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WO/2012/091306 |
The adhesive composition for semiconductors of the present invention is characterized in that two exothermic peaks appear at 65-350°C, of which a first exothermic peak appears at 65-185°C and a second exothermic peak appears at 155-350...
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WO/2012/091306 |
The adhesive composition for semiconductors of the present invention is characterized in that two exothermic peaks appear at 65-350°C, of which a first exothermic peak appears at 65-185°C and a second exothermic peak appears at 155-350...
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WO/2012/086944 |
The present invention relates to an adhesive resin composition for a decorative film, and to a decorative film including same. In the present invention, an amine-based (including N) accelerator having a functional group which can react w...
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WO/2012/086588 |
Provided is an electroconductive adhesive which exhibits excellent electroconductivity and adhesiveness and which can be inhibited from settling or bleeding and exhibits excellent electroconductivity stability. This electroconductive adh...
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WO/2012/086770 |
The purpose of the present invention is to prevent the occurrence of blocking in a reel body. A reel body comprises an anisotropic conductive film (3) which comprises a release base (31) and a resin film (32) formed on the release base (...
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WO/2012/086466 |
A process for producing an adhesive optical film, comprising a step of applying an anchor layer coating solution that comprises a mixed solvent containing water and an alcohol as the main components and a binder resin onto an optical fil...
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WO/2012/086554 |
An adhesive tape, characterized in that the initial wetting speed defined below is not less than 1 cm2/second, is provided. The initial wetting speed is the adhesion area per unit time (seconds) immediately after contact when the adhesiv...
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WO/2012/088541 |
A method of preparing a window module includes providing a metal frame having a first major surface, applying a structural glazing tape to the first major surface of the metal frame, and positioning a glass panel overtop the structural g...
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WO/2012/086278 |
Provided is an anisotropic conductive adhesive film for anisotropic conductive connection of a terminal of a flexible substrate with a terminal of a rigid substrate, wherein conductive particles are employed having a particle size of at ...
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WO/2012/086944 |
The present invention relates to an adhesive resin composition for a decorative film, and to a decorative film including same. In the present invention, an amine-based (including N) accelerator having a functional group which can react w...
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WO/2012/088541 |
A method of preparing a window module includes providing a metal frame having a first major surface, applying a structural glazing tape to the first major surface of the metal frame, and positioning a glass panel overtop the structural g...
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WO/2012/081608 |
The present invention provides a temporary fixative with which it is possible to finish a substrate with high precision while damage to the substrate is minimized, and with which the substrate can be easily removed from a support substra...
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WO/2012/077471 |
Provided is an auxiliary sheet for laser dicing, that is not fully cut and does not reduce workability even in dicing processes that use a short-wavelength laser. The auxiliary sheet for laser dicing includes: a base material comprising ...
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WO/2012/073702 |
Provided are a solar cell module with high connection reliability and a production method for same. A conductive adhesive film (20) with a glass transition temperature of 130°-180°C is pasted onto a bus bar electrode (11) in one solar ...
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WO/2012/072502 |
The invention relates to a composition comprising (A) at least 5 wt % of an organic prepolymer P having at least two water-curable organosilicon terminal groups, (B) 0.01 to 3.0 wt % of boric acid and/or boric acid ester, and (C) 0.01 to...
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WO/2012/072504 |
In the case of a curable composition based on at least one silyl-terminated polymer, the aim is to improve the adhesion spectrum in the bonding of plastics, and the rate of development of the adhesion. This is accomplished by provision o...
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WO/2012/070476 |
The objective of the present invention is to provide a curable composition having high hardness, which can be used as an adhesive or a coating agent. The objective can be achieved by a curable composition which contains (A) 100 parts by ...
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WO/2012/068573 |
The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. Th...
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WO/2012/066805 |
The present invention is a method for producing a molded fiber-reinforced plastic involving, in the following order: a laminate formation step for forming a preform laminate (5b) secured to a molding die (6), the preform laminate (5b) be...
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WO/2012/065716 |
The invention relates to a curable compound, which can be obtained as a mixture of at least two components to be stored separately, of which one component comprises a silane-modified polymer and said component or a second component compr...
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WO/2012/066777 |
A protective film (10) provided with a base layer (12), a pressure-sensitive adhesive layer (14), and a removable liner (16). The base layer (12) takes the form of a circular sheet, and a typical implementation thereof is a polyethylene ...
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WO/2012/068573 |
The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. Th...
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WO/2012/066897 |
An anisotropic conductive film for electrically connecting a first circuit member to a second circuit member, the first circuit member having an insulating film formed in at least part thereof. The anisotropic conductive film comprises a...
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WO/2012/067145 |
The purpose of the present invention is to improve adhesion failure associated with "a bubble formation phenomenon" that may occur in an adhesive layer when the thickness of an adhesive agent is increased and "the formation of fisheyes" ...
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WO/2012/067232 |
Provided is a method for detaching a light-transmitting rigid substrate laminate without adhesive deposits. This method for detaching a light-transmitting rigid substrate laminate comprises: a step (1) for preparing a light-transmitting ...
