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WO/2011/108442 |
A pressure-sensitive adhesive sheet (1) which is provided with a substrate (11) and a pressure-sensitive adhesive layer (12) and in which multiple through holes (2) that extend from one surface of the sheet (1) to the other surface there...
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WO/2011/108490 |
Disclosed is an electrically conductive adhesive tape which can exhibit steady electrical conductivity even when used for a long period or when used under severe environmental conditions. The electrically conductive tape has an adhesive ...
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WO/2011/105211 |
In order for the disclosed laminated glass lens for glasses to have excellent glare-prevention characteristics, a tetraazaporphyrin compound is combined at a required concentration with an extremely thin adhesive agent layer and is moreo...
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WO/2011/102170 |
Disclosed are a thermally conductive pressure-sensitive adhesive sheet which has a high thermal conductivity, a good flame retardancy and a high electric breakdown strength in a well-balanced manner, a thermally conductive pressure-sensi...
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WO/2011/090046 |
Disclosed is a curable resin composition which can be reduced in the burden on the environment, while securing safety and having extremely high curability at low temperatures. Specifically disclosed is a curable resin composition which c...
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WO/2011/087741 |
The present invention relates to new improved adhesives for binding books and related articles and the production of such adhesives. In particular, the adhesives have reduced content of monomeric diisocyanates or no monomeric diisocyanat...
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WO/2011/083809 |
Disclosed are: a TAC base for cycloolefin polymer bonding, which has extremely excellent air release during the bonding, excellent transparency and excellent bonding workability, while being capable of enhancing the bonding strength with...
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WO/2011/083824 |
Provided is a circuit connecting adhesion film having at least an adhesive layer (A) and an adhesive layer (B), wherein the adhesive layer (A) is an anisotropic conductive layer (11) containing a prescribed adhesive ingredient (3a) and c...
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WO/2011/082327 |
An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight p...
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WO/2011/078313 |
Disclosed are: an intermediate film for laminated glass, which is capable of providing laminated glass that has excellent sound insulation properties and is capable of suppressing generation and growth of foam; and a multilayer intermedi...
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WO/2011/077922 |
Conventionally, it was difficult to sufficiently affix an adherend when polishing, and to easily peel off the adherend. Disclosed is a non-reactive temporarily fixing composition for plane polishing, wherein the shear strength is 0.05MPa...
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WO/2011/074619 |
Provided is a near-infrared absorptive coloring matter that enables the production of a near-infrared blocking filter having excellent transparency, heat resistance and moist heat resistance. The near-infrared absorptive coloring matter ...
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WO/2011/074414 |
Disclosed is an aqueous dispersion adhesive composition containing an aqueous dispersion polymer and alkali disilicate, wherein the proportion of the alkali disilicate is 0.01 to 10 parts by weight in relation to 100 parts by weight of t...
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WO/2011/072056 |
A method for modifying cure speed of a condensation reaction curable involves converting the higher alkoxy groups on ingredient (A) to lower alkoxy groups (such as methoxy groups) using ingredients (B) and (C). Ingredient (A) is a substr...
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WO/2011/071036 |
Disclosed are an adhesion method for firmly bonding a member and an adhesion layer, an ultra-thin adhesion layer in which adhesion and removal can be performed repeatedly without adhesion layer remnants or adhesive residue and without da...
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WO/2011/065341 |
Disclosed is a double-sided pressure-sensitive adhesive sheet for optical use, which has high corrosion resistance and high adhesion reliability at the same time. Specifically disclosed is a double-sided pressure-sensitive adhesive sheet...
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WO/2011/059994 |
Described herein is a mixture comprising: a non-self-crosslinking polymer; and a modifying compound comprising at least two different functional groups. The first functional group of the modifying compound is capable of reacting with the...
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WO/2011/057896 |
The present invention relates to a multi-component, in particular two-component adhesive and sealant system based on at least one component substantially free of volatile organic compounds (VOC), wherein a first and/or a second component...
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WO/2011/055580 |
Disclosed are an adhesive composition containing a resin having piperazine skeletons, a circuit connecting structure, a semiconductor device, and an adhesion improvement agent for glass.
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WO/2011/055784 |
A thermopolymerization initiator system which comprises (A) a iodonium salt represented by general formula (I) and (B) a radical polymerization initiator. In general formula (I), R1 and R2 are each independently substituted or unsubstitu...
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WO/2011/052730 |
Disclosed is a film for protecting a coated surface, with which discoloration of a coated surface due to moisture can be effectively prevented, and also an attachment operation to the coated surface can be facilitated. The film for prote...
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WO/2011/051056 |
The invention relates to a one-component, moisture-curable adhesive comprising at least one polyoxyalkylene and/or poly(methyl)acrylate pre-polymer having at least one hydrolyzable silane group, at least one filler material and auxiliary...
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WO/2011/048874 |
Disclosed is a pressure-sensitive adhesive layer for optical films which is formed by applying an aqueous dispersion type pressure-sensitive adhesive comprising an aqueous dispersion that comprises water and, dispersed therein, a polymer...
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WO/2011/047131 |
A primer composition including a toughening agent can be applied to a surface to be bonded using a separate curable adhesive composition. The primer composition toughens cured reaction products of the adhesive composition. In some embodi...
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WO/2011/047131 |
A primer composition including a toughening agent can be applied to a surface to be bonded using a separate curable adhesive composition. The primer composition toughens cured reaction products of the adhesive composition. In some embodi...
