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Patent Searching and Data


Matches 1 - 50 out of 18,673

Document Document Title
WO/2017/048890A1
Curable silicone pressure sensitive adhesive compositions and films suitable for sealing and adhering substrates for optically clear electronic devices are described. The curable silicone pressure sensitive adhesive compositions are suit...  
WO/2017/047600A1
The present invention is a film for plastic restoration with which a plastic that has deteriorated in transparency can be easily made to recover the transparency. The film for plastic restoration according to the present invention compri...  
WO/2017/047389A1
[Problem] To provide an adhesive film structure, an adhesive film accommodating body, and a method for temporarily adhering an adhesive film structure, with which the efficiency of a temporary adhesion step can be improved. [Solution] An...  
WO/2017/047281A1
Provided are: a functional film; and an aircraft window structure. This functional film (100) is sequentially provided, on a first main surface of a transparent film base (10), with a functional thin film (20) that is composed of a lamin...  
WO/2017/046855A1
This adhesive tape for semiconductor wafer processing has a radiation curable adhesive agent layer above a base material film. This adhesive tape for semiconductor wafer processing is to be used in a step whereby a semiconductor wafer th...  
WO/2017/047452A1
Provided is an alumina-based heat conductive oxide which has not only excellent thermal conductivity but also excellent chemical resistance, water resistance and electrical insulation properties, while having good kneadability (miscibili...  
WO/2017/047183A1
The purpose of the present invention is to provide a protective film for a semiconductor, with which it is possible to prevent warpage of semiconductor wafers and semiconductor chips and to prevent chipping and reflow cracking from occur...  
WO/2017/043283A1
A metal panel reinforcement material that comprises a resin composition, said resin composition at least comprising a plastic component for a curable crosslinked polymer matrix, a curing agent for the plastic component, a curing accelera...  
WO/2017/043256A1
Provided is a composition which includes: powdered silver in which grain distribution of primary particles has a first peak in a particle size range of 20 to 70 nm and a second peak in a particle size range of 200 to 500 nm, in which 50%...  
WO/2017/043173A1
The pressure-sensitive adhesive composition according to the present invention comprises (A) a polymer including a structural unit having a hydroxy group in a side chain, (B) a compound having two or more isocyanate groups, (C) a bismuth...  
WO/2017/038916A1
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising: a substrate (11) having a first surface (11a) and a second surface (11b) on the op...  
WO/2017/038913A1
Disclosed is an adhesive sheet (10) used in a semiconductor device production process involving: a step for attaching, to said adhesive sheet (10), a frame member (20) having a plurality of openings (21) formed therein, said adhesive she...  
WO/2017/037951A1
The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) a radical-polymerizable compound, (c) a free-radical polymerization initiator, and (d) an epoxy resin containing no (meth)acryloyloxy...  
WO/2017/038922A1
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12). The surface free energy of the a...  
WO/2017/038920A1
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12) including an adhesive agent. When...  
WO/2017/038921A1
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12). The surface free energy of the a...  
WO/2017/037170A1
The present patent application relates to a method for gluing two adjacent substrates together by using a radiation curable adhesive composition and a use of a radiation curable adhesive composition for gluing. In particular, the method ...  
WO/2017/038199A1
To provide: a rubber composition which enables the achievement of a cement having excellent solubility in a solvent and excellent tack properties, while having high adhesive power; a cement composition; and a hose for liquid transportati...  
WO/2017/038918A1
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12). A value found for the adhesive a...  
WO/2017/038530A1
A display sheet to be installed on a road surface, a floor surface or a wall surface, which sequentially comprises in the following order: an adhesive layer for installation having a thickness of 50 μm or more; a base that is obtained b...  
WO/2017/033935A1
Provided is an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and minimize migration and keep the connection resistance low even when the electrode width...  
WO/2017/033933A1
Provided is an electroconductive material in which solder can be selectively disposed in the electroconductive particles on an electrode without an inorganic filler excessively inhibiting the movement of the solder, electroconductivity c...  
WO/2017/033705A1
This one-surface-protected polarizing film comprises a polarizer and a protective film disposed over only one surface thereof, and has a transparent resin layer disposed on at least one surface of the polarizer. The protective film has b...  
WO/2017/033824A1
This adhesive water vapor barrier laminate comprises a base and an adhesive layer arranged on the base; and the adhesive layer is obtained from an adhesive composition that contains a component (A), a component (B) and a component (C).  
WO/2017/033930A1
[Problem] To provide an electroconductive material with which it is possible to suppress the occurrence of black soot in a cured object, selectively dispose solder in electroconductive particles on an electrode, and improve electroconduc...  
WO/2017/033274A1
A pressure-sensitive adhesive tape which comprises a substrate and a pressure-sensitive adhesive layer disposed on one or both surfaces thereof, characterized in that the substrate comprises 30 mass% or more ethylene/vinyl acetate copoly...  
