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Patent Searching and Data


Matches 451 - 500 out of 10,385

Document Document Title
WO/2010/093035
A conductive resin composition with which high conduction reliability can be ensured, a process for producing, using the composition, an electronic part having high connection reliability, a connecting method by which works to be connect...  
WO/2010/092906
The disclosed heat-sensitive adhesive comprises a side chain crystalline polymer and exhibits adhesive strength at temperatures above the melting point of the side chain crystalline polymer. The side chain crystalline polymer is composed...  
WO/2010/087079
Disclosed is an adhesive product in which the dot diameter of an adhesive is reduced and the thickness of an adhesive layer is reduced while ensuring a necessary and sufficient adhesive force. Specifically disclosed is an adhesive produ...  
WO/2010/086932
Disclosed is a one-pack type cyanate-epoxy composite resin composition, containing (A) a cyanate resin, (B) an epoxy resin, and (C) a latent curing agent. The latent curing agent (C) contains (a) a modified amine having at least one ami...  
WO/2010/082488
A curable composition that has excellent curability without using an organotin-based curing catalyst, the toxicity of which has been pointed out, and that gives a cured object suffering no surface discoloration even through long-term exp...  
WO/2010/074135
An adhesive which has a high degree of moist-heat resistance that enables the adhesive layer to withstand soldering with a lead-free solder under high-humidity conditions and which has excellent adhesiveness under high-temperature high-h...  
WO/2010/067745
Disclosed is an adhesive sheet comprising a substrate and an adhesive layer formed from an adhesive composition containing a polyrotaxane (A) for which a linear molecule penetrates the aperture parts of at least two cyclic molecules, one...  
WO/2010/067744
Disclosed is an adhesive composition that includes: a (meth)acrylic acid ester copolymer (A) obtained by copolymerizing (meth)acrylic acid ester and a monomer containing a reactive group such that the ratio of the monomer (the constituen...  
WO/2010/064358
A double-faced pressure-sensitive adhesive tape for solar cell modules which has excellent applicability and attains excellent working efficiency. The double-faced pressure-sensitive adhesive tape for solar cell modules is a double-faced...  
WO/2010/062624
An adhesive composition is disclosed that includes an inorganic material and an adhesion promoting material where the weight ratio of the adhesion promoting material to the inorganic material is sufficient to permit adhesion of the adhes...  
WO/2010/057946
The present invention relates to compositions comprising a) 0.001–10 wt % of a hydrophobin (H), b) an adhesive (K), c) optionally a solvent and/or dispersant (L) and d) optionally other additives (Z), and to a corresponding method for ...  
WO/2010/046996
Disclosed is an adhesive composition for semiconductors, which contains a thermosetting resin (A) and a compound (B) having a sulfide bond represented by the formula (1) below and an alkoxysilyl group. -(S)n- (1) (In the formula (1), n r...  
WO/2010/047374
Adhesive film formed from an adhesive which can be obtained by mixing a curable resin composition and two or more types of insulating organic particles differing in mean particle size, wherein the average particle size of the insulating ...  
WO/2010/041667
Provided are adhesive laminates with which there is no adhesive residue even when polyester backing layers are used. The adhesive laminates comprise a polyester backing layer and an adhesive layer. One surface of the polyester backing la...  
WO/2010/038753
Disclosed is an anisotropic electroconductive adhesive that, even when a heating tool is contacted and pressed at a slow speed, can realize high electrical connection reliability. The anisotropic electroconductive adhesive comprises an...  
WO/2010/038484
Provided is a heat-resistant and highly heat-conductive adhesive agent which has excellent mechanical strength, heat-resistance and heat-conductivity. A heat-resistant and highly heat-conductive adhesive agent comprising (a) a first com...  
WO/2010/037139
A method is disclosed for making a soft adhesive tape. The method comprises providing a soft adhesive, rolling a gravure cylinder on the soft adhesive to meter the soft adhesive, depositing the metered soft adhesive from the gravure cyli...  
WO/2010/035906
Disclosed is a method for manufacturing a composite polarizing plate, comprising the step of laminating a transparent protective film onto one side surface of a polarizing film, laminating a releasable adhesive film on the opposite side ...  
WO/2010/037139
A method is disclosed for making a soft adhesive tape. The method comprises providing a soft adhesive, rolling a gravure cylinder on the soft adhesive to meter the soft adhesive, depositing the metered soft adhesive from the gravure cyli...  
WO/2010/035820
Disclosed is a curable composition which exhibits excellent curability without using a toxic organotin curing catalyst and provides a cured product which does not suffer from discoloration or cracks in the surface even after being expose...  
WO/2010/035614
Disclosed is a thermally conductive pressure-sensitive adhesive sheet which can be produced easily and can be peeled off easily. Also disclosed is a thermally conductive pressure-sensitive adhesive composition which serves as a raw mate...  
WO/2010/035821
A curable composition which contains an organic polymer having a reactive silicon group as a main component. The curable composition is environmentally friendly since the composition does not contain a toxic organotin catalyst, and main...  
WO/2010/032583
A surface-protective film comprising a substrate and a pressure-sensitive adhesive layer formed on one side thereof, wherein the pressure-sensitive adhesive layer is such that the difference between storage modulus at 150°C and that at ...  
WO/2010/033382
Articles prepared with a pressure sensitive adhesive prepared by combining an acrylic polymer and a silane-functional polymer, such as glass and plastic laminates, show improved impact resistance.  