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WO/2011/045962 |
Disclosed are light reflecting conductive particles for an anisotropic conductive adhesive to be used for the purpose of connecting a light emitting element to a wiring board by means of anisotropic conductive connection. Each of the lig...
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WO/2011/046176 |
Disclosed is a conductive adhesive which contains conductive particles including a metal, a thermosetting resin, a flux activator, and preferably, a rheology control agent. The melting point of the conductive particles is preferably 220Â...
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WO/2011/040498 |
Provided is a powdered thermosetting adhesive, the fluidity of which is so improved that a quantitative feeder or a conveyance passage can be prevented from being clogged with the powdered thermosetting adhesive. The powdered thermosetti...
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WO/2011/040442 |
Disclosed is a conductive connection material which has a laminated structure comprising a resin composition and metal foil selected from solder foil or tin foil. The resin composition of the conductive connection material has a minimum ...
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WO/2011/040438 |
Provided is an adhesive composition which can keep high bond strength even under solder reflow conditions or other high-temperature conditions. Further, the adhesive composition can be easily peeled off without doing damage to an adheren...
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WO/2011/038182 |
What is disclosed is a water-based adhesive composition that is an aqueous dispersion or emulsion of a polymer component having functional groups that are inactive in a reversible manner in the adhesive composition as prepared; and a wat...
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WO/2011/033743 |
Disclosed is an adhesive film having a composition containing (A) a thermosetting resin, (B) a hardening agent, (C) a flux activation compound, and (D) a film forming resin. The adhesive film has a minimum melt viscosity of 0.01-10,000 P...
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WO/2011/030621 |
Disclosed is a light-reflective anisotropic electroconductive adhesive agent which is intended to be used for the anisotropic electroconductive connection of a light-emitting element to a wiring board. The light-reflective anisotropic el...
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WO/2011/030876 |
Disclosed is an adhesive composition for slide rail, which exhibits a highly excellent workability in attaching a slide rail to a vehicle body and has a strong adhesive force after heating, the magnetic force of which can be lowered, whi...
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WO/2011/024788 |
Disclosed are: an intermediate film for laminated glass, which is capable of providing laminated glass that has excellent heat shielding properties, and which enables the laminated glass to maintain the excellent heat shielding propertie...
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WO/2011/024787 |
Disclosed is an intermediate film for laminated glass, which is capable of providing laminated glass that has high heat shielding properties and high visible light transmittance. Specifically disclosed is an intermediate film (2) for lam...
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WO/2011/016539 |
Provided are: a release agent which has release properties inherent in polyolefin and exhibits excellent tight adhesion to a substrate; a release material using the same; and a pressure -sensitive adhesive tape with the release material....
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WO/2011/010044 |
The invention relates to an adhesive composition, including: 10 to 95% of a moisture cross-linkable polymer (A), the main chain includes 2 silyl terminal groupings, each of which includes at least one hydrolyzable group bonded to the sil...
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WO/2011/007646 |
Provided is a bonding structure excellent in conductivity and bonding property between a piezoelectric body and a metal plate. In the bonding structure in which a metal plate (1) and an electrode (3) of a piezoelectric body (2) are bonde...
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WO/2011/004710 |
Disclosed is a heat-curable adhesive tape or sheet provided with a heat-curable adhesive layer, which has a good storage stability at room temperature and can exert an excellent adhesiveness and a high heat resistance after a high temper...
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WO/2011/004658 |
A film for a semiconductor comprises a support film, a second adhesive layer, a first adhesive layer, and a bonding layer stacked in this order. The film for a semiconductor allows a semiconductor wafer to be stacked on the bonding layer...
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WO/2011/004657 |
A film for a semiconductor comprises a support film, a second adhesive layer, a first adhesive layer, and a bonding layer stacked in this order. The film for a semiconductor allows a semiconductor wafer to be stacked on the bonding layer...
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WO/2011/001942 |
Provided is an alkali-developable photosensitive adhesive which excels sufficiently in applicability, pattern formation properties, thermocompression bondability, and high -temperature adhesiveness and which is thermocompression -bondabl...
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WO/2011/001713 |
Disclosed is a protection tape for plating, which is capable of preventing occurrence of plating failure and can be easily removed after being used. Specifically disclosed is a protection tape for plating, which is used for the purpose o...
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WO/2011/001760 |
Provided are a thermally conductive pressure-sensitive adhesive sheet which is flexible and has high thermal conductivity and flame retardancy, a thermally conductive pressure-sensitive adhesive composition which is a material for the th...
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WO/2011/000843 |
Aim of the invention is to implement low viscosity prior to curing along with good elasticity after curing and a broad adhesion spectrum in a solvent-free and water-free curable composition. This aim is achieved by using at least one pol...
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WO/2011/000843 |
Aim of the invention is to implement low viscosity prior to curing along with good elasticity after curing and a broad adhesion spectrum in a solvent-free and water-free curable composition. This aim is achieved by using at least one pol...
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WO/2010/150673 |
Provided are a novel, liquid, two-part, fast-curing, water-based adhesive of separate-application type which exhibits initial adhesion and adhesion properties for a wide variety of adherends, and a method for adhesive bonding. The novel,...
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WO/2010/147103 |
Disclosed are: a temporarily fixing agent for a semiconductor wafer, which can reduce the damage to the semiconductor wafer, enables the easy removal of the semiconductor wafer, and enables the reduction in time required for the thermal ...
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WO/2010/147102 |
Disclosed are: a temporarily fixing agent for a semiconductor wafer, which can reduce the damage to the semiconductor wafer, enables the easy removal of the semiconductor wafer, and enables the reduction in time required for the thermal ...
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