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Patent Searching and Data


Matches 651 - 700 out of 15,387

Document Document Title
WO/2008/047610A1
Disclosed is a film for semiconductor wherein an adhesive layer, a first cohesive layer and a second cohesive layer are bonded together in this order and the peripheral portion of the second cohesive layer extends beyond the peripheral p...  
WO/2008/044330A1
Disclosed is an adhesive tape containing a flux activation compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In this adhesive tape, the thermosetting resin may be an epoxy ...  
WO/2008/044266A1
A superstrong adhesive tape that in a strongly viscous structure simultaneously having an adhesive function and an adsorptive function, realizes an enhanced bonding strength. There is provided a superstrong adhesive tape comprising plast...  
WO/2008/038565A1
An anisotropic conductive adhesive composition is provided for connecting a first circuit member, which has a first circuit electrode on the main surface of a first substrate, and a second circuit member, which has a second circuit elect...  
WO/2008/035791A1
Disclosed is an adhesive resin composition containing (a) a thermosetting resin component such as an epoxy resin, (b) a latent curing agent, (c) a photopolymerizable resin component having an unsaturated group such as an acrylic monomer,...  
WO/2008/035709A1
Disclosed is a solvent-type removable adhesive composition which comprises a high-Tg polymer (A) having a glass transition temperature (Tg) of 0˚C or higher, a low-Tg polymer (B) having a Tg lower than that of the high-Tg polymer and al...  
WO/2008/035825A1
Disclosed is an adhesive sheet for marking, which comprises an adhesive layer on one surface of a non-vinyl-chloride-based resin base material and a crosslinked acryl urethane coating layer on the other surface of the base material, wher...  
WO/2008/031537A1
The invention relates to an adhesive composition which is in one embodiment a free flowing, water-redispersible powder adhesive, comprising about 30 to 99.9 wt.-% of at least one water-insoluble, film-forming polymer and/ or at least one...  
WO/2008/032539A1
Disclosed are a moisture-curable polymer having excellent curability, and a curable composition. Specifically disclosed is a polymer having a silicon group represented by the following general formula: -SiFaR1 bZc (wherein R1 represents ...  
WO/2008/029580A1
An anisotropic conductive tape (1) for electrically connecting opposed circuit electrodes to each other comprises a tape-like base (20) and adhesive agent layers (11b, 12b) arranged parallel with each other on the major surface of the ba...  
WO/2008/026517A1
A conductive bonding material which comprises: a thermosetting resin (7); low-melting metal particles (8) which melt at a temperature not higher than the thermosetting temperature of the thermosetting resin (7); high-melting metal partic...  
WO/2008/023565A1
Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board with a second circuit member wherein a plurality of s...  
WO/2008/023452A1
Disclosed is an adhesive tape (101) for electrically connecting conductive members to each other. The adhesive tape (101) comprises a resin layer (132) containing a thermocurable resin, a solder powder (103), and a curing agent. The sold...  
WO/2008/020768A1
A process for manufacturing a water resistant board from wood fibre involves the use of a liquid binder system using waste powder coating powder (either a thermosetting resin such as polyester or epoxy or a thermoplastic powder) together...  
WO/2008/021923A1
To provide a detaching method capable of detaching a first substrate and a second substrate bonded together through a pressure-sensitive adhesive film, while minimizing the physical external load imposed on these substrates. A method for...  
WO/2008/013661A3
The invention is an adhesive composition comprising one or more polymers having a flexible backbone and silane moieties capable of silanol condensation; one or more hydrophobic silanes having one or more hydrocarbyloxy groups and one or ...  
WO/2008/013661A2
The invention is an adhesive composition comprising one or more polymers having a flexible backbone and silane moieties capable of silanol condensation; one or more hydrophobic silanes having one or more hydrocarbyloxy groups and one or ...  
WO/2008/004287A1
It is intended to provide a conductive adhesive which does not have a problem of migration of a conductive metal upon applying voltage and exhibits a low resistance value. One embodiment of the invention relates to a conductive adhesive ...  
WO/2008/004399A1
The invention aims at providing a technique which brings about a remarkable improvement in the close adhesion of a fluororesin substrate and a non-coarsened metal foil through easier means and enables the formation of fine-pitch circuits...  
WO/2008/004367A1
A conductive particle comprising: a core particle having an electrical conductivity; and a insulating coating provided on the surface of the core particle and comprising an organic polymeric compound, wherein the conductive particle has ...  
WO/2007/132881A1
Disclosed is a double sided adhesive tape for fixing a polishing pad, which enables to improve the polishing accuracy of the polishing pad. Specifically disclosed is a double sided adhesive tape (1) for fixing a polishing pad, which has ...  
WO/2007/131986A3
The invention relates to a method for improving the elastic recovery of the cross-linked polymer mixtures (P), whereby A) alkoxysilane-terminated polymers (A) with at least one terminal group of general formula (I), -A-(CH2)m-SiR1 a(OR2)...  
WO/2007/126067A1
A nonaqueous pressure-sensitive adhesive composition characterized by containing both a non-water-soluble polymer (A) having functional groups capable of forming crosslink points with polyvalent metal ions and a polyvalent metal compound...  
WO/2007/125650A1
Disclosed is an adhesive tape for electrically connecting conductive members to each other. The adhesive tape comprises a resin, a solder powder and a curing agent having a flux activity, wherein the solder powder and the curing agent ar...  
WO/2007/123003A1