WO/2010/032529
Disclosed is a semiconductor device having excellent heat resistance, wherein a semiconductor element and an object to be bonded are bonded together through a patterned film-like photosensitive adhesive by means of thermal compression bo...  
WO/2010/027017
Disclosed is an electroconductive connecting material that electrically connects terminals for respective electronic members to each other. The electroconductive connecting material has a laminate structure comprising a curable resin co...  
WO/2010/024087
A photosensitive adhesive composition having a minimum melt viscosity of not more than 30000 Pa·s as measured at 20 to 200°C after pattern formation.  
WO/2010/022585
A back sheet of solar cell with high adhesion property comprises a substrate (3) and a fluorine-based film (2). A layer of fluoro-siloxane film (1) or silicon-titanium compound film (4) exists between the substrate (3) and the fluorine-b...  
WO/2010/024295
A photosensitive adhesive composition that can form adhesive patterns by forming an adhesive layer on an adherend and performing a radiation exposure and development by a developing solution. The photosensitive adhesive composition has s...  
WO/2010/021201
A sheet (1) for manufacturing an optical disc is provided with an adhesive layer (11) having loss tangent peak temperature of -10°C or below and a surface energy polar component (γPs) of 2.0 mJ/m2 or more, and a protecting sheet (12), ...  
WO/2010/018712
Disclosed is a conductive adhesive mainly composed of a conductive filler, a binder resin and a solvent. The conductive filler is mainly composed of a metal powder having an average particle diameter of 2-30 μm, while containing ultraf...  
WO/2010/016305
Disclosed is an adhesive composition containing (A) a thermoplastic resin having a Tg of not more than 100˚C and (B) a thermosetting component. The thermosetting component (B) contains (B1) a compound having an allyl group and (B2) a c...  
WO/2010/016503
A seamless can or the like which is important as a container for beverages or foods is increased in commercial value by imparting a shining decoration having an excellent specular gloss to the outer surface of the barrel of the can body....  
WO/2010/013653
Disclosed is an adhesive material that has low viscosity, has good coatability, can be rendered solventless, has low adhesive strength while causing little increase in adhesive strength with the elapse of time, has good adhesion to an ad...  
WO/2010/013664
Provided is a light-diffusing adhesive sheet comprising: a transparent plastic film; a light-diffusing adhesive layer which includes an aqueous emulsion containing polymer particles (A-1) comprising acrylic copolymer (A), fine organic pa...  
WO/2010/010900
Provided is a method of provisional fixing which is remarkably effective in the dimensional accuracy of processed members. The method of provisional fixing comprises: a coating step in which a fixing member is coated with an adhesive for...  
WO/2010/004678
The issue is to provide an electronic paper manufacturing method capable of forming a thin film transistor and adhering a display layer to form electronic paper without wrinkling in the support film, even when a thin support film is used...  
WO/2010/004703
Disclosed is a process for producing an organic electroluminescent (EL) panel using a very thin glass substrate. The production process does not cause “cracking” or “chipping” of a very thin glass substrate in production steps, ...  
WO/2010/001900
Disclosed is a circuit connection material which is interposed between opposing circuit electrodes so as to electrically connect opposing electrodes in the direction of pressure when pressure is applied to the circuit electrodes. The ci...  
WO/2010/001959
Provided is a pressure-sensitive adhesive film which scarcely generates wrinkles, peeling off or the like and scarcely causes any color change of a base material in the case of repeatedly bonding to a molded article comprising a syntheti...  
WO/2009/150328
1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: - fr...  
WO/2009/150328
1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: - fr...  
WO/2009/150832
Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has exc...  
WO/2009/150818
Disclosed is a flame-retardant adhesive composition which does not contain any halogen compound and contains a phosphorus compound. Also disclosed is a novel laminated film having superior flame retardancy. The laminated film comprises...  
WO/2009/147024
The invention provides for the use of polymers (P) which comprise at least one structural element of the general formula (I), polymer-R2-Y-CH2-SiXnR1 3-n (I) where R1, R2, Y, X and n are each as defined in claims 1 and 3, as a binder or ...  
WO/2009/139318
Provided is a manufacturing method of a laminate, wherein the method has a process in which two or more layers of polycarbonate resin film and/or sheet are laminated by using a (meth)acrylate adhesive composition containing (A) a (meth)a...  
WO/2009/133897
Disclosed is a connecting material that, even when joined at a curing temperature of 200°C or below without applying a load, has a high coefficient of thermal conductivity and has a satisfactory bonding strength even when a cured produc...  
WO/2009/133901
Provided is a circuit connecting material (20) which electrically connects a pair of facing circuit electrodes by applying a pressure to the circuit electrodes in a direction wherein the circuit electrodes face each other, by arranging t...  
WO/2009/128530
Disclosed is an adhesive composition containing (a) a thermoplastic resin, (b) a radically polymerizable compound containing two or more (meth)acryloyl groups and two or more urethane bonds in a molecule and having a weight average molec...  
WO/2009/128514
Disclosed is an adhesive material tape (10) comprising a tape-like backing (1) having a first surface (F1) and an opposing second surface (F2), and an adhesive layer (2) formed on the first surface (F1) of the backing (1) and containing ...  

Matches 451 - 500 out of 10,385