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Matches 1 - 50 out of 15,970

Document Document Title
WO/2015/111577A1
 The present invention pertains to a curable composition containing an organic polymer (A) containing reactive silicon groups and a conjugate (B) of kaolinite and quartz. This curable composition has high environmental compatibility an...  
WO/2015/111436A1
The purpose of the present invention is to provide an adhesive sheet capable of being affixed such that no air bubbles are easily formed in a bonding interface with an adherend. In the adhesive sheet (AS) which has one surface, another s...  
WO/2015/111632A1
Provided is a sheet (2) for forming a protective membrane, said sheet comprising: a protective-membrane-forming film (1) characterized in that the light transmittance thereof at a wavelength of 1600nm of 72% or more, and the light transm...  
WO/2015/111599A1
Provided are a connection body production method and an electronic component connection method such that electronic components are connected at a low temperature using a photo-curing adhesive and poor electronic component connections are...  
WO/2015/111738A1
Provided are: a film-shaped adhesive whereby a semiconductor element can easily be sealed by affixing the film-shaped adhesive to the semiconductor element, and whereby the semiconductor element can be sealed by a cured product having ex...  
WO/2015/108063A1
 Provided is an activation energy beam-curable adhesive having improved water resistance. The adhesive includes an activation energy beam-curable component, and a polyrotaxane, the polyrotaxane having an activation energy beam-polymeri...  
WO/2015/108160A1
Provided is an adhesive agent sheet which can be produced readily at low cost, and which contains an adhesive agent layer that can effectively prevent the occurrence of internal reflection when used for the bonding of optical member lami...  
WO/2015/104988A1
Provided are: a conductive film-like adhesive which is capable of suppressing migration and enables the production of a highly reliable semiconductor device; and a dicing tape with a film-like adhesive. The present invention is a conduct...  
WO/2015/104986A1
Provided are: a film-like adhesive having excellent conductivity; and a dicing tape with a film-like adhesive. The present invention relates to a film-like adhesive which contains conductive particles having a specific shape. Examples of...  
WO/2015/104987A1
Disclosed is a film-like conductive adhesive to be used in a semiconductor device manufacturing method that includes: a step for die-bonding, via the film-like conductive adhesive, a semiconductor chip on a body on which the semiconducto...  
WO/2015/102978A1
Provided herein are compositions having a good balance between the curing speed, transparency, tackiness and/or melt viscosity thereof. In one aspect, there are provided compositions containing nano-particulate filler and the use thereof...  
WO/2015/099022A1
This laminated polarizing film comprises a polarizing film and a non-polarizer optical film laminated together with a low-modulus-adhesive layer (a) interposed therebetween. The polarizing film comprises a polarizer, at least one surface...  
WO/2015/098983A1
 Provided is a double-sided adhesive tape for fastening aircraft components, which has an exceptional balance of hand-cuttability, flame retardance, and peelability. This double-sided adhesive tape has adhesive layers placed on both si...  
WO/2015/098949A1
This film for temporary fixing is used in a processing method for a semiconductor wafer, said method comprising: a temporary fixing step wherein a semiconductor wafer is temporarily fixed to a supporting body with this film for temporary...  
WO/2015/098998A1
Provided is a curable composition which contains: (A) 100 parts by weight of an organic polymer which has a silicon-containing group and can be cross-linked by forming siloxane bonds; (B) 21-300 parts by weight of a diester compound obta...  
WO/2015/095118A1
A solid thermoplastic semi-crystalline friction-activated adhesive composition comprising the mixture of: (a) from about 50 to about 100 parts by weight of a semi-crystalline adhesive polymer that comprises: (1) crystalline monomer havin...  
WO/2015/093517A1
Disclosed is an aqueous emulsion containing a polymer component containing at least one polymer (1) selected from the group consisting of polymer (A) and polymer (B), and a photopolymerization initiator and/or an aromatic polyisocyanate....  
WO/2015/093597A1
Provided are highly reliable silver-coated conductive particles, which are prevented from the occurrence of migration. A tin layer is formed on the surface of each spherical base particle, and a silver plating layer is formed on the surf...  
WO/2015/088021A1
 Provided is a curable composition containing an organic polymer having a crosslinkable silicon group, the composition having sufficient usable life and having adhesive properties with respect to an adherend (substrate) that are equal ...  
WO/2015/087971A1
 This adhesive composition includes silver particles containing silver atoms, zinc particles containing metallic zinc, and a thermosetting resin.  
WO/2015/087955A1
A thermoplastic elastomer composition comprising: 100 parts by mass of a hydrogenated block copolymer (A) which comprises a polymer block (a) comprising a structure unit derived from an aromatic vinyl compound and a polymer block (b) com...  
WO/2015/083306A1
Provided is an anisotropic conductive adhesive which, when manufacturing a light-emitting device involving flip-chip mounting of a light-emitting element such as a light-emitting diode (LED) to a wiring board using an anisotropic conduct...  
WO/2015/080536A1
The present application relates to an adhesive composition, a protective film, an optical laminate, a polarizing plate, and a display device. In the present application, an adhesive composition may be provided which has good overall phys...  
WO/2015/079897A1
The main purpose of the present invention is to provide a window film which is excellent in terms of weatherability and durability. The purpose is accomplished by providing a window film characterized in that a first adhesive layer conta...  
WO/2015/079862A1
The present invention provides: an adhesive film for touch panels, which is equipped with an adhesive layer that can prevent the occurrence of malfunction of a capacitive touch panel under an environment having a temperature falling with...  
