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Patent Searching and Data


Matches 551 - 600 out of 10,223

Document Document Title
WO/2008/082929
An adhesive composition including an etchant for a hard tissue surface, at least one multifunctional crosslinkable (meth)acrylate monomer with a functionality greater than 4, and water. The adhesive composition is a water-in-oil emulsion.  
WO/2008/078469
This invention provides an adhesive agent composition for temporal fixation, which can realize easy identification of a coated part in temporal fixation of an optical member and can easily distinguish the state of curing in a curing proc...  
WO/2008/078654
Disclosed is a curable composition having excellent curability and storage stability without containing a toxic organotin curing catalyst or a volatile compound. This curable composition enables to obtain a cured product having excellent...  
WO/2008/076184
A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R2 2Si02/2)b, (R2Si03/2)c , (SiO4/2)d, (R1 ')f, and (R2 3Si01/2)g, where each...  
WO/2008/075604
An organic damping material which by itself has excellent damping properties without being combined with other material(s), need not have a certain thickness or volume for ensuring sufficient damping performance, and is easy to process. ...  
WO/2008/075767
A pressure-sensitive adhesive sheet which comprises: a substrate having, on at least one side, recesses and protrusions in which any adjoining two recesses are interconnected to each other; and an air-impermeable pressure-sensitive adhes...  
WO/2008/072462
This invention provides a double-sided adhesive sheet (7) for fixing a liquid crystal display module unit (8) and a backlight unit (6) to each other in a liquid crystal display device. The double-sided adhesive sheet (7) comprises at lea...  
WO/2008/068996
[PROBLEMS] To provide: a thermosetting resin which can be used in the production of a laminate for use in an destiné à être employé dans un component, an electrical product or a fiber, particularly can be used in a multilayer circuit...  
WO/2008/069088
The present invention aims to prevent cutting of a dicing sheet, damage to a chuck table and fusion bonding of a dicing sheet to a chuck table by laser light during laser dicing. Specifically disclosed is a laser dicing sheet which is ch...  
WO/2008/064724
There are disclosed aqueous dispersions suitable for preparing pressure sensitive adhesive (PSA) comprising (a) monomer composition of (i) at least one hydrophobic monomer (Component I), (ii) at least one hydrophilic monomer (Component I...  
WO/2008/061828
The invention relates to a two-component binder system, consisting of a component A and a component B, wherein A) contains at least one polymer having at least two Michael acceptor groups, B) contains at least one polymer or oligomer hav...  
WO/2008/061827
The invention relates to a two-component binder system, consisting of a component A and a component B, containing A) at least one polymer that has at least one Michael acceptor group and additionally at least one Michael donor group, B) ...  
WO/2008/062866
Disclosed is a curable composition which exhibits good curability by using a non-organotin catalyst. Specifically disclosed is a curable composition containing an organic polymer (A) having a silicon-containing group which can be crossli...  
WO/2008/053713
A heat-peelable pressure-sensitive adhesive sheet which, even when applied to a flexible adherend or extremely small adherend, enables the adherend to be efficiently separated and recovered therefrom without breaking. The heat-peelable p...  
WO/2008/053694
[PROBLEMS] To provide a crystalline lamellar zirconium phosphate which is ion exchanger particles excellent in heat resistance and chemical resistance and utilizable as a trapping agent for impurity ions in electronic materials or as a r...  
WO/2008/050725
Disclosed is a near infrared ray-absorbable dye composition which can absorb near infrared ray with efficiency, has a high visible light transmittance, has excellent light resistance, heat resistance and wet heat resistance, is hardly de...  
WO/2008/047915
Disclosed is a film base material which shows good balance among flexibility, workability on film cutting, heat resistance, abrasion resistance, flame retardancy, and a property of hardly causing bleed-out when a bromine flame retardant ...  
WO/2008/047610
Disclosed is a film for semiconductor wherein an adhesive layer, a first cohesive layer and a second cohesive layer are bonded together in this order and the peripheral portion of the second cohesive layer extends beyond the peripheral p...  
WO/2008/044330
Disclosed is an adhesive tape containing a flux activation compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In this adhesive tape, the thermosetting resin may be an epoxy ...  
WO/2008/044266
A superstrong adhesive tape that in a strongly viscous structure simultaneously having an adhesive function and an adsorptive function, realizes an enhanced bonding strength. There is provided a superstrong adhesive tape comprising plast...  
WO/2008/038565
An anisotropic conductive adhesive composition is provided for connecting a first circuit member, which has a first circuit electrode on the main surface of a first substrate, and a second circuit member, which has a second circuit elect...  
WO/2008/035791
Disclosed is an adhesive resin composition containing (a) a thermosetting resin component such as an epoxy resin, (b) a latent curing agent, (c) a photopolymerizable resin component having an unsaturated group such as an acrylic monomer,...  
WO/2008/035709
Disclosed is a solvent-type removable adhesive composition which comprises a high-Tg polymer (A) having a glass transition temperature (Tg) of 0˚C or higher, a low-Tg polymer (B) having a Tg lower than that of the high-Tg polymer and al...  
WO/2008/035825
Disclosed is an adhesive sheet for marking, which comprises an adhesive layer on one surface of a non-vinyl-chloride-based resin base material and a crosslinked acryl urethane coating layer on the other surface of the base material, wher...  
WO/2008/031537
The invention relates to an adhesive composition which is in one embodiment a free flowing, water-redispersible powder adhesive, comprising about 30 to 99.9 wt.-% of at least one water-insoluble, film-forming polymer and/ or at least one...  
