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Patent Searching and Data


Matches 501 - 550 out of 15,192

Document Document Title
WO/2010/032583A1
A surface-protective film comprising a substrate and a pressure-sensitive adhesive layer formed on one side thereof, wherein the pressure-sensitive adhesive layer is such that the difference between storage modulus at 150°C and that at ...  
WO/2010/033382A3
Articles prepared with a pressure sensitive adhesive prepared by combining an acrylic polymer and a silane-functional polymer, such as glass and plastic laminates, show improved impact resistance.  
WO/2010/032529A1
Disclosed is a semiconductor device having excellent heat resistance, wherein a semiconductor element and an object to be bonded are bonded together through a patterned film-like photosensitive adhesive by means of thermal compression bo...  
WO/2010/027017A1
Disclosed is an electroconductive connecting material that electrically connects terminals for respective electronic members to each other. The electroconductive connecting material has a laminate structure comprising a curable resin co...  
WO/2010/024087A1
A photosensitive adhesive composition having a minimum melt viscosity of not more than 30000 Pa·s as measured at 20 to 200°C after pattern formation.  
WO/2010/022585A1
A back sheet of solar cell with high adhesion property comprises a substrate (3) and a fluorine-based film (2). A layer of fluoro-siloxane film (1) or silicon-titanium compound film (4) exists between the substrate (3) and the fluorine-b...  
WO/2010/024295A1
A photosensitive adhesive composition that can form adhesive patterns by forming an adhesive layer on an adherend and performing a radiation exposure and development by a developing solution. The photosensitive adhesive composition has s...  
WO/2010/021201A1
A sheet (1) for manufacturing an optical disc is provided with an adhesive layer (11) having loss tangent peak temperature of -10°C or below and a surface energy polar component (γPs) of 2.0 mJ/m2 or more, and a protecting sheet (12), ...  
WO/2010/018712A1
Disclosed is a conductive adhesive mainly composed of a conductive filler, a binder resin and a solvent. The conductive filler is mainly composed of a metal powder having an average particle diameter of 2-30 μm, while containing ultraf...  
WO/2010/016305A1
Disclosed is an adhesive composition containing (A) a thermoplastic resin having a Tg of not more than 100˚C and (B) a thermosetting component. The thermosetting component (B) contains (B1) a compound having an allyl group and (B2) a c...  
WO/2010/016503A1
A seamless can or the like which is important as a container for beverages or foods is increased in commercial value by imparting a shining decoration having an excellent specular gloss to the outer surface of the barrel of the can body....  
WO/2010/013653A1
Disclosed is an adhesive material that has low viscosity, has good coatability, can be rendered solventless, has low adhesive strength while causing little increase in adhesive strength with the elapse of time, has good adhesion to an ad...  
WO/2010/013664A1
Provided is a light-diffusing adhesive sheet comprising: a transparent plastic film; a light-diffusing adhesive layer which includes an aqueous emulsion containing polymer particles (A-1) comprising acrylic copolymer (A), fine organic pa...  
WO/2010/010900A1
Provided is a method of provisional fixing which is remarkably effective in the dimensional accuracy of processed members. The method of provisional fixing comprises: a coating step in which a fixing member is coated with an adhesive for...  
WO/2010/004678A1
The issue is to provide an electronic paper manufacturing method capable of forming a thin film transistor and adhering a display layer to form electronic paper without wrinkling in the support film, even when a thin support film is used...  
WO/2010/004703A1
Disclosed is a process for producing an organic electroluminescent (EL) panel using a very thin glass substrate. The production process does not cause “cracking” or “chipping” of a very thin glass substrate in production steps, ...  
WO/2010/001900A1
Disclosed is a circuit connection material which is interposed between opposing circuit electrodes so as to electrically connect opposing electrodes in the direction of pressure when pressure is applied to the circuit electrodes. The ci...  
WO/2010/001959A1
Provided is a pressure-sensitive adhesive film which scarcely generates wrinkles, peeling off or the like and scarcely causes any color change of a base material in the case of repeatedly bonding to a molded article comprising a syntheti...  
WO/2009/150328A3
1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: - fr...  
WO/2009/150328A2
1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: - fr...  
WO/2009/150832A1
Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has exc...  
WO/2009/150818A1
Disclosed is a flame-retardant adhesive composition which does not contain any halogen compound and contains a phosphorus compound. Also disclosed is a novel laminated film having superior flame retardancy. The laminated film comprises...  
WO/2009/147024A1
The invention provides for the use of polymers (P) which comprise at least one structural element of the general formula (I), polymer-R2-Y-CH2-SiXnR1 3-n (I) where R1, R2, Y, X and n are each as defined in claims 1 and 3, as a binder or ...  
WO/2009/139318A1
Provided is a manufacturing method of a laminate, wherein the method has a process in which two or more layers of polycarbonate resin film and/or sheet are laminated by using a (meth)acrylate adhesive composition containing (A) a (meth)a...  
WO/2009/133897A1
Disclosed is a connecting material that, even when joined at a curing temperature of 200°C or below without applying a load, has a high coefficient of thermal conductivity and has a satisfactory bonding strength even when a cured produc...  
WO/2009/133901A1
Provided is a circuit connecting material (20) which electrically connects a pair of facing circuit electrodes by applying a pressure to the circuit electrodes in a direction wherein the circuit electrodes face each other, by arranging t...  
