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Patent Searching and Data


Matches 451 - 500 out of 18,200

Document Document Title
WO/2014/038366A1
A flame-retardant laminate (10) having a base material (11) and a print receptive layer (12) laminated therein. The base material (11) has flame retardation equivalent to VTM-0. The print receptive layer (12) includes a resin and titaniu...  
WO/2014/033770A1
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive comp...  
WO/2014/034100A1
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive comp...  
WO/2014/026906A1
The invention relates to multicomponent crosslinkable compositions (K) comprising at least one component (K1) and a component (K2), characterized in that component (K1) contains 100 parts by weight of compounds (A) of the formula: Y-[(CR...  
WO/2014/024829A1
The purpose of the present invention is to provide a processing method for a wafer that processes the wafer in a state in which the wafer is affixed to a support plate via an adhesive composition, and that achieves higher production effi...  
WO/2014/024678A1
The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the freq...  
WO/2014/020867A1
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; 0.05-3 parts by mass of a (meth)acrylate polymer (B) having a weight average molecular ...  
WO/2014/020868A1
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; 0.05-3 parts by mass of a (meth)acrylate polymer (B) having a weight average molecular ...  
WO/2014/020878A1
One embodiment of the adhesive layer of the present invention contains a (meth)acrylate polymer having a weight average molecular weight of at least 1000 and less than 30,000, has an adhesive strength when 30 minutes have elapsed after p...  
WO/2014/021450A1
This film-like adhesive contains a binder resin (A), epoxy resin (B), hardener (C), and filler (D), wherein the total light transmittance in a D65 standard light source is 70% or higher and the haze value is 50% or lower. Provided are a ...  
WO/2014/021687A1
The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for e...  
WO/2014/020821A1
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; and 0.05-20 parts by mass of a (meth)acrylate polymer (B) having a weight average molec...  
WO/2014/021696A1
The present invention relates to an adhesive film and a product for encapsulating an organic electronic device using the same. The present invention maintains a moisture blocking capability by preventing moisture within a matrix resin fr...  
WO/2014/016969A1
Provided is an adhesive capable of instantaneously fixing adherends together, capable of re-adhering adherends together, having excellent workability such as being capable of having sheet-shaped cut outs being made therefrom, does not pe...  
WO/2014/017473A1
[Problem] To provide: a protective film-forming layer which exhibits excellent bonding strength to a chip even after exposure to severe wet heat conditions and a reflow process after storage of a certain period of time; a sheet for formi...  
WO/2014/014011A1
Provided is a surface-treated heavy calcium carbonate useful for a film precisely controlling pore diameters or a polyester-based resin, etc., that is readily hydrolyzed; or a heavy calcium carbonate that is adequate with no preliminary ...  
WO/2014/013791A1
Provided is a surface protection sheet which has a balance between reworkability and protection function at high levels. A surface protection sheet (10) comprises a supporting base (1) and an adhesive layer (2) that is arranged on the su...  
WO/2014/014881A1
A composition and method of using the composition are described. The composition is useful for quickly bonding chlorinated polyvinylchloride during installation and repair operations. Embodiments of the composition include at least one v...  
WO/2014/010627A1
Provided is a novel active energy ray-polymerizable resin composition which has excellent thermal resistance, wet heat resistance, thermal dimensional stability, weather resistance, and the like, can be favorably used in optical uses, co...  
WO/2014/010511A1
Provided is a manufacturing method for a polarizing plate in which a transparent film is laminated to one of both surfaces of a polarizing film. The method includes: an adhesive coating step in which an active energy ray-curable adhesive...  
WO/2014/011970A1
In one embodiment, a selectively-releasable adhesive includes a base adhesive compound and a releasing compound that is blended with the base adhesive compound, the releasing compound being capable of decreasing the adhesive strength of ...  
WO/2014/007238A1
Provided are conductive particles with insulating particles, which are capable of increasing insulation reliability in cases where electrodes are connected with each other using the conductive particles with insulating particles. Each co...  
WO/2014/007237A1
Provided are conductive particles with insulating particles, which are capable of increasing both conduction reliability and insulation reliability in cases where electrodes are connected with each other using the conductive particles wi...  
WO/2014/006189A1
The invention relates to the use of an adhesive composition to provide a bonding in a wet environment. The invention also relates to a method for providing a bonding in a wet environment.  
WO/2014/007334A1
Provided is a conductive particle whereby, when electrically connecting electrodes with the conductive particle, connection resistance is lowered, and it is possible to increase connection reliability. A conductive particle according to ...  
WO/2013/191106A1
This adhesive tape comprises an adhesive layer on a foam substrate, the foam substrate having a thickness of 250 μm or less and an interlayer strength of 10 to 18 N/cm, and the adhesive layer having a thickness of 40 μm or less. The ad...  
WO/2013/191075A1
The purpose of the present invention is to provide: an amorphous inorganic anion exchanger that has excellent anion exchanging performance and rarely causes metals to corrode; and a production method which enables the production of an am...  
