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Patent Searching and Data


Matches 1 - 50 out of 10,223

Document Document Title
WO/2014/054701
 Provided is a self-adhesive surface protection film which exhibits strong adhesion to a body to be covered, with which the adhesive film is stored in a rolled state while being usable with various bodies to be covered, which is not su...  
WO/2014/053271
The invention relates to an aqueous composition comprising (A) a water-soluble or water-dispersible binder, or a water-soluble or water-dispersible constituent comprising carboxyl groups, and (B) at least one cyclic hydroxyalkyl amide.  
WO/2014/054409
Provided is a thermally restorable article, which has good embeddability during heat-shrinking and is capable of improving adhesion to the substrate being processed, and which is capable of reducing variations in the thickness of the adh...  
WO/2014/054618
The present invention relates to a silver hybrid copper powder which is characterized in that: a fine silver particle powder adheres to the surface of a copper powder; the ratio of the average particle diameter (D50) of the copper powder...  
WO/2014/051043
The present invention is characterized by containing conductive carbon, a water-soluble polymer, a particulate binder, and a dispersing medium, the water-soluble polymer being partially hydrolyzed and being an isobutylene-maleic anhydrid...  
WO/2014/050538
Provided are: a temporary adhesive for semiconductor device production that contains (A) a polymer compound that is substantially insoluble in an alkaline solution, and has a radical polymerizable group in a side chain, (B) a radical pol...  
WO/2014/051142
The purpose of the present invention is to provide an intermediate film for a laminated glass, the intermediate film being extremely transparent, wherein it is possible to prevent the occurrence of pests. Another purpose of the present i...  
WO/2014/050156
The present invention relates to a conductive composition containing a conductive metal powder and a resin component, wherein the conductive metal powder contains metal flakes and metal nanoparticles, and the resin component contains an ...  
WO/2014/050455
Provided are: a temporary adhesive for semiconductor device production that contains (A) a polymer compound having a thermal decomposition temperature of at least 250°C, and (B) a radical polymerizable monomer; an adhesive substrate tha...  
WO/2014/050763
Provided is a radiation-curing adhesive tape for dicing capable of easy pickup without any residual adhesive in the pickup step even for, e.g., a semiconductor chip on which a through electrode is provided. This radiation-curing adhesive...  
WO/2014/051106
An adhesive sheet in which a support substrate, an adhesive layer (X), a continuous-void-containing layer comprising a composition containing an adhesive and silica particles, and an adhesive layer (Y) are laminated in this order, swelli...  
WO/2014/050664
The present invention relates to a method for producing a laminated member formed by laminating multiple articles including at least one article having a heating allowable temperature of 80˚C or lower on each other, said method comprisi...  
WO/2014/045931
An anisotropic conductive film in which a terminal of first electronic component and a terminal of second electronic component are connected in an anisotropically conductive manner; wherein the anisotropic conductive film contains a crys...  
WO/2014/046093
Provided is an anisotropic conductive adhesive which is capable of achieving high heat dissipation performance. Conductive particles (31) and solder particles (32) are dispersed in a binder. In an LED package which is obtained by thermal...  
WO/2014/046053
An anisotropic conductive film produced by the anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component, said anisotropic conductive film comprising a conductive...  
WO/2014/046082
The purpose of the present invention is to reduce the occurrence of substrate warping after being connected in a connection using an anisotropic conductive film. An anisotropic conductive film (23) has a first insulating adhesive agent l...  
WO/2014/046102
This conductive sheet has a structure wherein a conductive adhesive layer is laminated on one surface of a base substrate and a light-blocking insulating layer is laminated on the other surface of the base substrate. A substrate which ha...  
WO/2014/046128
The aim of the present invention is to provide an adhesive for electronic components, which is easy to apply, maintains shape well after application, and with which voids can be minimized. Another aim of the present invention is to provi...  
WO/2014/041904
A method for manufacturing a laminate in which a transfer layer having an uneven shape is laminated on a transferred object, the method for manufacturing a laminate provided with an uneven shape including: a first step for obtaining a tr...  
WO/2014/038366
A flame-retardant laminate (10) having a base material (11) and a print receptive layer (12) laminated therein. The base material (11) has flame retardation equivalent to VTM-0. The print receptive layer (12) includes a resin and titaniu...  
WO/2014/038477
The present invention provides an anti-fouling treatment method for an underwater structure by using an anti-fouling adhesive tape, whereby it is possible to prevent peeling of the anti-fouling adhesive tape, the progression of the peeli...  
WO/2014/033770
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive comp...  
WO/2014/034100
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive comp...  
WO/2014/026906
The invention relates to multicomponent crosslinkable compositions (K) comprising at least one component (K1) and a component (K2), characterized in that component (K1) contains 100 parts by weight of compounds (A) of the formula: Y-[(CR...  
WO/2014/024829