WO/2015/079918A1
 To provide an aqueous dispersion composition containing a modified polyolefin, the aqueous dispersion composition having good adhesion and water resistance, and the viscosity thereof being constant and in a range of 500 mPa∙s or les...  
WO/2015/080188A1
 Provided is a semiconductor-processing pressure-sensitive adhesive tape provided with strong adhesion necessary when physical/mechanical peeling of a support member is to be performed, in which even if a washing fluid for washing away...  
WO/2015/076087A1
The present invention provides a capacitive touch panel which is not prone to operation errors in a wide range of temperature environments from low temperatures to high temperatures. This capacitive touch panel comprises, in the followin...  
WO/2015/076548A1
The present application relates to an adhesive composition, an optical laminate, a polarizing plate and a display device. The present application can provide an adhesive composition having excellent cohesive force or a stress relaxation ...  
WO/2015/076205A1
[Problem] To provide a method for bonding hydrogels to each other with a hydrogel-forming composition interposed between the gel surface to be bonded of one hydrogel and that of the other. [Solution] A method for bonding hydrogels to eac...  
WO/2015/076236A1
The purpose of the present invention is to provide an adhesive film for semiconductor bonding which, when laminated to a wafer surface and diced along a scribe line (dicing line), is less apt to peel off at the interface between the adhe...  
WO/2015/072268A1
Provided is a method for manufacturing a polarizing plate including a polarizing film and a first protective film, using a polarizing plate manufacturing device including a film conveyance path which passes through a bonding section and ...  
WO/2015/068611A1
 This electroconductive adhesive includes a thermosetting resin (A) having a carboxyl group, an epoxy resin (B), an elastomer (C) having a reactive functional group, an electroconductive filler (D), and a curing agent (E). Through this...  
WO/2015/068691A1
This invention discloses a solar-cell sealing material and an adhesive film containing a sealing resin, a silane coupling agent, and a basic compound having a pKb between 5 and 12, inclusive. This invention also discloses a solar-cell mo...  
WO/2015/064574A1
[Problem] To provide a semiconductor bonding adhesive sheet in which a protruding electrode such as a bump electrode can be embedded, thereby achieving excellent backside grinding properties. [Solution] This semiconductor bonding adhesiv...  
WO/2015/064323A1
The present invention provides a microcapsule-type curable resin composition which enables the mass production of microcapsules each encapsulating a curing agent and therefore can be produced at significantly low cost, and which has an e...  
WO/2015/060177A1
Provided is a novel transparent adhesive material capable of uniformly diffusing light even if light guide plates and so forth, which are designed considering the difference in refractive indexes of the air layer interface, are brought i...  
WO/2015/054822A1
Provided is a waterborne adhesive composition comprising (i) an aqueous medium; (ii) one or more isocyanate compounds dispersed in said aqueous medium, and (iii) one or more functional silane compounds dispersed in said aqueous medium.  
WO/2015/056499A1
Provided is an adhesive sheet that makes it possible to maintain the characteristics required thereof while reducing the amount of greenhouse gas emissions. The adhesive sheet is provided with a substrate and an adhesive layer that is pr...  
WO/2015/056467A1
[Problem] To provide an adhesive sheet exhibiting curved-surface following properties and chemical resistance. [Solution] This adhesive sheet is provided with at least a base material and an adhesive agent layer. The load on the base mat...  
WO/2015/056754A1
The purpose of the present invention is to provide an anisotropic conductive adhesive that makes it possible to obtain excellent heat dissipation properties and connection reliability. In this anisotropic conductive adhesive (30), conduc...  
WO/2015/056512A1
 This electrical connection material for an anisotropically-conductive film or the like minimizes the occurrence of warp in the electrical connection parts such as anisotropically-conductive connection parts, and moreover does not dimi...  
WO/2015/054821A1
Provided is a waterborne adhesive composition comprising (i) an aqueous medium; (ii) one or more isocyanate compounds dispersed in said aqueous medium, and (iii) one or more functional silane compounds dispersed in said aqueous medium. A...  
WO/2015/053261A1
The present invention provides: a touch-panel adhesive film provided with an adhesive layer which exhibits little change in adhesive strength over time and excellent step-following properties, and with which the occurrence of malfunction...  
WO/2015/053303A1
This invention provides a pressure-sensitive adhesive sheet for conveying an electrolyte membrane. When processing a membrane electrode assembly (MEA), said pressure-sensitive adhesive sheet can contribute to making it easier to handle a...  
WO/2015/053041A1
The present invention is intended to solve the problem of providing an adhesive tape that adheres excellently to a foam material, that suppresses the occurrence of tears, etc. in a mold release liner when the mold release liner is remove...  
WO/2015/053304A1
This invention provides a method for manufacturing a fuel-cell membrane electrode assembly. Said method makes it easy to handle a polymer electrolyte membrane, prevents deformation and wrinkling of said polymer electrolyte membrane, and ...  
WO/2015/053223A1
Provided are: an adhesive agent which can exert strong adhesiveness and can adhere and fix an object of interest even under a high-temperature environment during a period in which fixing is needed, and can be removed without damaging the...  
WO/2015/052859A1
The present invention is a room temperature curing resin composition which comprises a phosphazene backbone-containing organic silicon compound represented by general formula (1). Accordingly, a room temperature curing resin is provided ...  
WO/2015/045945A1
The present invention addresses the problem of providing: a modified sheet-like inorganic compound which is produced by a surface treatment with a phosphonic acid or phosphoric acid derivative that enables the provision of a water vapor ...  

Matches 1 - 50 out of 15,970