WO/2008/032539
Disclosed are a moisture-curable polymer having excellent curability, and a curable composition. Specifically disclosed is a polymer having a silicon group represented by the following general formula: -SiFaR1 bZc (wherein R1 represents ...  
WO/2008/029580
An anisotropic conductive tape (1) for electrically connecting opposed circuit electrodes to each other comprises a tape-like base (20) and adhesive agent layers (11b, 12b) arranged parallel with each other on the major surface of the ba...  
WO/2008/026517
A conductive bonding material which comprises: a thermosetting resin (7); low-melting metal particles (8) which melt at a temperature not higher than the thermosetting temperature of the thermosetting resin (7); high-melting metal partic...  
WO/2008/023565
Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board with a second circuit member wherein a plurality of s...  
WO/2008/023452
Disclosed is an adhesive tape (101) for electrically connecting conductive members to each other. The adhesive tape (101) comprises a resin layer (132) containing a thermocurable resin, a solder powder (103), and a curing agent. The sold...  
WO/2008/020768
A process for manufacturing a water resistant board from wood fibre involves the use of a liquid binder system using waste powder coating powder (either a thermosetting resin such as polyester or epoxy or a thermoplastic powder) together...  
WO/2008/021923
To provide a detaching method capable of detaching a first substrate and a second substrate bonded together through a pressure-sensitive adhesive film, while minimizing the physical external load imposed on these substrates. A method for...  
WO/2008/013661
The invention is an adhesive composition comprising one or more polymers having a flexible backbone and silane moieties capable of silanol condensation; one or more hydrophobic silanes having one or more hydrocarbyloxy groups and one or ...  
WO/2008/013661
The invention is an adhesive composition comprising one or more polymers having a flexible backbone and silane moieties capable of silanol condensation; one or more hydrophobic silanes having one or more hydrocarbyloxy groups and one or ...  
WO/2008/004287
It is intended to provide a conductive adhesive which does not have a problem of migration of a conductive metal upon applying voltage and exhibits a low resistance value. One embodiment of the invention relates to a conductive adhesive ...  
WO/2008/004399
The invention aims at providing a technique which brings about a remarkable improvement in the close adhesion of a fluororesin substrate and a non-coarsened metal foil through easier means and enables the formation of fine-pitch circuits...  
WO/2008/004367
A conductive particle comprising: a core particle having an electrical conductivity; and a insulating coating provided on the surface of the core particle and comprising an organic polymeric compound, wherein the conductive particle has ...  
WO/2007/132881
Disclosed is a double sided adhesive tape for fixing a polishing pad, which enables to improve the polishing accuracy of the polishing pad. Specifically disclosed is a double sided adhesive tape (1) for fixing a polishing pad, which has ...  
WO/2007/131986
The invention relates to a method for improving the elastic recovery of the cross-linked polymer mixtures (P), whereby A) alkoxysilane-terminated polymers (A) with at least one terminal group of general formula (I), -A-(CH2)m-SiR1 a(OR2)...  
WO/2007/126067
A nonaqueous pressure-sensitive adhesive composition characterized by containing both a non-water-soluble polymer (A) having functional groups capable of forming crosslink points with polyvalent metal ions and a polyvalent metal compound...  
WO/2007/125650
Disclosed is an adhesive tape for electrically connecting conductive members to each other. The adhesive tape comprises a resin, a solder powder and a curing agent having a flux activity, wherein the solder powder and the curing agent ar...  
WO/2007/123003
A circuit connecting adhesive film is provided for connecting a first circuit member, in which a first circuit electrode is formed on the main plane of a first substrate, with a second circuit member, in which a second circuit electrode ...  
WO/2007/122261
The current invention relates to a moisture-hardening composition that contains, in addition to a silane-functional polymer with end groups of formula (I), a reaction product that can be manufactured from an amino silane with primary ami...  
WO/2007/123167
Disclosed is a curable composition which exhibits excellent curability while using a non-organic-tin catalyst. Specifically disclosed is a curable composition which is characterized by containing (A) a polymer having a silicon group whic...  
WO/2007/119770
Disclosed is a vulcanizing adhesive composition containing 45-75% by weight of a phenol resin, preferably a mixture of a novolac-type phenol resin and a resol type phenol resin, 5-25% by weight of a halogenated polymer and 10-30% by weig...  
WO/2007/119867
Disclosed is a curable resin composition containing an organic polymer having a reactive silicon group, which composition has excellent workability (thixotropy and coating workability) required for adhesives for floor coverings and the l...  
WO/2007/116686
Disclosed is a thermally conductive pressure-sensitive adhesive composition (F) obtained by adding a flame-retardant thermally conductive inorganic compound (B) and an expanded graphite powder (E) into an adhesive and/or cohesive composi...  
WO/2007/114450
An anti-rust pressure-sensitive adhesive film for automotive brake disks which comprises a surface base film having a tensile modulus of 30-200 MPa, yield strength of 5 N/15 mm or lower, and yield elongation of 7.0% or less and a pressur...  
WO/2007/114159
A multilayer film, which is light in weight, thin and flexible, a laminated body including such multilayer film, and a method for manufacturing such laminated body are provided by forming the laminated body to the substrate. The laminate...  
WO/2007/111607
A radiation-curable adhesive/sealant composition comprises a radiation- curable rubber resin, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.  

Matches 551 - 600 out of 10,223