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Matches 1 - 50 out of 15,200

Document Document Title
WO/2014/174174A1
The invention relates to a multilayer structure comprising at least one layer of supramolecular material and one layer of rigid material, to a method for producing such a structure by casting a composition comprising a precursor of the s...  
WO/2014/175249A1
The purpose of the present invention is to provide a tetrazole compound or salt thereof which exhibits excellent heat resistance and excellent responsiveness to long wavelength ultraviolet radiation having a wavelength of 300 nm or highe...  
WO/2014/174733A1
 A pressure-sensitive adhesive composition characterized by containing 100 parts by mass of a polymer (A) substantially free of carboxyl groups, and 0.05-20 parts by mass of a (meth)acrylic homopolymer (B) having a weight-average molec...  
WO/2014/174958A1
Provided is a self-rolling pressure-sensitive adhesive tape which can roll by itself and which makes it possible to easily recover a roll, which has been formed by applying the tape to an adherend and then making the tape roll by itself,...  
WO/2014/174732A1
An adhesive composition comprises: 100 parts by mass of a polymer (A) which has a glass transition temperature of less than 0°C; 0.05 to 50 parts by mass of a (meth)acrylic polymer (B) which has a weight average molecular weight of 1000...  
WO/2014/175186A1
Provided is a rubber composition which has good adhesion to a metal-plated reinforcing layer. A rubber composition adhesive to a metallic surface, which can adhere to a metallic surface, and which comprises: 100 parts by mass of a diene ...  
WO/2014/171503A1
A substrate (11) as a glass laminate comprises, laminated in order therein, a resin layer (21), an adhesive layer (22), a thin-film glass (23), an adhesive layer (24), and a polarizing layer (25). The resin layers (21, 24) include a co-c...  
WO/2014/171075A1
 This adhesive composition contains: 100 mass parts of a polymer (A) having a glass transition temperature of less than 0°C; and 0.1 to 20 mass parts of a polymer (B) containing, as monomer units, a monomer having a polyorganosiloxane...  
WO/2014/162943A1
This temporary fixing double-sided adhesive tape is provided with: a base material; a first adhesive compound layer that adheres to a pedestal; and a second adhesive compound layer that adheres to a workpiece. The first adhesive compound...  
WO/2014/163059A1
An electrically conductive coating material according to the present invention has good wettability on various adherends and, when the adherends are particles, can be coated on the surfaces of the particles uniformly by a specific produc...  
WO/2014/157227A1
Provided is a laminate for temporary bonding in semiconductor device manufacture which is capable of reliably and easily providing temporary support for a member (such as a semiconductor wafer) being mechanically or chemically processed,...  
WO/2014/156882A1
Provided are: an underfill material that can mitigate the difference in thermal response behavior between a semiconductor element and an adherend and has easy positioning for mounting the semiconductor element; a sealing sheet provided w...  
WO/2014/157175A1
 To provide a resin composition that allows excellent adhesive strength to be displayed and separation of cured material in a high-temperature process to be suppressed in the manufacture of a semiconductor device. The present invention...  
WO/2014/156642A1
The present invention addresses the problem of providing an adhesive tape having so-called touch feedback properties that allow displacement (allow compression) in response to a touch panel section being pressed and do not interfere with...  
WO/2014/157439A1
Provided is a laminate for temporary bonding in semiconductor device manufacture, the laminate enabling the reliable and easy provision of temporary support for a member (such as a semiconductor wafer) being mechanically or chemically pr...  
WO/2014/157426A1
A composite sheet (10) for forming a protective film is provided with a pressure-sensitive adhesive sheet (16) obtained by providing a pressure-sensitive adhesive layer (12) on a substrate (11), a film (13) for forming a protective film,...  
WO/2014/156685A1
An anisotropic conductive film for anisotropically electrically connecting terminals of a substrate to terminals of electronic components, the film having a two-layer structure which consists of an anisotropic conductive layer that compr...  
WO/2014/156335A1
This double-sided adhesive sheet has an adhesive layer comprising a first surface and a second surface, a first release film adhered to the first surface of the adhesive layer, and a second release film adhered to the second surface of t...  
WO/2014/156744A1
Provided are: an adhesive sheet for a tire which can finely conform to spews and unevenness of the surface and thereby prevent lifting and peeling thereof even when applied by hand or by an automatic label applicator; a method of produci...  
WO/2014/156816A1
Provided is a double-sided adhesive tape that comprises a foam substrate having an adhesive layer on both sides thereof and that is characterized in that the foam substrate has a density of 0.45 g/cm3 or less and an interlayer strength o...  
WO/2014/156868A1
Provided are: a resin composition characterized by having an amount of outgassing generation when heated for 24 hours at 100°C of no greater than 100 ppm, and a product of the loss tangent (tanδ1) measured at the conditions of 80°C an...  
WO/2014/142151A1
[Problem] To provide a composite sheet for protective film formation, which has good holding power with respect to a jig such as a ring frame and excellent releasability at the time of pick-up, and which is capable of preventing defects ...  
WO/2014/142085A1
An adhesive sheet (1) is provided with a base material (2), and an adhesive agent layer (3) provided to one main-surface side of the base material (2). The adhesive agent layer (3) is formed from an adhesive agent composition including: ...  
WO/2014/142194A1
Provided is an adhesive sheet which can prevent the occurrence of defects when cutting microcomponents such as electronic components. This adhesive sheet is provided with an adhesive layer and a resin layer disposed on one side of the ad...  
WO/2014/142192A1
Provided is an adhesive sheet which is able to realize excellent cutting precision and a reduction in cutting debris when cutting microcomponents such as electronic components. This adhesive sheet is provided with an adhesive layer which...  
