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Patent Searching and Data


Matches 1 - 50 out of 10,373

Document Document Title
WO/2014/115468
Provided is a base material particle that, when electrically connecting electrodes using conductive particles having a conductive layer formed at the surface thereof, can reduce connection resistance and can suppress connection defects r...  
WO/2014/115639
Provided are the following: an optical-member adhesive composition which contains an adhesive material, reactive modified metal oxide particles having a volume average particle diameter of 1-500 nm, and organic light-diffusing particles,...  
WO/2014/115343
Provided are: a low cost resin paste composition that is suitably used for adhering conductor elements such as semiconductor chips and the like to a supporting member such as a lead frame or the like, that reduces the usage of silver whi...  
WO/2014/112621
The present invention provides an oxygen-absorbing film having an oxygen-absorbing adhesive agent layer comprising an oxygen-absorbing adhesive agent resin composition, wherein the oxygen-absorbing adhesive agent layer has at least two g...  
WO/2014/112165
Provided are: a heat-curable composition having an excellent adhesion property and excellent storage stability; and a laminated structure produced using the composition. A heat-curable composition characterized by comprising (A) a blocke...  
WO/2014/103327
This thermally conductive pressure-sensitive adhesive sheet contains the following: a thermally conductive sheet that contains a thermally conductive filler and a fluorine resin; and a pressure-sensitive adhesive layer or layers, provide...  
WO/2014/097757
Provided is a base-less double-sided adhesive sheet, which can exhibit good antistatic performance and releasability when used as, for example, a member for a capacitive touch panel, and in which release films contained therein have olig...  
WO/2014/098069
The present invention provides a resin composition for use as a vapor-barrier adhesive. Said resin composition is obtained by reacting a polyol with a hardener, and either the polyol or the hardener has tricycloalkane structures that con...  
WO/2014/091512
This patent application concerns the fabrication, composition and properties of new plastic materials containing two components, A and B; said A is a polymer obtained by synthesis from reagents derived from fossil sources, such as polyet...  
WO/2014/093141
Methods of forming an adhesive composition including the steps of (a) combining a non-deaerated mixture comprising at least one free radically (co)polymerizable ethylenically-unsaturated material with a sealable packaging, wherein the pa...  
WO/2014/091863
This optical film with adhesive on both sides comprises: an optical film, further comprising a polarizing sheet; a first adhesive layer which is disposed on a face of the optical film which is a side which is pasted upon an image display...  
WO/2014/091966
Provided is an adhesive composition having high shear bond strength, peel bond strength, and impact bond strength, and in particular one able to form a cured article having outstanding bond strength resistance to cold/hot cycles. The adh...  
WO/2014/088095
Provided is a conductive material which forms a connection part that is not susceptible to voids in cases where electrodes of members to be connected are electrically connected with each other, and which is capable of increasing the conn...  
WO/2014/084069
An adhesive which contains a product of condensation of a cellulose derivative with a polysiloxane having at least one kind of substituent selected from the group consisting of hydroxyl group and alkoxyl groups.  
WO/2014/084357
[Problem] To improve the adhesion between a resin film-forming layer, which serves as a precursor of an adhesive film or protective film, or a cured resin film obtained therefrom and a semiconductor chip or semiconductor wafer that is an...  
WO/2014/083875
The present invention relates to an electroconductive film (including electromagnetic wave shielding films) and provides a novel electroconductive film that not only has excellent conductivity but also is capable of increased adhesivenes...  
WO/2014/084173
Provided is a conductive particle with insulating particles, which is able to be efficiently arranged on an electrode. A conductive particle (1) with insulating particles according to the present invention is provided with: a conductive ...  
WO/2014/083872
[Problem] To provide a sheet having excellent bondability, which is capable of imparting a semiconductor device that is obtained using the sheet with heat dissipation characteristics without having a semiconductor wafer or chip subjected...  
WO/2014/080954
To provide: an adhesive composition for skin whereby an adhesive for skin can be obtained that can be readily coated and which has good aggregability; an adhesive for skin obtained using said adhesive composition for skin; and an adhesiv...  
WO/2014/078071
A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow mic...  
WO/2014/077115
The present invention addresses the problem of providing an easily peelable adhesive agent which is adhesive at high temperatures and non-adhesive at low temperatures, and an easily peelable adhesive material using this adhesive agent. T...  
WO/2014/073316
Provided is a new double-sided adhesive sheet for an image display device which can be firmly laminated onto a surface without a gap even when the surface on which the adhesive sheet is to be laminated has a step difference due to printi...  
WO/2014/069353
Provided is a highly reliable semiconductor device which exhibits excellent heat dissipation performance of a heat-generating element and solves the problem of decrease in the bonding strength between the heat-generating element and a su...  
WO/2014/069542
A laminated body with good reworkability is provided. The laminated body is bonded to an adherend and used. The laminated body comprises, in order from an adherend side, a first adhesive layer, a first substrate layer, a second adhesive ...  
WO/2014/065247
