Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 651 - 700 out of 15,192

Document Document Title
WO/2008/004367A1
A conductive particle comprising: a core particle having an electrical conductivity; and a insulating coating provided on the surface of the core particle and comprising an organic polymeric compound, wherein the conductive particle has ...  
WO/2007/132881A1
Disclosed is a double sided adhesive tape for fixing a polishing pad, which enables to improve the polishing accuracy of the polishing pad. Specifically disclosed is a double sided adhesive tape (1) for fixing a polishing pad, which has ...  
WO/2007/131986A3
The invention relates to a method for improving the elastic recovery of the cross-linked polymer mixtures (P), whereby A) alkoxysilane-terminated polymers (A) with at least one terminal group of general formula (I), -A-(CH2)m-SiR1 a(OR2)...  
WO/2007/126067A1
A nonaqueous pressure-sensitive adhesive composition characterized by containing both a non-water-soluble polymer (A) having functional groups capable of forming crosslink points with polyvalent metal ions and a polyvalent metal compound...  
WO/2007/125650A1
Disclosed is an adhesive tape for electrically connecting conductive members to each other. The adhesive tape comprises a resin, a solder powder and a curing agent having a flux activity, wherein the solder powder and the curing agent ar...  
WO/2007/123003A1
A circuit connecting adhesive film is provided for connecting a first circuit member, in which a first circuit electrode is formed on the main plane of a first substrate, with a second circuit member, in which a second circuit electrode ...  
WO/2007/122261A1
The current invention relates to a moisture-hardening composition that contains, in addition to a silane-functional polymer with end groups of formula (I), a reaction product that can be manufactured from an amino silane with primary ami...  
WO/2007/123167A1
Disclosed is a curable composition which exhibits excellent curability while using a non-organic-tin catalyst. Specifically disclosed is a curable composition which is characterized by containing (A) a polymer having a silicon group whic...  
WO/2007/119770A1
Disclosed is a vulcanizing adhesive composition containing 45-75% by weight of a phenol resin, preferably a mixture of a novolac-type phenol resin and a resol type phenol resin, 5-25% by weight of a halogenated polymer and 10-30% by weig...  
WO/2007/119867A1
Disclosed is a curable resin composition containing an organic polymer having a reactive silicon group, which composition has excellent workability (thixotropy and coating workability) required for adhesives for floor coverings and the l...  
WO/2007/116686A1
Disclosed is a thermally conductive pressure-sensitive adhesive composition (F) obtained by adding a flame-retardant thermally conductive inorganic compound (B) and an expanded graphite powder (E) into an adhesive and/or cohesive composi...  
WO/2007/114450A1
An anti-rust pressure-sensitive adhesive film for automotive brake disks which comprises a surface base film having a tensile modulus of 30-200 MPa, yield strength of 5 N/15 mm or lower, and yield elongation of 7.0% or less and a pressur...  
WO/2007/114159A1
A multilayer film, which is light in weight, thin and flexible, a laminated body including such multilayer film, and a method for manufacturing such laminated body are provided by forming the laminated body to the substrate. The laminate...  
WO/2007/111607A1
A radiation-curable adhesive/sealant composition comprises a radiation- curable rubber resin, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.  
WO/2007/105378A1
Disclosed is an adhesive optical film wherein an adhesive layer is arranged on at least one side of an optical film via an anchor layer. The anchor layer has a thickness of 5-300 nm, while the adhesive layer has a thickness of 5-50 μm. ...  
WO/2007/097365A1
A pressure-sensitive adhesive layer of pressure-sensitive adhesive sheet is prepared by the use of a pressure-sensitive adhesive composition comprising (A) polyrotaxane having a linear-chain molecule passing through opening portions of a...  
WO/2007/093381A1
The adhesive is composed of a mixture of silane- terminated polyoxypropylenes and silane-terminated alkyl acrylates of together 25% to 70% by mass, 20% to 70% by mass of chalk powder, 0.5% to 5% by mass of drying agents, 0.5% to 5% by ma...  
WO/2007/094276A1
Disclosed is a curable composition which is excellent in surface curability and deep-section curability without using an organotin curing catalyst which is pointed out to be toxic. This curable composition enables to obtain a cured produ...  
WO/2007/094273A1
Disclosed is a curable composition using an amidine compound as a non-organic tin catalyst, which is good in elongation, flexibility, surface curability, deep-section curability and adhesion. Specifically disclosed is a curable compositi...  
WO/2007/094274A1
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties, while securing practical surface cura...  
WO/2007/094275A1
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties and good weather resistance, while sec...  
WO/2007/094272A1
The invention aims at providing a curable composition containing a guanidine as a nonorganotin catalyst which is little discolored and is excellent in the curability of both the surface and the depths and in the rising of strength and wh...  
WO/2007/089705A1
This invention relates to a moisture-curable silylated resin-containing composition containing, inter alia, moisture-curable silylated resin, the cured composition exhibiting low permeability to gas(es).  
WO/2007/088666A1
This invention provides a heat curable adhesive that, when an electronic component is pressure bonded onto a substrate with the aid of a heat curable adhesive such as an anisotropic electroconductive adhesive, can facilitate repair. The ...  
WO/2007/083566A1
Disclosed is an easily demountable adhesive which is used for forming a structure by bonding constitutional parts and enables to easily disassemble the bonded structure by having demountability. Specifically disclosed is a demountable ad...  
WO/2007/077833A1
A potting material which, when used in stationary potting, is less apt to scramble up and can sufficiently penetrate into the spaces among porous hollow fibers. The potting material is one for fixing an end part of a group of porous holl...  
