Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 18,200

Document Document Title
WO/2016/185956A1
Provided is a laminate which has superior low dielectric constant characteristics, which exhibits excellent adhesion between metal substrates and not only conventional polyimide and polyester film substrates, but also low polarity resin ...  
WO/2016/186017A1
Provided is a water-activated double-sided adhesive tape or sheet, wherein a water-absorbing adhesive layer 2 is provided on one surface of a water permeable substrate 1, and a water-activated adhesive layer 3 which is made slippery by a...  
WO/2016/186099A1
Provided is an electroconductive pressure-sensitive adhesive material which can have a sufficiently heightened electromagnetic-wave-shielding function even when the adherend has a rugged surface. The electroconductive pressure-sensitive ...  
WO/2016/181877A1
These flat elliptical polymer particles have a front view, a planar view, and a side view in a projection diagram based on third-angle projection which are all elliptical. The flat elliptical polymer particles satisfy (1)-(4): (1) the av...  
WO/2016/181741A1
A surface protective film 10 affixed to an optical member or an electronic member and used for protecting the surface thereof, the surface protective film being provided with a flat annular first film substrate 11, a first adhesive layer...  
WO/2016/181678A1
Provided is a silane coupling agent comprising a silane compound that has, as a basic skeleton, a fused ring that is formed by combining at least two of any single ring in formulas (1)-(3) or of one or more of formulas (1)-(4), and has a...  
WO/2016/178396A1
This adhesive composition (12) contains a coupling agent including a compound having a first functional group that reacts with an inorganic material and a second functional group that reacts with an organic material, and a cross-linking ...  
WO/2016/175611A1
The present invention relates to a resin composition for bonding semiconductors, an adhesive film for semiconductors comprising the resin composition for bonding semiconductors, a dicing die bonding film comprising an adhesion layer comp...  
WO/2016/175612A1
The present invention relates to an adhesive film, for semiconductors, having a particular property capable of improving reliability and efficiency of a semiconductor packaging process, the adhesive film better facilitating embedding une...  
WO/2016/171253A1
An adhesive composition which contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator and (d) a complex containing boron, and wherein (d) the complex containing boron is a compou...  
WO/2016/171170A1
In the present invention, a manufacturing method for a sealed semiconductor element comprises the following: a sealing step in which, a semiconductor element, which has been subjected to pressure-sensitive adhesion to a pressure-sensitiv...  
WO/2016/169190A1
Embodiments of the present invention relate to the technical field of display. Provided are a conductive adhesive composition and a preparation method therefor, a frame sealing adhesive and a display panel. The dispersion uniformity of c...  
WO/2016/171269A1
Provided is a method for producing a pressure-sensitive adhesive, in which a cured product of a curable composition that contains an organic polymer having a crosslinkable silicon group and an adhesion-imparting resin is provided as a pr...  
WO/2016/167305A1
One objective of the present invention is to provide a cured body having excellent flexibility and reliability. A further objective of the present invention is to provide an electronic component and display element formed using said cure...  
WO/2016/167245A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burde...  
WO/2016/167303A1
 Although cationic photocurable compositions of the prior art had photocuring properties, the curing process was extremely slow, ultimately making it difficult to obtain cured products that had cured adequately. This photocurable compo...  
WO/2016/163360A1
Provided is an adhesive tape for preventing adhesion of aquatic organisms, which sequentially comprises an antifouling layer, a base layer and an adhesive layer in this order, and wherein: the base layer is formed of a low-cost material;...  
WO/2016/158760A1
By providing an adhesive sheet that has a low water vapor permeability and a high elasticity before thermosetting, the reliabilities such as dielectric breakdown test results of an electronic equipment are improved and a method, whereby ...  
WO/2016/158412A1
The provided adhesive tape roll comprises an adhesive tape which comprises a polyvinyl chloride (PVC) film and an adhesive layer arranged on one surface of said PVC film, and which is wound in the longitudinal direction. In this adhesive...  
WO/2016/158604A1
The objective of the present invention is to provide: a near-infrared shielding film which has low initial haze and is suppressed in increase of the haze in a weather resistance test; a method for producing this near-infrared shielding f...  
WO/2016/157631A1
The purpose of the present invention is to improve the adhesiveness and tight adhesion of a composite material to substrates such as copper, silver, aluminum, silicon, and ferrite by compositing a low-melting-point glass which is used fo...  
WO/2016/158727A1
The present invention provides: a sheet for forming a resin film, which has excellent reworkability and is bonded to a silicon wafer to form a resin film on the silicon wafer, and wherein a surface (α) of the sheet, said surface being b...  
WO/2016/158411A1
A polyvinyl chloride (PVC) adhesive tape is provided which is not prone to cracking at low temperatures even when the PVC film is thin. This adhesive tape includes a PVC film and an adhesive layer arranged on at least one surface of said...  
WO/2016/158268A1
An adhesive composition sheet which comprises organic compounds and inorganic particles, the adhesive composition sheet comprising a structure obtained by superposing at least one layer A comprising an organic compound and at least one l...  
WO/2016/157594A1
Provided are: a sheet-like joining material which is used in cases such as when an electronic component provided with electrodes is to be mounted on a circuit board, exhibits excellent handling properties, and is capable of achieving rel...  
WO/2016/157644A1
[Problem] To provide a means for preventing blocking in adhesive resin pellets, which are used in adhesives. Further, to provide a means for preventing blocking in adhesive resin pellets which are more adhesive and are used in adhesive t...  
