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Patent Searching and Data


Matches 501 - 550 out of 10,337

Document Document Title
WO/2009/069783
Provided is a circuit member connecting adhesive for connecting circuit boards facing each other. The circuit member connecting adhesive is composed of a resin composition containing a thermoplastic resin, a thermosetting resin and a cur...  
WO/2009/060927
This invention provides an adhesive sheet for a semiconductor, which has good cuttability by expanding and can be separated into pieces, and possesses an excellent capability of being embedded into concaves and convexes in a wiring board...  
WO/2009/057530
This invention provides an adhesive composition for a semiconductor, comprising filler particles (A), a heat curing resin (B), and a sulfide bond-containing compound (C) represented by formula (1): -(S)n- (1) where n is an integer of 1 o...  
WO/2009/058018
Described is a moisture sealant composition for use in making wood joints. The composition is based on silyl polymers and provides a good moisture resistance and adhesive bond, By being gap-filling, the composition provides a better mois...  
WO/2009/054410
Disclosed is a circuit connecting material (50) for connecting a first electrode and a second electrode facing each other, which contains an adhesive composition (52) and conductive particles (10) dispersed in the adhesive composition (5...  
WO/2009/054387
Disclosed is a coated conductive powder which is useful as a conductive filler for an anisotropic conductive adhesive that is particularly used for electrically connecting circuit boards or circuit components. Also disclosed is a conduct...  
WO/2009/054386
Disclosed is a coated conductive powder having excellent electrical reliability, wherein aggregation of conductive particles is suppressed. Also disclosed is a conductive adhesive using such a coated conductive powder, which is capable o...  
WO/2009/047984
This invention provides a pressure sensitive adhesive double coated sheet (100) for electronic components. The pressure sensitive adhesive double coated sheet (100) comprises a pressure sensitive adhesive layer (3), a first release sheet...  
WO/2009/048176
A pressure-sensitive adhesive sheet which comprises a base sheet (1) and a pressure-sensitive adhesive layer (2) disposed on at least one surface thereof. The pressure-sensitive adhesive sheet is characterized in that (a) the pressure-se...  
WO/2009/047070
The invention relates to silane-substituted RAFT reagents of general formulae R1 n(OR2 )3-nSi-L1 -Rf -R3 (1a), R1 n(OR2 )3-nSi-L1 -Rf -L2 -Si(OR2 )3-nR1 n(1b), and R1 n(OR2 )3-n Si-L1 -Rf -L2 -Rf -L3 -Si(OR2 )3-nR1 n (1c), wherein R1, R2...  
WO/2009/044678
Disclosed is a circuit connecting material for connecting a first circuit member obtained by forming a first circuit electrode on a major surface of a first substrate with a second circuit member obtained by forming a second circuit elec...  
WO/2009/044801
This invention provides an adhesive composition which, while maintaining storage stability, can form a metallic bond in such a state that the cured product wets components and is spread well between components, and is excellent in adhesi...  
WO/2009/041550
Disclosed is an adhesive set composed of a liquid A containing a first polymer having an alkyldialkoxysilyl group represented by the general formula (I) below at an end of a molecule, and a liquid B containing a second polymer having a t...  
WO/2009/041674
This invention provides an electroconductive pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer having a thickness of 10 to 30 µm. The pressure-sensitive adhesive layer is formed of a pressure-sensitive adhe...  
WO/2009/038020
Disclosed is an adhesive composition for electronic components, which has excellent adhesion durability, thermal cycle performance and insulation reliability under high temperature conditions over a long time. Specifically disclosed is a...  
WO/2009/031472
Provided is an adhesive containing (a) a thermoplastic resin, (b) a radical polymerizable compound and (c) a radical polymerization initiator. The radical polymerizable compound is in a solid-state at a temperature of 30°C or below.  
WO/2009/025224
[PROBLEMS] To provide an adhesive tape that being an adhesive tape for use in clothing, especially an adhesive tape for use in nonsewn type clothing formed into clothing configuration with the use of an adhesive tape while minimizing sew...  
WO/2009/025787
A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 ...  
WO/2009/025787
A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 ...  
WO/2009/025058
[PROBLEMS] To provide a process for producing an adhesive sheet that exhibits a sufficient strength of retention for a relatively heavy metal artificial nail or jeweled artificial nail, and provide a relevant adhesive sheet. [MEANS FOR S...  
WO/2009/025787
A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 ...  
WO/2009/022516
Disclosed are: a method for producing an adhesive resin composition; a resin film; and a laminate. The method is characterized by kneading a saturated polyester resin having a melt index of 10 to 500 g/10 minutes and a thermoplastic resi...  
WO/2009/020040
Disclosed is a curable composition which has good workability and storage stability while keeping its properties including solvent-free property, rapid curability and good adhesion which cannot be achieved by a solvent-containing asphalt...  
WO/2009/017160
An adhesive composition which contains an elastomer having a solubility parameter of 18.5MPa1/2 or below, a tackifier having a hydroxyl value of 20mgKOH/g or above, and a near infrared absorbing coloring matter. The tackifier content is ...  
WO/2009/014077
The present invention aims to improve the balance among transparency, adhesiveness and yellowing resistance of a curable composition which is obtained by using an organic polymer having a reactive silicon group and applicable to sealing ...  
WO/2009/013968
Provided are an adhesive film which can connect an electronic component to a substrate without causing short-circuiting, a connecting method and a connected body. The adhesive film is provided with a first adhesive layer wherein conducti...  
