer, such as an add...
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WO/2023/204091A1 |
Provided is a heat-resistant adhesive film for a semiconductor package manufacturing step, the heat-resistant adhesive film having low adhesive strength at room temperature and favorable reworkability and attachability to a lead frame, w...
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WO/2023/195390A1 |
[Problem] To provide: a silicone adhesive composition for forming an adhesive layer capable of maintaining high adhesive strength and holding power even at high temperatures above 150°C; and an adhesive tape and an adhesive film compris...
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WO/2023/195268A1 |
The present invention is a silicone pressure-sensitive adhesive composition that contains: (A) an organopolysiloxane which is represented by average formula (1) and in which the content of silicon atom-bonded alkenyl groups is 0.0010-0.0...
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WO/2023/195671A1 |
The present invention relates to a glass adhesive primer composition, which does not use organic solvents, and thus is environmentally friendly and can be ensured to have a sufficient pot life, the primer composition comprising: a mercap...
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WO/2023/188521A1 |
The present invention addresses the problem of providing a wafer production method that makes it possible to remove an adhesive material from a laminate that comprises a wafer and the adhesive material more simply and stably than convent...
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WO/2023/184222A1 |
A curable composition contains: (A) a polydiorganosiloxane component including: (A1) greater than 3.1 wt% to 20 wt% of an aliphatically unsaturated polydiorganosiloxane polymer and (A3) a hydroxyl-terminated polydiorganosiloxane gum of u...
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WO/2023/182138A1 |
The present invention provides an adhesive and a laminated body having the adhesive. The adhesive exhibits excellent performance in spin coating onto a wafer circuit surface or a support body (support substrate), is excellent in heat res...
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WO/2023/170501A1 |
Curable bonding compositions include a free radically polymerizable bis- maleimide resin, a polymerizable siloxane -based release agent, and an optional thermal or ultraviolet free radical initiator. The curable composition is a coatable...
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WO/2023/172340A1 |
A laminate includes a silicone pressure sensitive adhesive adhered to an article comprising a fluorosilicone rubber or a silicone foam. A method for fabricating the laminate is provided.
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WO/2023/166775A1 |
Provided is an adhesive sheet 1 including a single-layered or multi-layered adhesive agent layer 11, in which at least one of layers constituting the adhesive agent layer 11 comprises an adhesive agent comprising a modified cyclodextrin....
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WO/2023/157603A1 |
An organopolysiloxane according to the present invention, having a structural unit ratio represented by formula (1), provides a room temperature-curable composition that has excellent curability and stability even when a solvent is not u...
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WO/2023/156602A1 |
The invention relates to oligomers of silane compounds having at least one hydrolysable group and at least one heteroatom bridged to a silicon atom via a sp2-hybridized quaternary carbon atom, as defined herein, a process for preparing s...
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WO/2023/146692A1 |
A pressure sensitive adhesive composition can cure via hydrosilylation to form a pressure sensitive adhesive. The pressure sensitive adhesive composition may be coated on a substrate and cured to form a protective film. The protective fi...
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WO/2023/123746A1 |
Disclosed in the present invention discloses a flexible packaging agent for a semiconductor element and a preparation method therefor, and a thin film packaging method. The flexible packaging agent for the semiconductor element comprises...
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WO/2023/127219A1 |
The present invention provides a silicone adhesive which contains a modified cyclodextrin. It is preferable that the modified cyclodextrin is at least one of a modified β-cyclodextrin and a modified γ-cyclodextrin. It is also preferabl...
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WO/2023/120634A1 |
Provided is a laminated film comprising a cured resin layer on one surface of a substrate film (A), wherein: the cured resin layer has an uneven structure; the arithmetic mean height (Sa) of the surface of the cured resin layer is at lea...
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WO/2023/120356A1 |
[Problem] To provide a curable organopolysiloxane composition that has high initial adhesive strength in a step such as temporary fixation and can be detached easily from a base material in a subsequent step, and a method for using the c...
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WO/2023/116494A1 |
The present application provides an adhesive composition. The adhesive composition comprises an adhesive matrix and a modified polymer, wherein the backbone of the modified polymer comprises a boron-oxygen coordinate bond and/or a bridgi...
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WO/2023/111478A1 |
The present invention relates to a silicone composition X which is cross-linkable by polyaddition reactions to form a silicone elastomer. In particular, the present invention relates to a silicone composition X which is cross-linkable by...
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WO/2023/114886A1 |
The present disclosure relates to a pressure sensitive adhesive may include a silicone based pressure sensitive adhesive component, and an iron oxide filler mixture. The content of the iron oxide filler mixture may be at least about 0.5 ...
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WO/2023/100705A1 |
An adhesive composition including a polymer having an amide bond and a polyorganosiloxane structure.
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