WO/2009/128530A1
Disclosed is an adhesive composition containing (a) a thermoplastic resin, (b) a radically polymerizable compound containing two or more (meth)acryloyl groups and two or more urethane bonds in a molecule and having a weight average molec...  
WO/2009/128514A1
Disclosed is an adhesive material tape (10) comprising a tape-like backing (1) having a first surface (F1) and an opposing second surface (F2), and an adhesive layer (2) formed on the first surface (F1) of the backing (1) and containing ...  
WO/2009/125672A1
Disclosed is an adhesive composition with which a surface protective film can be easily bonded to a glass surface. By using the adhesive composition, residues resulting from the surface protective film (specifically, from an adhesive lay...  
WO/2009/122878A1
In a pressure-sensitive adhesive composition or a pressure-sensitive adhesive sheet containing an energy ray-curable polymer, problems associated with the volatilization of a low-molecular weight compound contained in the composition are...  
WO/2009/119885A1
Disclosed is an adhesive composition, characterized by comprising a mixture of a hot-melt adhesive with a ferromagnetic material and having a shear force of not less than 20 N after heat (150°C, 10 min) bonding. Also disclosed is an adh...  
WO/2009/113616A1
Disclosed are adhesive compositions which contain amphiphilic molecule particles having a structure formed by aggregation of a base polymer and an amphiphilic molecule which has a hydrophilic group and a hydrophobic group in the molecule...  
WO/2009/107537A1
Disclosed is a curable composition which can be cured by heating or an active energy ray at room temperature. A cured product produced by using the composition is also disclosed. Specifically disclosed are an active energy ray-curable co...  
WO/2009/098884A1
Disclosed is an inorganic-polymer composite material, wherein hydrophilic inorganic compounds having a maximum length of 1-1,000 nm are unevenly distributed over the surfaces of polymer particles having an average particle diameter of 0....  
WO/2009/099191A1
Disclosed is a film for semiconductors, which comprises a sheet base and an adhesive layer formed on one side of the sheet base. The film for semiconductors is characterized in that the adhesive layer is composed of a resin composition c...  
WO/2009/096052A1
A corrugated-cardboard adhesive for preventing package stack crumbling which is characterized by comprising a mixture of a petroleum resin emulsion containing a mineral oil with a solution of a water-soluble resin. Examples of the water-...  
WO/2009/090119A1
An, in particular, pressure-sensitive adhesive which comprises expanded microballoons, wherein the bond strength of the adhesive comprising the expanded microballoons is reduced by at most 30%, preferably at most 20%, more preferably 10%...  
WO/2009/090922A1
A photosensitive adhesive composition which comprises (A) a resin having carboxy groups and/or hydroxy groups, (B) a thermosetting resin, (C) a radiation-polymerizable compound, and (D) photoinitiators and in which the mixture of all pho...  
WO/2009/084651A1
Disclosed are: an adhesive composition having excellent properties; and others. Specifically disclosed is an adhesive composition characterized by comprising bis(fluorosulfonyl) imide. The adhesive composition has properties equivalent o...  
WO/2009/084348A1
A metal member (3) to be bonded is bonded with an adhesive (6) to have a strength higher than the basic material strength of the metal member (3) to be bonded. A metal insertion coupling has a socket portion (4) in which an insertion hol...  
WO/2009/078409A1
Provided is a circuit connecting material, which is arranged between circuit electrodes facing each other, pressurizes the facing circuit electrodes and electrically connects the electrodes in the pressurizing direction. The circuit conn...  
WO/2009/072497A1
Provided is a circuit member connecting adhesive characterized in containing a curing resin, a thermosetting resin, a curing agent for curing resin, and barium sulfate.  
WO/2009/069783A1
Provided is a circuit member connecting adhesive for connecting circuit boards facing each other. The circuit member connecting adhesive is composed of a resin composition containing a thermoplastic resin, a thermosetting resin and a cur...  
WO/2009/060927A1
This invention provides an adhesive sheet for a semiconductor, which has good cuttability by expanding and can be separated into pieces, and possesses an excellent capability of being embedded into concaves and convexes in a wiring board...  
WO/2009/057530A1
This invention provides an adhesive composition for a semiconductor, comprising filler particles (A), a heat curing resin (B), and a sulfide bond-containing compound (C) represented by formula (1): -(S)n- (1) where n is an integer of 1 o...  
WO/2009/058018A1
Described is a moisture sealant composition for use in making wood joints. The composition is based on silyl polymers and provides a good moisture resistance and adhesive bond, By being gap-filling, the composition provides a better mois...  
WO/2009/054410A1
Disclosed is a circuit connecting material (50) for connecting a first electrode and a second electrode facing each other, which contains an adhesive composition (52) and conductive particles (10) dispersed in the adhesive composition (5...  
WO/2009/054387A1
Disclosed is a coated conductive powder which is useful as a conductive filler for an anisotropic conductive adhesive that is particularly used for electrically connecting circuit boards or circuit components. Also disclosed is a conduct...  
WO/2009/054386A1
Disclosed is a coated conductive powder having excellent electrical reliability, wherein aggregation of conductive particles is suppressed. Also disclosed is a conductive adhesive using such a coated conductive powder, which is capable o...  
WO/2009/047984A1
This invention provides a pressure sensitive adhesive double coated sheet (100) for electronic components. The pressure sensitive adhesive double coated sheet (100) comprises a pressure sensitive adhesive layer (3), a first release sheet...  

Matches 501 - 550 out of 15,192