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Patent Searching and Data


Matches 1 - 50 out of 17,406

Document Document Title
WO/2016/152385A1
This anisotropically conductive film connects a terminal of a first electronic component and a terminal of a second electronic component in an anisotropically conductive manner, and is characterized by containing at least conductive part...  
WO/2016/152919A1
[Problem] To provide a semiconductor processing tape which has excellent pick-up properties and in which the thermal shrinkage rate in a tape shrinkage process is low, wrinkles do not occur, and kerf width extends sufficiently without di...  
WO/2016/152631A1
[Problem] To provide a coating film protective film which exhibits high fouling prevention performance, while having high followability to curved surfaces. [Solution] A coating film protective film which has (a) a coating layer that is o...  
WO/2016/152598A1
A kit which can suppress residue from a temporary adhesive in semiconductor manufacturing, and a laminate body are provided. This kit for semiconductor device manufacture is provided with a composition containing a solvent A, a compositi...  
WO/2016/151911A1
A semiconductor processing sheet 1 has a 100% strength of 3-14 N/15 mm and a recovery of 75-100%. A method for manufacturing a semiconductor device includes a step for preparing a semiconductor processing sheet 1 in which a plurality of ...  
WO/2016/152543A1
[Problem] To provide: a novel and improved anisotropic conductive connection structure which is able to be produced by a simple process and has high reliability; an anisotropic conductive connection method; and an anisotropic conductive ...  
WO/2016/152271A1
The present invention is a resin composition used to seal an interface between an adherend and a semiconductor element that is flipchip-bonded to the adherend, wherein the resin composition contains a radical reactive compound, a thermop...  
WO/2016/152599A1
A laminate body, a temporary adhesive composition and a temporary adhesion film are provided which can make warpage less prone to occur even when a wafer is thin. This laminate body comprises, in order and adjacent to each other, a first...  
WO/2016/152787A1
A double-sided adhesive tape provided with various properties needed as characteristics of double-sided adhesive tape, such as adhesive strength, even when the width of the tape is reduced, has a substrate film 2, a first adhesive layer ...  
WO/2016/152762A1
Provided are a surface-treated calcium carbonate filler useful in a curable resin, for imparting performance having excellent heat resistance, color fastness, strength, and elongation, and a curable resin composition containing the fille...  
WO/2016/148110A1
The present invention provides an adhesive tape for semiconductor processing, which does not leave adhesive residue when the adhesive tape for semiconductor processing is removed from a wafer surface after back polishing, especially in a...  
WO/2016/143623A1
The invention is an adhesive sheet provided with an adhesive layer that is used for direct or indirect adhesion onto an optical semiconductor element. A curve obtained by dynamic viscoelasticity measurements on the adhesive layer under t...  
WO/2016/143711A1
The present invention provides an adhesive tape for protecting the surface of a semiconductor wafer, the adhesive tape being constituted from a base material film, an intermediate resin layer, and an adhesive layer, wherein: the base mat...  
WO/2016/142966A1
This adhesive sheet is an adhesive sheet for bonding an unvulcanized rubber to a metal, and is provided with: a mold release film which is composed of a first film layer formed from a polypropylene and a second film layer formed from a p...  
WO/2016/144515A1
Compositions are provided that include a coating and porous polymeric particles disposed in the coating. Adhesive articles are also provided including a substrate and a composition disposed on a first major surface of the substrate. The ...  
WO/2016/140248A1
A film-like adhesive composite sheet which is provided with: a supporting sheet having a base; and a curable film-like adhesive that is provided on the supporting sheet and has a thickness of 1-50 μm. The peel strength at the interface ...  
WO/2016/139840A1
A dicing sheet 10 which is provided with a base 3, an intermediate layer 2 that is provided on one surface of the base 3, and an adhesive layer 1 that is provided on the intermediate layer 2, and wherein: the adhesive layer 1 contains a ...  
WO/2016/140196A1
The conduction paste comprises an adhesive and conductive particles that enable conduction between electrodes, wherein the coefficient of variation for the conductive particle diameter dimension is 25% or less. The average particle diame...  
WO/2016/136774A1
[Problem] To provide a film-like adhesive agent and an adhesive sheet which are suitable for a breaking method with a heated gas. [Solution] The film-like adhesive agent according to the present invention comprises a polymer component (A...  
WO/2016/136800A1
The present invention provides an adhesive cleaner capable of sufficiently removing oily solid debris and aqueous solid debris. The present invention provides an adhesive cleaner equipped with a capturing member for capturing matter to b...  
WO/2016/136710A1
Provided is an adhesive composition for forming an adhesive layer which is excellent in stress relaxation properties and durability, and has a sufficiently low haze value. Further, provided is an adhesive layer formed out of the adhesive...  
WO/2016/136759A1
This release agent composition comprises a polyester resin (A) and an acrylic polymer (B), wherein: the acrylic polymer (B) includes structural formula (1) as a structural unit; and the ratio (A):(B) between the blending amount of said p...  
WO/2016/136436A1
The purpose of the present invention is to provide a pressure-sensitive adhesive film through which air bubbles trapped at the bonding interface upon application of the pressure-sensitive adhesive film are apt to disappear at ordinary te...  
WO/2016/133104A1
Provided is a core-shell particle mixture: which comprises first core-shell particles configured from first cores containing a first substance and first shells covering the first cores and second core-shell particles configured from seco...  
WO/2016/132962A1
Provided are a laminated body for temporary adhesion, a laminated body, and a kit which are capable of exerting release properties, flatly polishing properties, and of suppressing warpage, simultaneously. The laminated body for temporary...  
