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WO/2005/108520 |
The invention relates to a two-component adhesive/sealant, comprising a component A, with at least one silane-terminated pre-polymer, at least one catalyst for silane cross-linking and low molecular weight, organofunctional silanes and a...
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WO/2005/108498 |
[PROBLEMS] Disclosed is a curable composition which exhibits good curability and good adhesiveness while using a catalyst other than organic tin catalysts. [MEANS FOR SOLVING PROBLEMS] Specifically disclosed is a curable composition cont...
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WO/2005/108491 |
[PROBLEMS] To provide a curable composition having good curability and adhesiveness. [MEANS FOR SOLVING PROBLEMS] A curable composition characterized by comprising (A) an organic polymer containing a reactive silicon group, (B) a titaniu...
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WO/2005/108493 |
[PROBLEM] Disclosed is a curable composition which exhibits high thixotropy and good curability while using a catalyst other than organic tin catalysts. [MEANS FOR SOLVING PROBLEMS] Specifically disclosed is a curable composition which i...
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WO/2005/108492 |
[PROBLEMS] Disclosed is a curable composition which exhibits good curability and adhesiveness with use of a non-tin curing catalyst, and hardly suffers from deterioration in mechanical characteristics after storage. [MEANS FOR SOLVING PR...
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WO/2005/105633 |
An anisotropic conductive film layer is adhered on an anisotropic conductive film holding tape (1). A splice tape (5) is bonded by an adhesive tape (6) on one edge part or both edge parts in a longitudinal direction of a base film (3) wh...
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WO/2005/103185 |
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WO/2005/103186 |
A gel adhesive composition comprising a crosslinked water-soluble polymer, water, a moisture retention agent, an amphipathic polymer, a sticky water-insoluble polymer and an electrolyte salt, wherein based on the total amount of composit...
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WO/2005/097909 |
Transparent curable compositions which can be of the one-pack type and give a cured article excellent in strength, elongation at break, weatherability, and adhesion. One of the curable compositions comprises 100 parts by weight of a viny...
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WO/2005/097934 |
A curable adhesive composition kit and method of adhering substrates is provided having three basic adhesives and up to three additional optional adhesives. The basic adhesives include: at least one curable silicone end group-containing ...
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WO/2005/095485 |
A hardenable composition that despite a low viscosity, yields elastomers with a wide range of properties from hardness to softness and yields a transparent hardened matter excelling in weather resistance and thermal stability, which tran...
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WO/2005/096442 |
An anisotropic conductive film, which is applicable to a narrower pitch of an object to be connected, while maintaining connection reliability, is provided at a low cost compared with the conventional ones. A method for manufacturing suc...
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WO/2005/090510 |
A resin composition useful as the adhesive for bonding semiconductor chips or heat-dissipating members, characterized by comprising at least (A) a filler, (B) a compound which contains a structure represented by the general formula (1) i...
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WO/2005/087865 |
A moisture-curable composition having excellent performance required of the adhesives or fixatives for use in assembling electrical or precision appliances for which flame retardancy is required. The composition comprises as essential in...
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WO/2005/087888 |
A heat-peelable pressure-sensitive adhesive sheet in which the pressure-sensitive adhesive layer can be prevented from being deformed by pressing and which can improve unsusceptibility to chipping during grinding or cutting. After proces...
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WO/2005/087887 |
A heat-peelable pressure-sensitive adhesive sheet in which the pressure-sensitive adhesive layer can be prevented from being deformed by pressing in a pressing step and which, after processing, enables the processed work to be easily sep...
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WO/2005/087822 |
A liquid composition containing no solvent, which comprises a low molecular weight organic compound having at least one reactive group (with the proviso that an ionic liquid having a polymerizable group is excluded) and/or at least one p...
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WO/2005/085309 |
The invention relates to a method for hardening a photosensitive filler material, in particular, an adhesive and a hardening device, whereby a photosensitive material for hardening is irradiated with UV light and a narrow-band UV laser l...
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WO/2005/077996 |
The invention relates to a tackifier dispersion comprising a resinous material and an emulsifier, the emulsifier being obtainable by a method comprising providing an ester of one or more fatty acids containing at least two conjugated dou...
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WO/2005/078037 |
Adhesives comprising up to about (40) wt % of an ionomer can be applied at low temperatures and exhibit good bond strength. The adhesives are particularly useful as elastic attachment adhesives.
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WO/2005/076376 |
[Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions. [Means for Solving the Problem] An adhesive sheet for a light-emitting diode d...
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WO/2005/075552 |
A thermoplastic resin composition which comprises a thermoplastic resin (A) having a specific moisture permeability, at least one unvalcanized rubber (B) selected from the group consisting of a halogenated product of a copolymer of p-met...
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WO/2005/073334 |
A pressure sensitive adhesive composition which comprises (A) an organic polymer containing a hydrolyzable silyl group which has 1.3 or more pieces of a hydrolyzable silyl group in one molecule thereof and has a number average molecular ...
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WO/2005/073333 |
A pressure sensitive adhesive composition which comprises (A) an oxyalkylene based polymer which contains 0.3 to 0.7 equivalent of a hydrolyzable silyl group in one molecule thereof and has a number average molecular weight of 15,000 to ...
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WO/2005/071015 |
Disclosed is a curing composition which enables to obtain a rubber-like cured product which has attained an improved weather-resistant adhesiveness to a photocatalyst coated transparent base while maintaining adhesiveness to general-purp...