WO/2013/191046A1
A thermally conductive adhesive composition containing an adhesive component and thermally conductive particles. The adhesive component contains high polymers and low polymers. The low polymer content is 1%-38% by mass relative to the to...  
WO/2013/191045A1
A thermally conductive adhesive composition comprising: an adhesive component containing high polymers and low polymers; and thermally conductive particles. The gel fraction measured in the adhesive component is 28%-59% by mass and the t...  
WO/2013/187190A1
Provided are: a temporary adhesive for semiconductor-device production that is capable of definitively and simply supporting a member to be treated, when performing a mechanical or chemical treatment on a member (semiconductor wafer or t...  
WO/2013/187244A1
Provided are: a temporary adhesive for semiconductor device production, which is capable of temporarily supporting a member to be processed (such as a semiconductor wafer) easily and reliably when the member to be processed is mechanical...  
WO/2013/186349A1
The invention relates to compounds containing silane groups, in particular in the form of polymers that contain silane groups, have low viscosity, and are suitable for elastic adhesives and sealants. The compounds can be obtained by reac...  
WO/2013/183375A1
The purpose of the present invention is to provide an adhesive layer which exhibits excellent adhesion to a non-polar object to be adhered such as a polyethylene or a polypropylene and is not be deteriorated in characteristics even at lo...  
WO/2013/180133A1
Provided is an adhesive showing excellent adhesiveness even when the adherend is glass or a thermoplastic resin. This adhesive is for resin layer adherends containing glass and/or a thermoplastic resin (A), and contains a thermoplastic r...  
WO/2013/180196A1
A peelable adhesive comprising a main chain of liquid crystal polymer having a plurality of liquid crystal mesogenic groups on a side chain, and a cross-linking group for cross-linking main chains, wherein the mesogenic groups receive en...  
WO/2013/180134A1
Provided is an adhesive having excellent solvent resistance and showing excellent adhesiveness even when the adherend is glass or a thermoplastic resin. This adhesive is for resin layer adherends containing glass and/or a thermoplastic r...  
WO/2013/174940A3
The invention relates to a composition, comprising a) at least one silane-functional polymer P having alkoxy end groups, which are not methoxy groups; b) at least one catalyst for the cross-linking of silane-functional polymers, selected...  
WO/2013/174892A1
The invention relates to low-viscosity polymers containing silane groups, said polymers curing rapidly under the effect of moisture to form an elastic material with good heat resistance and being in particular suitable for elastic adhesi...  
WO/2013/174940A2
The invention relates to a composition, comprising a) at least one silane-functional polymer P having alkoxy end groups, which are not methoxy groups; b) at least one catalyst for the cross-linking of silane-functional polymers, selected...  
WO/2013/176031A1
An adhesive tape which has an adhesive layer on at least one surface of a foam base. The foam base has a thickness of 300 μm or less and an interlaminar strength of 6-50 N/cm. The adhesive layer has a thickness of 50 μm or less, while ...  
WO/2013/176990A1
Biomimetic adhesive compositions can be used in various aspects of subterranean treatment operations. Methods for treating a subterranean formation can comprise: providing an adhesive composition that comprises a first polymer comprising...  
WO/2013/172328A1
[Problem] To provide: a sheet having an adhesive resin layer attached thereto, which enables the transfer of chip-like components while keeping the chip-like components in a nicely arranged state; and a method for producing a semiconduct...  
WO/2013/168712A1
The purpose of the present invention is to provide an adhesive agent which has stronger adhesion force and can be adhered and detached reversibly by the irradiation with light. A light-responsive adhesive agent which can be adhered stron...  
WO/2013/164413A1
The invention relates to a moisture-curing two-component composition consisting of a component A which contains at least one polyoxyl alkylene, polyolefin, and/or polyacrylate prepolymer with at least one hydrolyzable silane group and wh...  
WO/2013/161713A1
A circuit connection material for electrically connecting two circuit members facing each other, which contains a thermoplastic resin, radically polymerizable compounds, a radical polymerization initiator and inorganic fine particles. Th...  
WO/2013/162059A1
The present invention provides a hot melt adhesive being highly environmentally-friendly, and as well having sufficient pressure-sensitive adhesiveness, adhesion, thermal stability and the like. The present invention relates to a hot mel...  
WO/2013/157436A1
Provided is an adhesive tape for preventing aquatic biofouling, which can prevent discoloration or degradation of an adherent, to which said adhesive tape for preventing aquatic biofouling is adhered, caused by exposure to ultraviolet ra...  
WO/2013/157378A1
Provided are a circuit connection material, which has a superior low temperature curability, and a manufacturing method for an assembly using same. The circuit connection material has a two-layer structure in which a first adhesive layer...  
WO/2013/157552A1
The present invention provides technology for anisotropic conductive adhesive that uses conductive particles with a silver based metal for a conductive layer, has high light reflectivity, and has superior migration resistance properties....  
WO/2013/153953A1
A device for applying an adhesive film, the device being provided with: a conveyance mechanism for conveying an adhesive film tape with a base film and an adhesive layer supported on the base film; a support section for supporting an app...  

Matches 451 - 500 out of 18,200