WO/2017/029917A1
Provided is an adhesive composition that is highly adhesive not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, ensures a high solder heat resistance ...  
WO/2017/025787A1
The present invention pertains to a hot-melt adhesive resin film having excellent adhesive force and durability with respect to metal as well as glass, plastic, and other various types of bodies to be adhered to, and a production method ...  
WO/2017/022640A1
The objective of the present invention is to provide: a printing ink composition for laminates, which is capable of exhibiting good color developability and easy tearability; and an easily tearable laminate which is obtained by applying ...  
WO/2017/022500A1
This method for adhesion-fixing an optical assembly comprises forming an optical assembly by adhesion-fixing a plurality of assembly constituent components including an assembly constituent component having an optical component, the meth...  
WO/2017/022822A1
This cutting auxiliary lubricant includes a high molecular weight compound (A) having a weight average molecular weight of 5×104 to 1×106, a medium molecular weight compound (B) having a weight average molecular weight of 1×103 or mor...  
WO/2017/022786A1
A pressure-sensitive adhesive film which comprises a base film and a pressure-sensitive adhesive layer disposed on one surface of the base film, wherein the back surface (surface on which the pressure-sensitive adhesive layer has not bee...  
WO/2017/022523A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing...  
WO/2017/018135A1
Provided is a release film which comprises: a substrate including a plurality of linear asperities extending in one direction on the surface thereof; and a release layer provided on the surface of the substrate. When measured with a peel...  
WO/2017/013803A1
The purpose of the present invention is to provide a rubber composition from which a rubber layer with excellent adhesiveness to a metal surface may be obtained, and to provide a rubber composition metal laminate and a vulcanized rubber ...  
WO/2017/014088A1
GFD-type layer structures having transparent conductive layers formed on both surfaces of one substrate are used as one type of sensor layer structure for a capacitance-type touch panel. In order to sufficiently suppress internal reflect...  
WO/2017/014242A1
Provided is an easily and inexpensively producible polarizing film laminate containing an adhesive layer and capable of effectively suppressing internal reflection when used in an image display panel. By forming a refractive index-adjust...  
WO/2017/013914A1
Provided is an adhesion technique for delaminating a material of interest while satisfying the requirements for the reliability assurance temperature for the material, with a view to reproduce the material. A double-sided adhesive tape c...  
WO/2017/014090A1
When providing adhesive sheets having refractive index-adjusting sections and having PET separators adhered to both surfaces thereof, distinguishing the front and the rear of the adhesive sheet from one another is difficult. To address t...  
WO/2017/014089A1
When providing adhesive sheets having refractive index-adjusting sections and having PET separators adhered to both surfaces thereof, distinguishing the front and the rear of the adhesive sheet from one another is difficult. To address t...  
WO/2017/014243A1
Provided is an easily and inexpensively producible adhesive sheet containing an adhesive layer and capable of effectively suppressing internal reflection when used in the joining of an optical member laminate. A polarizing film laminate ...  
WO/2017/013798A1
The purpose of the present invention is to provide a rubber composition from which a rubber layer with excellent adhesiveness to a metal surface may be obtained, and to provide a rubber composition metal laminate and a vulcanized rubber ...  
WO/2017/013717A1
Provided are: a surface protection film whereby display light from a display panel is effectively transmitted and an image can be stably displayed, whereas outside light is efficiently reflected and a mirror state can be stably assumed i...  
WO2017010101A1
Provided are: a conductive adhesive sheet (3) having a conductive adhesive layer (2) that has good temporary bonding properties, good bonding strength to a reinforcing plate, and good conductivity, while being less susceptible to blockin...  
WO2017010352A1
A decorative sheet according to one aspect of the present disclosure includes: a decorative plate; and an adhesive layer provided on one side of the decorative plate. The decorative plate includes: (A) a decorative layer positioned on a ...  
WO2017010225A1
Provided is a curable adhesive composition for a polarizing film that is for adhering a transparent protective film to at least one surface of a polarizer, said curable adhesive composition for a polarizing film containing: an active ene...  
WO/2017/006799A1
[Problem] To provide an adhesive composition that is flexible and that realizes exceptional adhesion durability. [Means for solving problem] Provided is an adhesive composition containing (a) a 2-cyanoacrylic acid ester, (b) a polymer ha...  
WO/2017/006549A1
The purpose of the present invention is to provide a semiconductor wafer surface protection film that can be affixed so as to conform satisfactorily with irregularities on the circuit formation surface of a semiconductor wafer and inhibi...  
WO/2017/006460A1
Provided are: a thermoconductive member that has a combination of properties including (A) having high thermoconductivity, (B) adaptability to the irregularities in the surface of an electronic component and the surface of a heat-dissipa...  
WO/2017/002741A1
The present invention provides a film bonding device that enables a film bonding method by which intrusion of foreign matter and air bubbles in a bonding surface can be prevented even in a case where the bonding process is performed in a...  

Matches 1 - 50 out of 18,673