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Patent Searching and Data


Matches 1 - 50 out of 17,246

Document Document Title
WO/2016/129610A1
Provided are an adhesive that makes it possible to bond thermoplastic resins to each other in a short time and to obtain excellent adhesive strength, a structure bonded by this adhesive, and a bonding method using this adhesive. The adhe...  
WO/2016/129577A1
The purpose of the present invention is to provide a method for dicing a wafer in a state of being reinforced by a dicing tape and manufacturing a semiconductor chip, wherein positional displacement and similar problems are prevented fro...  
WO/2016/129567A1
An adhesive resin and an easily releasable film, including: a copolymer A of ethylene and an unsaturated carboxylic acid ester, in which the content of structural units derived from the unsaturated carboxylic acid ester is more than 0% b...  
WO/2016/125835A1
Provided is a resin-film forming composite sheet which has a structure in which a resin-film forming film capable of forming a resin film is directly laminated on a support sheet, and which satisfies the following requirements (I) and (I...  
WO/2016/125683A1
An adhesive sheet (10) according to the present invention comprises a first region (11) to which an adherend is bonded and a second region (12) provided on an outer periphery of the first region (11), wherein a tensile modulus of elastic...  
WO/2016/121488A1
An adhesive sheet for use in semiconductor processing, having an intermediate layer and an adhesive layer on a substrate in this order, and satisfying the conditions that (a) the loss tangent of the intermediate layer when measured at a ...  
WO/2016/121149A1
Provided is a magnet adhesive member that comprises a rare-earth magnet adhered to a soft magnetic material and that can be reutilized while ensuring material strength, without having to dissolve the resulting rare-earth magnet, for exam...  
WO/2016/120705A1
The present invention pertains to a laminate characterized by: comprising an adhesive layer, a surface layer laminated on one surface of the adhesive layer, and a resin separator layer laminated on an other surface of the adhesive layer,...  
WO/2016/121557A1
The purpose of the present invention is to provide: a pressure-sensitive adhesive sheet which has a high elongation at break, changes little in relative permittivity with changing temperature, and is excellent in terms of processability,...  
WO/2016/121806A1
This paste adhesive composition includes metal particles (A) and a compound (B) polymerized by heating, and when the metal particles (A) are caused to undergo sintering and form a particle connection structure by heat treatment, and the ...  
WO/2016/121651A1
Provided is a material capable of being repeatedly used as an adhesive. This photosensitive composite material contains a polymer compound, a liquid crystal compound, and a photosensitive compound. The molecular shape of the photosensiti...  
WO/2016/117613A1
To connect an electronic component at low temperatures by using a photocurable adhesive and to prevent alignment deviation of the electronic component. A method for producing a connected body, which comprises: an adhesive arrangement ste...  
WO/2016/117605A1
Provided is an adhesive that is applied using an inkjet device, wherein the adhesive can make it difficult for voids to form in an adhesive layer and, after bonding, can increase adhesiveness, moisture-resistant adhesion reliability, and...  
WO/2016/117350A1
Provided is an anisotropic conductive film with superior insulation between neighboring terminals and superior conductivity for long periods between connected terminals, even when connected to substrates that have been anti-corrosion tre...  
WO/2016/114317A1
The present invention pertains to a composition for forming an adhesive layer, an adhesive layer, a manufacturing method for an adhesive layer, a composite material, a sheet, a heat dissipation member, an electronic device, a battery, a ...  
WO/2016/111208A1
The present invention discloses an adhesive tape having an adhesive layer 1, 2 respectively on the two sides of a substrate, wherein: at least the adhesive layer 2 on one side among the adhesive layers is formed by comprising, in a mixed...  
WO/2016/104275A1
Provided is an electrically conductive paste that makes it possible to efficiently arrange solder particles upon an electrode and that makes it possible to improve the reliability of conduction between electrodes. This electrically condu...  
WO/2016/104787A1
 Provided is a dual-curing photocurable composition that utilizes moisture curing and photocuring, wherein said composition: allows sufficient work time to be taken during which curing does not proceed before being irradiated with ligh...  
WO/2016/105134A1
The present invention relates to an adhesive resin composition for semiconductor, the composition containing: a thermoplastic resin with a low moisture absorption rate; an epoxy resin including a biphenyl-based epoxy resin; and a hardene...  
WO/2016/103784A1
The invention improves the dimensional accuracy for a high heat conduction portion and a low heat conduction portion of a thermally conductive adhesive sheet, and lowers the thermal conduction rate of the low heat conduction portion. Fur...  
WO/2016/103381A1
A pressure-sensitive adhesive sheet (10) which includes a release film (11) and in which a net (12) has been superposed so that one surface thereof faces the release film (11) and a foamed base (13) that is expandable and flexible has be...  
WO/2016/104459A1
Provided is a solder transfer sheet which is capable of increasing the amount of transferred solder without forming a bridge. This solder transfer sheet 1A is provided with: a base 5; an adhesive layer 4 that is formed on a surface of th...  
WO/2016/103783A1
Provided are: a thermally conductive adhesive sheet enabling improvement of the dimensional precision of a high thermal conductivity part and a low thermal conductivity part of the thermally conductive adhesive sheet, reduction in therma...  
WO/2016/104322A1
This pressure-sensitive adhesive sheet 10A is a pressure-sensitive adhesive sheet which comprises, disposed in the following order, a base 11, an interlayer 12, and a pressure-sensitive adhesive layer 13, wherein the interlayer 12 is a l...  
WO/2016/104276A1
Provided is an electrically conductive paste that makes it possible to efficiently arrange solder particles upon an electrode, that makes it possible to prevent positional displacement between electrodes, and that makes it possible to in...  
