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Patent Searching and Data


Matches 601 - 650 out of 10,388

Document Document Title
WO/2008/061827
The invention relates to a two-component binder system, consisting of a component A and a component B, containing A) at least one polymer that has at least one Michael acceptor group and additionally at least one Michael donor group, B) ...  
WO/2008/062866
Disclosed is a curable composition which exhibits good curability by using a non-organotin catalyst. Specifically disclosed is a curable composition containing an organic polymer (A) having a silicon-containing group which can be crossli...  
WO/2008/053713
A heat-peelable pressure-sensitive adhesive sheet which, even when applied to a flexible adherend or extremely small adherend, enables the adherend to be efficiently separated and recovered therefrom without breaking. The heat-peelable p...  
WO/2008/053694
[PROBLEMS] To provide a crystalline lamellar zirconium phosphate which is ion exchanger particles excellent in heat resistance and chemical resistance and utilizable as a trapping agent for impurity ions in electronic materials or as a r...  
WO/2008/050725
Disclosed is a near infrared ray-absorbable dye composition which can absorb near infrared ray with efficiency, has a high visible light transmittance, has excellent light resistance, heat resistance and wet heat resistance, is hardly de...  
WO/2008/047915
Disclosed is a film base material which shows good balance among flexibility, workability on film cutting, heat resistance, abrasion resistance, flame retardancy, and a property of hardly causing bleed-out when a bromine flame retardant ...  
WO/2008/047610
Disclosed is a film for semiconductor wherein an adhesive layer, a first cohesive layer and a second cohesive layer are bonded together in this order and the peripheral portion of the second cohesive layer extends beyond the peripheral p...  
WO/2008/044330
Disclosed is an adhesive tape containing a flux activation compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In this adhesive tape, the thermosetting resin may be an epoxy ...  
WO/2008/044266
A superstrong adhesive tape that in a strongly viscous structure simultaneously having an adhesive function and an adsorptive function, realizes an enhanced bonding strength. There is provided a superstrong adhesive tape comprising plast...  
WO/2008/038565
An anisotropic conductive adhesive composition is provided for connecting a first circuit member, which has a first circuit electrode on the main surface of a first substrate, and a second circuit member, which has a second circuit elect...  
WO/2008/035791
Disclosed is an adhesive resin composition containing (a) a thermosetting resin component such as an epoxy resin, (b) a latent curing agent, (c) a photopolymerizable resin component having an unsaturated group such as an acrylic monomer,...  
WO/2008/035709
Disclosed is a solvent-type removable adhesive composition which comprises a high-Tg polymer (A) having a glass transition temperature (Tg) of 0˚C or higher, a low-Tg polymer (B) having a Tg lower than that of the high-Tg polymer and al...  
WO/2008/035825
Disclosed is an adhesive sheet for marking, which comprises an adhesive layer on one surface of a non-vinyl-chloride-based resin base material and a crosslinked acryl urethane coating layer on the other surface of the base material, wher...  
WO/2008/031537
The invention relates to an adhesive composition which is in one embodiment a free flowing, water-redispersible powder adhesive, comprising about 30 to 99.9 wt.-% of at least one water-insoluble, film-forming polymer and/ or at least one...  
WO/2008/032539
Disclosed are a moisture-curable polymer having excellent curability, and a curable composition. Specifically disclosed is a polymer having a silicon group represented by the following general formula: -SiFaR1 bZc (wherein R1 represents ...  
WO/2008/029580
An anisotropic conductive tape (1) for electrically connecting opposed circuit electrodes to each other comprises a tape-like base (20) and adhesive agent layers (11b, 12b) arranged parallel with each other on the major surface of the ba...  
WO/2008/026517
A conductive bonding material which comprises: a thermosetting resin (7); low-melting metal particles (8) which melt at a temperature not higher than the thermosetting temperature of the thermosetting resin (7); high-melting metal partic...  
WO/2008/023565
Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board with a second circuit member wherein a plurality of s...  
WO/2008/023452
Disclosed is an adhesive tape (101) for electrically connecting conductive members to each other. The adhesive tape (101) comprises a resin layer (132) containing a thermocurable resin, a solder powder (103), and a curing agent. The sold...  
WO/2008/020768
A process for manufacturing a water resistant board from wood fibre involves the use of a liquid binder system using waste powder coating powder (either a thermosetting resin such as polyester or epoxy or a thermoplastic powder) together...  
WO/2008/021923
To provide a detaching method capable of detaching a first substrate and a second substrate bonded together through a pressure-sensitive adhesive film, while minimizing the physical external load imposed on these substrates. A method for...  
WO/2008/013661
The invention is an adhesive composition comprising one or more polymers having a flexible backbone and silane moieties capable of silanol condensation; one or more hydrophobic silanes having one or more hydrocarbyloxy groups and one or ...  
WO/2008/013661
The invention is an adhesive composition comprising one or more polymers having a flexible backbone and silane moieties capable of silanol condensation; one or more hydrophobic silanes having one or more hydrocarbyloxy groups and one or ...  
WO/2008/004287
It is intended to provide a conductive adhesive which does not have a problem of migration of a conductive metal upon applying voltage and exhibits a low resistance value. One embodiment of the invention relates to a conductive adhesive ...  
WO/2008/004399
