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Patent Searching and Data


Matches 1 - 50 out of 18,868

Document Document Title
WO/2017/082269A1
Provided are: a method for manufacturing a laminate in which a carrier substrate can be mechanically delaminated at room temperature, voids are reduced, and an excellent peeling force stability is obtained; a method for manufacturing a s...  
WO/2017/082210A1
A method for manufacturing a semiconductor chip, said method including the following steps (a) through (d): (a) a step in which, while a mask-integrated surface protection tape is affixed to a pattern surface side of a semiconductor wafe...  
WO/2017/081716A1
This adhesive sheet is used for the purpose of bonding an unvulcanized rubber to a metal, and is provided with: a base fabric layer that is impregnated with a solvent dispersion type vulcanization adhesive which is reactive with the unvu...  
WO/2017/082418A1
Provided is an adhesive tape to be used for securing an electrode and a separator when producing a secondary cell, it being possible with the adhesive tape to secure the separator and electrode to an excellent degree while maintaining th...  
WO/2017/078055A1
This curable resin film is for forming a first protective film on the bump-equipped surface of a semiconductor wafer by adhering to the surface and being cured. The haze (h1) of the surface when the curable resin film is cured by being h...  
WO/2017/078157A1
This adhesive composition comprises a silane compound having a structure represented by general formula (I). (In the formula, X represents an organic group, R1 and R2 each independently represent an alkyl group, m represents an integer f...  
WO/2017/078056A1
This curable resin film is for forming a first protective film on the bump-equipped surface of a semiconductor wafer by adhering to said surface and being cured. The yellow index (YI1) when the curable resin film is cured by being heated...  
WO/2017/077809A1
This method for manufacturing a semiconductor device is characterized by including: a step in which an energy ray-curable resin layer (12) of a first protective film forming sheet (1), which comprises a first support sheet (11) and the e...  
WO/2017/078047A1
The present invention pertains to a first protective film forming sheet obtained by laminating a first adhesive layer on a first substrate and laminating a curable resin layer on the first adhesive layer. The first protective film formin...  
WO/2017/077912A1
Provided is a laminate that exhibits good adhesion properties with respect to not only conventional polyimide and polyester films but also to metal substrates and low polarity resin substrates, such as LCP, and that can attain high solde...  
WO/2017/073630A1
Disclosed is a method for manufacturing a semiconductor device provided with a semiconductor chip, a substrate and/or another semiconductor chip, and an adhesive layer interposed therebetween. This method comprises: a step for sandwichin...  
WO/2017/073671A1
The present invention provides a light emitting body protective film which is provided with a first optical film and an adhesive layer having barrier properties, and wherein the first optical film is an optical barrier film that comprise...  
WO/2017/073691A1
Provided is an adhesive layer containing composite tungsten oxide particles and/or tungsten oxide particles, a dispersant, a metal coupling agent having an amino group, an adhesive, and a crosslinking agent.  
WO/2017/073091A1
Provided is a pressure-sensitive adhesive film which is for use as various surface-protective films, etc., has few fish-eyes, is excellent in terms of mechanical strength and heat resistance, and has satisfactory pressure-sensitive adhes...  
WO/2017/069195A1
The purpose of the present invention is to provide a colored adhesive tape whereby there is no separation of a support layer and a coloration shielding layer and occurrence of ink peeling even during reworking or the like, and to provide...  
WO/2017/069050A1
Provided is an ultrasmall-sized securing tape that is suitable as a disposable tape for absorbent articles such as disposable diapers, sanitary napkins, and incontinence pads. This ultrasmall securing tape comprises an extending portion ...  
WO/2017/065072A1
The purpose of the present invention is to provide a tackifier which is superior in adhesiveness at high temperatures (high-temperature holding power) and adhesion to rough surfaces to conventional tackifiers produced using rosin acids h...  
WO/2017/065113A1
A semiconductor device 100 according to one embodiment of the present invention is provided with a semiconductor substrate 11 and a protective layer 20. The semiconductor substrate 11 has a first surface that constitutes a circuit surfac...  
WO/2017/064925A1
This double-sided adhesive sheet has a multilayer structure including, for example, an electrolyte-containing adhesive layer (11), an adhesive layer (21), and a conducting substrate (30). This joined body comprising a double-sided adhesi...  
WO/2017/065188A1
A pressure-sensitive adhesive sheet which includes a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition, characterized in that the pressure-sensitive adhesive composition comprises an aliphatic polyca...  
WO/2017/065124A1
Provided is a tabbed pressure-sensitive adhesive product comprising a stretchable pressure-sensitive adhesive sheet and a tab affixed to the pressure-sensitive adhesive sheet. In this tabbed pressure-sensitive adhesive product, the tab c...  
WO/2017/065275A1
Provided is a separator-fitted adhesive tape such that a decrease in the protrusion height of weakly adhesive protruding portions provided in parts of the adhesive layer surface is suppressed sufficiently. The separator-fitted adhesive t...  
WO/2017/064918A1
Provided is an electrically peelable adhesive composition for forming an adhesive layer that has high adhesiveness and that can be easily peeled by applying voltage for a short time even when a low voltage is used. Also provided are: an ...  
WO/2017/061597A1
