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Patent Searching and Data


Matches 551 - 600 out of 18,357

Document Document Title
WO/2013/125388A1
Provided is a manufacturing method for a connection structure in which an anisotropic conductive connection layer is interposed between a terminal provided to a flexible display and a terminal of an electronic component, and the flexible...  
WO/2013/121796A1
Provided is a multilayer porous sheet for suction applications that has a non-conventional structure and is located on the suction surface of a suction unit, thereby preventing contact between said suction surface and an object to which ...  
WO/2013/122060A1
A semiconductor-wafer-surface-protective adhesive tape having a pressure-sensitive adhesive layer on a substrate film, wherein the thickness of the adhesive layer is 10μm or more, the surface free energy (γs) of the surface of the adhe...  
WO/2013/121854A1
Provided is an adhesive tape formed integrally by co-extruding a base layer, a rear treatment layer formed on one surface of the base layer, and an adhesive layer formed on the other surface of the base layer, said adhesive tape having e...  
WO/2013/122117A1
 A thermoconductive adhesive sheet, wherein the quantity of organic compound gas generated by heating for 30 minutes at a temperature of 150°C does not exceed 50μg/cm2, and the thermal resistance after being stored for 30 minutes at ...  
WO/2013/118562A1
An adhesive agent for a laminate is prepared from: an aqueous resin produced by reacting an isocyanate-group-terminal prepolymer having an anionic group with a chain extender; a wettable inorganic layered compound; and a water-dispersibl...  
WO/2013/118747A1
This solar cell module is provided with: a solar cell element; a protective member which is arranged on one side of the solar cell element in the thickness direction; an adhesive layer which is interposed between the solar cell element a...  
WO/2013/114956A1
Provided is a stretchable thermal-release adhesive sheet which: exhibits excellent heat-resistance and stretchability; can accommodate setting the processing temperature and thermal-release temperature to a high temperature when cutting ...  
WO/2013/115132A1
The purpose of the present invention is provide a slidable adhesive tape that allows the amount of outgassing, particularly of siloxane gas, to be greatly reduced. A slidable adhesive tape (6) comprises an adhesive layer (2) and a peelab...  
WO/2013/115338A1
A flame-retardant heat-conductive adhesive sheet having: a base material; and a flame-retardant heat-conductive adhesive layer provided on at least one surface of the base material. The base material comprises a polyester film, the ratio...  
WO/2013/114955A1
Provided is a thermally releasable protective tape for sliding, which: exhibits excellent sliding properties without detaching during use from that to which the tape is adhered; and is capable of being easily removed from that to which t...  
WO/2013/115116A1
Provided is a surface-protective film which exhibits excellent heat-resistance, is capable of ensuring visibility in an optical inspection test, and is unlikely to be scratched. This surface-protective film has an adhesive layer and a su...  
WO/2013/111688A1
Provided are heat-expandable microspheres which contains a blowing agent encapsulated in high yield and which have excellent heat expandability, a process for producing the heat-expandable microspheres with satisfactory reproducibility, ...  
WO/2013/111634A1
The present invention provides a method for preventing the fouling of a structure. The method for preventing the fouling of a structure comprises step (1) and steps (2a-1) to (2a-2) or step (2b): (step 1) providing an anti-fouling adhesi...  
WO/2013/111883A1
Provided is a resin acid ester-type of adhesiveness-imparting agent which has good compatibility with synthetic rubber elastomers, can have a decreased melt viscosity, and can impart excellent adhesion/cohesion properties. As the adhesiv...  
WO/2013/108740A1
Provided are conductive particles which are capable of lowering the connection resistance between electrodes in cases where the conductive particles are used for the connection between the electrodes. A conductive particle (21) of the pr...  
WO/2013/108843A1
Provided are conductive particles which are capable of effectively lowering the connection resistance in cases where the conductive particles are used for the electrical connection between electrodes. A conductive particle (1) of the pre...  
WO/2013/108842A1
Provided are conductive particles which are capable of effectively lowering the connection resistance in cases where the conductive particles are used for the electrical connection between electrodes. A conductive particle (1) of the pre...  
WO/2013/105582A1
The purpose of the present invention is to provide: an adhesive composition having excellent heat resistance, which has high adhesive power and can still be easily released; an adhesive tape which uses the adhesive composition; and a met...  
WO/2013/105377A1
Provided is a surface protection film which can have a balanced combination of satisfactory conformability to the surface irregularities of an adherend with the ability to be removed lightly. This surface protection film comprises a base...  
WO/2013/103065A1
Provided is an adhesive composition, adapted for use in seawater, which is able to offer a favorable balance between the property of less readily peeling away from an adherend during use in seawater and the property of being more readily...  
WO/2013/103092A1
Provided is an adhesive tape for preventing aquatic biofouling, which has excellent impact resistance and can prevent damage to or loss of an antifouling layer due to a colliding object. This adhesive tape for preventing aquatic biofouli...  
WO/2013/103091A1
Provided is an adhesive tape for preventing aquatic biofouling, which can be readily attached with favorable workability even to sites other than a flat surface, such as a curved surface or an acutely angled surface, and is less suscepti...  
WO/2013/103116A1
The purpose of the present invention is to provide a wafer-processing tape that does not result in displacement at the interface between the adhesive layer and the sticky agent layer due to expansion, that has uniform expansion propertie...  
WO/2013/103282A1