WO/2016/152385A1
This anisotropically conductive film connects a terminal of a first electronic component and a terminal of a second electronic component in an anisotropically conductive manner, and is characterized by containing at least conductive part...  
WO/2016/152919A1
[Problem] To provide a semiconductor processing tape which has excellent pick-up properties and in which the thermal shrinkage rate in a tape shrinkage process is low, wrinkles do not occur, and kerf width extends sufficiently without di...  
WO/2016/152631A1
[Problem] To provide a coating film protective film which exhibits high fouling prevention performance, while having high followability to curved surfaces. [Solution] A coating film protective film which has (a) a coating layer that is o...  
WO/2016/152598A1
A kit which can suppress residue from a temporary adhesive in semiconductor manufacturing, and a laminate body are provided. This kit for semiconductor device manufacture is provided with a composition containing a solvent A, a compositi...  
WO/2016/151911A1
A semiconductor processing sheet 1 has a 100% strength of 3-14 N/15 mm and a recovery of 75-100%. A method for manufacturing a semiconductor device includes a step for preparing a semiconductor processing sheet 1 in which a plurality of ...  
WO/2016/152543A1
[Problem] To provide: a novel and improved anisotropic conductive connection structure which is able to be produced by a simple process and has high reliability; an anisotropic conductive connection method; and an anisotropic conductive ...  
WO/2016/152271A1
The present invention is a resin composition used to seal an interface between an adherend and a semiconductor element that is flipchip-bonded to the adherend, wherein the resin composition contains a radical reactive compound, a thermop...  
WO/2016/152599A1
A laminate body, a temporary adhesive composition and a temporary adhesion film are provided which can make warpage less prone to occur even when a wafer is thin. This laminate body comprises, in order and adjacent to each other, a first...  
WO/2016/152787A1
A double-sided adhesive tape provided with various properties needed as characteristics of double-sided adhesive tape, such as adhesive strength, even when the width of the tape is reduced, has a substrate film 2, a first adhesive layer ...  
WO/2016/152762A1
Provided are a surface-treated calcium carbonate filler useful in a curable resin, for imparting performance having excellent heat resistance, color fastness, strength, and elongation, and a curable resin composition containing the fille...  
WO/2016/148110A1
The present invention provides an adhesive tape for semiconductor processing, which does not leave adhesive residue when the adhesive tape for semiconductor processing is removed from a wafer surface after back polishing, especially in a...  
WO/2016/143623A1
The invention is an adhesive sheet provided with an adhesive layer that is used for direct or indirect adhesion onto an optical semiconductor element. A curve obtained by dynamic viscoelasticity measurements on the adhesive layer under t...  
WO/2016/143711A1
The present invention provides an adhesive tape for protecting the surface of a semiconductor wafer, the adhesive tape being constituted from a base material film, an intermediate resin layer, and an adhesive layer, wherein: the base mat...  
WO/2016/142966A1
This adhesive sheet is an adhesive sheet for bonding an unvulcanized rubber to a metal, and is provided with: a mold release film which is composed of a first film layer formed from a polypropylene and a second film layer formed from a p...  
WO/2016/144515A1
Compositions are provided that include a coating and porous polymeric particles disposed in the coating. Adhesive articles are also provided including a substrate and a composition disposed on a first major surface of the substrate. The ...  
WO/2016/140248A1
A film-like adhesive composite sheet which is provided with: a supporting sheet having a base; and a curable film-like adhesive that is provided on the supporting sheet and has a thickness of 1-50 μm. The peel strength at the interface ...  
WO/2016/139840A1
A dicing sheet 10 which is provided with a base 3, an intermediate layer 2 that is provided on one surface of the base 3, and an adhesive layer 1 that is provided on the intermediate layer 2, and wherein: the adhesive layer 1 contains a ...  
WO/2016/140196A1
The conduction paste comprises an adhesive and conductive particles that enable conduction between electrodes, wherein the coefficient of variation for the conductive particle diameter dimension is 25% or less. The average particle diame...  
WO/2016/136774A1
[Problem] To provide a film-like adhesive agent and an adhesive sheet which are suitable for a breaking method with a heated gas. [Solution] The film-like adhesive agent according to the present invention comprises a polymer component (A...  
WO/2016/136800A1
The present invention provides an adhesive cleaner capable of sufficiently removing oily solid debris and aqueous solid debris. The present invention provides an adhesive cleaner equipped with a capturing member for capturing matter to b...  
WO/2016/136710A1
Provided is an adhesive composition for forming an adhesive layer which is excellent in stress relaxation properties and durability, and has a sufficiently low haze value. Further, provided is an adhesive layer formed out of the adhesive...  
WO/2016/136759A1
This release agent composition comprises a polyester resin (A) and an acrylic polymer (B), wherein: the acrylic polymer (B) includes structural formula (1) as a structural unit; and the ratio (A):(B) between the blending amount of said p...  
WO/2016/136436A1
The purpose of the present invention is to provide a pressure-sensitive adhesive film through which air bubbles trapped at the bonding interface upon application of the pressure-sensitive adhesive film are apt to disappear at ordinary te...  
WO/2016/133104A1
Provided is a core-shell particle mixture: which comprises first core-shell particles configured from first cores containing a first substance and first shells covering the first cores and second core-shell particles configured from seco...  

Matches 1 - 50 out of 18,200