WO/2016/133111A1
The present invention relates to a stress-induced light-emitting sheet, particularly, to a stress-induced light-emitting sheet having a Gurley stiffness, which conforms to JAPAN TAPPI No. 40, of 1.55 mN or less. According to the present ...  
WO/2016/129610A1
Provided are an adhesive that makes it possible to bond thermoplastic resins to each other in a short time and to obtain excellent adhesive strength, a structure bonded by this adhesive, and a bonding method using this adhesive. The adhe...  
WO/2016/129577A1
The purpose of the present invention is to provide a method for dicing a wafer in a state of being reinforced by a dicing tape and manufacturing a semiconductor chip, wherein positional displacement and similar problems are prevented fro...  
WO/2016/129567A1
An adhesive resin and an easily releasable film, including: a copolymer A of ethylene and an unsaturated carboxylic acid ester, in which the content of structural units derived from the unsaturated carboxylic acid ester is more than 0% b...  
WO/2016/125835A1
Provided is a resin-film forming composite sheet which has a structure in which a resin-film forming film capable of forming a resin film is directly laminated on a support sheet, and which satisfies the following requirements (I) and (I...  
WO/2016/125683A1
An adhesive sheet (10) according to the present invention comprises a first region (11) to which an adherend is bonded and a second region (12) provided on an outer periphery of the first region (11), wherein a tensile modulus of elastic...  
WO/2016/121488A1
An adhesive sheet for use in semiconductor processing, having an intermediate layer and an adhesive layer on a substrate in this order, and satisfying the conditions that (a) the loss tangent of the intermediate layer when measured at a ...  
WO/2016/121149A1
Provided is a magnet adhesive member that comprises a rare-earth magnet adhered to a soft magnetic material and that can be reutilized while ensuring material strength, without having to dissolve the resulting rare-earth magnet, for exam...  
WO/2016/120705A1
The present invention pertains to a laminate characterized by: comprising an adhesive layer, a surface layer laminated on one surface of the adhesive layer, and a resin separator layer laminated on an other surface of the adhesive layer,...  
WO/2016/121557A1
The purpose of the present invention is to provide: a pressure-sensitive adhesive sheet which has a high elongation at break, changes little in relative permittivity with changing temperature, and is excellent in terms of processability,...  
WO/2016/121806A1
This paste adhesive composition includes metal particles (A) and a compound (B) polymerized by heating, and when the metal particles (A) are caused to undergo sintering and form a particle connection structure by heat treatment, and the ...  
WO/2016/121651A1
Provided is a material capable of being repeatedly used as an adhesive. This photosensitive composite material contains a polymer compound, a liquid crystal compound, and a photosensitive compound. The molecular shape of the photosensiti...  
WO/2016/117613A1
To connect an electronic component at low temperatures by using a photocurable adhesive and to prevent alignment deviation of the electronic component. A method for producing a connected body, which comprises: an adhesive arrangement ste...  
WO/2016/117605A1
Provided is an adhesive that is applied using an inkjet device, wherein the adhesive can make it difficult for voids to form in an adhesive layer and, after bonding, can increase adhesiveness, moisture-resistant adhesion reliability, and...  
WO/2016/117350A1
Provided is an anisotropic conductive film with superior insulation between neighboring terminals and superior conductivity for long periods between connected terminals, even when connected to substrates that have been anti-corrosion tre...  
WO/2016/114317A1
The present invention pertains to a composition for forming an adhesive layer, an adhesive layer, a manufacturing method for an adhesive layer, a composite material, a sheet, a heat dissipation member, an electronic device, a battery, a ...  
WO/2016/111208A1
The present invention discloses an adhesive tape having an adhesive layer 1, 2 respectively on the two sides of a substrate, wherein: at least the adhesive layer 2 on one side among the adhesive layers is formed by comprising, in a mixed...  
WO/2016/104275A1
Provided is an electrically conductive paste that makes it possible to efficiently arrange solder particles upon an electrode and that makes it possible to improve the reliability of conduction between electrodes. This electrically condu...  
WO/2016/104787A1
 Provided is a dual-curing photocurable composition that utilizes moisture curing and photocuring, wherein said composition: allows sufficient work time to be taken during which curing does not proceed before being irradiated with ligh...  
WO/2016/105134A1
The present invention relates to an adhesive resin composition for semiconductor, the composition containing: a thermoplastic resin with a low moisture absorption rate; an epoxy resin including a biphenyl-based epoxy resin; and a hardene...  
WO/2016/103784A1
The invention improves the dimensional accuracy for a high heat conduction portion and a low heat conduction portion of a thermally conductive adhesive sheet, and lowers the thermal conduction rate of the low heat conduction portion. Fur...  
WO/2016/103381A1
A pressure-sensitive adhesive sheet (10) which includes a release film (11) and in which a net (12) has been superposed so that one surface thereof faces the release film (11) and a foamed base (13) that is expandable and flexible has be...  
WO/2016/104459A1
Provided is a solder transfer sheet which is capable of increasing the amount of transferred solder without forming a bridge. This solder transfer sheet 1A is provided with: a base 5; an adhesive layer 4 that is formed on a surface of th...  
WO/2016/103783A1
Provided are: a thermally conductive adhesive sheet enabling improvement of the dimensional precision of a high thermal conductivity part and a low thermal conductivity part of the thermally conductive adhesive sheet, reduction in therma...  
WO/2016/104322A1
This pressure-sensitive adhesive sheet 10A is a pressure-sensitive adhesive sheet which comprises, disposed in the following order, a base 11, an interlayer 12, and a pressure-sensitive adhesive layer 13, wherein the interlayer 12 is a l...  

Matches 1 - 50 out of 17,406