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WO/2012/064133 |
The present invention relates to a conductive transparent adhesive composition and to a conductive transparent adhesive produced by same. The conductive transparent adhesive composition comprises: a conductive mesoporous filler selected ...
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WO/2012/063810 |
This oil-resistant, heat-resistant adhesive sheet is provided with: a substrate containing a fluororesin; and an adhesive layer that is layered on at least one surface of the substrate. One surface of the substrate is subjected to roughe...
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WO/2012/064081 |
The present invention relates to an underwater antifouling coating sheet for preventing a ship or an underwater structure from being contaminated by marine life and an underwater antifouling coating method using the same. The underwater ...
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WO/2012/064133 |
The present invention relates to a conductive transparent adhesive composition and to a conductive transparent adhesive produced by same. The conductive transparent adhesive composition comprises: a conductive mesoporous filler selected ...
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WO/2012/063811 |
A water-dispersible oil-resistant adhesive agent composition comprises a water-dispersible polymer and inorganic particles, wherein the content of the inorganic particles is 3-90 parts by mass relative to 100 parts by mass of the water-d...
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WO/2012/064081 |
The present invention relates to an underwater antifouling coating sheet for preventing a ship or an underwater structure from being contaminated by marine life and an underwater antifouling coating method using the same. The underwater ...
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WO/2012/063554 |
An anisotropic conductive film obtained by laminating an insulating adhesive layer that comprises a polymerizable acrylic compound, a film-forming resin and a polymerization initiator with a conductive-particle-containing layer that comp...
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WO/2012/056511 |
Provided is an adhesive film that allows a wound-up adhesive agent layer to be prevented from breaking in a step for winding up the adhesive agent layer during production of a wafer-processing tape pre-cut in a shape that corresponds to ...
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WO/2012/051687 |
A concentrated gel for use in a compound mixture for promoting the waterproofing, adherence and fastening power between various elements and substrates. Said compound mixture is a concentrated mixture which is novel and functional, and d...
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WO/2012/053478 |
Provided is a moisture-curable reactive hot-melt adhesive which includes a less toxic polymer having a reactive silicon group and which has the controlled properties of relatively slowly curing at high temperatures (excellent high-temper...
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WO/2012/053589 |
The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connec...
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WO/2012/053373 |
The present invention addresses the problem of providing an electronic device in which a conductive layer has excellent adhesiveness and low surface resistivity, and a production method therefor. The problem is solved by a conductive adh...
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WO/2012/046710 |
Provided are: a heat-conductive adhesive agent comprising an adhesive resin and a heat-conductive filler, wherein the heat-conductive filler comprises plate-shaped metal particles; an adhesive sheet which has, formed on at least one surf...
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WO/2012/045566 |
The invention relates to a curable composition comprising at least one polymer having at least one end group of the general formula (I) comprising -An-R-SiXYZ (I), where A is a double-bonded bond group comprising at least one heteroatom,...
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WO/2012/046695 |
This method for manufacturing a semiconductor device is characterized by providing: a first step for providing a resin paste coating (30) by applying a resin paste for bonding that has 5% by mass or less content of a solvent that contain...
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WO/2012/043652 |
This resin film with an adhesive layer laminates a first transparent resin film, an oligomer prevention layer, and an adhesive layer in the given order; the oligomer prevention layer is a cured layer formed by curing a composition contai...
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WO/2012/042869 |
The present invention addresses the problem of obtaining an olefinic expandable base material that has low contamination, has a high degree of expandability, which has been insufficient in conventional olefinic expandable base materials,...
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WO/2012/043657 |
The present invention addresses the problem of further improving bonding reliability of an object in which a metal plate and a porous material are attached together, in a history of harsh environments and high load conditions. The presen...
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WO/2012/043472 |
Provided are: conductive particles, each of which is not susceptible to a large crack in a conductive layer even in cases where a large force is applied thereto; an anisotropic conductive material which uses the conductive particles; and...
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WO/2012/039323 |
This adhesive layer for an optical film is formed by applying and then drying a water-dispersible adhesive containing emulsion particles in the presence of a surfactant. The state of the adhesive layer is such that when the adhesive laye...
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WO/2012/037509 |
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from e...
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WO/2012/036209 |
The purpose of the present invention is the provision of: a pressure-sensitive adhesive compound that exhibits high initial adhesion, can securely fix an adherend in place, and can be easily removed by the application of light even after...
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WO/2012/036109 |
The present invention addresses the problem of providing a fast-curing curable composition able to be used as a sealing material or an adhesive material, etc., and which can provide a cured product that is flexible and tough. The problem...
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WO/2012/037509 |
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from e...
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WO/2012/033626 |
A multilayer construct includes a fluoropolymer first layer; a UV resistant fluoropolymer adhesive layer, and a third layer, wherein the fluoropolymer adhesive layer is between the first and third layers. The adhesive layer can optionall...
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