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Patent Searching and Data


Matches 551 - 600 out of 10,474

Document Document Title
WO/2009/022516A1
Disclosed are: a method for producing an adhesive resin composition; a resin film; and a laminate. The method is characterized by kneading a saturated polyester resin having a melt index of 10 to 500 g/10 minutes and a thermoplastic resi...  
WO/2009/020040A1
Disclosed is a curable composition which has good workability and storage stability while keeping its properties including solvent-free property, rapid curability and good adhesion which cannot be achieved by a solvent-containing asphalt...  
WO/2009/017160A1
An adhesive composition which contains an elastomer having a solubility parameter of 18.5MPa1/2 or below, a tackifier having a hydroxyl value of 20mgKOH/g or above, and a near infrared absorbing coloring matter. The tackifier content is ...  
WO/2009/014077A1
The present invention aims to improve the balance among transparency, adhesiveness and yellowing resistance of a curable composition which is obtained by using an organic polymer having a reactive silicon group and applicable to sealing ...  
WO/2009/013968A1
Provided are an adhesive film which can connect an electronic component to a substrate without causing short-circuiting, a connecting method and a connected body. The adhesive film is provided with a first adhesive layer wherein conducti...  
WO/2009/011383A1
Provided is an adhesive for an electronic component. The adhesive has excellent coating properties and contamination resistance for a bonded electronic component, and a highly reliable electronic component can be obtained by using the ad...  
WO/2009/011329A1
Disclosed is a curable composition having good curability and good tensile property (high elongation), wherein the amount of toxic dibutyltin compound content is reduced. Specifically disclosed is a curable composition characterized by c...  
WO/2009/011421A1
Disclosed is a detachable adhesive containing an organic adhesive component and a reaction product which is obtained by reacting an onium salt containing an oxidizing anion with an amine group of an amine compound at a reaction ratio of ...  
WO/2009/008448A1
Disclosed is a thermosetting adhesive for circuit member connection, which is composed of a resin composition containing a thermally crosslinkable resin and a curing agent reactive with the thermally crosslinkable resin and complex oxide...  
WO/2009/005130A1
An adhesive composition which comprises, as essential ingredients, a thermosetting resin ingredient (A) which at a temperature of 5-40°C is evenly compatible and mixable without separating out, a high-molecular ingredient (B), and a har...  
WO/2009/001605A1
This invention provides an anisotropic electroconductive material which, when an IC chip or flexible wiring is connected to a wiring board through an anisotropic elctroconductive material, does not cause a difference in continuity resist...  
WO/2009/001771A1
Disclosed are: an adhesive film which enables to connect an electronic component to a substrate without causing short-circuiting; a connection method; and an assembly. The adhesive film comprises a first adhesive layer and a second adhes...  
WO/2008/153883A1
Room temperature curing structural adhesive compositions including polyurethane oligomers having multi-methacrylate functionality, cycloalkylmethacrylate, at least one maleimide-functionalized compound and a cure system are disclosed. Th...  
WO/2008/149745A1
Disclosed is a bonding method which enables to firmly join two members without using an adhesive and without deteriorating fine structures and optical characteristics of the bonding surfaces. Also disclosed are a biochemical chip and an ...  
WO/2008/149820A1
Disclosed is a bonding method which enables to firmly join two members without using an adhesive and without deteriorating fine structures and optical characteristics of the bonding surfaces. Also disclosed are a biochemical chip and an ...  
WO/2008/149678A1
A method for electrically connecting an electronic component with high reliability of electrical connection after the electrical connection, enabling correct counting of captured conductive particles and a joined body are provided. The e...  
WO/2008/149787A1
[PROBLEMS] To provide: a resin-coated metal sheet which has a chromium-free surface treatment layer and has a coating formed by applying an organic resin, and which is excellent in adhesion and corrosion resistance even after formation b...  
WO/2008/146014A3
An adhesive material comprising at least one adhesive polymeric resin, at least one low aspect ratio metal-coated additive, and at least one high aspect ratio metal-coated additive. There is additionally provided an adhesive material com...  
WO/2008/146688A1
A method for producing anisotropic conductive adhesive exhibiting high connection reliability of electronic component while preventing short circuit of a terminal. A method for connecting an electronic component using an anisotropic cond...  
WO/2008/146014A2
An adhesive material comprising at least one adhesive polymeric resin, at least one low aspect ratio metal-coated additive, and at least one high aspect ratio metal-coated additive. There is additionally provided an adhesive material com...  
WO/2008/145618A1
Adhesive and sealant systems Adhesive and sealant systems on the basis of unsaturated polyester resins, epoxy resins, polyurethane, silane-terminated polymers, vinyl ester resins, acrylates, polyvinyl acetate, polyvinyl alcohol, polyviny...  
WO/2008/146849A1
A heat-releasable pressure-sensitive adhesive sheet that excelling in rugged surface follow-up property, exhibits a satisfactory adhesive strength even when a bonding face of adherend is rough, and that in the use as a pressure-sensitive...  
WO/2008/146793A1
In an electric device (1), a wiring board (20) and an electric component (25), which has a connecting terminal (27) arranged at least on one surface, are fixed by a curing adhesive layer (12a).The curing adhesive layer (12a) is provided ...  
WO/2008/143010A1
Disclosed is a resin composition which is suitable for production of an adhesive of an adhesive sheet for electrostatic charge prevention. This resin composition is excellent in adhesive properties and anti-contaminating property for an ...  
WO/2008/143358A1