WO/2009/011383
Provided is an adhesive for an electronic component. The adhesive has excellent coating properties and contamination resistance for a bonded electronic component, and a highly reliable electronic component can be obtained by using the ad...  
WO/2009/011329
Disclosed is a curable composition having good curability and good tensile property (high elongation), wherein the amount of toxic dibutyltin compound content is reduced. Specifically disclosed is a curable composition characterized by c...  
WO/2009/011421
Disclosed is a detachable adhesive containing an organic adhesive component and a reaction product which is obtained by reacting an onium salt containing an oxidizing anion with an amine group of an amine compound at a reaction ratio of ...  
WO/2009/008448
Disclosed is a thermosetting adhesive for circuit member connection, which is composed of a resin composition containing a thermally crosslinkable resin and a curing agent reactive with the thermally crosslinkable resin and complex oxide...  
WO/2009/005130
An adhesive composition which comprises, as essential ingredients, a thermosetting resin ingredient (A) which at a temperature of 5-40°C is evenly compatible and mixable without separating out, a high-molecular ingredient (B), and a har...  
WO/2009/001605
This invention provides an anisotropic electroconductive material which, when an IC chip or flexible wiring is connected to a wiring board through an anisotropic elctroconductive material, does not cause a difference in continuity resist...  
WO/2009/001771
Disclosed are: an adhesive film which enables to connect an electronic component to a substrate without causing short-circuiting; a connection method; and an assembly. The adhesive film comprises a first adhesive layer and a second adhes...  
WO/2008/153883
Room temperature curing structural adhesive compositions including polyurethane oligomers having multi-methacrylate functionality, cycloalkylmethacrylate, at least one maleimide-functionalized compound and a cure system are disclosed. Th...  
WO/2008/149820
Disclosed is a bonding method which enables to firmly join two members without using an adhesive and without deteriorating fine structures and optical characteristics of the bonding surfaces. Also disclosed are a biochemical chip and an ...  
WO/2008/149678
A method for electrically connecting an electronic component with high reliability of electrical connection after the electrical connection, enabling correct counting of captured conductive particles and a joined body are provided. The e...  
WO/2008/149787
[PROBLEMS] To provide: a resin-coated metal sheet which has a chromium-free surface treatment layer and has a coating formed by applying an organic resin, and which is excellent in adhesion and corrosion resistance even after formation b...  
WO/2008/146014
An adhesive material comprising at least one adhesive polymeric resin, at least one low aspect ratio metal-coated additive, and at least one high aspect ratio metal-coated additive. There is additionally provided an adhesive material com...  
WO/2008/146688
A method for producing anisotropic conductive adhesive exhibiting high connection reliability of electronic component while preventing short circuit of a terminal. A method for connecting an electronic component using an anisotropic cond...  
WO/2008/146014
An adhesive material comprising at least one adhesive polymeric resin, at least one low aspect ratio metal-coated additive, and at least one high aspect ratio metal-coated additive. There is additionally provided an adhesive material com...  
WO/2008/145618
Adhesive and sealant systems Adhesive and sealant systems on the basis of unsaturated polyester resins, epoxy resins, polyurethane, silane-terminated polymers, vinyl ester resins, acrylates, polyvinyl acetate, polyvinyl alcohol, polyviny...  
WO/2008/146849
A heat-releasable pressure-sensitive adhesive sheet that excelling in rugged surface follow-up property, exhibits a satisfactory adhesive strength even when a bonding face of adherend is rough, and that in the use as a pressure-sensitive...  
WO/2008/146793
In an electric device (1), a wiring board (20) and an electric component (25), which has a connecting terminal (27) arranged at least on one surface, are fixed by a curing adhesive layer (12a).The curing adhesive layer (12a) is provided ...  
WO/2008/143010
Disclosed is a resin composition which is suitable for production of an adhesive of an adhesive sheet for electrostatic charge prevention. This resin composition is excellent in adhesive properties and anti-contaminating property for an ...  
WO/2008/143358
An electric device (40) is provided with land sections (63, 64) arranged on a wiring board (60); and connecting sections (41, 42), which have connecting terminals (67, 68) of the electric component (65) facing each other and are electric...  
WO/2008/139857
Disclosed is an anisotropic conductive adhesive film for making an electrically conductive connection between electronic components or the like. This anisotropic conductive adhesive film comprises a first releasing film (2) provided with...  
WO/2008/140094
Disclosed is a circuit-connecting material for electrically interconnecting two circuit members each having a circuit electrode formed thereon with the circuit electrodes being opposed to each other. The circuit-connecting material compr...  
WO/2008/133118
The invention aims at providing a heat-peelable pressure -sensitive adhesive sheet which is little deformed by pressure and is excellent in cohesive strength even under a high -temperature atmosphere and which can keep proper pressure -s...  
WO/2008/133104
This invention provides a pressure-sensitive adhesive sheet for water jet laser dicing, which can realize fabrication of a very thin semiconductor wafer or material without causing defects such as breaking in the separation of chips, IC ...  
WO/2008/133120
Disclosed is a thermally releasable double-sided adhesive sheet which can be used suitably in a cutting process for a laminated ceramic sheet under a high-temperature atmosphere. Also disclosed is a method for cutting a laminated ceramic...  

Matches 501 - 550 out of 10,337