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Matches 1 - 50 out of 15,404

Document Document Title
WO/2015/024773A1
The invention relates to cross-linkable masses (M), containing (A) 100 parts by weight of silane-cross-linking polymers of the formula (HO)x-Y- [O-CO-NH- (CR1 2)b-SiRa(OR2)3-a]2-x (I), with the stipulation that component (A) has less tha...  
WO/2015/025661A1
A sheet for sealing is for embedding a semiconductor chip, and is characterized in that the surface specific resistance value at at least one surface is 1.0 × 1012.  
WO/2015/019667A1
The purpose of the present invention is to provide a conductive bonding agent which is capable of curing a thermosetting resin in a short time. This conductive bonding agent contains a conductive metal powder that contains 40% or more of...  
WO/2015/019666A1
The purpose of the present invention is to provide an electrically conductive adhesive agent which can cure a heat-curable resin within a short time. The electrically conductive adhesive agent comprises a Sn-containing electrically condu...  
WO/2015/019414A1
The present invention mainly addresses the problem of producing an electronic component joint material which can be cured at a low temperature and contains CNTs that can achieve high electrical conductivity. According to the present inve...  
WO/2015/019726A1
Provided is an adhesive sheet having a surface sliding property and stain resistance. The adhesive sheet comprises at least a base material and an adhesive agent layer, wherein the static friction coefficient of the base material is 0.05...  
WO/2015/016169A1
In the present invention, conductive particles filling openings are reliably transferred to a binder resin layer. The present invention has: a step for filling a plurality of openings (12) formed in a predetermined pattern at the surface...  
WO/2015/016064A1
A protective film formation-use composite sheet (1) is provided with an adhesive sheet (2) formed by laminating an adhesive layer (22) on one surface of a base material (21), and a protective film formation film (3) laminated on the adhe...  
WO/2015/016063A1
A protective film formation-use composite sheet (1) is provided with an adhesive sheet (2) formed by laminating an adhesive layer (22) on one surface of a base material (21), and a protective film formation film (3) laminated on the adhe...  
WO/2015/012274A1
 The purpose of the present invention is to provide a surface protective film in which, when affixed to various adherends that are flat or have concavities and convexities, self-releasing from an adherend is prevented and acceleration ...  
WO/2015/008617A1
 The present invention provides a layered body for a touch panel in which metal migration is suppressed and changes in the electrical resistance of a fine metal wire are also suppressed. The present invention also provides a touch pane...  
WO/2015/005266A1
The present invention addresses the problem of providing a novel adhesive agent composition for protecting a coating film, which exhibits good adhesion properties in a wide temperature range ranging from a lower temperature to a higher t...  
WO/2014/208595A1
Provided is an adhesive tape for preventing aquatic biofouling that: exhibits good adhesion properties even under water; has good mechanical characteristics; is readily peeled off; is capable of continuing to exhibit an antifouling effec...  
WO/2014/208591A1
Provided is an adhesive tape for preventing aquatic biofouling that: exhibits good adhesion properties even under water; has good mechanical characteristics; is readily peeled off; is capable of continuing to exhibit an antifouling effec...  
WO/2014/208590A1
Provided is an adhesive tape for preventing aquatic biofouling that: exhibits good adhesion properties even under water; has good mechanical characteristics; is readily peeled off; is capable of continuing to exhibit an antifouling effec...  
WO/2014/208594A1
Provided is an adhesive tape for preventing aquatic biofouling that: exhibits good adhesion properties even under water; has good mechanical characteristics; is readily peeled off; is capable of continuing to exhibit an antifouling effec...  
WO/2014/199726A1
Provided are: a thermal airflow meter having improved measurement accuracy; a method for manufacturing the thermal airflow meter; and an adhesive sheet for use in the thermal airflow meter. An adhesive sheet which is divided into at leas...  
WO/2014/192767A1
Provided is a hot-melt adhesive agent which satisfies both a solidification rate and an adhesion property. A base polymer for a hot-melt adhesive agent, which satisfies the following requirements (1) and (2): (1) the tensile elastic modu...  
WO/2014/192460A1
The present invention addresses the problem of providing a double-sided adhesive tape which has proper impact resistance and can be broken down upon the application of a certain level of force, and of which a residual material remaining ...  
WO/2014/192970A1
An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent ther...  
WO/2014/192502A1
Provided is a polymerizable composition for forming a polymer layer to be interposed between an image display part of an image display device and a light-transmissive protective part, the polymerizable composition exhibiting excellent pe...  
WO/2014/188559A1
Provided is a reactive powder which is capable of a favorable and stable self-propagating high temperature synthesis (SHS) reaction. Also provided is a bonding material which, by using the reactive powder, enables a reliable bond while s...  
WO/2014/181853A1
The purpose of the present invention is to find a method for controlling relative permittivity more accurately and to provide an adhesive sheet in which the relative permittivity is controlled by said controlling method. The present inve...  
WO/2014/181845A1
Provided is an adhesive sheet for glass protection adhered to the outer surface of a vehicle window glass to protect said window glass. This adhesive sheet for glass protection includes a plastic film as a substrate, and an adhesive laye...  
WO/2014/178252A1
A film-like adhesive for semiconductor devices, which contains a thermosetting resin, a curing agent and conductive particles, and which has a glass transition temperature of 130°C or more after being cured.  
WO/2014/174174A1
The invention relates to a multilayer structure comprising at least one layer of supramolecular material and one layer of rigid material, to a method for producing such a structure by casting a composition comprising a precursor of the s...  