A production method for a transparent surface material having an adhesive layer, comprising: a step in which a frame-shaped film is laminated upon the upper surface of each of a plurality of transparent surface materials as same are bein...  
WO/2014/065350
The purpose of the present invention is to provide an active energy ray-curable adhesive composition which exhibits excellent heat resistance, film hardness and adhesion after being irradiated with an active energy ray. An active energy ...  
WO/2014/054701
 Provided is a self-adhesive surface protection film which exhibits strong adhesion to a body to be covered, with which the adhesive film is stored in a rolled state while being usable with various bodies to be covered, which is not su...  
WO/2014/053271
The invention relates to an aqueous composition comprising (A) a water-soluble or water-dispersible binder, or a water-soluble or water-dispersible constituent comprising carboxyl groups, and (B) at least one cyclic hydroxyalkyl amide.  
WO/2014/054409
Provided is a thermally restorable article, which has good embeddability during heat-shrinking and is capable of improving adhesion to the substrate being processed, and which is capable of reducing variations in the thickness of the adh...  
WO/2014/054618
The present invention relates to a silver hybrid copper powder which is characterized in that: a fine silver particle powder adheres to the surface of a copper powder; the ratio of the average particle diameter (D50) of the copper powder...  
WO/2014/051043
The present invention is characterized by containing conductive carbon, a water-soluble polymer, a particulate binder, and a dispersing medium, the water-soluble polymer being partially hydrolyzed and being an isobutylene-maleic anhydrid...  
WO/2014/050538
Provided are: a temporary adhesive for semiconductor device production that contains (A) a polymer compound that is substantially insoluble in an alkaline solution, and has a radical polymerizable group in a side chain, (B) a radical pol...  
WO/2014/051142
The purpose of the present invention is to provide an intermediate film for a laminated glass, the intermediate film being extremely transparent, wherein it is possible to prevent the occurrence of pests. Another purpose of the present i...  
WO/2014/050156
The present invention relates to a conductive composition containing a conductive metal powder and a resin component, wherein the conductive metal powder contains metal flakes and metal nanoparticles, and the resin component contains an ...  
WO/2014/050455
Provided are: a temporary adhesive for semiconductor device production that contains (A) a polymer compound having a thermal decomposition temperature of at least 250°C, and (B) a radical polymerizable monomer; an adhesive substrate tha...  
WO/2014/050763
Provided is a radiation-curing adhesive tape for dicing capable of easy pickup without any residual adhesive in the pickup step even for, e.g., a semiconductor chip on which a through electrode is provided. This radiation-curing adhesive...  
WO/2014/051106
An adhesive sheet in which a support substrate, an adhesive layer (X), a continuous-void-containing layer comprising a composition containing an adhesive and silica particles, and an adhesive layer (Y) are laminated in this order, swelli...  
WO/2014/050664
The present invention relates to a method for producing a laminated member formed by laminating multiple articles including at least one article having a heating allowable temperature of 80˚C or lower on each other, said method comprisi...  
WO/2014/045931
An anisotropic conductive film in which a terminal of first electronic component and a terminal of second electronic component are connected in an anisotropically conductive manner; wherein the anisotropic conductive film contains a crys...  
WO/2014/046093
Provided is an anisotropic conductive adhesive which is capable of achieving high heat dissipation performance. Conductive particles (31) and solder particles (32) are dispersed in a binder. In an LED package which is obtained by thermal...  
WO/2014/046053
An anisotropic conductive film produced by the anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component, said anisotropic conductive film comprising a conductive...  
WO/2014/046082
The purpose of the present invention is to reduce the occurrence of substrate warping after being connected in a connection using an anisotropic conductive film. An anisotropic conductive film (23) has a first insulating adhesive agent l...  
WO/2014/046102
This conductive sheet has a structure wherein a conductive adhesive layer is laminated on one surface of a base substrate and a light-blocking insulating layer is laminated on the other surface of the base substrate. A substrate which ha...  
WO/2014/046128
The aim of the present invention is to provide an adhesive for electronic components, which is easy to apply, maintains shape well after application, and with which voids can be minimized. Another aim of the present invention is to provi...  
WO/2014/041904
A method for manufacturing a laminate in which a transfer layer having an uneven shape is laminated on a transferred object, the method for manufacturing a laminate provided with an uneven shape including: a first step for obtaining a tr...  
WO/2014/038366
A flame-retardant laminate (10) having a base material (11) and a print receptive layer (12) laminated therein. The base material (11) has flame retardation equivalent to VTM-0. The print receptive layer (12) includes a resin and titaniu...  
WO/2014/038477
The present invention provides an anti-fouling treatment method for an underwater structure by using an anti-fouling adhesive tape, whereby it is possible to prevent peeling of the anti-fouling adhesive tape, the progression of the peeli...  
WO/2014/033770
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive comp...  
WO/2014/034100
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive comp...  
WO/2014/026906
The invention relates to multicomponent crosslinkable compositions (K) comprising at least one component (K1) and a component (K2), characterized in that component (K1) contains 100 parts by weight of compounds (A) of the formula: Y-[(CR...  

Matches 1 - 50 out of 10,373