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Patent Searching and Data


Matches 1 - 50 out of 19,992

Document Document Title
WO/2017/199979A1
Disclosed is a laminated resin film having a second resin film laminated on at least one surface of a first resin film with an adhesive layer therebetween, the laminated resin film comprising a compound including a specific borate group ...  
WO/2017/199985A1
Provided is an adhesive having excellent adhesiveness with thermoplastic resins and ethylene-vinyl alcohol copolymers. Provided are an adhesive including a thermoplastic resin (A), a copolymer (B) of ethylene and a vinyl ester and/or acr...  
WO/2017/199547A1
The present invention addresses the problem of realizing a thermoplastic adhesive product that can be automatically supplied continuously to a heating and melting tank and can be produced easily. Provided is a thermoplastic adhesive prod...  
WO/2017/200103A1
A demolding film comprising: a support comprising a substrate and an adhesive layer disposed upon the substrate; and an electromagnetic wave-shielding sheet disposed upon the adhesive layer of the support. The peel strength between the a...  
WO/2017/199978A1
Disclosed is a polarizing film having a transparent protection film laminated on at least one surface of a polarizer with an adhesive layer therebetween, the polarizing film including, on the lamination surface of the polarizer, an adhes...  
WO/2017/195811A1
The present invention relates to an aluminum alloy material that comprises: an aluminum alloy base material; a first coating film that is formed on at least one portion of the surface of the aluminum alloy base material and that comprise...  
WO/2017/195899A1
Provided is a heat-peelable pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer which, even when heated under severe conditions (for example, 100°C, 3 hours), can retain the expanded state without shrinking and ...  
WO/2017/195806A1
This aluminum alloy material production method is provided with: an oxide film-forming step for forming an oxide film, which contains 0.1 atom% to less than 30 atom% of Mg and in which Cu is restricted to less than 0.6 atom%, on at least...  
WO/2017/195400A1
The present invention addresses the problem of providing an electrically conductive adhesive which has superior heat cycle properties and good reflow properties, and is less likely to come off a substrate. The problem is solved by an ele...  
WO/2017/195517A1
Disclosed is a method for manufacturing a semiconductor device provided with a semiconductor chip having connection parts, and a wiring circuit substrate having connection parts, the respective connection parts being electrically connect...  
WO/2017/191812A1
A method for modifying a carbon nanotube sheet, in which a structure has a mounting part for mounting a carbon nanotube sheet, and the mounting part has non-contacting sections that do not contact the carbon nanotube sheet, and contactin...  
WO/2017/191815A1
This resin film for temporary fixation is equipped with a first layer including a first thermoplastic resin having a glass transition temperature of -50 to 50°C and a second layer including a second thermoplastic resin having a glass tr...  
WO/2017/191827A1
The present invention provides a degradable polyrotaxane compound that is easily produced and has large changes in physical properties during degradation. More specifically, said polyrotaxane compound is provided as a result of synthesiz...  
WO/2017/191836A1
This adhesive sheet has a configuration in which a substrate and an adhesive layer formed from an adhesive composition are layered in this order, and an electroconductive layer which is formed from a material including carbon nanotubes a...  
WO/2017/188411A1
Disclosed are a sulfur-containing silane compound that is a product of a reaction between a compound expressed by general formula (1) and a compound expressed by general formula (2), and a synthesis method therefor, as well as a rubber c...  
WO/2017/188223A1
The present invention addresses the problem of providing a two-sided adhesive sheet provided with both contour conforming properties and outgas resistance. The present invention is the two-sided adhesive sheet comprising: a base material...  
WO/2017/188205A1
The present invention provides an energy ray-curable film for forming a protective film. The film for forming the protective film is capable of forming the protective film on the rear surface of a semiconductor wafer or a semiconductor c...  
WO/2017/188231A1
An energy ray-curable film for forming a protective coat, wherein said film for forming a protective coat has a characteristic in which, when said film for forming a protective coat has been irradiated with energy rays and made into a pr...  
WO/2017/188198A1
This composite sheet for forming a protective coating includes a support sheet, and also includes, upon the support sheet, an energy-ray-curable film for forming a protective coating. When the film for forming a protective coating is irr...  
WO/2017/188199A1
Provided are a film for forming a protective coating and a composite sheet for forming a protective coating, both of which can prevent curing defects even in the presence of oxygen. Said film for forming a protective coating can be cured...  
WO/2017/188211A1
This film for forming a protective coating can be cured by energy rays, and when irradiated with energy rays to obtain the protective coating, the tensile elasticity of the protective coating is at least 1×108Pa. This composite sheet fo...  
WO/2017/188203A1
The present invention relates to a method for producing a semiconductor chip 19 equipped with a protective film, wherein a semiconductor wafer 18 in a laminate provided with a support sheet 10, an energy ray-curable film 13 for forming t...  
WO/2017/188200A1
This film for forming a protective film is energy ray curable. When the film for forming the protective film is irradiated with energy rays to form the protective film, the maximum cross-sectional height (Rt) of at least one surface (β'...  
WO/2017/188229A1
This film for forming a protective coating satisfies both condition (1): the transmittance therethrough of laser light having a 1342-nm wavelength is 45% or more, and condition (2): the transmittance therethrough of laser light having a ...  
WO/2017/183310A1
The purpose of the present invention is to provide an adhesive-film-integrated pressure-sensitive adhesive tape which has satisfactory conformability to wafers that have bumps and in which the pressure-sensitive adhesive tape combines ad...  