The purpose of the present invention is to provide a processing method for a wafer that processes the wafer in a state in which the wafer is affixed to a support plate via an adhesive composition, and that achieves higher production effi...  
WO/2014/024678
The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the freq...  
WO/2014/021696
The present invention relates to an adhesive film and a product for encapsulating an organic electronic device using the same. The present invention maintains a moisture blocking capability by preventing moisture within a matrix resin fr...  
WO/2014/020868
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; 0.05-3 parts by mass of a (meth)acrylate polymer (B) having a weight average molecular ...  
WO/2014/021450
This film-like adhesive contains a binder resin (A), epoxy resin (B), hardener (C), and filler (D), wherein the total light transmittance in a D65 standard light source is 70% or higher and the haze value is 50% or lower. Provided are a ...  
WO/2014/020867
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; 0.05-3 parts by mass of a (meth)acrylate polymer (B) having a weight average molecular ...  
WO/2014/021687
The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for e...  
WO/2014/020878
One embodiment of the adhesive layer of the present invention contains a (meth)acrylate polymer having a weight average molecular weight of at least 1000 and less than 30,000, has an adhesive strength when 30 minutes have elapsed after p...  
WO/2014/020821
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; and 0.05-20 parts by mass of a (meth)acrylate polymer (B) having a weight average molec...  
WO/2014/017473
[Problem] To provide: a protective film-forming layer which exhibits excellent bonding strength to a chip even after exposure to severe wet heat conditions and a reflow process after storage of a certain period of time; a sheet for formi...  
WO/2014/016969
Provided is an adhesive capable of instantaneously fixing adherends together, capable of re-adhering adherends together, having excellent workability such as being capable of having sheet-shaped cut outs being made therefrom, does not pe...  
WO/2014/014011
Provided is a surface-treated heavy calcium carbonate useful for a film precisely controlling pore diameters or a polyester-based resin, etc., that is readily hydrolyzed; or a heavy calcium carbonate that is adequate with no preliminary ...  
WO/2014/014881
A composition and method of using the composition are described. The composition is useful for quickly bonding chlorinated polyvinylchloride during installation and repair operations. Embodiments of the composition include at least one v...  
WO/2014/013791
Provided is a surface protection sheet which has a balance between reworkability and protection function at high levels. A surface protection sheet (10) comprises a supporting base (1) and an adhesive layer (2) that is arranged on the su...  
WO/2014/011970
In one embodiment, a selectively-releasable adhesive includes a base adhesive compound and a releasing compound that is blended with the base adhesive compound, the releasing compound being capable of decreasing the adhesive strength of ...  
WO/2014/010627
Provided is a novel active energy ray-polymerizable resin composition which has excellent thermal resistance, wet heat resistance, thermal dimensional stability, weather resistance, and the like, can be favorably used in optical uses, co...  
WO/2014/010511
Provided is a manufacturing method for a polarizing plate in which a transparent film is laminated to one of both surfaces of a polarizing film. The method includes: an adhesive coating step in which an active energy ray-curable adhesive...  
WO/2014/007334
Provided is a conductive particle whereby, when electrically connecting electrodes with the conductive particle, connection resistance is lowered, and it is possible to increase connection reliability. A conductive particle according to ...  
WO/2014/007237
Provided are conductive particles with insulating particles, which are capable of increasing both conduction reliability and insulation reliability in cases where electrodes are connected with each other using the conductive particles wi...  
WO/2014/007238
Provided are conductive particles with insulating particles, which are capable of increasing insulation reliability in cases where electrodes are connected with each other using the conductive particles with insulating particles. Each co...  
WO/2014/006189
The invention relates to the use of an adhesive composition to provide a bonding in a wet environment. The invention also relates to a method for providing a bonding in a wet environment.  
WO/2013/191106
This adhesive tape comprises an adhesive layer on a foam substrate, the foam substrate having a thickness of 250 μm or less and an interlayer strength of 10 to 18 N/cm, and the adhesive layer having a thickness of 40 μm or less. The ad...  
WO/2013/191046
A thermally conductive adhesive composition containing an adhesive component and thermally conductive particles. The adhesive component contains high polymers and low polymers. The low polymer content is 1%-38% by mass relative to the to...  
WO/2013/191075
The purpose of the present invention is to provide: an amorphous inorganic anion exchanger that has excellent anion exchanging performance and rarely causes metals to corrode; and a production method which enables the production of an am...  
WO/2013/191045
A thermally conductive adhesive composition comprising: an adhesive component containing high polymers and low polymers; and thermally conductive particles. The gel fraction measured in the adhesive component is 28%-59% by mass and the t...  
WO/2013/186349
The invention relates to compounds containing silane groups, in particular in the form of polymers that contain silane groups, have low viscosity, and are suitable for elastic adhesives and sealants. The compounds can be obtained by reac...  

Matches 1 - 50 out of 10,223