Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 501 - 550 out of 10,440

Document Document Title
WO/2009/150328
1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: - fr...  
WO/2009/150328
1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: - fr...  
WO/2009/150832
Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has exc...  
WO/2009/150818
Disclosed is a flame-retardant adhesive composition which does not contain any halogen compound and contains a phosphorus compound. Also disclosed is a novel laminated film having superior flame retardancy. The laminated film comprises...  
WO/2009/147024
The invention provides for the use of polymers (P) which comprise at least one structural element of the general formula (I), polymer-R2-Y-CH2-SiXnR1 3-n (I) where R1, R2, Y, X and n are each as defined in claims 1 and 3, as a binder or ...  
WO/2009/139318
Provided is a manufacturing method of a laminate, wherein the method has a process in which two or more layers of polycarbonate resin film and/or sheet are laminated by using a (meth)acrylate adhesive composition containing (A) a (meth)a...  
WO/2009/133897
Disclosed is a connecting material that, even when joined at a curing temperature of 200°C or below without applying a load, has a high coefficient of thermal conductivity and has a satisfactory bonding strength even when a cured produc...  
WO/2009/133901
Provided is a circuit connecting material (20) which electrically connects a pair of facing circuit electrodes by applying a pressure to the circuit electrodes in a direction wherein the circuit electrodes face each other, by arranging t...  
WO/2009/128530
Disclosed is an adhesive composition containing (a) a thermoplastic resin, (b) a radically polymerizable compound containing two or more (meth)acryloyl groups and two or more urethane bonds in a molecule and having a weight average molec...  
WO/2009/128514
Disclosed is an adhesive material tape (10) comprising a tape-like backing (1) having a first surface (F1) and an opposing second surface (F2), and an adhesive layer (2) formed on the first surface (F1) of the backing (1) and containing ...  
WO/2009/125672
Disclosed is an adhesive composition with which a surface protective film can be easily bonded to a glass surface. By using the adhesive composition, residues resulting from the surface protective film (specifically, from an adhesive lay...  
WO/2009/122878
In a pressure-sensitive adhesive composition or a pressure-sensitive adhesive sheet containing an energy ray-curable polymer, problems associated with the volatilization of a low-molecular weight compound contained in the composition are...  
WO/2009/119885
Disclosed is an adhesive composition, characterized by comprising a mixture of a hot-melt adhesive with a ferromagnetic material and having a shear force of not less than 20 N after heat (150°C, 10 min) bonding. Also disclosed is an adh...  
WO/2009/113616
Disclosed are adhesive compositions which contain amphiphilic molecule particles having a structure formed by aggregation of a base polymer and an amphiphilic molecule which has a hydrophilic group and a hydrophobic group in the molecule...  
WO/2009/107537
Disclosed is a curable composition which can be cured by heating or an active energy ray at room temperature. A cured product produced by using the composition is also disclosed. Specifically disclosed are an active energy ray-curable co...  
WO/2009/098884
Disclosed is an inorganic-polymer composite material, wherein hydrophilic inorganic compounds having a maximum length of 1-1,000 nm are unevenly distributed over the surfaces of polymer particles having an average particle diameter of 0....  
WO/2009/099191
Disclosed is a film for semiconductors, which comprises a sheet base and an adhesive layer formed on one side of the sheet base. The film for semiconductors is characterized in that the adhesive layer is composed of a resin composition c...  
WO/2009/096052
A corrugated-cardboard adhesive for preventing package stack crumbling which is characterized by comprising a mixture of a petroleum resin emulsion containing a mineral oil with a solution of a water-soluble resin. Examples of the water-...  
WO/2009/090119
An, in particular, pressure-sensitive adhesive which comprises expanded microballoons, wherein the bond strength of the adhesive comprising the expanded microballoons is reduced by at most 30%, preferably at most 20%, more preferably 10%...  
WO/2009/090922
A photosensitive adhesive composition which comprises (A) a resin having carboxy groups and/or hydroxy groups, (B) a thermosetting resin, (C) a radiation-polymerizable compound, and (D) photoinitiators and in which the mixture of all pho...  
WO/2009/084651
Disclosed are: an adhesive composition having excellent properties; and others. Specifically disclosed is an adhesive composition characterized by comprising bis(fluorosulfonyl) imide. The adhesive composition has properties equivalent o...  
WO/2009/084348
A metal member (3) to be bonded is bonded with an adhesive (6) to have a strength higher than the basic material strength of the metal member (3) to be bonded. A metal insertion coupling has a socket portion (4) in which an insertion hol...  
WO/2009/078409
Provided is a circuit connecting material, which is arranged between circuit electrodes facing each other, pressurizes the facing circuit electrodes and electrically connects the electrodes in the pressurizing direction. The circuit conn...  
WO/2009/072497
Provided is a circuit member connecting adhesive characterized in containing a curing resin, a thermosetting resin, a curing agent for curing resin, and barium sulfate.  
WO/2009/069783
Provided is a circuit member connecting adhesive for connecting circuit boards facing each other. The circuit member connecting adhesive is composed of a resin composition containing a thermoplastic resin, a thermosetting resin and a cur...  
