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Patent Searching and Data


Matches 1 - 50 out of 10,445

Document Document Title
WO/2014/142151
[Problem] To provide a composite sheet for protective film formation, which has good holding power with respect to a jig such as a ring frame and excellent releasability at the time of pick-up, and which is capable of preventing defects ...  
WO/2014/142085
An adhesive sheet (1) is provided with a base material (2), and an adhesive agent layer (3) provided to one main-surface side of the base material (2). The adhesive agent layer (3) is formed from an adhesive agent composition including: ...  
WO/2014/142194
Provided is an adhesive sheet which can prevent the occurrence of defects when cutting microcomponents such as electronic components. This adhesive sheet is provided with an adhesive layer and a resin layer disposed on one side of the ad...  
WO/2014/142192
Provided is an adhesive sheet which is able to realize excellent cutting precision and a reduction in cutting debris when cutting microcomponents such as electronic components. This adhesive sheet is provided with an adhesive layer which...  
WO/2014/142054
The purpose of the present invention is to provide an adhesive film which is provided with an adhesive layer, and with which malfunction of a capacitance-type touch panel can be inhibited under an environment having a broad temperature r...  
WO/2014/137065
Disclosed are an anti-scattering film with excellent optical and scratch-resistant properties and a method for manufacturing the same. The anti-scattering film according to the present invention comprises: a transparent film; and a hard ...  
WO/2014/136606
An adhesive sheet provided with a conductive adhesive layer, for realizing electrical conductivity or thermal conductivity in at least a thickness direction, the conductive adhesive layer having a conduction part continuous in the thickn...  
WO/2014/136777
A pressure-sensitive adhesive tape for processing semiconductor wafers. Said pressure-sensitive adhesive tape has a pressure-sensitive adhesive layer on a base sheet, and if said base sheet is compressed at 1 mm/min in the thickness dire...  
WO/2014/136767
Provided is a double-faced adhesive tape that is for securing electronic device members, has excellent adhesiveness, retention, and resistance to resilience, and can be manufactured even with a plant-derived material having a high biomas...  
WO/2014/136484
An apparatus (1) is provided with: a supporting base material (12) that supports an element (11); a heat dissipating member (13) having the supporting base material (12) disposed thereon; and an adhesive layer (14) that is disposed betwe...  
WO/2014/132764
The purpose of the present invention is to provide: a lamination method with which high membrane thickness precision can be obtained by reducing variations in substrate membrane thickness, the method being highly versatile and capable of...  
WO/2014/132334
Provided is an adhesive that causes thermosetting resins and thermoplastic resins to heat efficiently and improves the adhesion of the adhesive to a resin or other such non-magnetic or insulating material, when bonding is performed using...  
WO/2014/129260
The present invention addresses the problem of providing a polarization plate comprising a cation-polymerizable adhesive exhibiting superior curability even when using a protective film including a urethane primer layer. The present inve...  
WO/2014/129395
Provided is a light emitting device, light radiated from which has high intensity. A blue LED chip (20) that has a peak of emitted light within the range of from 360 nm to 500 nm (inclusive) is bonded to an electrode substrate (11) by me...  
WO/2014/129325
Provided is an underfill sheet capable of favorably filling an unevenly profiled circuit surface of a semiconductor element, favorably connecting the terminal of the semiconductor element with the terminal of an object onto which the sem...  
WO/2014/126096
Provided is a pressure-sensitive adhesive tape for use in semiconductor processing. This pressure-sensitive adhesive tape is a dicing tape which exhibits such an adhesive force that can inhibit the scattering of chips in dicing and which...  
WO/2014/125914
Provided is an optical member which has the excellent effect of being prevented from corroding, while retaining adhesion reliability and transparency to a high degree. A pressure-sensitive adhesive composition and a pressure-sensitive ad...  
WO/2014/118266
A dendritic or hyperbranched polymer comprising a plurality of branches, wherein at least one of the branches comprises at least one catechol moiety that is oxidisible to a semiquinone moiety and/or a quinone moiety.  
WO/2014/119426
[Problem] To provide a multilayer adhesive sheet having good resistance to solvents, surface slipperiness, and ability to follow curved surfaces. [Solution] This multilayer adhesive sheet has at least a surface protection layer, a substr...  
WO/2014/119357
[Problem] To provide a multilayer adhesive sheet having good ability to follow curved surfaces, and excellent affixing workability. [Solution] This multilayer adhesive sheet has at least a surface protection layer, a substrate layer and ...  
WO/2014/119417
Provided are: a sealing film which comprises a polar group and still has water repellency, and which firmly adheres to an element for organic electronic devices even if heated at low temperatures and has a function of protecting the elem...  
WO/2014/118878
Disclosed are: a flame-retardant adhesive tape comprising a base and a flame-retardant adhesive agent layer formed on one surface of the base and comprising an adhesive agent base polymer, a flame retardant agent of a melamine salt compo...  
WO/2014/119565
The purpose of the present invention is to provide: a sealing material of a near-infrared ray irradiation type, which can adhere a member composed of a resin, a glass or the like satisfactorily upon the irradiation with near-infrared ray...  
WO/2014/119547
Provided is an adhesive film which has excellent adhesion even to a nonpolar surface and a method for manufacturing electronic components using the same. An adhesive film which has a first layer (11) that comprises a thermosetting resin ...  
WO/2014/115468