WO/2007/077779A1
Disclosed is a novel environmentally friendly, high-performance inorganic sulfate ion scavenger. The inorganic sulfate ion scavenger is characterized in that the amount of ionic impurities to be eluted in purified water is not more than ...  
WO/2007/074652A1
Provided is an adhesive composition which contains an adhesive ingredient, conductive particles and insulating particles. The ratio (Ri/Rc) of the average particle diameter (Ri) of the insulating particle to the average particle diameter...  
WO/2007/072799A1
Disclosed is an adhesive composition for optical use which enables to form an adhesive layer for closely bonding a glass substrate and an optical functional film in a liquid crystal cell as a component of a liquid crystal display. Such a...  
WO/2007/066640A1
[PROBLEMS] To provide a hardenable pressure-sensitive adhesive film which is excellent in cuttability and permits excellent shearing such as punching or perforating without adhesive spew. [MEANS FOR SOLVING PROBLEMS] A hardenable pressur...  
WO/2007/067404A2
Anionic emulsifiers based on rosin acid or derivatives thereof, and to methods of preparing said emulsifiers. The emulsifiers are useful for preparing tackifier dispersions having improved properties with respect to foam stability. As su...  
WO/2007/058159A1
An adhesive composition is provided with an adhesive component and conductive particles (10) dispersed in the adhesive component. The conductive particle (10) is provided with a base material particle (1) constituting the center portion,...  
WO/2007/055176A1
A pressure-sensitive adhesive base characterized by comprising a polymer having carboxy groups in the molecule and a crosslinking agent which crosslinks the polymer. It is further characterized in that the crosslinking agent is a compoun...  
WO/2007/052661A1
Disclosed is a conductive adhesive which prevents migration and sulfuration of a metal component during mounting of electronic components. Such a conductive adhesive is obtained by dispersing metal filler particles in a thermosetting res...  
WO/2007/049666A1
Disclosed is a fiber-reinforced composite resin composition which can be used as a sealing agent, an adhesive or a filler, specifically a fiber-reinforced composite resin composition which has low thermal expansion, high strength light w...  
WO/2007/048538A1
The invention relates to a-ethoxysilane-modified polymers of average general formula (I), wherein R represents a monovalent to quadrivalent polymer radical, no more than one third of the radicals R1, R2, and R3 contained in the polymer o...  
WO/2007/037485A1
Disclosed is a curable composition which is suppressed in bleed-out of a liquid compound to the surface of a cured product while using, as a silanol condensation catalyst, an amine compound which is a non-organic-tin catalyst. This curab...  
WO/2007/037014A1
It is intended to provide a building material which has an effect of promoting human health. A far infrared radiation material containing animal and plant plankton fossils collected from a place, which was once the sea bottom such as a c...  
WO/2007/037345A1
[PROBLEMS] To provide: a pressure-sensitive adhesive which causes no environmental deterioration and can produce a laminate with good efficiency in a simpler manner; and a pressure-sensitive adhesive which enables the repeated attachment...  
WO/2007/037368A1
A one-pack type curable composition which contains no organotin catalyst and is satisfactory in curability, adhesion, and storage stability. The one-pack type curable composition comprises (A) an organic polymer having a silicon-containi...  
WO/2007/037484A1
Disclosed is a curable composition which exhibits practical curability by using a non-organic-tin curing catalyst. This curable composition has good adhesive properties while maintaining practical curability. Specifically disclosed is a ...  
WO/2007/037483A1
Disclosed is a curable composition containing, as a component, an organic polymer having a reactive silicon group. This curable composition uses an amine compound as a non-organic-tin catalyst, while exhibiting good adhesiveness and wate...  
WO/2007/034925A1
A particle classification apparatus capable of precision classification of particles with uniform length; and an adhesive containing particles classified by the apparatus that is capable of inter-electrode connection under low pressure a...  
WO/2007/029733A1
Disclosed is a curable composition comprising a vinyl polymer having a cross-linkable silyl group at the end terminus, which can be cured over ample operation time and, if required, can also be cured rapidly, and shows excellent in heat ...  
WO/2007/023669A1
[PROBLEMS] To provide curable resin compositions useful as one-part moisture-curable adhesives which exhibit cure rates higher than those of conventional elastomeric adhesives and are excellent in adhesiveness. [MEANS FOR SOLVING PROBLEM...  
WO/2007/023834A1
Disclosed is an adhesive composition which is free from problems involved in conventional thermosetting resins while having adhesiveness sufficient for electronic component mounting, desired electrical characteristics and long-term durab...  
WO/2007/018239A1
An electropeeling composition that while at the time of fixing (adhesion, coating, etc.) to adherends, exhibiting satisfactory bonding strength thereto, can be easily detached from the adherends after use; and making use of the same, an ...  
WO/2007/015516A1
[PROBLEMS] To provide resin particles which are excellent in static properties, high-temperature storage stability, and thermal properties and have evenness of particle diameter. [MEANS FOR SOLVING PROBLEMS] The resin particles (D) compr...  
WO/2007/008558A2
A method and composition for forming an adhesive bond is described. The method includes depositing an aqueous dispersion on a substrate to form a selectively activatable coating, the aqueous dispersion including (A) a polymer capable of ...  
WO/2007/008558A3
A method and composition for forming an adhesive bond is described. The method includes depositing an aqueous dispersion on a substrate to form a selectively activatable coating, the aqueous dispersion including (A) a polymer capable of ...  

Matches 651 - 700 out of 15,192