WO/2014/142054A1
The purpose of the present invention is to provide an adhesive film which is provided with an adhesive layer, and with which malfunction of a capacitance-type touch panel can be inhibited under an environment having a broad temperature r...  
WO/2014/137065A1
Disclosed are an anti-scattering film with excellent optical and scratch-resistant properties and a method for manufacturing the same. The anti-scattering film according to the present invention comprises: a transparent film; and a hard ...  
WO/2014/136606A1
An adhesive sheet provided with a conductive adhesive layer, for realizing electrical conductivity or thermal conductivity in at least a thickness direction, the conductive adhesive layer having a conduction part continuous in the thickn...  
WO/2014/136777A1
A pressure-sensitive adhesive tape for processing semiconductor wafers. Said pressure-sensitive adhesive tape has a pressure-sensitive adhesive layer on a base sheet, and if said base sheet is compressed at 1 mm/min in the thickness dire...  
WO/2014/136767A1
Provided is a double-faced adhesive tape that is for securing electronic device members, has excellent adhesiveness, retention, and resistance to resilience, and can be manufactured even with a plant-derived material having a high biomas...  
WO/2014/136484A1
An apparatus (1) is provided with: a supporting base material (12) that supports an element (11); a heat dissipating member (13) having the supporting base material (12) disposed thereon; and an adhesive layer (14) that is disposed betwe...  
WO/2014/132764A1
The purpose of the present invention is to provide: a lamination method with which high membrane thickness precision can be obtained by reducing variations in substrate membrane thickness, the method being highly versatile and capable of...  
WO/2014/132334A1
Provided is an adhesive that causes thermosetting resins and thermoplastic resins to heat efficiently and improves the adhesion of the adhesive to a resin or other such non-magnetic or insulating material, when bonding is performed using...  
WO/2014/129260A1
The present invention addresses the problem of providing a polarization plate comprising a cation-polymerizable adhesive exhibiting superior curability even when using a protective film including a urethane primer layer. The present inve...  
WO/2014/129395A1
Provided is a light emitting device, light radiated from which has high intensity. A blue LED chip (20) that has a peak of emitted light within the range of from 360 nm to 500 nm (inclusive) is bonded to an electrode substrate (11) by me...  
WO/2014/129325A1
Provided is an underfill sheet capable of favorably filling an unevenly profiled circuit surface of a semiconductor element, favorably connecting the terminal of the semiconductor element with the terminal of an object onto which the sem...  
WO/2014/126096A1
Provided is a pressure-sensitive adhesive tape for use in semiconductor processing. This pressure-sensitive adhesive tape is a dicing tape which exhibits such an adhesive force that can inhibit the scattering of chips in dicing and which...  
WO/2014/125914A1
Provided is an optical member which has the excellent effect of being prevented from corroding, while retaining adhesion reliability and transparency to a high degree. A pressure-sensitive adhesive composition and a pressure-sensitive ad...  
WO/2014/118266A1
A dendritic or hyperbranched polymer comprising a plurality of branches, wherein at least one of the branches comprises at least one catechol moiety that is oxidisible to a semiquinone moiety and/or a quinone moiety.  
WO/2014/119426A1
[Problem] To provide a multilayer adhesive sheet having good resistance to solvents, surface slipperiness, and ability to follow curved surfaces. [Solution] This multilayer adhesive sheet has at least a surface protection layer, a substr...  
WO/2014/119357A1
[Problem] To provide a multilayer adhesive sheet having good ability to follow curved surfaces, and excellent affixing workability. [Solution] This multilayer adhesive sheet has at least a surface protection layer, a substrate layer and ...  
WO/2014/119417A1
Provided are: a sealing film which comprises a polar group and still has water repellency, and which firmly adheres to an element for organic electronic devices even if heated at low temperatures and has a function of protecting the elem...  
WO/2014/118878A1
Disclosed are: a flame-retardant adhesive tape comprising a base and a flame-retardant adhesive agent layer formed on one surface of the base and comprising an adhesive agent base polymer, a flame retardant agent of a melamine salt compo...  
WO/2014/119565A1
The purpose of the present invention is to provide: a sealing material of a near-infrared ray irradiation type, which can adhere a member composed of a resin, a glass or the like satisfactorily upon the irradiation with near-infrared ray...  
WO/2014/119547A1
Provided is an adhesive film which has excellent adhesion even to a nonpolar surface and a method for manufacturing electronic components using the same. An adhesive film which has a first layer (11) that comprises a thermosetting resin ...  
WO/2014/115468A1
Provided is a base material particle that, when electrically connecting electrodes using conductive particles having a conductive layer formed at the surface thereof, can reduce connection resistance and can suppress connection defects r...  
WO/2014/115639A1
Provided are the following: an optical-member adhesive composition which contains an adhesive material, reactive modified metal oxide particles having a volume average particle diameter of 1-500 nm, and organic light-diffusing particles,...  
WO/2014/115343A1
Provided are: a low cost resin paste composition that is suitably used for adhering conductor elements such as semiconductor chips and the like to a supporting member such as a lead frame or the like, that reduces the usage of silver whi...  
WO/2014/112621A1
The present invention provides an oxygen-absorbing film having an oxygen-absorbing adhesive agent layer comprising an oxygen-absorbing adhesive agent resin composition, wherein the oxygen-absorbing adhesive agent layer has at least two g...  
WO/2014/112165A1
Provided are: a heat-curable composition having an excellent adhesion property and excellent storage stability; and a laminated structure produced using the composition. A heat-curable composition characterized by comprising (A) a blocke...  

Matches 1 - 50 out of 15,200