WO/2014/175249A1
The purpose of the present invention is to provide a tetrazole compound or salt thereof which exhibits excellent heat resistance and excellent responsiveness to long wavelength ultraviolet radiation having a wavelength of 300 nm or highe...  
WO/2014/174733A1
 A pressure-sensitive adhesive composition characterized by containing 100 parts by mass of a polymer (A) substantially free of carboxyl groups, and 0.05-20 parts by mass of a (meth)acrylic homopolymer (B) having a weight-average molec...  
WO/2014/174958A1
Provided is a self-rolling pressure-sensitive adhesive tape which can roll by itself and which makes it possible to easily recover a roll, which has been formed by applying the tape to an adherend and then making the tape roll by itself,...  
WO/2014/174732A1
An adhesive composition comprises: 100 parts by mass of a polymer (A) which has a glass transition temperature of less than 0°C; 0.05 to 50 parts by mass of a (meth)acrylic polymer (B) which has a weight average molecular weight of 1000...  
WO/2014/175186A1
Provided is a rubber composition which has good adhesion to a metal-plated reinforcing layer. A rubber composition adhesive to a metallic surface, which can adhere to a metallic surface, and which comprises: 100 parts by mass of a diene ...  
WO/2014/171503A1
A substrate (11) as a glass laminate comprises, laminated in order therein, a resin layer (21), an adhesive layer (22), a thin-film glass (23), an adhesive layer (24), and a polarizing layer (25). The resin layers (21, 24) include a co-c...  
WO/2014/171075A1
 This adhesive composition contains: 100 mass parts of a polymer (A) having a glass transition temperature of less than 0°C; and 0.1 to 20 mass parts of a polymer (B) containing, as monomer units, a monomer having a polyorganosiloxane...  
WO/2014/162943A1
This temporary fixing double-sided adhesive tape is provided with: a base material; a first adhesive compound layer that adheres to a pedestal; and a second adhesive compound layer that adheres to a workpiece. The first adhesive compound...  
WO/2014/163059A1
An electrically conductive coating material according to the present invention has good wettability on various adherends and, when the adherends are particles, can be coated on the surfaces of the particles uniformly by a specific produc...  
WO/2014/157227A1
Provided is a laminate for temporary bonding in semiconductor device manufacture which is capable of reliably and easily providing temporary support for a member (such as a semiconductor wafer) being mechanically or chemically processed,...  
WO/2014/156882A1
Provided are: an underfill material that can mitigate the difference in thermal response behavior between a semiconductor element and an adherend and has easy positioning for mounting the semiconductor element; a sealing sheet provided w...  
WO/2014/157175A1
 To provide a resin composition that allows excellent adhesive strength to be displayed and separation of cured material in a high-temperature process to be suppressed in the manufacture of a semiconductor device. The present invention...  
WO/2014/156642A1
The present invention addresses the problem of providing an adhesive tape having so-called touch feedback properties that allow displacement (allow compression) in response to a touch panel section being pressed and do not interfere with...  
WO/2014/157439A1
Provided is a laminate for temporary bonding in semiconductor device manufacture, the laminate enabling the reliable and easy provision of temporary support for a member (such as a semiconductor wafer) being mechanically or chemically pr...  
WO/2014/157426A1
A composite sheet (10) for forming a protective film is provided with a pressure-sensitive adhesive sheet (16) obtained by providing a pressure-sensitive adhesive layer (12) on a substrate (11), a film (13) for forming a protective film,...  
WO/2014/156685A1
An anisotropic conductive film for anisotropically electrically connecting terminals of a substrate to terminals of electronic components, the film having a two-layer structure which consists of an anisotropic conductive layer that compr...  
WO/2014/156335A1
This double-sided adhesive sheet has an adhesive layer comprising a first surface and a second surface, a first release film adhered to the first surface of the adhesive layer, and a second release film adhered to the second surface of t...  
WO/2014/156744A1
Provided are: an adhesive sheet for a tire which can finely conform to spews and unevenness of the surface and thereby prevent lifting and peeling thereof even when applied by hand or by an automatic label applicator; a method of produci...  
WO/2014/156816A1
Provided is a double-sided adhesive tape that comprises a foam substrate having an adhesive layer on both sides thereof and that is characterized in that the foam substrate has a density of 0.45 g/cm3 or less and an interlayer strength o...  
WO/2014/156868A1
Provided are: a resin composition characterized by having an amount of outgassing generation when heated for 24 hours at 100°C of no greater than 100 ppm, and a product of the loss tangent (tanδ1) measured at the conditions of 80°C an...  
WO/2014/142151A1
[Problem] To provide a composite sheet for protective film formation, which has good holding power with respect to a jig such as a ring frame and excellent releasability at the time of pick-up, and which is capable of preventing defects ...  
WO/2014/142085A1
An adhesive sheet (1) is provided with a base material (2), and an adhesive agent layer (3) provided to one main-surface side of the base material (2). The adhesive agent layer (3) is formed from an adhesive agent composition including: ...  
WO/2014/142194A1
Provided is an adhesive sheet which can prevent the occurrence of defects when cutting microcomponents such as electronic components. This adhesive sheet is provided with an adhesive layer and a resin layer disposed on one side of the ad...  
WO/2014/142192A1
Provided is an adhesive sheet which is able to realize excellent cutting precision and a reduction in cutting debris when cutting microcomponents such as electronic components. This adhesive sheet is provided with an adhesive layer which...  

Matches 1 - 50 out of 15,404