Provided is a base material particle that, when electrically connecting electrodes using conductive particles having a conductive layer formed at the surface thereof, can reduce connection resistance and can suppress connection defects r...  
WO/2014/115639
Provided are the following: an optical-member adhesive composition which contains an adhesive material, reactive modified metal oxide particles having a volume average particle diameter of 1-500 nm, and organic light-diffusing particles,...  
WO/2014/115343
Provided are: a low cost resin paste composition that is suitably used for adhering conductor elements such as semiconductor chips and the like to a supporting member such as a lead frame or the like, that reduces the usage of silver whi...  
WO/2014/112621
The present invention provides an oxygen-absorbing film having an oxygen-absorbing adhesive agent layer comprising an oxygen-absorbing adhesive agent resin composition, wherein the oxygen-absorbing adhesive agent layer has at least two g...  
WO/2014/112165
Provided are: a heat-curable composition having an excellent adhesion property and excellent storage stability; and a laminated structure produced using the composition. A heat-curable composition characterized by comprising (A) a blocke...  
WO/2014/103327
This thermally conductive pressure-sensitive adhesive sheet contains the following: a thermally conductive sheet that contains a thermally conductive filler and a fluorine resin; and a pressure-sensitive adhesive layer or layers, provide...  
WO/2014/097757
Provided is a base-less double-sided adhesive sheet, which can exhibit good antistatic performance and releasability when used as, for example, a member for a capacitive touch panel, and in which release films contained therein have olig...  
WO/2014/098069
The present invention provides a resin composition for use as a vapor-barrier adhesive. Said resin composition is obtained by reacting a polyol with a hardener, and either the polyol or the hardener has tricycloalkane structures that con...  
WO/2014/091512
This patent application concerns the fabrication, composition and properties of new plastic materials containing two components, A and B; said A is a polymer obtained by synthesis from reagents derived from fossil sources, such as polyet...  
WO/2014/093141
Methods of forming an adhesive composition including the steps of (a) combining a non-deaerated mixture comprising at least one free radically (co)polymerizable ethylenically-unsaturated material with a sealable packaging, wherein the pa...  
WO/2014/091863
This optical film with adhesive on both sides comprises: an optical film, further comprising a polarizing sheet; a first adhesive layer which is disposed on a face of the optical film which is a side which is pasted upon an image display...  
WO/2014/091966
Provided is an adhesive composition having high shear bond strength, peel bond strength, and impact bond strength, and in particular one able to form a cured article having outstanding bond strength resistance to cold/hot cycles. The adh...  
WO/2014/088095
Provided is a conductive material which forms a connection part that is not susceptible to voids in cases where electrodes of members to be connected are electrically connected with each other, and which is capable of increasing the conn...  
WO/2014/084069
An adhesive which contains a product of condensation of a cellulose derivative with a polysiloxane having at least one kind of substituent selected from the group consisting of hydroxyl group and alkoxyl groups.  
WO/2014/084357
[Problem] To improve the adhesion between a resin film-forming layer, which serves as a precursor of an adhesive film or protective film, or a cured resin film obtained therefrom and a semiconductor chip or semiconductor wafer that is an...  
WO/2014/083875
The present invention relates to an electroconductive film (including electromagnetic wave shielding films) and provides a novel electroconductive film that not only has excellent conductivity but also is capable of increased adhesivenes...  
WO/2014/084173
Provided is a conductive particle with insulating particles, which is able to be efficiently arranged on an electrode. A conductive particle (1) with insulating particles according to the present invention is provided with: a conductive ...  
WO/2014/083872
[Problem] To provide a sheet having excellent bondability, which is capable of imparting a semiconductor device that is obtained using the sheet with heat dissipation characteristics without having a semiconductor wafer or chip subjected...  
WO/2014/080954
To provide: an adhesive composition for skin whereby an adhesive for skin can be obtained that can be readily coated and which has good aggregability; an adhesive for skin obtained using said adhesive composition for skin; and an adhesiv...  
WO/2014/078071
A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow mic...  
WO/2014/077115
The present invention addresses the problem of providing an easily peelable adhesive agent which is adhesive at high temperatures and non-adhesive at low temperatures, and an easily peelable adhesive material using this adhesive agent. T...  
WO/2014/073316
Provided is a new double-sided adhesive sheet for an image display device which can be firmly laminated onto a surface without a gap even when the surface on which the adhesive sheet is to be laminated has a step difference due to printi...  
WO/2014/069353
Provided is a highly reliable semiconductor device which exhibits excellent heat dissipation performance of a heat-generating element and solves the problem of decrease in the bonding strength between the heat-generating element and a su...  
WO/2014/069542
A laminated body with good reworkability is provided. The laminated body is bonded to an adherend and used. The laminated body comprises, in order from an adherend side, a first adhesive layer, a first substrate layer, a second adhesive ...  
WO/2014/065247
A production method for a transparent surface material having an adhesive layer, comprising: a step in which a frame-shaped film is laminated upon the upper surface of each of a plurality of transparent surface materials as same are bein...  
WO/2014/065350
The purpose of the present invention is to provide an active energy ray-curable adhesive composition which exhibits excellent heat resistance, film hardness and adhesion after being irradiated with an active energy ray. An active energy ...  

Matches 1 - 50 out of 10,445