The invention aims at providing a technique which brings about a remarkable improvement in the close adhesion of a fluororesin substrate and a non-coarsened metal foil through easier means and enables the formation of fine-pitch circuits...  
WO/2008/004367
A conductive particle comprising: a core particle having an electrical conductivity; and a insulating coating provided on the surface of the core particle and comprising an organic polymeric compound, wherein the conductive particle has ...  
WO/2007/132881
Disclosed is a double sided adhesive tape for fixing a polishing pad, which enables to improve the polishing accuracy of the polishing pad. Specifically disclosed is a double sided adhesive tape (1) for fixing a polishing pad, which has ...  
WO/2007/131986
The invention relates to a method for improving the elastic recovery of the cross-linked polymer mixtures (P), whereby A) alkoxysilane-terminated polymers (A) with at least one terminal group of general formula (I), -A-(CH2)m-SiR1 a(OR2)...  
WO/2007/126067
A nonaqueous pressure-sensitive adhesive composition characterized by containing both a non-water-soluble polymer (A) having functional groups capable of forming crosslink points with polyvalent metal ions and a polyvalent metal compound...  
WO/2007/125650
Disclosed is an adhesive tape for electrically connecting conductive members to each other. The adhesive tape comprises a resin, a solder powder and a curing agent having a flux activity, wherein the solder powder and the curing agent ar...  
WO/2007/123003
A circuit connecting adhesive film is provided for connecting a first circuit member, in which a first circuit electrode is formed on the main plane of a first substrate, with a second circuit member, in which a second circuit electrode ...  
WO/2007/122261
The current invention relates to a moisture-hardening composition that contains, in addition to a silane-functional polymer with end groups of formula (I), a reaction product that can be manufactured from an amino silane with primary ami...  
WO/2007/123167
Disclosed is a curable composition which exhibits excellent curability while using a non-organic-tin catalyst. Specifically disclosed is a curable composition which is characterized by containing (A) a polymer having a silicon group whic...  
WO/2007/119770
Disclosed is a vulcanizing adhesive composition containing 45-75% by weight of a phenol resin, preferably a mixture of a novolac-type phenol resin and a resol type phenol resin, 5-25% by weight of a halogenated polymer and 10-30% by weig...  
WO/2007/119867
Disclosed is a curable resin composition containing an organic polymer having a reactive silicon group, which composition has excellent workability (thixotropy and coating workability) required for adhesives for floor coverings and the l...  
WO/2007/116686
Disclosed is a thermally conductive pressure-sensitive adhesive composition (F) obtained by adding a flame-retardant thermally conductive inorganic compound (B) and an expanded graphite powder (E) into an adhesive and/or cohesive composi...  
WO/2007/114450
An anti-rust pressure-sensitive adhesive film for automotive brake disks which comprises a surface base film having a tensile modulus of 30-200 MPa, yield strength of 5 N/15 mm or lower, and yield elongation of 7.0% or less and a pressur...  
WO/2007/114159
A multilayer film, which is light in weight, thin and flexible, a laminated body including such multilayer film, and a method for manufacturing such laminated body are provided by forming the laminated body to the substrate. The laminate...  
WO/2007/111607
A radiation-curable adhesive/sealant composition comprises a radiation- curable rubber resin, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.  
WO/2007/105378
Disclosed is an adhesive optical film wherein an adhesive layer is arranged on at least one side of an optical film via an anchor layer. The anchor layer has a thickness of 5-300 nm, while the adhesive layer has a thickness of 5-50 μm. ...  
WO/2007/097365
A pressure-sensitive adhesive layer of pressure-sensitive adhesive sheet is prepared by the use of a pressure-sensitive adhesive composition comprising (A) polyrotaxane having a linear-chain molecule passing through opening portions of a...  
WO/2007/093381
The adhesive is composed of a mixture of silane- terminated polyoxypropylenes and silane-terminated alkyl acrylates of together 25% to 70% by mass, 20% to 70% by mass of chalk powder, 0.5% to 5% by mass of drying agents, 0.5% to 5% by ma...  
WO/2007/094276
Disclosed is a curable composition which is excellent in surface curability and deep-section curability without using an organotin curing catalyst which is pointed out to be toxic. This curable composition enables to obtain a cured produ...  
WO/2007/094273
Disclosed is a curable composition using an amidine compound as a non-organic tin catalyst, which is good in elongation, flexibility, surface curability, deep-section curability and adhesion. Specifically disclosed is a curable compositi...  
WO/2007/094274
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties, while securing practical surface cura...  
WO/2007/094275
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties and good weather resistance, while sec...  
WO/2007/094272
The invention aims at providing a curable composition containing a guanidine as a nonorganotin catalyst which is little discolored and is excellent in the curability of both the surface and the depths and in the rising of strength and wh...  
WO/2007/089705
This invention relates to a moisture-curable silylated resin-containing composition containing, inter alia, moisture-curable silylated resin, the cured composition exhibiting low permeability to gas(es).  
WO/2007/088666
This invention provides a heat curable adhesive that, when an electronic component is pressure bonded onto a substrate with the aid of a heat curable adhesive such as an anisotropic electroconductive adhesive, can facilitate repair. The ...  
WO/2007/083566
Disclosed is an easily demountable adhesive which is used for forming a structure by bonding constitutional parts and enables to easily disassemble the bonded structure by having demountability. Specifically disclosed is a demountable ad...  

Matches 601 - 650 out of 10,388