Provided is a metal-coated nonwoven fabric with an adhesive layer, the metal-coated nonwoven fabric being capable of attaining enhanced adhesiveness. The metal-coated nonwoven fabric with an adhesive layer according to the present invent...  
WO/2017/061416A1
Provided is an adhesive enabling: adhesion and fixing of an adherend onto a support while maintaining a high adhesive property during when the adherend is required to be fixed onto the support, even in a high temperature environment or a...  
WO/2017/057404A1
Provided is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pro...  
WO/2017/057410A1
Provided is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pro...  
WO/2017/057408A1
Disclosed is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pr...  
WO/2017/057428A1
A thermal bonding sheet provided with a layer in which, after heating the layer from 80°C to 300°C at a temperature increase rate of 1.5°C/second under 10 MPa pressurization and then maintaining 300°C for 2.5 minutes, the average are...  
WO/2017/057413A1
An adhesive sheet which has, on a substrate or a peel-off material, a resin layer containing a resin portion (X) including a carbon atom containing resin with, as main component, carbon atoms in the main chain of the structural unit, and...  
WO/2017/057405A1
Provided is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pro...  
WO/2017/057412A1
Disclosed is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pr...  
WO/2017/057130A1
Provided are a thermal bonding sheet that prevents bonding irregularities by having a uniform thickness and can impart bonding reliability at high temperatures, and a thermal bonding sheet with dicing tape that is provided with said ther...  
WO/2017/057519A1
The purpose of the present invention is to provide an adhesive tape for an electronic component, the adhesive tape having excellent wire bonding properties and workability. Provided is an adhesive tape for an electronic component, charac...  
WO/2017/057354A1
Provided are: an easily peeled temporary adhesive which is not prone to film unevenness and in which voids are not prone to occur, while adhesive strength necessary for temporary bonding of a carrier substrate to a base material is maint...  
WO/2017/057357A1
The purpose of the present invention is to provide an adhesive layer-equipped polarizing film having, in order, a polarizer, an anchor coat layer containing a polyvinyl alcohol-based resin, and an adhesive layer, the anchor coat layer an...  
WO/2017/057407A1
An adhesive sheet having a resin layer including resin, upon a base material. At least the surface (α) of the resin layer on the opposite side to the base material side is adhesive. The bending stress coefficient k of the base material ...  
WO/2017/057429A1
A thermal bonding sheet provided with a layer in which, after heating the layer from 80°C to 300°C at a temperature increase rate of 1.5°C/second under 10 MPa pressurization and then maintaining 300°C for 2.5 minutes, the hardness of...  
WO/2017/057406A1
Provided is an adhesive sheet comprising a resin layer that is a multi-layer structure in which at least a layer (Xβ), a layer (Y1), and a layer (Xα) are layered in this order, wherein a surface (α) of the layer (Xα) has adhesive pro...  
WO/2017/057409A1
Provided is an adhesive sheet having a resin layer including resin, upon a base material, and having a resin layer including: a resin section (X) including resin as the main component thereof; and a particle section (Y) comprising fine p...  
WO/2017/048890A1
Curable silicone pressure sensitive adhesive compositions and films suitable for sealing and adhering substrates for optically clear electronic devices are described. The curable silicone pressure sensitive adhesive compositions are suit...  
WO/2017/047600A1
The present invention is a film for plastic restoration with which a plastic that has deteriorated in transparency can be easily made to recover the transparency. The film for plastic restoration according to the present invention compri...  
WO/2017/047389A1
[Problem] To provide an adhesive film structure, an adhesive film accommodating body, and a method for temporarily adhering an adhesive film structure, with which the efficiency of a temporary adhesion step can be improved. [Solution] An...  
WO/2017/047281A1
Provided are: a functional film; and an aircraft window structure. This functional film (100) is sequentially provided, on a first main surface of a transparent film base (10), with a functional thin film (20) that is composed of a lamin...  
WO/2017/046855A1
This adhesive tape for semiconductor wafer processing has a radiation curable adhesive agent layer above a base material film. This adhesive tape for semiconductor wafer processing is to be used in a step whereby a semiconductor wafer th...  
WO/2017/047452A1
Provided is an alumina-based heat conductive oxide which has not only excellent thermal conductivity but also excellent chemical resistance, water resistance and electrical insulation properties, while having good kneadability (miscibili...  
WO/2017/047183A1
The purpose of the present invention is to provide a protective film for a semiconductor, with which it is possible to prevent warpage of semiconductor wafers and semiconductor chips and to prevent chipping and reflow cracking from occur...  
WO/2017/043283A1
A metal panel reinforcement material that comprises a resin composition, said resin composition at least comprising a plastic component for a curable crosslinked polymer matrix, a curing agent for the plastic component, a curing accelera...  
WO/2017/043256A1
Provided is a composition which includes: powdered silver in which grain distribution of primary particles has a first peak in a particle size range of 20 to 70 nm and a second peak in a particle size range of 200 to 500 nm, in which 50%...  
WO/2017/043173A1
The pressure-sensitive adhesive composition according to the present invention comprises (A) a polymer including a structural unit having a hydroxy group in a side chain, (B) a compound having two or more isocyanate groups, (C) a bismuth...  

Matches 1 - 50 out of 18,868