WO/2017/179579A1
This granular adhesive contains an adhesive particle. The adhesive particle comprises a core containing an adhesive composition, a shell covering the core, and an encapsulated gas. The shell comprises a solid particle.  
WO/2017/175480A1
This sheet 1 for producing a three-dimensional integrated laminated circuit, which is interposed between a plurality of semiconductor chips having through-electrodes and is used to adhere the semiconductor chips to each other and obtain ...  
WO/2017/175481A1
This sheet 1 for producing a three-dimensional integrated laminated circuit, which is interposed between a plurality of semiconductor chips having through-electrodes and is used to adhere the semiconductor chips to each other and obtain ...  
WO/2017/170021A1
A semiconductor processing sheet comprises an adhesive agent layer on a base material, and has the following characteristics: when the adhesive agent layer has a thickness of 200 μm, the adhesive agent layer with the thickness of 200 μ...  
WO/2017/169451A1
Provided is a surface protection film that comprises an adhesive layer, a middle layer, and a back surface layer, and that is characterized in that the back surface layer comprises a polyolefin resin composition containing 0.3-10 wt% of ...  
WO/2017/171025A1
The main objective of the present invention is to provide a modified hydrocarbon resin that imparts a hot-melt adhesive composition which is low-odor, has excellent thermal stability, and has high adhesive performance. The present invent...  
WO/2017/170413A1
[Problem] To provide: a novel and improved method for cutting an adhesive film, which is capable of producing an adhesive film that has a width of less than 1 mm, while having a low glass transition point and high quality; and an adhesiv...  
WO/2017/168828A1
Provided is a tape for an electronic device package, with which it is possible to suppress the occurrence of bending and marks in a metal layer, which are caused by the edge section of the rotating stage of a pickup device when picking u...  
WO/2017/169672A1
[Problem] To provide a radio wave absorbing material having increased reflective attenuation. [Solution] A radio wave absorbing adhesive sheet is characterized in that two or more sets of laminates are stacked, the laminates comprising a...  
WO/2017/169388A1
Reinforcing adhesive (41) is applied by bringing an application surface (25) at the tip of application material (22) impregnated with the adhesive (41) using capillary action into contact with sewn parts (76) wherein airbag base material...  
WO/2017/170955A1
Provided is a composition which exhibits sufficient adhesive strength even after a high-temperature treatment. The composition comprises (1) polymerizable monomers comprising an ingredient (1-1) which is a monofunctional polymerizable mo...  
WO/2017/169387A1
A film adhesive (13) according to the present invention is a curable film adhesive. A single layer of the film adhesive (13) that has a thickness of 60 µm and that is uncured, or a laminate formed by stacking two or more layers of the f...  
WO/2017/170375A1
Provided are: a novel cyanic acid ester compound which has excellent solubility in solvents and makes it possible to produce a cured article having a low thermal expansion coefficient and excellent flame retardancy and heat resistance; a...  
WO/2017/169747A1
[Problem] To provide a film for manufacture of a semiconductor component and a film for manufacture of an electronic component which, even when used in an environment with a changing temperature, can be easily removed from a table surfac...  
WO/2017/170492A1
Provided is an inductor adhesive with which it is possible to increase humidity resistance and to suppress reduction in adhesion even when exposed to high humidity. An inductor adhesive according to the present invention includes a therm...  
WO/2017/168820A1
Provided is an electronic device package tape that can inhibit the occurrence of warpage in a layered product of a semiconductor, bonding adhesive layer, and semiconductor chip when precuring the bonding adhesive layer and that can inhib...  
WO/2017/170452A1
This adhesive film (50), for use in semiconductor device manufacturing, is used for temporarily fixing an electronic component (70) when sealing the electronic component (70) by means of a sealing member (60) in a semiconductor device ma...  
WO/2017/162690A1
The invention relates to a method for producing an adhesive based on a silane-modified polymer, containing at least one silyl-containing polymer, at least one compatible tacky resin and at least one catalyst. According to the invention, ...  
WO/2017/164088A1
The purpose of the present invention is to provide a display in which an adhesive having zero temperature-dependent birefringence is used to join together a glass sheet and an optical film, whereby the display does not exhibit warping or...  
WO/2017/163971A1
This supporting sheet comprises a base and an adhesive layer that is laminated on the base. The surface roughness (Ra) of the adhesive layer-side surface of the base is 0.4 μm or less; and the surface roughness (Ra) of another surface o...  
WO/2017/163721A1
Provided is a method for manufacturing a connection structure in which the allowable range of a terminal interval in a member can be enlarged and which can be mounted at low temperature. The method comprises: an arranging step for arrang...  
WO/2017/163605A1
The carbon fiber sheet (1) for reinforcement of the present invention includes carbon fiber filaments (2) arranged in parallel along one direction and a thermoplastic adhesive (4) present in at least some of each cross-section along a di...  
WO/2017/164318A1
The present invention provides an anisotropic conductive adhesive which allows for flip chip mounting of a light emission element, such as an LED chip having fine-pitch wiring, and is capable of imparting high optical characteristics, hi...  
WO/2017/159789A1
The purpose of the present invention is to provide an adhesive sheet which is formed from a dual curing adhesive composition and which has sufficiently low relative dielectric constant and excellent durability. The present invention rela...  
WO/2017/159349A1
This adhesive sheet for a molding stage is an adhesive sheet (X1) which has a layered structure comprising a substrate (11) and an adhesive agent layer (12), for example. The adhesive sheet (X1) has a piercing strength of 3.3 to 12 N as ...  

Matches 1 - 50 out of 19,992