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Patent Searching and Data


Matches 651 - 700 out of 10,337

Document Document Title
WO/2007/037483
Disclosed is a curable composition containing, as a component, an organic polymer having a reactive silicon group. This curable composition uses an amine compound as a non-organic-tin catalyst, while exhibiting good adhesiveness and wate...  
WO/2007/034925
A particle classification apparatus capable of precision classification of particles with uniform length; and an adhesive containing particles classified by the apparatus that is capable of inter-electrode connection under low pressure a...  
WO/2007/029733
Disclosed is a curable composition comprising a vinyl polymer having a cross-linkable silyl group at the end terminus, which can be cured over ample operation time and, if required, can also be cured rapidly, and shows excellent in heat ...  
WO/2007/023669
[PROBLEMS] To provide curable resin compositions useful as one-part moisture-curable adhesives which exhibit cure rates higher than those of conventional elastomeric adhesives and are excellent in adhesiveness. [MEANS FOR SOLVING PROBLEM...  
WO/2007/023834
Disclosed is an adhesive composition which is free from problems involved in conventional thermosetting resins while having adhesiveness sufficient for electronic component mounting, desired electrical characteristics and long-term durab...  
WO/2007/018239
An electropeeling composition that while at the time of fixing (adhesion, coating, etc.) to adherends, exhibiting satisfactory bonding strength thereto, can be easily detached from the adherends after use; and making use of the same, an ...  
WO/2007/015516
[PROBLEMS] To provide resin particles which are excellent in static properties, high-temperature storage stability, and thermal properties and have evenness of particle diameter. [MEANS FOR SOLVING PROBLEMS] The resin particles (D) compr...  
WO/2007/008558
A method and composition for forming an adhesive bond is described. The method includes depositing an aqueous dispersion on a substrate to form a selectively activatable coating, the aqueous dispersion including (A) a polymer capable of ...  
WO/2007/008558
A method and composition for forming an adhesive bond is described. The method includes depositing an aqueous dispersion on a substrate to form a selectively activatable coating, the aqueous dispersion including (A) a polymer capable of ...  
WO/2007/002318
Polymers and compositions, collectively "bioadhesive materials", with improved bioadhesive properties have been developed. One or more compounds comprising: a) an aromatic moiety comprising two or more hydroxyl substituents, methoxy subs...  
WO/2007/002318
Polymers and compositions, collectively "bioadhesive materials", with improved bioadhesive properties have been developed. One or more compounds comprising: a) an aromatic moiety comprising two or more hydroxyl substituents, methoxy subs...  
WO/2006/118277
This invention provides a pressure-sensitive adhesive containing a near infrared absorbing coloring matter that has an excellent function of shielding near infrared rays and has excellent durability. The pressure-sensitive adhesive conta...  
WO/2006/114896
With respect to a thermally insulating material comprising a laminate having a carbon formed article as a layer constituent of the laminate, an adhesive agent for an thermally insulating material which is free from the occurrence of flak...  
WO/2006/112311
For attaining laminating without bubble retention of heterogeneous materials, such as synthetic resin plates and glass plates, there is provided double sided adhesive sheet (1) produced by forming ultraviolet-crosslinked adhesive layer (...  
WO/2006/109441
Disclosed are an adhesion-imparting agent applicable to various adhesions and an adhesion-imparting resin emulsion applicable to various aqueous adhesions, each of which is a raw material for an adhesion exhibiting good adhesion properti...  
WO/2006/107054
A fabric pressure-sensitive adhesive tape usable for protection, packing, repair, and so on, which is excellent particularly in hand cuttability and which is so thin and flexible as to be applicable to uneven or stepped areas, more speci...  
WO/2006/107748
A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fill...  
WO/2006/098352
Disclosed is an adhesive composition containing a radical generator, a thermoplastic resin, and a urethane (meth)acrylate having two or more radically polymerizable groups in a molecule whose weight average molecular weight is 3,000-30,000.  
WO/2006/095595
A conductive-polymer solution which comprises a &pgr -conjugated conductive polymer, a solubilized polymer, a phase-transfer catalyst, and an organic solvent. A process for producing the conductive-polymer solution comprises adding an or...  
WO/2006/093315
An anisotropic conductive adhesive that realizes secure connection to joining terminals of fine pitch; and a method of electrode connection with the use of the same. There is provided anisotropic conductive adhesive (1) comprising insula...  
WO/2006/090467
[PROBLEMS] To impart simultaneously excellent solvent resistance and connection reliability to insulation-coated elecroconductive particles for anisotropic conductive adhesives. [MEANS FOR SOLVING PROBLEMS] In an electroconductive partic...  
WO/2006/090715
A rubber-based curable hot-melt adhesive composition of the one-pack curable type which is free from the environmental problem associated with solvent-based curable adhesives and from drawbacks of moisture-curable polyurethane-based hot-...  
WO/2006/088112
Disclosed is an adhesion composition for a hardly adhesive substrate, which has a sufficient adherability on a hardly adhesive substrate. A reactive resin composition comprising (A) an organic polymer having a reactive silicon group at a...  
WO/2006/085483
A transfer-type pressure sensitive adhesive tape having a pressure sensitive adhesive layer on a support body. In transfer of the pressure sensitive adhesive layer to a body to which the transfer is made such as a paper surface, the tape...  
WO/2006/082887
Disclosed is a multilayer film for a strain-free laminate which is used for flexible TFT substrates or the like. Also disclosed are a laminate obtained by arranging such a multilayer film on a substrate made of an inorganic material, and...  
WO/2006/082887