A circuit connecting adhesive film is provided for connecting a first circuit member, in which a first circuit electrode is formed on the main plane of a first substrate, with a second circuit member, in which a second circuit electrode ...  
WO/2007/122261A1
The current invention relates to a moisture-hardening composition that contains, in addition to a silane-functional polymer with end groups of formula (I), a reaction product that can be manufactured from an amino silane with primary ami...  
WO/2007/123167A1
Disclosed is a curable composition which exhibits excellent curability while using a non-organic-tin catalyst. Specifically disclosed is a curable composition which is characterized by containing (A) a polymer having a silicon group whic...  
WO/2007/119770A1
Disclosed is a vulcanizing adhesive composition containing 45-75% by weight of a phenol resin, preferably a mixture of a novolac-type phenol resin and a resol type phenol resin, 5-25% by weight of a halogenated polymer and 10-30% by weig...  
WO/2007/119867A1
Disclosed is a curable resin composition containing an organic polymer having a reactive silicon group, which composition has excellent workability (thixotropy and coating workability) required for adhesives for floor coverings and the l...  
WO/2007/116686A1
Disclosed is a thermally conductive pressure-sensitive adhesive composition (F) obtained by adding a flame-retardant thermally conductive inorganic compound (B) and an expanded graphite powder (E) into an adhesive and/or cohesive composi...  
WO/2007/114450A1
An anti-rust pressure-sensitive adhesive film for automotive brake disks which comprises a surface base film having a tensile modulus of 30-200 MPa, yield strength of 5 N/15 mm or lower, and yield elongation of 7.0% or less and a pressur...  
WO/2007/114159A1
A multilayer film, which is light in weight, thin and flexible, a laminated body including such multilayer film, and a method for manufacturing such laminated body are provided by forming the laminated body to the substrate. The laminate...  
WO/2007/111607A1
A radiation-curable adhesive/sealant composition comprises a radiation- curable rubber resin, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.  
WO/2007/105378A1
Disclosed is an adhesive optical film wherein an adhesive layer is arranged on at least one side of an optical film via an anchor layer. The anchor layer has a thickness of 5-300 nm, while the adhesive layer has a thickness of 5-50 μm. ...  
WO/2007/097365A1
A pressure-sensitive adhesive layer of pressure-sensitive adhesive sheet is prepared by the use of a pressure-sensitive adhesive composition comprising (A) polyrotaxane having a linear-chain molecule passing through opening portions of a...  
WO/2007/093381A1
The adhesive is composed of a mixture of silane- terminated polyoxypropylenes and silane-terminated alkyl acrylates of together 25% to 70% by mass, 20% to 70% by mass of chalk powder, 0.5% to 5% by mass of drying agents, 0.5% to 5% by ma...  
WO/2007/094276A1
Disclosed is a curable composition which is excellent in surface curability and deep-section curability without using an organotin curing catalyst which is pointed out to be toxic. This curable composition enables to obtain a cured produ...  
WO/2007/094273A1
Disclosed is a curable composition using an amidine compound as a non-organic tin catalyst, which is good in elongation, flexibility, surface curability, deep-section curability and adhesion. Specifically disclosed is a curable compositi...  
WO/2007/094274A1
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties, while securing practical surface cura...  
WO/2007/094275A1
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties and good weather resistance, while sec...  
WO/2007/094272A1
The invention aims at providing a curable composition containing a guanidine as a nonorganotin catalyst which is little discolored and is excellent in the curability of both the surface and the depths and in the rising of strength and wh...  
WO/2007/089705A1
This invention relates to a moisture-curable silylated resin-containing composition containing, inter alia, moisture-curable silylated resin, the cured composition exhibiting low permeability to gas(es).  
WO/2007/088666A1
This invention provides a heat curable adhesive that, when an electronic component is pressure bonded onto a substrate with the aid of a heat curable adhesive such as an anisotropic electroconductive adhesive, can facilitate repair. The ...  
WO/2007/083566A1
Disclosed is an easily demountable adhesive which is used for forming a structure by bonding constitutional parts and enables to easily disassemble the bonded structure by having demountability. Specifically disclosed is a demountable ad...  
WO/2007/077833A1
A potting material which, when used in stationary potting, is less apt to scramble up and can sufficiently penetrate into the spaces among porous hollow fibers. The potting material is one for fixing an end part of a group of porous holl...  
WO/2007/077779A1
Disclosed is a novel environmentally friendly, high-performance inorganic sulfate ion scavenger. The inorganic sulfate ion scavenger is characterized in that the amount of ionic impurities to be eluted in purified water is not more than ...  
WO/2007/074652A1
Provided is an adhesive composition which contains an adhesive ingredient, conductive particles and insulating particles. The ratio (Ri/Rc) of the average particle diameter (Ri) of the insulating particle to the average particle diameter...  
WO/2007/072799A1
Disclosed is an adhesive composition for optical use which enables to form an adhesive layer for closely bonding a glass substrate and an optical functional film in a liquid crystal cell as a component of a liquid crystal display. Such a...  
WO/2007/066640A1
[PROBLEMS] To provide a hardenable pressure-sensitive adhesive film which is excellent in cuttability and permits excellent shearing such as punching or perforating without adhesive spew. [MEANS FOR SOLVING PROBLEMS] A hardenable pressur...  
WO/2007/067404A2
Anionic emulsifiers based on rosin acid or derivatives thereof, and to methods of preparing said emulsifiers. The emulsifiers are useful for preparing tackifier dispersions having improved properties with respect to foam stability. As su...  

Matches 651 - 700 out of 15,387