WO/2009/060927
This invention provides an adhesive sheet for a semiconductor, which has good cuttability by expanding and can be separated into pieces, and possesses an excellent capability of being embedded into concaves and convexes in a wiring board...  
WO/2009/057530
This invention provides an adhesive composition for a semiconductor, comprising filler particles (A), a heat curing resin (B), and a sulfide bond-containing compound (C) represented by formula (1): -(S)n- (1) where n is an integer of 1 o...  
WO/2009/058018
Described is a moisture sealant composition for use in making wood joints. The composition is based on silyl polymers and provides a good moisture resistance and adhesive bond, By being gap-filling, the composition provides a better mois...  
WO/2009/054410
Disclosed is a circuit connecting material (50) for connecting a first electrode and a second electrode facing each other, which contains an adhesive composition (52) and conductive particles (10) dispersed in the adhesive composition (5...  
WO/2009/054387
Disclosed is a coated conductive powder which is useful as a conductive filler for an anisotropic conductive adhesive that is particularly used for electrically connecting circuit boards or circuit components. Also disclosed is a conduct...  
WO/2009/054386
Disclosed is a coated conductive powder having excellent electrical reliability, wherein aggregation of conductive particles is suppressed. Also disclosed is a conductive adhesive using such a coated conductive powder, which is capable o...  
WO/2009/047984
This invention provides a pressure sensitive adhesive double coated sheet (100) for electronic components. The pressure sensitive adhesive double coated sheet (100) comprises a pressure sensitive adhesive layer (3), a first release sheet...  
WO/2009/048176
A pressure-sensitive adhesive sheet which comprises a base sheet (1) and a pressure-sensitive adhesive layer (2) disposed on at least one surface thereof. The pressure-sensitive adhesive sheet is characterized in that (a) the pressure-se...  
WO/2009/047070
The invention relates to silane-substituted RAFT reagents of general formulae R1 n(OR2 )3-nSi-L1 -Rf -R3 (1a), R1 n(OR2 )3-nSi-L1 -Rf -L2 -Si(OR2 )3-nR1 n(1b), and R1 n(OR2 )3-n Si-L1 -Rf -L2 -Rf -L3 -Si(OR2 )3-nR1 n (1c), wherein R1, R2...  
WO/2009/044678
Disclosed is a circuit connecting material for connecting a first circuit member obtained by forming a first circuit electrode on a major surface of a first substrate with a second circuit member obtained by forming a second circuit elec...  
WO/2009/044801
This invention provides an adhesive composition which, while maintaining storage stability, can form a metallic bond in such a state that the cured product wets components and is spread well between components, and is excellent in adhesi...  
WO/2009/041550
Disclosed is an adhesive set composed of a liquid A containing a first polymer having an alkyldialkoxysilyl group represented by the general formula (I) below at an end of a molecule, and a liquid B containing a second polymer having a t...  
WO/2009/041674
This invention provides an electroconductive pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer having a thickness of 10 to 30 µm. The pressure-sensitive adhesive layer is formed of a pressure-sensitive adhe...  
WO/2009/038020
Disclosed is an adhesive composition for electronic components, which has excellent adhesion durability, thermal cycle performance and insulation reliability under high temperature conditions over a long time. Specifically disclosed is a...  
WO/2009/031472
Provided is an adhesive containing (a) a thermoplastic resin, (b) a radical polymerizable compound and (c) a radical polymerization initiator. The radical polymerizable compound is in a solid-state at a temperature of 30°C or below.  
WO/2009/025224
[PROBLEMS] To provide an adhesive tape that being an adhesive tape for use in clothing, especially an adhesive tape for use in nonsewn type clothing formed into clothing configuration with the use of an adhesive tape while minimizing sew...  
WO/2009/025787
A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 ...  
WO/2009/025787
A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 ...  
WO/2009/025058
[PROBLEMS] To provide a process for producing an adhesive sheet that exhibits a sufficient strength of retention for a relatively heavy metal artificial nail or jeweled artificial nail, and provide a relevant adhesive sheet. [MEANS FOR S...  
WO/2009/025787
A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 ...  
WO/2009/022516
Disclosed are: a method for producing an adhesive resin composition; a resin film; and a laminate. The method is characterized by kneading a saturated polyester resin having a melt index of 10 to 500 g/10 minutes and a thermoplastic resi...  
WO/2009/020040
Disclosed is a curable composition which has good workability and storage stability while keeping its properties including solvent-free property, rapid curability and good adhesion which cannot be achieved by a solvent-containing asphalt...  
WO/2009/017160
An adhesive composition which contains an elastomer having a solubility parameter of 18.5MPa1/2 or below, a tackifier having a hydroxyl value of 20mgKOH/g or above, and a near infrared absorbing coloring matter. The tackifier content is ...  
WO/2009/014077
The present invention aims to improve the balance among transparency, adhesiveness and yellowing resistance of a curable composition which is obtained by using an organic polymer having a reactive silicon group and applicable to sealing ...  
WO/2009/013968
Provided are an adhesive film which can connect an electronic component to a substrate without causing short-circuiting, a connecting method and a connected body. The adhesive film is provided with a first adhesive layer wherein conducti...  

Matches 501 - 550 out of 10,440