The present application relates to an encapsulation film, an electronic device, and a manufacturing method therefor. The present application can provide an encapsulation film having excellent moisture barrier properties, handling propert...  
WO/2013/100301A1
In one embodiment of the present invention, a starch-based hot-melt adhesive is provided which consists of a composition comprising starch, a thermoplastic polymer, a tackifying agent, a plasticizer and an adhesion promoter. The hot-melt...  
WO/2013/099800A1
The purpose of the present invention is to fabricate a laminated structure with excellent adhesiveness. The present invention is a fabrication method for a laminated structure in which a first base material, an adhesive layer, and a seco...  
WO/2013/099755A1
Favorable conformity to the adherend and excellent impact resistance can be achieved with a pressure sensitive adhesive tape using a specific foam base material wherein: the mean bubble diameter in the flow direction (MD) and the transve...  
WO/2013/094564A1
Provided is a mounting table (70) which is capable of preventing deterioration of an adhesive used in adhesive bonding of an electrostatic chuck, and a plasma processing apparatus (10) which comprises the mounting table (70). The mountin...  
WO/2013/093951A1
Composition, and processes for the production and use of mixture of water soluble biopolymers, said mixture comprising an organic fraction and a mineral fraction, the organic fraction comprising polymer molecules having a molecular weigh...  
WO/2013/093652A1
A pressure-sensitive adhesive material including a visco-elastic layer and an elastic layer is provided. In some embodiments, a reusable pressure-sensitive adhesive material exhibiting high adhesive strength after repeated cycles of adhe...  
WO/2013/088686A1
This adhesive resin composition contains a foaming adhesive polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by general formula (1) and an adhesive resin.  
WO/2013/088889A1
Provided is a production method for a transparent double-sided adhesive sheet having little variation in the storage modulus therefor caused by temperature variation, and also having few residual monomers. The production method for the t...  
WO/2013/084952A1
[Problem] To provide an adhesive sheet for wafer processing that satisfies characteristics such as: (1) protecting an uneven circuit surface during grinding with an adhesive force that is not excessively weak; (2) being easy to remove af...  
WO/2013/080792A1
Provided is a protective sheet that achieves a high level of both easy peeling from and adhesion to an adherend. The protective sheet is provided with a base material and an adhesive agent layer provided to one surface of the base materi...  
WO/2013/081155A1
The present invention addresses the problem of providing with a simple production process and with high efficiency a new photosensitive azobenzene derivative which is capable of freely controlling phase transition by photostimulation, an...  
WO/2013/077306A1
An energy ray-curable liquid resin composition, which is used in the production of an optical component that is obtained by bonding a protective panel and a display element or a touch panel, or alternatively a touch panel and a display e...  
WO/2013/073563A1
An anisotropic conductive film for the anisotropic conductive connection of a substrate terminal and an electronic component terminal, which film comprises a conductive particle layer including conductive particles and a photocurable res...  
WO/2013/074338A1
The present disclosure relates to a rolled multilayer tire inner liner product and processes or methods for preparing a rolled multilayer tire inner liner product. The product comprises a film layer, two adhesive layers (each directly co...  
WO/2013/069784A1
The purpose of the present invention is to provide an adhesive tape that has a feel and texture that is very close to paper tape; that follows curved surfaces, rough surfaces, and irregular surfaces well; has excellent water resistance; ...  
WO/2013/066597A1
An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacry...  
WO/2013/065482A1
The sheet manufacturing device comprises a feeding means (10) for feeding a base sheet (BS), a first laminating means (20A) for laminating a first adhesive layer (AD1) on one surface of the base sheet (BS), and a second laminating means ...  
WO/2013/061925A1
The purpose of the present invention is to provide an adhesive tape whereby dicing can be performed by preventing cut dust from adhering to semiconductor devices without implementing extra improvement of equipment and introducing extra c...  
WO/2013/059549A1
Articles with thin caliper melt coatings of high molecular weight, high viscosity materials and methods of making such coatings.  
WO/2013/058526A2
The present invention relates to a self-adhesive protection film having improved release, and a product having the film attached thereto. In more detail, a carrier layer includes a monodispersive bead, or an embossed pattern is formed on...  
WO/2013/058290A1
An adhesive tape (100) for semiconductor device dicing, which is obtained by forming a radiation-curable adhesive layer (20) on a base film (10). The base film (10) is formed of two or more base resin film layers. A base resin film layer...  
WO/2013/058168A1
A conductive adhesive for connecting an electrode of a solar cell and a tab wire, which contains a curable resin, conductive particles, a curing agent and a black coloring agent that is formed only of titanium black.  
WO/2013/058526A3
The present invention relates to a self-adhesive protection film having improved release, and a product having the film attached thereto. In more detail, a carrier layer includes a monodispersive bead, or an embossed pattern is formed on...  
WO/2013/058380A1
An adhesive composition of the present invention contains a resin composition and a plurality of conductive particles, and when the maximum diameter in the particle size distribution of the conductive particles is represented by a and th...  
WO/2013/055733A1
The present invention relates to a B-stageable silicone adhesive having microencapsulation. The encapsulated B-stageable silicone adhesive allows lengthening the assembly time between applying the adhesive and lamination. Although exempl...  

Matches 551 - 600 out of 18,357