WO/2016/098697A1
[Problem] To provide a sheet laminate for forming a resin film, whereby it becomes possible to deliver a resin film formation sheet from a release sheet easily and it also becomes possible to adhere the resin film formation sheet onto an...  
WO/2016/098378A1
The invention is a dicing die bonding sheet comprising above a base material an adhesive layer containing a dye, the dye content of the adhesive layer being 8.3 % by mass or lower, and the color difference between the base material and t...  
WO/2016/098533A1
A cyanic acid ester compound which has a structure represented by general formula (1). (In the formula, n represents an integer of 1 or more.)  
WO/2016/099149A1
The present application may provide an adhesive composition, which has excellent durability in a high-temperature or high-humidity condition, which exhibits excellent adhesion with an optical film, and which thus can form an adhesive hav...  
WO/2016/093114A1
The purpose of the present invention is to provide an adhesive composition in which recognition of an alignment mark is possible, solder wettability of a joining section is adequately ensured, and suppression of void occurrence is excell...  
WO/2016/093075A1
Provided is a semiconductor device with which the total thickness of a laminate structure can be controlled to a constant value, even in cases of, e.g. tolerance-based variations in thickness of the laminated components. This semiconduct...  
WO/2016/093261A1
Provided is a connector inspection method allowing a conductive particle to be inspected readily and rapidly after connector production; also provided are a connector, a conductive particle and an anisotropic conductive adhesive. In the ...  
WO/2016/093120A1
Provided is a transparent conductive film having excellent flexibility and high environmental durability. This transparent conductive film with an adhesive layer comprises a transparent base material, a transparent conductive layer, and ...  
WO/2016/088381A1
An electromagnetic wave shielding film is provided with an electroconductive shield layer 110 having protrusions and recesses, and an adhesive layer 120 for coating the protrusions and recesses. The maximum peak height of the protrusions...  
WO/2016/088859A1
A semiconductor device in which the connection parts of a semiconductor chip and a wiring circuit board are electrically connected to each other, and a semiconductor adhesive used for sealing the connection parts of a semiconductor devic...  
WO/2016/084948A1
Provided is an adhesive sheet which is capable of exhibiting high adhesive strength over time, and with which excellent air release properties between the adhesive sheet and an adherend are achieved. According to the present invention, p...  
WO/2016/084946A1
Provided is an adhesive sheet which is used for portable electronic devices, and which is capable of achieving excellent air release properties. According to the present invention, provided is an adhesive sheet for portable electronic de...  
WO/2016/084973A1
An object of the present invention is to provide a pressure-sensitive adhesive having excellent adhesive property, facilitating secondary processing of an adhesive product and providing an adhesive product with excellent holding strength...  
WO/2016/084947A1
Provided is an adhesive sheet capable of achieving a further improvement in quality while achieving excellent air release properties. According to the present invention, provided is an adhesive sheet provided with: a film-like base mater...  
WO/2016/084707A1
Provided is a sheet-like resin composition with which it is possible to sufficiently suppress voids at the interface of the sheet-like resin composition and an adherend and with which it is possible to suppress excessive protrusion at th...  
WO/2016/080324A1
The present invention provides a substrate film for a dicing film, the substrate film including a substrate layer and an outer surface layer disposed on one primary surface of the substrate layer. The substrate film for a dicing film is ...  
WO/2016/080069A1
Provided is an inkjet photo- and heat-curable adhesive capable of increasing the thickness precision of an adhesive layer in which the adhesive is cured and also capable of making it more difficult for voids to occur in the adhesive laye...  
WO/2016/080084A1
The present invention relates to: a photocurable resin composition with which laminating between a display and a touch panel or between a display and a front panel or between a touch panel and a front panel can be performed using a photo...  
WO/2016/076398A1
The present invention provides a photocurable anisotropic conductive adhesive agent which is a photocurable adhesive agent, can be used for connecting an electronic part at a lower temperature and within a short time, and has improved bi...  
WO/2016/076261A1
Provided are a method for manufacturing a temporary adhesive film having excellent release properties and whereby a release interface can be controlled, a temporary adhesive film, a layered body, a layered body provided with a device waf...  
WO/2016/072358A1
Provided is a method for manufacturing an optical film provided with a protective film, the method including a step for affixing a protective film to the surface of an optical film, wherein the peel force of the protective film from the ...  
WO/2016/072450A1
The purpose of the present invention is to provide a transfer sheet capable of providing hard coat properties and excellent weather resistance to a resin molded article such as organic glass. The transfer sheet has, in order, a base mate...  
WO/2016/068233A1
The present invention pertains to a photocuring device which is provided with a light irradiation device having a light source and a reflector, and which applies light to a photocurable adhesive (S) the maximum sensitivity wavelength of ...  
WO/2016/068274A1
Provided is a material that has a structure carrying three or more anthracene structure groups per molecule as a photosensitive unit. Owing to this structure, the material is liquid at room temperature as the crystallinity lowers, after ...  
WO/2016/068196A1
This release sheet 1 has a substrate 12 and a release agent layer 11 that is provided atop the substrate 12. The release agent layer 11 is composed of a cured product of a release agent composition that includes 50 mass% or more of a die...  

Matches 1 - 50 out of 17,246