Disclosed is a multilayer film for a strain-free laminate which is used for flexible TFT substrates or the like. Also disclosed are a laminate obtained by arranging such a multilayer film on a substrate made of an inorganic material, and...  
WO/2006/082661
A solid adhesive agent which comprises an adhesive polymer having a glass transition temperature (Tg) of 40 to 55&ring C and a gelling agent; and a liquid raw material composition for preparing said solid adhesive agent. The above solid ...  
WO/2006/062713
An aqueous adhesive composition includes a polymer adhesive material having a pH of less than 7, a cationic thickener or an anionic thickener formed from at least one anionic monomer having a pKa of less than 3, and water. The adhesive c...  
WO/2006/062713
An aqueous adhesive composition includes a polymer adhesive material having a pH of less than 7, a cationic thickener or an anionic thickener formed from at least one anionic monomer having a pKa of less than 3, and water. The adhesive c...  
WO/2006/057149
Disclosed is a water-soluble film roll (3) wherein a masking member (5) is bonded to each end face (4) of the roll. With this water-soluble film roll (3), a water-soluble film (1) can be paid out while having the masking members (5) bond...  
WO/2006/057149
Disclosed is a water-soluble film roll (3) wherein a masking member (5) is bonded to each end face (4) of the roll. With this water-soluble film roll (3), a water-soluble film (1) can be paid out while having the masking members (5) bond...  
WO/2006/054541
Disclosed is a conductive tape for feeding which comprises a metal base foil made of a metal which is anodized in an electrolyte solution or corroded by a chemical reaction, a metal thin film layer made of a metal which is not anodized i...  
WO/2006/051798
Disclosed is a curable composition having good curability, adhesiveness and storage stability which uses a catalyst other than organic tin catalysts. Specifically disclosed is a curable composition composed of an organic polymer (A) havi...  
WO/2006/051799
Disclosed is a curable composition which exhibits excellent curability while using a catalyst other than organic tin catalysts. Specifically disclosed is a curable composition containing a polymer (A) having a silicon-containing group wh...  
WO/2006/050242
The present invention relates to methods for attaching a plastic component to another component where the plastic component is bonded to the other component with an adhesive in the absence of a primer on the plastic component and the adh...  
WO/2006/046474
Disclosed is a solvent-free, room temperature-curable composition which has excellent water-resistant adhesion, storage stability and curability and does not generate fumes or odors during application. Specifically disclosed is a curable...  
WO/2006/046726
Disclosed is a sheet adhesive which is characterized by consisting of a transparent adhesive layer containing a synthetic resin and a heat ray-cutting layer arranged on the transparent adhesive layer wherein fine particles of a metal oxi...  
WO/2006/046473
Disclosed is a curable composition characterized by containing a bituminous substance (A) and a saturated hydrocarbon polymer (B) having a reactive silicon group which is represented by the following general formula (1): -Si(R13-a)Xa. (I...  
WO/2006/046472
A curable composition which comprises (A) natural asphalt and/or petroleum asphalt and (B) a polyoxyalkylene polymer having a reactive silicon-containing group represented by the following general formula (1): -Si(R13-a)Xa (wherein R1 re...  
WO/2006/043612
This invention provides an electromagnetic steel sheet, which, after lamination, can be bonded by pressing and heating, can realize strain relieving annealing, and has a surface covered with a heat resistant adhesive insulating film, an ...  
WO/2006/040945
An adhesive sheet is provided with a peeling base material (10), a base material film (14), and a first adhesive layer (12) arranged between the peeling base material (10) and the base material film (14). On the peeling base material (10...  
WO/2006/030945
The electroconductive resin composition comprising 1 to 30 mass % of carbon fiber having a hollow structure, an average filament diameter of 50 to 500 nm and an average aspect ratio of 50 to 1000 and 99 to 70 mass % of resin, wherein the...  
WO/2006/019650
Polymer bonding compositions having greater than about 1 milliequivalent primary amine/100 grams of the polymer, more preferably greater than about 3 milliequivalent non-tertiary amine/100 grams of the polymer. Preferably the polymer is ...  
WO/2006/013616
A process for producing an IC chip as thin as 50 µm or less, such as an IC chip having a thickness of 25-30 µm, with high productivity. The process for producing an IC chip comprises a step 1 for fixing a wafer to a supporting plate by...  
WO/2006/014204
An adhesive composition includes a polymer adhesive material and a thickener. The adhesive composition has a stringing length of 9 cm or less and a phase lag of 45 degrees or less or a sag distance of 5 mm or less. The adhesive can be fo...  
WO/2006/013842
A work subject material (W) comprising a metal plate for use in punching and/or curving work and, attached thereto, a surface protection sheet, characterized in that the surface protection sheet comprises a support base material and, sup...  
WO/2006/006512
A two-pack type curable composition in which agent (A) is easy to handle and which has excellent inner-part curability and satisfactory storage stability. The two-pack type curable composition is characterized by being composed of: agent...  
WO/2006/006265
A self-tacky film which includes a base layer and adherent thereto an adhesive layer comprising a carboxylic-acid-modified thermoplastic elastomer, a thermoplastic elastomer not modified with a carboxylic acid, a crosslinking agent, and ...  
WO/2006/001548
The present invention relates to an adhesive compound composition having an appropriate degree of tackiness suitable for a packaging material that can be opened easily and sealed again, a laminated film using such adhesive compound compo...  
WO/2006/002297
Process to generate a water based adhesive by mixing a re-dispersible powder adhesive and water, optionally together with other components, characterized by mixing a re-dispersible powder adhesive, water and optionally other components s...  

Matches 651 - 700 out of 10,337