An electric device (40) is provided with land sections (63, 64) arranged on a wiring board (60); and connecting sections (41, 42), which have connecting terminals (67, 68) of the electric component (65) facing each other and are electric...  
WO/2008/140059A1
Disclosed is a flake glass made from a glass composition which has a light transmittance at a wavelength of 360 nm of not less than 80% when molded into a glass plate having a thickness of 1 mm, while having a refractive index at a wavel...  
WO/2008/139857A1
Disclosed is an anisotropic conductive adhesive film for making an electrically conductive connection between electronic components or the like. This anisotropic conductive adhesive film comprises a first releasing film (2) provided with...  
WO/2008/140094A1
Disclosed is a circuit-connecting material for electrically interconnecting two circuit members each having a circuit electrode formed thereon with the circuit electrodes being opposed to each other. The circuit-connecting material compr...  
WO/2008/133118A1
The invention aims at providing a heat-peelable pressure -sensitive adhesive sheet which is little deformed by pressure and is excellent in cohesive strength even under a high -temperature atmosphere and which can keep proper pressure -s...  
WO/2008/133104A1
This invention provides a pressure-sensitive adhesive sheet for water jet laser dicing, which can realize fabrication of a very thin semiconductor wafer or material without causing defects such as breaking in the separation of chips, IC ...  
WO/2008/133120A1
Disclosed is a thermally releasable double-sided adhesive sheet which can be used suitably in a cutting process for a laminated ceramic sheet under a high-temperature atmosphere. Also disclosed is a method for cutting a laminated ceramic...  
WO/2008/133186A1
[PROBLEMS] To improve transfer characteristics of a circuit connecting adhesive film to a circuit member while maintaining adhesion strength and long-term connection reliability after circuit connection at sufficiently high levels. [MEAN...  
WO/2008/129749A1
An adhesive material (B), which is characterized by having a plural number of (micro) capsules (1) comprising a water-proof outer wall (2) being breakable under an external force, a moisture-hardening adhesive agent (3) enclosed in the o...  
WO/2008/126718A1
Provided is a method for obtaining semiconductor chips from a semiconductor wafer at high yield while sufficiently suppressing generation of chip cracks and burrs. The method for manufacturing the semiconductor chips is provided with a s...  
WO/2008/123552A1
Disclosed is an adhesive material which has good coatability at a low viscosity, can be produced in a solvent-free form, has good adhesion to an object and excellent removability, produces a reduced amount of electrostatic charge when th...  
WO/2008/111598A1
Disclosed is a curable composition having excellent curability without containing a toxic organotin curing catalyst. This curable composition enables to obtain a cured product having excellent mechanical strength and suppressed in surfac...  
WO/2008/111663A1
A pressure sensitive adhesive film for wheel bonding, comprising a substratum film and, superimposed on one major surface thereof, a pressure sensitive adhesive layer, which pressure sensitive adhesive film has a ring adhesive strength o...  
WO/2008/110394A1
The invention relates to a one-component structural adhesive, having a flow limit of at least 1500 Pa and initial adhesion of more than 30 g/cm2, comprising at least one thickening agent and/or at least one filler. The invention further ...  
WO/2008/102616A1
Disclosed are: a cleaning sheet excellent in both of conveyability in a substrate-processing apparatus and an ability of removing foreign matters adhered in the apparatus; a conveying member having a cleaning function, which employs the ...  
WO/2008/102907A1
A near-infrared shielding film composed of a substratum film having, superimposed on its one major surface, a hard coat layer produced from a hard coat layer forming material containing a near-infrared absorbent and an actinic energy rad...  
WO/2008/102618A1
This invention provides a pressure sensitive adhesive tape for fastening a rolled aluminum electrolytic capacitor, which, even when used in an aluminum electrolytic capacitor, does not cause any lowering in electrostatic capacitance caus...  
WO/2008/100801A1
The invention is a composition comprising a) one or more organotitanates having four ligands wherein the ligands are hydrocarbyl, optionally containing one or more functional groups having one or more heteroatoms selected from the group ...  
WO/2008/099925A1
Disclosed is a conductive adhesive composition which does not deteriorate the conductivity of a metal powder and is suppressed in decrease of conductivity due to rust of the metal powder even when stored or used for a long time under hig...  
WO/2008/099858A1
Disclosed is a curable composition which is commercially highly practical and exhibits excellent curability even when a filler and a non-organotin catalyst are used. Specifically disclosed is a curable composition obtained by mixing (A) ...  
WO/2008/096530A1
Disclosed is a low-cost adhesive resin composition which is applicable to a base not having sufficient adhesiveness. Specifically disclosed is an adhesive resin composition containing a polymer (A) having no radically polymerizable doubl...  
WO/2008/096756A1
Disclosed is an aqueous adhesive composition exhibiting excellent adhesive performance from the viewpoints of water resistance, heat resistance and durability. The aqueous adhesive composition contains a base material containing at least...  
WO/2008/093648A1
Disclosed is a resin composition suitable for bonding a base layer such as a polyolefin layer with a barrier resin layer such as an ethylene-vinyl alcohol copolymer layer. Specifically disclosed is a resin composition (A) containing a th...  
WO/2008/090791A1
This invention provides an anisotropic electroconductive film which, when has been subjected to anisotropic electroconductive connection under pressure bonding conditions of pressure bonding temperature 130ºC or below and pressure bondi...  
WO/2008/088523A1
A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R22Si02/2)b, (R2Si03/2)c, (Si04/2)...  
WO/2008/084651A1
The invention aims at providing a curable composition which is free from organotin curing catalysts whose toxicity has been pointed out or from volatile compounds and which is excellent in curability, storage stability, and the strength ...  

Matches 551 - 600 out of 10,474