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WO/2005/068573 |
An adhesive film (4) having a first resin layer (10), a second resin layer (20) formed on the front surface of the first resin layer (10), and a third resin layer (15) formed on the rear surface of the first resin layer (10), wherein the...
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WO/2005/068726 |
To provide a structural material useful as a material for a flooring marking sheet excellent in abrasion resistance and stripping properties at low temperatures. A marking sheet having an elongation percentage of 20% or more under an env...
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WO/2005/066268 |
It is intended to provide a composition which has well-balanced pressure-sensitive adhesiveness and cohesive force as well as favorable application properties to the skin, and a skin patch which has the above-described characteristics an...
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WO/2005/066283 |
The invention relates to a moisture cross-linkable adhesive composition, which can be used as an adhesive and as sealants, and which is very easy to use while exhibiting excellent bonding capacities. The composition is obtained by mixing...
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WO/2005/056708 |
Polymers with improved bioadhesive properties and methods for improving bioadhesion of polymers have been developed. A compound containing an aromatic group which contains one or more hydroxyl groups is grafted onto a polymer or coupled ...
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WO/2005/057647 |
A silicone adhesive agent for joining a semiconductor pellet and a member for mounting said pellet, which comprises a addition reaction curing type silicone rubber composition exhibiting a stain onto a glass plate during curing by heatin...
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WO/2005/052085 |
[PROBLEMS] To provide an adhesive composition employed to fix a semiconductor wafer or the like onto a support base, which adhesive composition exhibits firm adherence of high thermal stability at the time of grinding operation but after...
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WO/2005/043493 |
An opening seal having a higher discriminating property than conventional ones is obtained. The discriminating medium (100) comprises a cholesteric liquid crystal layer (104) having a circular polarization selectivity, a base material la...
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WO/2005/038894 |
A surface-protecting sheet not producing any dimple when a wafer is lapped to an extremely small thickness, nor causing damage to and contamination of the wafer where even high bumps are arranged at high density, nor leaving any adhesive...
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WO/2005/035681 |
Pressure sensitive adhesive sheet (1) comprising substrate (2), the substrate (2) having its side of pressure sensitive adhesive layer (3) furnished with recess grooves (21) continuing to side end portion of the substrate (2), and pressu...
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WO/2005/034293 |
A second anisotropic conductive sheet (1) comprises a non-conductive second sheet elastomer (1A) and third elastomers (1B) which are conductive between the front and back sides of the sheet and formed in the second sheet elastomer (1A). ...
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WO/2005/033243 |
The invention relates to a hot-melt-type adhesive, comprising A) 20 - 95 wt. % of at least one sugar alcohol and B) 5 - 80 wt. % of at least one water-soluble or water-dispersible polymer. The inventive adhesive is water-soluble and is u...
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WO/2005/031759 |
Disclosed is a conductive particle for anisotropic conductive adhesives which provides sufficient insulation against a fine-pitch connection terminal. A conductive particle (3) comprises a conductive core body (30) having a conductive su...
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WO/2005/026280 |
A releasable adhesive tape comprising an extensible substrate layer and a pressure sensitive adhesive layer held on at least one surface of said substrate layer, wherein one end portion is divided parallel to the longitudinal direction o...
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WO/2005/023913 |
To provide a film having high tensile strength and elongation characteristics. A methacrylic film formed of (A) a carboxyl group-containing (meth)acrylic polymer having a glass transition temperature (Tg) of 0°C or higher and a weight-a...
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WO/2005/023954 |
An adhesive agent which comprises a binder component and an inorganic filler, and further comprises a silane coupling agent having a functional group capable of reacting with the binder component. The functional group capable of reacting...
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WO/2005/019367 |
A double-sided pressure-sensitive adhesive sheet comprising a laminate containing a flexible base layer, a first black layer and second black layer and a first pressure-sensitive adhesive layer and second pressure-sensitive adhesive laye...
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WO/2005/010056 |
An anaerobically curable composition comprising (a) a compound having at least one radical-polymerizable functional group in the molecule, (b) an organic peroxide, (c) o-benzoic sulfimide, and (d) a complex of a metal other than alkali m...
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WO/2005/005162 |
A shading decorative sheet comprises a transparent base layer (1) having a back face and a front face opposing to the back face, which comprises a thermoplastic resin film, a decorative layer (2) provided on said front face of the base l...
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WO/2004/113464 |
The present invention provides adhesive tapes that can be firmly bonded to a bonded article at a temperature below an activation temperature and cannot be easily peeled and removed, but can be easily peeled without substantially leaving ...
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WO/2004/112058 |
A flat cable covering material which has a base material film and, provided on one surface thereof, a thermal adhesive layer (P + V) containing at least a filler (P) and a thermoplastic resin (V), wherein the mass proportion (P)/(P + V) ...
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WO/2004/110125 |
An electromagnetic shielding adhesive composite material comprising a thermoplastic binder made of an adhesive agent composition and organic synthetic fibers, having thereon electrically conductive surface-coating, dispersed in the binde...
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WO/2004/108304 |
An adhesive layer forming method capable of forming an adhesive layer to a specified thickness in a step for forming the adhesive layer on the surface of a member to be treated for forming a film containing powder in the member to be tre...
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WO/2004/107423 |
A method of producing a film-thinning circuit board, comprising the steps of (a) grooving a candidate penetration portion in the surface of a circuit board to at least a depth as much as the thickness of a final product, (b) attaching a ...
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WO/2004/107820 |
A portable electromagnetic induction heating device which is used to heat an adhesive with a conductor heated by Joule heat produced by running an induction current to the conductor. A heating induction coil (13a) is formed of a pluralit...
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